JPH11258465A - Optical semiconductor module and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure the optical coupling by inhibiting the heat conduction through a guide pin and preventing the heating of an optical connector, to improve the reliability on the fixing of the guide pin, further to easily fix the same and to improve the yield in the manufacturing by mounting a new heat radiating path through a guide pin holder and an adhesive. SOLUTION: The heat conduction from an optical semiconductor module to an optical connector is inhibited by mounting a guide pin holder 7 and an adhesive 6 filled under the guide pin holder 7, and the deviation of an optical axis in accompany with the rise of temperature can be prevented. That is, the most of heat generated from the optical semiconductor element 2a and an IC 2b is transmitted to the optical connector through a guide pin, but it is radiated from the guide pin holder 7 to an external, and a path for diffusing the heat from the guide pin 5 to a substrate 1 through the adhesive 6 is formed, so that the conduction of the heat of the guide pin 5 can be reduced. As a result, the rise of temperature of the optical connector can be inhibited, and the deviation of the optical axis in accompany with the thermal distortion can be resolved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module and a method of manufacturing the same, and more particularly, to an optical semiconductor module capable of securely and easily fixing a guide pin for an optical connector of an optical semiconductor module and improving its performance. And its manufacturing method.

[0002]

2. Description of the Related Art In the field of optical communication in recent years, a technology for transmitting data at high capacity and at high speed is required in application fields such as data transfer between LANs and between boards in a computer. An optical transmission system used for data communication generally includes a transmission module, an optical transmission medium, and a reception module. The specific configuration of each is as follows. That is, the transmission module includes a laser diode, a control IC, and an optical coupling component for connecting to the optical connector. The optical transmission medium includes an optical connector and an optical fiber having a coupling mechanism with each module. Receiver module is photodiode, control IC
And an optical coupling component for connecting to an optical connector. Also, guide pins are often used to connect the optical connector to each module. Among these components, in this specification, the transmitting module and the receiving module are collectively referred to as an “optical semiconductor module”.

[0003] Optical semiconductor modules are required to be smaller, lighter, have higher durability, lower power consumption, and the like.
On the other hand, in order to increase the data amount and the data transfer rate, it is also necessary to increase the number of channels of the optical fiber and to develop a module equipped with an optical semiconductor element and a control IC that operate at high speed. However, in order to increase the number of transmission channels, more advanced assembly technology is required, and it is necessary to cope with a heat generation problem due to an increase in the circuit scale of the IC. In other words, it is necessary to realize a simple and reliable assembly while securing the heat radiation measures of the module. At the same time, in order to provide such an optical module to the market at a low cost, it is necessary that productivity and yield are sufficiently high.

FIG. 8 is a schematic plan view showing the internal configuration of a conventional optical semiconductor module. That is, the optical semiconductor module includes a silicon substrate 101 processed into a predetermined shape.
The optical semiconductor element 102a and the signal processing IC 10
2b are arranged.

[0005] The optical semiconductor element 102a is a semiconductor element such as a laser diode or a photodiode.
An optical fiber 103 is arranged on the front surface of the optical semiconductor element 102a, and an optical signal is input / output. The optical fiber 103 is
It is fixed by an optical fiber holder 104 as a reinforcing material. An optical connector (not shown) is coupled to the other end of the optical fiber 103 so that an optical signal can be input / output to / from another optical semiconductor module via the optical fiber (not shown). In order to secure such optical coupling with an optical connector (not shown), guide pins 105, 10
5 are provided.

[0006] In FIG.
Is illustrated as one, but in addition, the optical fiber 103 has a configuration in which a plurality of fibers are arranged in parallel,
Correspondingly, the optical semiconductor element 102a is often an element in which a plurality of laser diodes or photodiodes are arranged in an array. Such multi-channel type optical semiconductor modules are being widely used in application fields such as board-to-board connection. In addition, although the case where the number of the guide pins 105 is two is illustrated in the drawing, other than this, three or more guide pins may be arranged and configured. The silicon substrate 101 has a V-shaped guide pin fixing groove 10 formed by an etching method using an anisotropic wet etchant utilizing the plane orientation of silicon.
1a is provided. The guide pin 105 has a distal end portion which fits with the optical connector (not shown).
01 and is accommodated in the guide pin fixing groove 101 a and fixed to the substrate 101 by the adhesive 106.

