CN217587687U - Optical module - Google Patents

Abstract

The optical module comprises a circuit board and an optical receiving assembly, wherein a metal area is arranged on the circuit board, the optical receiving assembly comprises an optical transmission device and an optical receiving chip, the optical transmission device is arranged on the metal area, and the optical receiving chip is arranged on the circuit board; the metal area is provided with a boundary group and a notch, the boundary group comprises parallel boundaries, the boundaries correspond to the edges of the light transmission device, the notch is positioned between the boundaries, and the substrate of the circuit board is exposed through the notch; the grooving area is provided with a first glue coating layer, a second glue coating layer is arranged between the grooving area and the boundary group, the curing time of the first glue coating layer is longer than that of the second glue coating layer, and the light transmission device is fixed on the circuit board through the first glue coating layer and the second glue coating layer. According to the method, the notch and the boundary group are arranged on the metal area, the glue amount of the first glue coating layer and the second glue coating layer can be conveniently controlled through the notch and the boundary group, and the process stability is improved; the substrate of the circuit board is exposed through the notch, and the bonding force of the light transmission device is improved.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology becomes more and more important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

In most of the current optical module packaging processes, the light receiving module is assembled and then connected to the circuit board. In the process of assembling the light receiving module itself, since the light receiving module includes the originally mutually independent sub-elements such as the wavelength division multiplexer, the light receiving chip, and the like, a metal plate or a ceramic plate is required for carrying, thereby making the whole light receiving module complicated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module to directly fix a light receiving component on a circuit board, and the assembly complexity of the light receiving component is reduced.

The application provides an optical module, including:

a circuit board on which a metal region is disposed;

the light receiving assembly comprises a light transmission device and a light receiving chip, wherein the light transmission device is arranged on the metal area, one end of the light transmission device is provided with an inclined plane, the light receiving chip is arranged below the inclined plane, and the inclined plane is used for reflecting received light output by the light transmission device to the light receiving chip;

a fiber optic adapter connected to the optical transmission device by an optical fiber for transmitting the received light to the optical transmission device via the optical fiber;

wherein the metal area is provided with a boundary line group and a notch, the boundary line group comprises parallel boundary lines, the boundary lines correspond to the edges of the light transmission device, and the notch is positioned between the boundary lines; the substrate of the circuit board is exposed through the notch, and a first glue coating layer is arranged in the notch area; the notch groove and the boundary line group are provided with a second glue coating layer, the curing time of the first glue coating layer is longer than that of the second glue coating layer, and the light transmission device is fixed on the circuit board through the first glue coating layer and the second glue coating layer.

As can be seen from the foregoing embodiments, the optical module provided in the embodiments of the present application includes a circuit board, an optical receiving assembly and an optical fiber adapter, where the optical receiving assembly includes an optical transmission device and an optical receiving chip, the optical transmission device is disposed on the metal region, and the optical transmission device is connected to the optical fiber adapter through an optical fiber, so that external receiving light is transmitted to the optical transmission device through the optical fiber; one end of the light transmission device is provided with an inclined plane, the light receiving chip is arranged below the inclined plane, and the inclined plane is used for reflecting received light output by the light transmission device to the light receiving chip. The metal area of the circuit board is provided with a boundary line group and a dividing line, the boundary line group comprises parallel boundary lines, the dividing line is positioned between the boundary lines, and the boundary lines correspond to the edge of the light transmission device, so that the boundary lines are positioned on the periphery of the dividing line to define the edge of the light transmission device through the boundary lines; the base material of the circuit board is exposed through the notch, namely, part of the base material of the circuit board on the metal area is exposed, so that the smoothness of the metal area can be reduced; the grooving region is provided with first rubberised layer, be provided with the second rubberised layer between grooving and the boundary group, the curing time on first rubberised layer is greater than the curing time on second rubberised layer, so optical transmission device is fixed in advance through first rubberised layer and circuit board, then optical transmission device is fixed in on the circuit board through first rubberised layer, second rubberised layer, the substrate bonding of exposing, can promote the adhesion of optical transmission device through first rubberised layer, second rubberised layer and metallic segment. According to the method, the notch and the boundary group are arranged on the metal area, the metal area is divided into a plurality of parts, the first glue coating layer is coated on the area where the notch is located, and the second glue coating layer is coated on the area between the notch and the boundary group, so that the glue amount of the first glue coating layer and the second glue coating layer can be conveniently controlled, and the process stability can be improved; the substrate of the circuit board is exposed through the notch, the optical transmission device is bonded with the substrate through the glue coating layer, and the bonding force of the optical transmission device can be improved, so that the optical transmission device is directly fixed on the circuit board, and the assembly complexity of the optical receiving assembly is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an assembly diagram of a circuit board and a light receiving module in an optical module according to an embodiment of the present disclosure;

fig. 6 is an assembly top view of a circuit board and a light receiving module in an optical module according to an embodiment of the present disclosure;

