JP2008197173A - Optical communication module, electronic equipment, manufacturing method of optical communication module, and manufacturing method of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate electric connection between a light emitting element or light receiving element and an external terminal while positioning accuracy of the light emitting or receiving element and an optical fiber is improved. <P>SOLUTION: The optical communication module is configured to have: an insulating first planar member 13 having an optical waveguide and an optical fiber inserting guide 131 on one end face of the optical waveguide; an electrically conductive second planar member 15 installed in the upper part of the first planar member; an electrically conductive third planar member 11 installed in the lower part of the first planar member; and an element section 31 installed on the other end face of the optical waveguide of the first planar member and provided with a light emitting element or a light receiving element, wherein the element section is electrically connected to the second planar member 15 and the third planar member 11. Thus, the first and the second planar members are made electrically conductive and used as external connecting terminals. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical communication module and a manufacturing method thereof, and more particularly to an optical communication module that optically connects a light emitting element or a light receiving element and an optical fiber and a manufacturing method thereof.

  Data transmission using an optical fiber is performed. Such technology starts with long-distance communication technology represented by submarine cables and the like, and is recently applied to data transmission between various devices such as a server area network (SAN).

A component called a module including a light emitting element or a light receiving element is attached to the end of the optical fiber. For example, in Patent Document 1 below, in an optical semiconductor element module in which a lens is disposed on an optical path of light emitted from an optical semiconductor element, the lens holder that houses the lens is fixed on the optical path of light. A technique for reducing an optical axis angle shift due to a rotation error is disclosed.
JP-A-5-243688 JP 2004-325999 A JP 2004-264505 A

  However, in the optical communication module described in Patent Document 1, the light emitting element or the light receiving element, the lens, and the core end face of the optical fiber must be aligned with high accuracy, and the attachment of each element is performed. Has a three-dimensional degree of freedom, and it takes time and effort to adjust it.

  Therefore, the present applicant has studied various improvements in the configuration of the optical communication module as described in Japanese Patent Application Laid-Open No. 2004-325999 (Patent Document 2) and Japanese Patent Application Laid-Open No. 2004-264505 (Patent Document 3). Yes.

  However, in the technique described in the above publication, the examination of the electrical connection configuration of the light emitting element or the light receiving element in the optical communication module has been insufficient.

  The present invention has been made in view of the above circumstances, and facilitates electrical connection between a light emitting element or a light receiving element and an external terminal while improving alignment accuracy of the light emitting element or the light receiving element and the optical fiber. An object of the present invention is to provide an optical communication module that can be used. Another object of the present invention is to provide an optical communication module manufacturing method that can simplify the manufacturing process of the optical communication module and reduce the manufacturing cost.

  (1) An optical communication module according to the present invention includes an insulating first plate-like member in which an optical waveguide and a guide for inserting an optical fiber are provided on one end face side of the optical waveguide, and the first A conductive second plate-like member provided above the plate-like member, a conductive third plate-like member provided below the first plate-like member, and the first plate A light emitting element or a light receiving element provided on the other end face side of the optical waveguide of the shaped member, and the element portion is electrically connected to the second plate shaped member and the third plate shaped member. Connected.

  According to this configuration, it is possible to improve the alignment accuracy between the light emitting element or the light receiving element and the optical fiber. Moreover, since the first and second plate-like members are conductive, they can be used as terminals for external connection.

  The element portion is made of a thin film element and is in close contact with the other end face of the optical waveguide. According to this configuration, the alignment accuracy between the light emitting element or the light receiving element and the optical fiber can be further improved. Moreover, the optical coupling efficiency can be improved.

  The element portion includes at least two electrodes, and is disposed so that the light emitting element or the light receiving element faces the other end surface of the optical waveguide, and the second and third plate-like members face each other. Like face down bonding. Thus, even if the element portion is a device having an electrode such as a bump, for example, it can be connected to the second and third plate-like members by face-down bonding.

  An optical fiber is inserted into the guide. As described above, it is possible to align the light emitting element or the light receiving element and the optical fiber only by inserting the optical fiber into the guide.