[0007]

However, in the conventional optical semiconductor module as described above, there has been a problem caused by heat generation of the element. Further, there is a problem that the guide pin fixing strength cannot be sufficiently obtained. The following describes these problems in detail.

First, the problem of heat generation of the element will be described.

In the optical semiconductor module as shown in FIG. 8, heat generated from the optical semiconductor element 102a and the IC 102b is radiated to the outside by a heat sink (not shown) provided on the back surface of the substrate 101.

The IC 102b often has a circuit configuration in which power consumption per channel is 0.2 to 0.3 W. Therefore, the power consumption of the four-channel configuration can be reduced to 0.8 to 1.2 W, but the power consumption of the ten-channel configuration can reach 2 to 3 W. When the module is operated, the temperature at the end 101c of the substrate 101 may exceed 70 ° C. depending on how heat is dissipated and the operating environment temperature. However, the allowable temperature range of the optical connector connected to the module is often lower than 70 ° C., and the heat generated by the module may cause an optical axis shift or the like, preventing normal data transfer. Here, as a result of examining the heat transfer path, the inventor has found that the component of heat conduction via the guide pins 105, 105 is large. That is, since the guide pins 105 are made of a material such as a metal having high thermal conductivity, the optical connector is heated through the guide pins. When the optical connector is heated in this way, thermal strain is generated, and the optical axis of the module and the optical axis of the optical connector are shifted.

In the case of a multi-mode fiber, the core diameter is 50 μm, and the allowable width is slightly large. However, in the case of a single-mode fiber for performing single-mode transmission, the core diameter is about 1 μm.
There is a problem that even if the optical axis is shifted by only a few μm, the loss of optical coupling increases and stable data transfer cannot be performed.

Further, the heat is transmitted through the guide pins 105, 105, so that the guide pin
The adhesive for fixing 05 and 105 is also heated in the same manner, causing thermal distortion. When heat distortion occurs in the adhesive, there is a problem that the deterioration of the adhesive proceeds rapidly, and the reliability of fixing the guide pins is reduced.

On the other hand, when the guide pin 105 is inserted into or removed from an optical connector (not shown), a force is applied to the guide pin. Therefore, the guide pin 105 needs to have a fixing strength enough to withstand this force, but there is also a problem that sufficient strength cannot be obtained.

The guide pin 105 is provided in the guide pin fixing groove 1.
01a, the adhesive 106 is fixed on the substrate 101 by being raised on the guide pins, applied and cured. At this time, it is desirable that the fixing strength of the guide pin 105 is sufficiently larger than the required strength and uniform. The fixing strength of the guide pin 105 largely depends on the application area and thickness of the adhesive. Therefore, the adhesive may be applied widely and thickly. However, when the adhesive is applied while being raised in this manner, the application time increases in order to apply the adhesive widely and thickly. In addition, there are large variations in the application shape, it is difficult to keep the application area and thickness uniform, and the fixing strength varies greatly. In particular, if an attempt is made to increase the application area, the variation increases. Therefore, it is difficult to fix the guide pin with a uniform and large fixing strength by a method in which the adhesive 106 is raised and applied on the guide pin and cured, and the manufacturing yield of the guide pin fixing decreases, and the manufacturing cost increases. There was a problem of doing.