FIG. 7 is an enlarged view taken at A in FIG. 6;

fig. 8 is a schematic partial structure diagram of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 9 is a first schematic partial structure diagram of a circuit board of an optical module according to an embodiment of the present disclosure;

fig. 10 is an assembly side view of a circuit board and a light receiving module in an optical module according to an embodiment of the present disclosure;

fig. 11 is a schematic partial structure diagram of another circuit board in an optical module according to an embodiment of the present disclosure;

fig. 12 is a first partial structural diagram illustrating another exemplary circuit board of an optical module according to an embodiment of the present disclosure;

fig. 13 is a second schematic diagram of a partial structure of a circuit board on which glue is applied in an optical module according to an embodiment of the present application;

fig. 14 is a schematic diagram of a partial structure of another circuit board of an optical module according to an embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

In the field of optical fiber communication technology, signals transmitted by information transmission devices such as optical fibers or optical waveguides are optical signals, and signals that can be recognized and processed by information processing devices such as computers are electrical signals, so that the optical signals and the electrical signals need to be converted into each other by using optical modules.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, a bidirectional optical communication system is established between a remote server 1000 and a local information processing device 2000 through an optical fiber 101, an optical module 200, an optical network terminal 100, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100.

The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

In the optical module 200, an optical port is configured to be connected with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be plugged into the optical network terminal 100 so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100.

The optical network terminal 100 is provided with an optical module interface 102 and a network cable interface 104. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and as shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver disposed on the circuit board 300;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings 204 and 205; the outer contour of the housing generally appears square.

The direction of the connecting line of the two openings 204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. Wherein, the opening 204 is an electric port, and the golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer; the opening 205 is an optical port, and is configured to receive an external optical fiber 101 so that the optical fiber 101 is connected to the inside of the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further comprises an unlocking member 203 located on an outer wall of its housing. When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is clamped in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement between the optical module 200 and the upper computer is released.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design.

The circuit board 300 is generally a rigid circuit board, which can also realize a bearing effect due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The golden finger is configured to establish an electrical connection with the upper computer so as to realize power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, the flexible circuit board may be used with the circuit board 300 in some optical modules.

The optical transceiver may include an optical transmitter module 400 and an optical receiver module 500, the optical transmitter module 400 and the optical receiver module 500 are respectively connected to the optical fiber adapter 600, the optical transmitter module 400 generally includes a laser, a lens, and other devices, the laser generates emitted light under the action of an electrical signal transmitted by the circuit board 300, and the emitted light is coupled to the optical fiber adapter 600 through the lens to implement light emission. The light receiving module 500 generally includes a light receiving chip, and the light receiving chip can be connected to the optical fiber adapter 600 through an internal optical fiber, so that the receiving light transmitted by the optical fiber adapter 600 is transmitted to the light receiving chip through the internal optical fiber, and the light receiving chip converts the receiving light signal into an electrical signal to receive the light.

In some embodiments, for an optical module with a high transmission rate, the received light transmitted by the fiber adapter 600 may include multiple optical signals with different wavelengths, and the multiple optical signals with different wavelengths may be combined into one composite light, that is, the fiber adapter 600 transmits one composite light. Since optical signals with different wavelengths need to be transmitted to different optical receiving chips, the optical receiving component 500 further includes a wavelength division demultiplexer, where the wavelength division demultiplexer is configured to demultiplex the composite optical signal transmitted by the optical fiber adapter 600 into multiple received optical signals, and the multiple received optical signals are respectively transmitted to corresponding optical receiving chips.

Fig. 5 is an assembly schematic diagram of a circuit board and a light receiving element in an optical module provided in the embodiment of the present application, fig. 6 is an assembly top view of the circuit board and the light receiving element in the optical module provided in the embodiment of the present application, and fig. 7 is an enlarged schematic diagram of a point a in fig. 6. As shown in fig. 5, 6 and 7, the light receiving module 500 provided by the present application includes a light transmitting device and a light receiving chip 520, wherein one end of the light transmitting device is connected to the optical fiber adapter 600 through an optical fiber, so that the received light transmitted by the optical fiber adapter 600 is transmitted into the light transmitting device through the optical fiber; the other end of the light transmission device is provided with an inclined surface, and the light receiving chip 520 is located below the inclined surface, so that the received light output by the light transmission device is reflected to the light receiving chip 520 through the inclined surface to achieve light reception.