  The optical communication module further includes a socket having first and second terminals, and is mounted so that the first and second terminals are in contact with the second and third plate-like members. According to this configuration, the connection between the socket terminal and the element portion (second and third plate-like members) can be easily achieved.

  The optical communication module further includes an electronic substrate provided with at least two conductive portions, and the conductive portions and the second and third plate-like members are electrically connected. According to this configuration, it is possible to easily connect the electronic substrate and the element portion (second and third plate-like members).

  (2) An optical communication module according to the present invention has an insulating property in which a plurality of optical waveguides and a plurality of optical fiber insertion guides provided on one end face side of the plurality of optical waveguides are provided. A first plate member, a second plate member provided above the first plate member, a third plate member provided below the first plate member, A plurality of element portions each having a light emitting element or a light receiving element provided on one end face side of the plurality of optical waveguides of the first plate member, and the second plate member includes the plurality of element portions. A plurality of first conductive portions positioned on the guide and a plurality of first insulating portions that electrically insulate the plurality of first conductive portions, and the third plate-shaped member includes the plurality of first plate-like members. A plurality of second conductive portions located under the guides of the plurality and a plurality of second conductive portions electrically insulating the plurality of second conductive portions. And an insulating portion, the plurality of element portions are connected to the second conductive portion and electrically positioned the first conductive portion and positioned on top thereunder respectively.

  According to such a configuration, the alignment accuracy of each of the plurality of light emitting elements or light receiving elements and the plurality of optical fibers can be improved. In addition, transmission and transmission / reception of a signal having a plurality of channels can be performed. In addition, since the plurality of first and second conductive portions are electrically separated by the insulating portion, vibration (mutual influence) between signals transmitted by these conductive portions can be reduced. Therefore, transmission of a signal in a high frequency band is possible.

  The optical communication module further includes a socket having a plurality of first and second terminals, and is mounted so that the first and second terminals and the first and second conductive portions are in contact with each other. According to this configuration, the connection between the socket terminal and the element portion (second and third plate-like members) can be easily achieved.

  The optical communication module further includes an electronic substrate provided with a plurality of conductive portions, and the conductive portions and the second and third plate-like members are electrically connected to each other. According to this configuration, it is possible to easily connect the electronic substrate and the element portion (second and third plate-like members).

  (3) An electronic apparatus according to the present invention includes the optical communication module.

  According to such a configuration, the characteristics of the electronic device can be improved.

  (4) The method for manufacturing an optical communication module according to the present invention includes an insulating first plate-like member in which an optical waveguide and a guide for inserting an optical fiber are provided on one end face side of the optical waveguide. A step of joining so as to be sandwiched between the conductive second plate-like member and the conductive third plate-like member; and a light emitting element or a light emitting element on the other end face side of the optical waveguide of the first plate-like member A step of bonding an element portion having a light receiving element, and a step of inserting an optical fiber into the guide.

  According to this method, the alignment accuracy between the light emitting element or the light receiving element and the optical fiber can be improved. In addition, since the first and second plate-like members are conductive, they can be easily connected to an electronic substrate or the like in the subsequent steps using these as external connection terminals. In addition, the manufacturing cost can be reduced.

  A step of attaching the first to third plate-like members joined to a socket having first and second terminals, the first and second terminals and the second and third plate-like members. A step of mounting so as to contact the According to this method, the connection between the terminal of the socket and the element portion (second and third plate-like members) can be easily achieved.

  The bonded first to third plate-like members are mounted on an electronic board having at least two conductive portions on the top, and the conductive portions and the second and third plate-like members are mounted. Electrically connecting. According to such a method, the connection between the electronic substrate and the element portion (second and third plate-like members) can be easily achieved.

  (5) A method for manufacturing an electronic device according to the present invention includes the method for manufacturing the optical communication module.

  According to this method, a high-performance electronic device can be manufactured at a low cost.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or related code | symbol is attached | subjected to what has the same function, and the repeated description is abbreviate | omitted.
<Embodiment 1>
(Optical communication module configuration)
The configuration of the optical communication module of the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing the configuration of the optical communication module of the present embodiment. FIG. 2 is an exploded perspective view showing the configuration of the optical communication module of the present embodiment. FIG. 3 is a top view of the optical communication module of the present embodiment, and FIGS. 4 and 5 are cross-sectional views. 4 and 5 correspond to the AA cross section and the BB cross section of FIG. 3.