The present invention has been made in view of such a problem. That is, the purpose is to provide a new heat dissipation path via the guide pin holder and the adhesive, thereby suppressing heat conduction through the guide pin, preventing heating of the optical connector, securing optical coupling, and securing the guide pin. Improves the reliability of guide pin fixing by preventing heating of the adhesive to be fixed, and increases and uniforms the effective application area of the adhesive for fixing the guide pin, and simplifies the fixing, thereby improving the manufacturing yield. Another object of the present invention is to provide an optical semiconductor module having a low manufacturing cost and a method for manufacturing the same.

[0016]

That is, an optical semiconductor module according to the present invention comprises a substrate, an optical semiconductor element provided on the substrate, and an optical semiconductor element provided on the substrate, one end of which is optically connected to the optical semiconductor element. An optical fiber, the other end of which is extended to the end of the substrate, and a guide pin disposed substantially parallel to the optical fiber and provided so as to partially protrude from an end surface of the substrate, An optical semiconductor module configured such that the protruding portion of the guide pin fits into a recess provided in an optical connector, further comprising a guide pin holder provided so as to cover a part of the guide pin. The guide pin holder is fixed to the substrate by an adhesive filled in at least a part of a gap between the pair of guide pins and a lower surface of the guide pin holder. Each of the guide pins is fixed to the guide pin holder and the substrate by an adhesive, so that the guide pins can be firmly fixed, and the temperature rise of the optical connector via the guide pins can be reduced. Effective suppression can be achieved.

Here, the distance between the guide pin holder and the end face of the substrate is at least half of the length of the portion of the guide pins arranged on the substrate, whereby the guide is provided. Irrespective of the material of the pin holder, it is possible to effectively suppress the heating of the optical connector and prevent the optical axis from shifting.

Further, the guide pin holder has at least one through-hole penetrating the upper surface and the lower surface thereof, so that an adhesive is injected through the through-hole and hardening for curing. Light can be irradiated.

On the other hand, a method of manufacturing an optical semiconductor module according to the present invention comprises a substrate, an optical semiconductor element provided on the substrate, and an optical semiconductor element provided on the substrate, one end of which is optically coupled to the optical semiconductor element. An optical fiber having the other end extending to the end of the substrate, a guide pin provided so as to partially protrude from an end surface of the substrate, and an upper surface provided to cover a part of the guide pin. A guide pin holder having a through-hole penetrating through the lower surface, wherein the projecting portion of the guide pin is configured to be fitted with an optical connector, the method comprising: Arranging the guide pin thereon, arranging the guide pin holder on the guide pin, dropping an adhesive through the through hole, and curing the adhesive It may be characterized by including a reliably inject the adhesive through the through hole provided in the guide pin holder.

Here, the adhesive is a photo-curable adhesive, and the step of curing the adhesive is performed by irradiating light for curing the adhesive through the through-holes. By being characterized in that it is a step of curing the agent, the adhesive can be quickly cured.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing the internal structure of the optical semiconductor module according to the first embodiment of the present invention.

FIG. 2 is a schematic plan view of the internal structure of the module as viewed from above.

The optical semiconductor module according to the present embodiment comprises:
As shown in FIGS. 1 and 2, a guide pin holder 7 is provided. That is, on the substrate 1,
The optical semiconductor element 2a and the IC 2b are arranged. The optical semiconductor element 2a and the IC 2b are electrically connected by a wiring path (not shown). Further, on the front surface of the optical semiconductor element 2a, there is provided an optical fiber 3 for optically coupling with the optical semiconductor element 2a and transmitting light to an optical connector (not shown). This optical fiber 3
Is sandwiched between an optical fiber fixing groove 1d provided in the substrate and the optical fiber holder 4. The guide pin holder 7 is arranged on the guide pins so as to cover the area between the guide pins, and is fixed by the adhesive 6 together with the guide pins 5 accommodated in the guide pin fixing grooves 1 a provided on the substrate 1. I have. In the vicinity of the center of the guide pin 5, a portion 5a whose thickness is constricted is provided. The constricted portion 5a acts as a resistance to heat released from the optical semiconductor element 2a and the IC 2b, and suppresses heating of the optical connector via the guide pin 5. At the same time, the constricted portion 5a also has a role of preventing the adhesive 6 for fixing the guide pin 5 from flowing out to the end face 1c of the substrate 1 during the assembling process.