In some embodiments, the optical transmission device may be an optical device such as a wavelength division demultiplexer, a fiber array, a planar optical waveguide, an arrayed waveguide grating, etc., and the wavelength division demultiplexer may demultiplex the composite light transmitted by the fiber adapter 600 into multiple received lights, which are respectively reflected to the plurality of light receiving chips 520 through inclined planes at the end portions of the wavelength division demultiplexer. The present application is described with an example of the optical transmission device being a wavelength division demultiplexer 510.

The circuit board 300 may further include a transimpedance amplifier 350, one end of the transimpedance amplifier 350 is connected to the light receiving chip 520 through a signal line, the other end of the transimpedance amplifier 350 is connected to the gold finger 320 through a signal line, the transimpedance amplifier 350 is configured to amplify an electrical signal, and the amplified electrical signal is transmitted to the gold finger 320 through the signal line and is transmitted to the upper computer through the gold finger 320.

In some embodiments, when the wavelength division demultiplexer 510 is directly fixed on the surface of the circuit board 300 due to the low surface flatness of the circuit board 300, the surface flatness of the circuit board 300 may affect the coupling height of the wavelength division demultiplexer 510, and thus the coupling precision of the wavelength division demultiplexer 510 and the optical fiber.

In order to improve the flatness of the surface of the circuit board 300, a metal area may be disposed on the surface of the circuit board 300, and the metal area may be a copper-clad area, so that the flatness of the surface of the metal area is higher than that of the surface of the circuit board 300, and the wavelength division demultiplexer 510 is fixed on the metal area, so that the coupling precision of the wavelength division demultiplexer 510 can be ensured by the flatness of the metal area.

In some embodiments, since the light receiving chip 520 is located below the inclined plane of the end of the wavelength division demultiplexer 510, when the light receiving chip 520 is fixed, the light receiving chip 520 may be fixed on a metal region, and the light receiving chip 520 may also be fixed on the surface of the circuit board 300 outside the metal region.

The metal region is provided with a boundary group and a notch, the boundary group includes a plurality of parallel boundaries corresponding to the edges of the wavelength division demultiplexer 510, so as to define the outer edges of the wavelength division demultiplexer 510 by the boundaries. The scribe lines are located between the boundary lines, and the substrate of the circuit board 300 is exposed through the scribe lines, so that the metal region is divided into several parts by the scribe lines and the boundary line groups.

The grooving area is provided with a first glue coating, a second glue coating is arranged between the grooving area and the boundary group, the curing time of the first glue coating is longer than that of the second glue coating, so that when the wavelength division demultiplexer 510 is fixed on the metal area of the circuit board 300, the wavelength division demultiplexer 510 and the metal area are pre-fixed through the first glue coating, and after the wavelength division demultiplexer 510 is pre-fixed, the wavelength division demultiplexer 510 and the circuit board 300 are reinforced and fixed through the second glue coating.

The glue amount of the first glue coating layer and the glue amount of the second glue coating layer are convenient to control through grooving and boundary group, and the phenomenon that when the wavelength division demultiplexer 510 is fixed in a metal area, the glue amount of the glue coating layers overflows to influence other electric devices on the circuit board 300 is avoided. The substrate of the circuit board is exposed through the notch, and when the wavelength division demultiplexer 510 is fixed to the metal region, the wavelength division demultiplexer 510 is bonded to the substrate through the adhesive layer, so that the bonding force of the wavelength division demultiplexer 510 can be improved.

Fig. 8 is a schematic partial structure diagram of a circuit board in an optical module provided in the embodiment of the present application, and fig. 9 is a schematic partial structure diagram of glue applied to a circuit board in an optical module provided in the embodiment of the present application. As shown in fig. 8 and 9, when the boundary group and the notch are disposed in the metal region of the circuit board 300, the notch may include a first notch 301, a second notch 302, a third notch 303, and a fourth notch 304 disposed side by side, the first notch 301, the second notch 302, the third notch 303, and the fourth notch 304 may be disposed along the light receiving direction (left-right direction), the first notch 301 and the second notch 302 are disposed adjacent to each other, and the first notch 301 and the second notch 302 are disposed between the third notch 303 and the fourth notch 304, that is, the third notch 303, the first notch 301, the second notch 302, and the fourth notch 304 are disposed side by side in the up-down direction.

In some embodiments, the first notch 301, the second notch 302, the third notch 303 and the fourth notch 304 are rectangular notches, and the length dimension thereof in the left-right direction does not exceed the length dimension of the wavelength division demultiplexer 510.