  As shown in FIG. 1, the optical communication module of the present embodiment is composed of a plurality of plate-like members (blocks).

  That is, the optical communication module of the present embodiment has a configuration in which the plate member 13 is sandwiched between the plate member 11 and the plate member 15. Here, the plate-like members 11 and 15 are made of a conductive material. The plate member 13 is composed of two (two layers) insulating plate members 13A and 13B. These plate-like members 13A and 13B are provided with notches (guides, recesses, and openings) 131A and 131B that serve as insertion portions for the optical fiber 21, respectively (see FIG. 2). An optical waveguide 133 is provided on the surface of the lower plate member 13A. The optical waveguide 133 is made of, for example, a resin material embedded in a groove G (see FIG. 6A) on the surface of the plate member 13A. The optical waveguide 133 extends from one end of the plate-like member 13A (here, substantially the center of the side surface SC) to the notch 131A. Here, the side surface SC refers to the side surface on the opposite side to the insertion portion among the side surfaces orthogonal to the optical fiber 21.

  Here, a micro tile optical element (element part) 31 is provided at one end of the optical waveguide 133. The micro tile optical element 31 is a semiconductor device having a micro tile shape (plate shape, thin film), for example, a rectangular plate member having a thickness of 1 μm to 20 μm and a vertical and horizontal size of several tens μm to several hundred μm. . The shape of the micro tile element is not limited to a quadrangle, and may be another shape.

  The micro tile optical element 31 includes a light emitting element or a light receiving element. This light emitting element or light receiving element (hereinafter referred to as “element portion”) is aligned so as to face the optical waveguide 133. The micro tile optical element 31 includes pad electrodes (external connection terminals) 33A and 33B (see FIG. 8A). The pad electrodes 33A and 33B are electrically connected to the plate members 11 and 15, respectively. It is connected using the sex members 35A and 35B.

  A surface emitting laser is suitable as the light emitting element included in the micro tile optical element 31. In addition, an LED or the like can be applied. As the light receiving element provided in the micro tile optical element 31, for example, a photodiode, a phototransistor, or the like can be applied. Here, as the photodiode, a PIN photodiode, an APD (avalanche photodiode), or an MSM (Metal-Semiconductor-Metal) photodiode can be selected according to the application. APD has high photosensitivity and response frequency. The MSM type photodiode has a simple structure and is easily integrated with an amplifying transistor. These micro tile optical elements 31 are designed so that light can be emitted or received from the surface facing the optical waveguide 133.

  Note that the optical waveguide 133 is provided so as to penetrate the plate-like member 13, and other materials can be used as long as it is a member (including solid, liquid, or gas) through which light propagates in addition to the resin. It may be used.

  As described above, the optical fiber 21 inserted on the one end face side of the optical waveguide 133 and the micro tile optical element 31 provided on the other end face side of the optical waveguide 133 are optically coupled via the optical waveguide 133. A ferrule 23 is disposed on the outer periphery of the optical fiber 21.

  According to the above configuration, the alignment of the micro tile optical element 31 and the other end surface of the optical waveguide 133 is only performed by positioning the micro tile optical element 31 in two dimensions on the side surface (SC) of the plate member 13. It's okay.

  Further, the optical fiber 21 and the light emitting element or the light receiving element of the micro tile optical element 31 can be connected with high optical coupling efficiency simply by inserting one end of the optical fiber 21 into the notch 131.

  Furthermore, according to the present embodiment, the plate-like members 11 and 15 are made of a conductive material, and the pad electrodes 33A and 33B of the micro tile optical element 31 are connected. It can be used as an extraction electrode.

  Therefore, as will be described in detail later, for example, electrical connection when mounting the optical communication module (the plate-like members 11, 13, and 15) on the electronic substrate 100 is facilitated.

Below, while explaining the manufacturing method of the optical communication module of this Embodiment, the structure is further clarified.
(Method for manufacturing optical communication module)
6 to 8 are perspective views showing a method for manufacturing the optical communication module of the present embodiment.