As the material of the guide pin holder 7 that can be used in the present invention, a material having good adhesiveness and high rigidity is desirable. For example, a metal can be used. Other materials such as ceramics and plastics may be used, but a material having good heat conductivity is more preferable.

Next, a sectional configuration around the guide pin holder 7 and the guide pin 5 will be described. FIG. 3 shows FIG.
FIG. 2 is a schematic cross-sectional view taken along line AA of FIG. Here, a (100) silicon substrate is used as the substrate 1.
In the silicon substrate, the guide pin fixing groove 1 is formed.
a is in the [011] direction. The guide pin holder 7 has a rectangular flat plate shape, and is arranged on the guide pins so as to cover the pair of guide pins 5 and 5. The gap below the guide pin holder 7 is filled with an adhesive 6 and hardened, and the guide pin 5 and the guide pin holder 7 are fixed.

With such a structure, a part of the heat of the guide pin 5 is transmitted to the guide pin holder 7 and dissipated to the outside, and another part of the heat of the guide pin 5 is transferred to the gap under the guide pin holder. The heat is transmitted to the region between the guide pins through the adhesive 6 filled in the substrate 1, and is radiated to the outside of the module from a heat sink (not shown) through the substrate 1.

Also, since the adhesive 6 spreads below the guide pin holder, the thickness of the adhesive is equal to the left and right sides, the bonding area is wide and uniform, and the adhesive is widely bonded to the guide pin holder 7. 7, the guide pin fixing strength can be made uniform and large.

As a result of the trial production of the present inventor, for example, a diameter of 0.3 mm was obtained.
A SUS guide pin having a length of 699 mm and a length of 7 mm is protruded 1.5 mm from the end face to form a pair of Vs at 4.6 mm intervals.
It is housed in a groove-shaped guide pin fixing groove, and with the conventional configuration as shown in FIG. Then, the guide pin was fixed, and the guide pin fixing strength when a load was applied to the tip of the guide pin in a direction from below to above the substrate was about 5 to 8 N (Newton).

On the other hand, a guide pin holder having a length of 2 mm in a direction parallel to the guide pin, a length of 8 mm in a vertical direction, and a thickness of 0.8 mm is arranged on the guide pin having the same structure, and a guide pin holder is provided below the guide pin holder. When the same epoxy adhesive is filled and cured, and the guide pin is fixed, the guide pin strength is 12
-20 N or more, and it was confirmed that the fixing strength was greatly increased.

Further, when the guide pin holder 7 is fixed to the housing (not shown) of the optical semiconductor module or is integrated with the housing, the rigidity of the housing is added to the guide pin fixing strength. The fixing strength is further increased.

As the adhesive 6 used in the present invention,
Those having good heat conduction and strong adhesion to the guide pin 5, the guide pin holder 7, the optical fiber holder 4 and the substrate 1 are preferred. For example, there is an epoxy adhesive containing a metal filler.

According to the present invention, by providing the guide pin holder 7 and the adhesive 6 filled under the guide pin holder 7, heat conduction from the optical semiconductor module to the optical connector (not shown) is suppressed, and the temperature rises. Can be prevented from being displaced. That is, the optical semiconductor element 2a or the IC 2b
Most of the heat generated from is transmitted to an optical connector (not shown) via the guide pin 5. However, according to the present invention, the heat is radiated to the outside from the guide pin holder 7 and from the guide pin 5 via the adhesive 6. As a result, a path for dissipating heat to the substrate 1 is formed, so that heat conduction of the guide pins 5 can be reduced. As a result, it is possible to suppress a rise in the temperature of the optical connector, and it is possible to eliminate an optical axis shift due to thermal distortion.