  First, the manufacturing method of the plate-like member 13 will be described with reference to FIG. As shown in FIG. 6A, an insulating plate-like member 13A is prepared, and a groove G is formed in the center thereof. The groove G can be formed by an etching method, a cutting method, a laser processing method, or the like. Further, the groove G may be formed by a stamper or injection shaping.

  Next, as illustrated in FIG. 6B, a resin is embedded in the groove G. This resin is formed by applying a liquid member to the entire surface of the plate-like member 13A including the inside of the groove G and removing the resin on the surface of the plate-like member 13A. Alternatively, the liquid resin may be discharged and formed only inside the groove G using a dispenser, an ink jet method, or the like.

  Next, as shown in FIG. 6C, the plate member 13B is joined (bonded) onto the plate member 13A. For this bonding, for example, an insulating adhesive can be used. Alternatively, a resin filling the groove G may be used as an adhesive. That is, a liquid member may be applied to the entire surface of the plate-like member 13A including the inside of the groove G, and the plate-like member 13B may be pressed.

  Here, the sum of the thicknesses TA and TB of the plate-like members 13A and 13B is set to be substantially the same as the outer diameter of the ferrule 23 or slightly larger so as to give a slight clearance. Further, the thickness TA is set so as to correspond to the height of the optical fiber 21. That is, the optical waveguide 133 of the plate-like member 13A is set so as to be positioned at the substantially central portion C of the thickness after bonding.

  Next, as shown in FIG. 6D, notches 131 (131A, 131B) for inserting optical fibers are formed in the joined plate-like members 13A, 13B. This notch can be formed by cutting or laser processing. Here, the notch 131 is formed from the substantially central part of one side of the joined plate-like members 13A and 13B over the width W and the length L. The width W is set to be almost the same as the diameter of the outer diameter of the ferrule 23 or slightly larger so as to give a slight clearance.

  In addition, it is better to increase the width W toward the open end and to have a tapered shape. Further, the open end portion may be chamfered. Thus, the optical fiber (ferrule 23) 21 can be easily inserted by devising the shape of the notch. Here, the insertion direction of the optical fiber 21 is the x direction, the direction orthogonal thereto is the y direction, and the stacking direction of the plate-like members 13A and 13B is the z direction.

  Here, the optical waveguide 133 is formed in a quadrangular prism shape, and the upper surface of the quadrangular prism shape is configured to be flush with the upper surface of the plate member 13A. However, the shape of the optical waveguide 133 is limited to a quadrangular prism shape. It is not something. For example, a polygonal column shape other than a quadrangular column, a cylindrical shape, or an elliptical column shape may be used. Further, it is preferable to provide the optical waveguide 133 so that the upper surface of the optical waveguide 133 is flush with the surface of the plate-like member 13A. However, even if the optical waveguide 133 is formed so as to penetrate the inside of the plate-like member. Good. Of course, the optical waveguide 133 may be provided on the back surface of the plate-like member 13B. Further, the optical waveguide 133 may be formed so as to be embedded in the plate-like members 13A and 13B by half. In this way, the cylindrical optical waveguide 133 can be easily formed.

  Next, as shown in FIG. 7, the plate member 15 is bonded onto the plate member 13 using an adhesive or the like, and the plate member 11 is bonded below the plate member 13. That is, the plate member 13 is joined so as to be sandwiched between the plate members 11 and 15. Here, the plate-like member 15 has a length in the x direction shorter than that of the plate-like member 13, and the optical fiber insertion side of the joint surface is tapered (chamfered). The plate-like member 11 is longer in the x direction than the plate-like member 13. Further, the side surfaces SC of the plate-like members 11, 13, and 15 on the opposite side to the optical fiber insertion side are aligned so as to form a series of surfaces.

  Next, as shown in FIG. 8, the optical waveguide 133 exposed from the side surface SC and the micro tile-shaped optical element 31 are aligned with the side surface SC and bonded with an adhesive or the like. Next, the pad electrode 33A located on the surface (surface opposite to the bonding surface) of the micro tile optical element 31 is connected to the plate member 11 with the conductive member 35A (electrical wiring is applied). . Further, the pad electrode 33B located on the surface of the micro tile optical element 31 and the plate member 15 are connected by a conductive member 35A. The conductive material (wiring) 35A, 35B is, for example, applied a conductive paste or conductive ink from the pad electrode to the plate-like member using a dispenser drawing method, an ink jet method, a screen printing method, a tampo printing method, It can be formed by solidifying.

  As described above, according to the present embodiment, since the micro tile-shaped optical element 31 is closely mounted, the distance between the element portion and the optical waveguide 133 can be reduced, and the optical coupling efficiency can be improved. it can. Further, since the micro tile optical element 31 is used, the step between the pad electrodes 33A and 33B and the side surface SC is reduced, and the formation of the wirings 35A and 35B is facilitated.

  Next, the optical fiber 21 with the ferrule 23 attached is inserted into the notch 131 and fixed with an adhesive or the like. Thereafter, the side surface SC is covered with an insulating resin to protect the micro tile optical element 31 and the wirings 35A and 35B.

  As described above, according to the present embodiment, since the plate-like members 11 and 15 are made of a conductive material and the terminals 33A and 33B of the micro tile optical element 31 are connected, the plate-like members 11 and 15 themselves are connected to the outside. It can be used as an extraction electrode. Further, the step of separately forming the external lead electrode can be omitted. In addition, since the micro tile optical element 31 is mounted in the very vicinity of the plate members 11 and 15, the plate members 11 and 15 are excellent in addition to conductivity such as metal, graphite, and carbon nanotube composite material. By using a material having thermal conductivity, the heat dissipation of the micro tile optical element 31 is enhanced, and the element characteristics are improved.

  Below, the connection method of an optical communication module is demonstrated, referring FIG. 9 and FIG. 9 and 10 are diagrams illustrating an example of a method of connecting the electronic substrate and the optical communication module. 9 is a cross-sectional view, and FIG. 10 is a perspective view.

  In FIG. 9, a socket 103 provided with an electrode 103a facing an electrode (terminal, wiring) 100a on an electronic substrate 100 is provided. The height of the socket 103 (distance between the electrodes 100a and 103a) is set to be approximately the same as the thickness of the optical communication module (the total thickness of the plate-like members 11, 13 and 15). By inserting, the electrode 100a and the electroconductive plate-shaped member 11 contact, and the electrode 103a and the electroconductive plate-shaped member 15 contact. Therefore, electrical connection between the electrodes 100a and 103a and the micro tile optical element 31 is achieved. That is, a signal output from the electronic substrate 100 can be converted into an optical signal by the micro tile optical element 31 and transmitted to the optical fiber 21. Conversely, the signal transmitted to the optical fiber 21 can be converted into an electrical signal by the micro tile-shaped micro tile optical element 31 and input to the electronic substrate 100. Instead of using the electronic substrate 100, electrodes 100a and 103a facing the inside of the socket may be provided, and the socket may be built in the electronic device.

  In FIG. 9, the socket 103 is used. However, as shown in FIG. 10, the optical communication module itself may be directly mounted on a land (conductive part, wiring part, wiring pattern) on the electronic substrate. .

  Here, first, as shown in FIG. 10, optical communication modules (plate-like members 11, 13, and 15) are arranged above the lands 105 a and 105 b on the electronic substrate 100. At this time, the surfaces (front surface, back surface) orthogonal to the side surface SC are arranged in contact with the lands 105a and 105b, and the land 105a and the conductive plate member 11 are fixed by the solder 107a and are electrically connected. Further, the land 105b and the conductive plate-like member 15 are fixed with the solder 105b and the electrical connection is achieved.

  As described above, according to the present embodiment, the plate-like members 11 and 15 themselves can be used as the external extraction electrode, and the connection with the electronic substrate 100 is facilitated. That is, since the plate-like members 11 and 15 themselves are external lead electrodes, alignment with the electrodes such as the electronic substrate 100 is facilitated, and connection failures can be reduced. In addition, a large connection area can be ensured, and signal transmission characteristics can be improved. Further, as shown in FIGS. 9 and 10, since the formation surface (side surface SC) of the micro tile optical element 31 does not become a connection surface, the micro tile optical element 31 is attached to the socket 103 or soldered. Damage to the can be reduced. The electronic substrate is incorporated into various electronic devices. Therefore, data transmission between various electronic devices can be performed using optical signals.