Here, as a result of a more detailed study by the present inventor, as shown in FIG. 2, the guide pin holder 7 has a length L of a portion of the guide pin 5 accommodated in the substrate 1.
It has been found that it is desirable to provide such that it does not protrude more than half. That is, it is desirable to arrange the guide pin holder 7 so as to have a distance of L / 2 or more from the end face 1c of the substrate 1. This is due to heat dissipation. That is, when a material having high thermal conductivity such as metal is used as the material of the guide pin holder 7, the guide pin 5
The guide pin holder 7 is likely to be heated by the inflow of heat through the guide pin holder 7. When the heated guide pin holder 7 is disposed near the end face 1c of the substrate, heat radiation from the guide pin holder 7 heats an optical connector (not shown), which may cause a problem such as optical axis misalignment. Do you get it.
In order to prevent the optical connector from being heated by such radiation, it is desirable to move the guide pin holder 7 away from the end face 1c of the substrate 1 to some extent, and as a result of the inventor's experiment, when the guide pin holder 7 is separated from the end face 1c by L / 2 or more. It has been found that the heat from the guide pins 5 can be dissipated through the guide pin holder without inadvertently heating the optical connector.

According to the experiment of the present inventor, in the case of the conventional configuration in which the guide pin holder 7 is not provided, the temperature of the connection portion of the optical connector connected to the end face 1c of the substrate is about 80 in a steady operation state. ° C. On the other hand, when the guide pin holder 7 is made of stainless steel and the entire end surface 1c of the substrate is covered with the guide pin holder 7, the temperature of the connection portion of the optical connector in the steady state operation is about 50 ° C.
In the case where the guide pin holder 7 is provided at a distance of L / 2 from the end face 1c as shown in FIG.
Was found to be suppressed.

On the other hand, as a material of the guide pin holder 7,
When a material having a low thermal conductivity such as plastic or ceramics is used, the guide pin holder 7 is not easily heated. Therefore, the problem of heat radiation from the guide pin holder 7 as described above hardly occurs. However, when the heat conductivity of the guide pin holder 7 is low, heat radiation from the guide pin 5 in a portion covered by the guide pin holder 7 is hindered, and the temperature of the end portion of the guide pin 5 increases. As a result, it has been found that the optical connector is heated and problems such as an optical axis shift are likely to occur. As a result of an experiment by the inventor, if the guide pin holder 7 is separated from the end face 1c of the substrate by L / 2 or more, heat can be radiated from the exposed portions of the guide pins 5. Therefore, it was found that the heat radiation from the guide pin 5 was not hindered by the guide pin holder 7, and the heating of the optical connector was within the allowable range.

According to the experiment conducted by the present inventor, when the guide pin holder 7 is made of plastic and the entire end face 1c of the substrate is covered with the guide pin holder 7, the connection portion of the optical connector in the steady state operation state. The temperature is about 5
5 ° C., and as shown in FIG.
Is provided at a distance of L / 2 from the end face 1c, the temperature of the connection portion of the optical connector in the steady operation state is about 4 ° C.
It was found that the temperature was suppressed to 5 ° C.

That is, as a result of the study by the present inventors, it has been found that the temperature rise of the optical connector is affected by the position of the guide pin holder 7, and the guide pin holder 7 is moved from the end face 1c of the substrate by L / 2. It has been found that, by separating them, the temperature rise of the optical connector can be effectively suppressed regardless of the type of the material of the guide pin holder 7.

According to the present invention, since the heat conduction to the optical connector can be suppressed as described above, the durability and reliability relating to heat of the optical communication system can be improved. For example, even under severe conditions such as inside various electronic devices with high ambient temperature, or in desert or outer space, optical communication system that operates with high reliability by suppressing the optical axis shift of the coupling part due to temperature rise Can be realized.

Further, according to the present invention, good transmission characteristics can be obtained by using an optical connector having lower heat resistance than before, and an optical communication system can be provided at low cost. .