  Moreover, in the said embodiment, although the micro tile-shaped optical element 31 was directly joined to the plate-shaped member 13 as a component using the adhesive agent, it is desirable to join using the epitaxial lift transfer method. FIG. 11 shows a cross-sectional view of the transfer process of the micro tile optical element 31.

  As shown in FIG. 11A, on a substrate 73 made of, for example, a gallium / arsenic compound semiconductor, a sacrificial layer 74A made of, for example, aluminum / arsenic (AlAs) and having a thickness of, for example, several hundred nm is formed. Form. Further, a functional layer 74B is formed on the upper portion, and an optical element (for example, a surface emitting laser) 75, pad electrodes 33A and 33B, and wirings (not shown) for connecting them are formed on the main surface. As the optical element 75, other functional elements such as a phototransistor (PD) may be formed in addition to the surface emitting laser (VCSEL). In addition to the optical element 75, a circuit element such as a driver circuit or an APC circuit made of a high electron mobility transistor (HEMT), a hetero bipolar transistor (HBT), or the like may be formed. These optical elements and circuit elements are each formed by laminating a semiconductor layer, an insulating layer, and a conductive layer on the substrate 73 while patterning. Next, the intermediate transfer film 77 is attached to the surface of the substrate 73 (on the optical element 75 side), only the sacrificial layer 74A is selectively etched, and the substrate 73 is peeled off. As the selective etching solution, for example, low concentration hydrochloric acid having high selectivity with respect to aluminum / arsenic is used. As a result, the optical element 75 and the pad electrodes 33A and 33B are transferred to the intermediate transfer film 77.

  Thereafter, the semiconductor device or the like is pressed over the intermediate transfer film with, for example, a back-pressing rod 79 to join the plate-like member 13 to which the adhesive 71 is applied, and the intermediate transfer film is peeled off. If such a transfer method is used, even the micro tile optical element 31 can be easily transferred to the plate member 13.

  In the above embodiment, the pad electrodes 33A and 33B are provided on the front surface of the micro tile optical element 31, but the pad electrodes 33A and 33B are provided on the back surface and directly contact the plate members 11 and 15. You may connect. In this case, the interval between the pad electrodes 33A and 33B of the micro tile optical element 31 needs to be larger than the sum of the thicknesses TA and TB of the plate members 13A and 13B. Further, it is desirable to use an anisotropic conductive paste or the like as the adhesive 71.

In the above embodiment, the optical waveguide 133 has a quadrangular prism shape. However, the optical waveguide 133 may have a tapered shape (substantially a quadrangular pyramid shape) so that the cross section on the side surface SC side becomes large. In this case, alignment between the optical waveguide 133 and the micro tile optical element 31 is further facilitated.
<Embodiment 2>
In the first embodiment, the micro tile element 31 is used, but an optical device (semiconductor chip) 51 having a certain thickness may be used.

  FIG. 12 is a cross-sectional view showing the configuration of the optical communication module of the present embodiment. In addition, since the place different from Embodiment 1 is only the part of the optical device 51, the said site | part is demonstrated in detail. Further, portions corresponding to those in the first embodiment are denoted with the same reference numerals.

  As shown in FIG. 12, the optical device 51 is arranged on the side surface SC of the optical communication module to which the plate-like members 11, 13, and 15 are joined. At this time, the optical waveguide 133 exposed from the side surface SC and the optical element on the surface of the optical device 51 are aligned and joined. Here, bump electrodes 51 a and 51 b formed on the surface of the optical device 51 are face-down flip-chip bonded so as to be bonded to the side surfaces of the plate-like members 11 and 15.

Thus, according to this Embodiment, since the plate-shaped members 11 and 15 were made into electroconductivity, the connection with the optical device 51 can be aimed at using the side surface. At this time, if the bump electrode exposed on the surface is used, the connection becomes easy. When the optical device 51 is flip-chip mounted, a gap is formed between the optical waveguide 133 and the end of the optical waveguide 133, and the reflection loss of light at the end of the optical waveguide 133 increases. In order to avoid this, it is desirable to fill the gap with an underfill material having a refractive index close to that of the optical waveguide 133. The effect of increasing the flip-chip bonding strength by filling the underfill and the effect of protecting the optical elements on the surface of the optical device 51 are also obtained.
<Embodiment 3>
In the first embodiment, one cutout 131 serving as an insertion hole for the optical fiber 21 is provided, but a plurality of cutouts (optical fiber 21) 131 may be provided in the optical communication module.

  13 and 14 are diagrams showing the configuration of the optical communication module according to the present embodiment. FIG. 13 is a top view, and FIG. 14 is a perspective view. As shown in the drawing, a plurality of notches 131 which are insertion holes for the optical fiber 21 are provided. In addition, the same code | symbol is attached | subjected to the location corresponding to Embodiment 1, and the description is abbreviate | omitted.

  As shown in FIG. 13, in the present embodiment, a plurality of plate-like members 11 and 15 are arranged via spacers 11S and 15S. The spacers 11 </ b> S and 15 </ b> S are made of insulating plate-like members and insulate between the plurality of plate-like members 11 and between the plurality of plate-like members 15.

  Thus, in the present embodiment, optical coupling can be easily performed by simply inserting a plurality of optical fibers into a plurality of notches. Each optical fiber can be used for transmission and reception. Moreover, it can be used for transmission / reception of a plurality of channels (frequency).

  Note that, among the plurality of plate-like members 11 and 15, an electrode to which a common potential (for example, ground potential) is applied may be common. That is, you may comprise with a series of electroconductive plate-shaped members, without using a spacer. However, when a signal in a high frequency band is used, it is preferable to use a spacer in order to reduce resonance (vibration) between the signals and noise caused thereby.

  The optical communication module of the present embodiment may be mounted on the socket 103 or the lands (105a, 105b) on the electronic board as described with reference to FIGS. 9 and 10 in the first embodiment. In this case, a plurality of electrodes and lands are provided on the socket and the electronic substrate so as to correspond to the plurality of electrode pairs (plate members 15 and 11).

  The present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, the examples described with specific numerical values in the above-described embodiment are merely examples, and do not limit the scope of application of the present invention. In addition, the various configurations described through the above-described embodiments can be used in appropriate combination according to the application, or with changes or improvements.

1 is a perspective view illustrating a configuration of an optical communication module according to Embodiment 1. FIG. 1 is an exploded perspective view showing a configuration of an optical communication module according to Embodiment 1. FIG. 3 is a top view of the optical communication module according to Embodiment 1. FIG. 2 is a cross-sectional view of the optical communication module according to Embodiment 1. FIG. 2 is a cross-sectional view of the optical communication module according to Embodiment 1. FIG. FIG. 6 is a perspective view illustrating a method for manufacturing the optical communication module according to the first embodiment. FIG. 6 is a perspective view illustrating a method for manufacturing the optical communication module according to the first embodiment. FIG. 6 is a perspective view illustrating a method for manufacturing the optical communication module according to the first embodiment. It is sectional drawing which shows an example of the connection method of an electronic substrate and an optical communication module. It is a perspective view which shows an example of the connection method of an electronic substrate and an optical communication module. 6 is a cross-sectional view showing a transfer process of the micro tile optical element 31. FIG. FIG. 6 is a cross-sectional view illustrating a configuration of an optical communication module according to a second embodiment. FIG. 6 is a top view illustrating a configuration of an optical communication module according to a third embodiment. FIG. 6 is a perspective view illustrating a configuration of an optical communication module according to a third embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Plate-shaped member, 11s ... Spacer, 13, 13A, 13B ... Plate-shaped member, 15 ... Plate-shaped member, 15s ... Spacer, 21 ... Optical fiber, 23 ... Ferrule, 31 ... Micro tile-shaped optical element, 33A, 33B ... Pad electrode, 35A, 35B ... Conductive material (wiring), 51 ... Optical device, 51a, 51b ... Bump electrode, 71 ... Adhesive, 73 ... Substrate, 74A ... Sacrificial layer, 74B ... Functional layer, 75 ... Semiconductor device , 77 ... Intermediate transfer film, 79 ... Collet, 100 ... Electronic substrate, 100a, 103a ... Electrode, 103 ... Socket, 105a, 105b ... Land, 107a, 107b ... Solder, 131, 131A, 131B ... Notch, 133 ... Optical Waveguide, G ... groove, SC ... side, TA, TB ... thickness, W ... width, L ... length