Further, according to the present invention, the adhesive area for fixing the guide pin is uniform and increased, and the rigidity of the guide pin holder is added to the guide pin fixing strength, so that the guide pin fixing strength is improved. Thus, it is possible to improve the production yield and reduce the cost, and to obtain an optical semiconductor module excellent in mass productivity.

Next, a method of forming the guide pin fixing groove 1a will be briefly described. FIG. 4 is a schematic perspective view illustrating a main part manufacturing process of the substrate 1 of the optical semiconductor module according to the present embodiment. As shown in the figure, a silicon oxide film 10 is formed on the upper surface of a silicon substrate 1 ', and a rectangular opening 10a along the [011] direction is formed by PEP and wet etching. Further, using the silicon oxide film 10 as a mask, the opening 10a is wet-etched with a KOH aqueous solution, thereby {111} as shown in FIG.
A fixed groove 1a 'composed of a surface is formed. By cutting the substrate 1 'along the two-dot chain line shown in FIG. 4, the substrate 1 having the guide pin fixing groove 1a can be formed.

Next, a second embodiment of the present invention will be described. FIG. 5 is a schematic sectional view of the optical semiconductor module according to the present embodiment. As shown in the figure, in the present embodiment, a groove 7a is formed on the lower surface of the guide pin holder 7, the gap at the lower part is narrow, and the amount of the adhesive 6 filled in the gap is small. Also in the present embodiment, the bonding area is wide and uniform, and the bonding to the guide pin holder 7 is also wide, so that the rigidity of the guide pin holder 7 is also added, and the guide pin fixing strength can be uniform and large. Furthermore, in this embodiment, since the gap below the guide pin holder 7 is narrow, the thickness of the adhesive 6 filling the gap can be reduced. Therefore, the heat distortion of the adhesive 6 due to the difference in the linear expansion coefficient between the adhesive 6 and the adherend is reduced, and the reliability of fixing the guide pins can be improved.

Further, according to the present embodiment, since the thickness of the adhesive 6 is small, a sheet-like adhesive can be used, so that the manufacturing process of fixing the guide pins is simplified and the cost can be reduced.

Also, in the present embodiment, as in the first embodiment described above, since there is a heat dissipation path for conducting heat from the guide pin 5 to the area between the guide pins, heat conduction to an optical connector (not shown) is provided. It is possible to provide an optical semiconductor module with less optical axis deviation by suppressing the optical axis deviation.

Next, a third embodiment of the present invention will be described. FIG. 6 is a schematic plan view illustrating a main part of the substrate 1 of the optical semiconductor module according to the present embodiment. FIG. 7 shows FIG.
FIG. 5 is a schematic cross-sectional view illustrating an adhesive filling step according to the present embodiment, taken along line AA of FIG. As shown in these drawings, in the present embodiment, in the present embodiment, the guide pin holder 7 is provided with a circular through hole 8 penetrating vertically. In the present embodiment, the guide pin 5
When fixing the guide pin, the guide pin 5 is housed in the guide pin fixing groove 1a of the substrate 1, and the guide pin holder 7 is arranged on the guide pin so as to cover the area between the guide pins. The gap under the guide pin holder is filled with an adhesive 6 and cured to form the guide pin 5.
And the guide pin holder 7 is fixed. Therefore, also in the present embodiment, the bonding area is wide and uniform, and since the bonding is widely performed with the guide pin holder 7, the rigidity of the guide pin holder 7 is added, and the guide pin fixing strength can be uniform and large. Further, since the adhesive 6 can be filled from the through hole 8, the controllability of the amount of the adhesive is improved, and the filling time of the adhesive is shortened, so that the productivity is improved and the cost can be reduced.

Also, in the present embodiment, as in the first embodiment described above, since there is a heat dissipation path for transmitting heat from the guide pin 5 to the area between the guide pins, heat conduction to an optical connector (not shown) is provided. It is possible to provide an optical semiconductor module with less optical axis deviation by suppressing the optical axis deviation.

On the other hand, as the adhesive 6 in the present embodiment, a photocurable adhesive can be used. After filling the adhesive 6 from the through hole 8 to the lower side of the guide pin holder, the adhesive 6 is cured by irradiating curing light from the side surface and the upper side of the guide pin holder 7.

In general, the photocurable adhesive can shorten the process time because the curing time is short, but it does not cure unless curing light is sufficiently irradiated. However, according to the present embodiment, the entire adhesive can be irradiated with curing light sufficient to cure the adhesive 6 through the through hole 8 because of the presence of the through hole 8. As a result, the productivity is improved, the production yield is improved, and the cost can be reduced.

Further, by increasing the number of through holes 8 or increasing the size of the holes, the guide pin holder 7 can be irradiated with the adhesive 6 on the lower side by increasing the penetrating area to increase the amount of curing light. Thereby, the curing time of the adhesive 6 can be shortened.

As the photocurable adhesive that can be used in the present embodiment, an adhesive that is cured by irradiation with ultraviolet light or visible light can be used. Examples of the ultraviolet curable adhesive include an epoxy adhesive, an acrylic adhesive, and a silicone adhesive. Further, as a visible light curable adhesive, for example,
An acrylic adhesive can be used. The light absorption characteristics of these adhesives can be adjusted according to the light absorption characteristics of the photopolymerization initiator mixed in the solvent.

In the optical semiconductor module and the method of manufacturing the same according to the present embodiment, the through-holes 8 are provided in the guide pin holder 7, so that the process time is shortened and the manufacturing yield is improved. And an optical semiconductor module excellent in mass productivity can be obtained.

The embodiment of the invention has been described with reference to specific examples.

However, the present invention is not limited to these specific examples. For example, the number of guide pins 5 constituting the optical semiconductor module is not limited to one pair, and may be three or more. The planar shape of the guide pin holder 7 is not limited to a rectangle, but may be a circle, an ellipse, or a more complicated shape. The shape of the through hole 8 is not limited to a circle, but may be an ellipse, a rectangle, a polygon, or a more complicated shape.

[0054]

The present invention is embodied by the above-described embodiment, and has the following effects. First, according to the present invention, a guide pin holder is arranged above a guide pin, and an adhesive is filled in a gap below the guide pin holder,
Since a new heat dissipation path is provided, heat conduction from the optical semiconductor module to the optical connector can be suppressed, and the optical axis can be prevented from being shifted due to a rise in temperature. That is, heat generated from the optical semiconductor element or the IC has many components that are transmitted to an optical connector (not shown) via the guide pins, but the heat is transmitted from the guide pins to a region between the guide pins via the guide pin holder and the adhesive. By providing a path for dissipating heat from the heat sink through the board, the heat conduction of the guide pins can be reduced, the temperature rise of the optical connector can be suppressed, and the optical axis shift due to thermal distortion can be eliminated. . At the same time, the adhesive for fixing the guide pins can be prevented from being heated, so that the deterioration of the adhesive due to thermal distortion can be suppressed.

Further, according to the present invention, the guide pin holder is separated from the end face of the substrate by L / 2 or more, so that the temperature rise of the optical connector can be effectively suppressed irrespective of the kind of the material of the guide pin holder.

According to the present invention, since the heat conduction to the optical connector can be suppressed as described above, the durability and reliability related to heat of the optical communication system can be improved. For example, an optical communication system that operates with high reliability by suppressing the optical axis shift of the coupling part due to temperature rise even under severe conditions such as inside various electronic devices with high ambient temperature, desert or outer space. Can be realized.

According to the present invention, good transmission characteristics can be obtained using an optical connector having lower heat resistance than before, and an optical communication system can be provided at low cost. .