Claims (14)

An insulating first plate-like member in which an optical waveguide and a guide for inserting an optical fiber are provided on one end face side of the optical waveguide;
A conductive second plate-like member provided above the first plate-like member;
A conductive third plate-like member provided below the first plate-like member;
A light emitting element or a light receiving element provided on the other end face side of the optical waveguide of the first plate-shaped member, and
The optical communication module, wherein the element portion is electrically connected to the second plate member and the third plate member.   The optical communication module according to claim 1, wherein the element portion is formed of a thin film element and is in close contact with the other end face of the optical waveguide.   The element portion has at least two electrodes, and is arranged so that the light emitting element or the light receiving element faces the other end surface of the optical waveguide, and the side surfaces of the second and third plate-like members and the electrodes respectively 2. The optical communication module according to claim 1, wherein face-down bonding is performed so as to face each other.   The optical communication module according to any one of claims 1 to 3, wherein an optical fiber is inserted into the guide. The optical communication module further includes:
A socket having first and second terminals;
5. The optical communication module according to claim 1, wherein the first and second terminals and the second and third plate-like members are mounted so as to contact each other. The optical communication module further includes:
Having an electronic substrate provided with at least two conductive parts;
6. The optical communication module according to claim 1, wherein the conductive portion and the second and third plate-like members are electrically connected to each other. An insulating first plate-like member provided with a plurality of optical waveguides and a plurality of optical fiber insertion guides provided on one end face side of each of the plurality of optical waveguides;
A second plate member provided above the first plate member;
A third plate-like member provided below the first plate-like member;
A plurality of element portions each having a light emitting element or a light receiving element provided on one end face side of the plurality of optical waveguides of the first plate-shaped member,
The second plate-shaped member has a plurality of first conductive portions located on the plurality of guides and a plurality of first insulating portions that electrically insulate the plurality of first conductive portions,
The third plate-like member has a plurality of second conductive portions located under the plurality of guides and a plurality of second insulating portions that electrically insulate the plurality of second conductive portions,
Each of the plurality of element portions is electrically connected to the first conductive portion located above and the second conductive portion located below the first conductive portion. The optical communication module further includes:
A socket having a plurality of first and second terminals;
8. The optical communication module according to claim 7, wherein the first and second terminals and the first and second conductive portions are mounted so as to contact each other. The optical communication module further includes:
It has an electronic substrate provided with a plurality of conductive parts on the top,
The optical communication module according to claim 7, wherein the conductive portion and the second and third plate-like members are electrically connected to each other.   An electronic apparatus comprising the optical communication module according to claim 1. An insulating first plate member provided with an optical waveguide and an optical fiber insertion guide on one end face side of the optical waveguide, an electrically conductive second plate member, and an electrically conductive first plate member. A step of joining so as to be sandwiched between the three plate-like members,
Joining a light emitting element or an element portion having a light receiving element to the other end face side of the optical waveguide of the first plate-shaped member;
Inserting an optical fiber into the guide;
A method for manufacturing an optical communication module, comprising: A step of attaching the first to third plate-like members joined to a socket having first and second terminals, the first and second terminals and the second and third plate-like members. The process of mounting so that the
The method of manufacturing an optical communication module according to claim 11, comprising:   The bonded first to third plate-like members are mounted on an electronic substrate provided with at least two conductive portions, and the conductive portion and the second and third plate-like members are electrically connected. The method of manufacturing an optical communication module according to claim 11, further comprising a step of connecting to the optical communication module.   A method for manufacturing an electronic device, comprising the method for manufacturing an optical communication module according to claim 11.

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