Further, according to the present invention, by filling the lower portion of the guide pin holder with the adhesive, the bonding area is uniform and increased, the thickness of the adhesive becomes uniform, and the rigidity of the guide pin holder is fixed to the guide pin. In addition to the strength, the guide pin fixing strength is improved, and the manufacturing yield is improved, so that the cost can be reduced and an optical semiconductor module excellent in mass productivity can be obtained.

Further, according to the present invention, by providing a through hole in the guide pin holder, the filling of the adhesive becomes easy, the process time is shortened, and the cost can be reduced.
Further, the use of the photocurable adhesive shortens the curing time and improves the production yield, so that the cost can be reduced and an optical semiconductor module excellent in mass productivity can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view illustrating an internal structure of an optical semiconductor module according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of the internal structure of the optical semiconductor module according to the first embodiment of the present invention as viewed from above.

FIG. 3 is a schematic sectional view taken along line AA of FIG. 2;

FIG. 4 is a schematic cross-sectional view illustrating a cross-sectional structure of a guide pin fixing groove 1a provided in the substrate 1.

FIG. 5 is a schematic sectional view illustrating an internal structure of the optical semiconductor module according to the embodiment.

FIG. 6 is a schematic plan view illustrating an internal structure of the optical semiconductor module according to the embodiment.

FIG. 7 is a schematic cross-sectional view taken along line AA of FIG. 6, illustrating an optical semiconductor module adhesive filling step according to the embodiment.

FIG. 8 is a schematic plan view illustrating an internal configuration of a conventional optical semiconductor module.

[Explanation of symbols]

 1, 101 guide pin fixing substrate 1a, 101a fixing groove 1c end surface 2a, 102a optical semiconductor element 2b, 102b IC 3, 103 optical fiber 4, 104 optical fiber holder 5, 105 guide pin 5a constricted portion 6, 106 adhesive 7 guide Pin holder 8 Through hole

Claims (5)

[Claims] 1. A substrate, an optical semiconductor device provided on the substrate, and an optical semiconductor device provided on the substrate, one end of which is optically coupled to the optical semiconductor device and the other end extending to an end of the substrate. An optical fiber, and a guide pin disposed substantially parallel to the optical fiber and provided so as to partially protrude from an end surface of the substrate, wherein the protruding portion of the guide pin is provided in an optical connector. An optical semiconductor module configured to fit into the recessed part, further comprising a guide pin holder provided so as to cover a part of the guide pin, wherein the guide pin holder is provided between the pair of guide pins. And the guide pin holder is fixed to the substrate by an adhesive filling at least a part of a gap between the guide pin holder and the lower surface of the guide pin holder. And an optical semiconductor module, characterized by being fixed to the substrate. 2. The apparatus according to claim 1, wherein a distance between said guide pin holder and said end surface of said substrate is at least half of a length of a portion of said guide pins arranged on said substrate. The optical semiconductor module according to claim 1, wherein 3. The optical semiconductor module according to claim 1, wherein said guide pin holder has at least one through hole penetrating the upper and lower surfaces thereof. 4. A substrate, an optical semiconductor device provided on the substrate, and an optical semiconductor device provided on the substrate, one end of which is optically coupled to the optical semiconductor device and the other end extending to an end of the substrate. An optical fiber, a guide pin provided so as to partially protrude from an end face of the substrate, and a guide pin provided so as to cover a part of the guide pin and having a through hole penetrating the upper and lower surfaces thereof. A method for manufacturing an optical semiconductor module, comprising: a holder; and wherein the protruding portion of the guide pin is fitted to an optical connector, wherein the step of disposing the guide pin on the substrate; An optical semiconductor module, comprising: a step of disposing the guide pin holder on the guide pin; a step of injecting an adhesive through the through hole; and a step of curing the adhesive. Manufacturing method Le. 5. The method according to claim 1, wherein the adhesive is a photo-curable adhesive, and the step of curing the adhesive includes irradiating light for curing the adhesive through the through-hole. The method for manufacturing an optical semiconductor module according to claim 4, wherein the method is a step of curing.