In order to fix the wavelength division demultiplexer 510 conveniently, a first glue layer 330 is arranged between the upper part and the lower part of the first notch 301 and the second notch 302, that is, glue is coated in the region between the first notch 301 and the second notch 302, when the wavelength division demultiplexer 510 is bonded to a metal region, the spreading range 331 of the first glue layer 330 needs to be ensured to be located between the third notch 303 and the fourth notch 304, so that the first glue layer 330 does not overflow the outer side of the wavelength division demultiplexer 510, and the glue amount of the first glue layer 330 can be well controlled.

In some embodiments, short grooves may be further disposed in the region between the first groove 301 and the second groove 302, the region between the third groove 303 and the first groove 301, and the region between the second groove 302 and the fourth groove 304, so as to increase the exposed area of the substrate and further increase the adhesion of the wdm 510.

Fig. 10 is an assembly side view of a circuit board and a light receiving module in an optical module according to an embodiment of the present application. As shown in fig. 10, when assembling the wavelength division demultiplexer 510, first coating the first adhesive layer 330 between the first notch 301 and the second notch 302, then placing the wavelength division demultiplexer 510 on the first adhesive layer 330, and applying a downward force to make the first adhesive layer 330 spread between the third notch 303 and the fourth notch 304, where the first adhesive layer 330 can ensure the coupling height of the wavelength division demultiplexer 510, so that the multiple received lights output by the wavelength division demultiplexer 510 can be smoothly emitted into the light receiving chip 520 on the circuit board 300; the first rubberized layer 330 is then cured by irradiating ultraviolet rays from the center toward the periphery of the wavelength division demultiplexer 510.

In some embodiments, the first adhesive layer 330 is a UV adhesive layer, and the UV adhesive layer serves as a pre-fixing function, that is, the wavelength division demultiplexer 510 and the circuit board 300 are pre-fixed by the first adhesive layer 330, and then a reinforcing adhesive is filled between the wavelength division demultiplexer 510 and the circuit board 300, and the wavelength division demultiplexer 510 is reinforced by the reinforcing adhesive, so as to improve the stability of the wavelength division demultiplexer 510 and the circuit board 300.

The boundary set includes a first boundary 305 and a second boundary 306, and the first scribe 301, the second scribe 302, the third scribe 303 and the fourth scribe 304 are located between the first boundary 305 and the second boundary 306, that is, the first boundary 305 is located above the third scribe 303, and the second boundary 306 is located below the fourth scribe 304.

In some embodiments, the first boundary 305 and the second boundary 306 are dashed lines in the wavelength division multiplexer 510 in fig. 7, i.e., the first boundary 305 and the second boundary 306 are disposed corresponding to the upper and lower edges of the wavelength division demultiplexer 510.

The second glue layer includes a first glue region 332 and a second glue region 333, the first glue region 332 may be located between the first boundary line 305 and the third groove 303, and the second glue region 333 may be located between the second boundary line 306 and the fourth groove 304, so that when the wavelength demultiplexer 510 is fixed to the metal region, the edge region of the wavelength demultiplexer 510 is bonded to the metal region through the first glue region 332 and the second glue region 333.

In some embodiments, the first glue region 332 may further cover the region between the first boundary 305 and the third notch 303 and the region of the third notch 303, and the second glue region 333 may further cover the region between the second boundary 306 and the fourth notch 304 and the region of the fourth notch 304, so as to increase the area of the second glue layer.

In some embodiments, the first glue area 332 and the second glue area 333 are black glue, the black glue is reinforcing glue, after the central area of the wavelength division demultiplexer 510 is pre-fixed to the metal area through the first glue coating layer 330, the first glue area 332 and the second glue area 333 are coated with the black glue, and the black glue is cured through ultraviolet rays and heating, so that the adhesion force between the wavelength division demultiplexer 510 and the circuit board 300 is improved.

Fig. 11 is a partial structural schematic view of another circuit board in the optical module provided in the embodiment of the present application, and fig. 12 is a partial structural schematic view of another circuit board in the optical module provided in the embodiment of the present application with glue. As shown in fig. 11 and 12, when the boundary group and the scribe line are disposed in the metal region of the circuit board 300, the scribe line may further include a first scribe line 301, a second scribe line 302, a third scribe line 303, and a fourth scribe line 304 disposed side by side, the first scribe line 301, the second scribe line 302, the third scribe line 303, and the fourth scribe line 304 may be disposed along a vertical light receiving direction (up-down direction), the first scribe line 301 and the second scribe line 302 are disposed adjacent to each other, the first scribe line 301 and the second scribe line 302 are located between the third scribe line 303 and the fourth scribe line 304, that is, the third scribe line 303, the first scribe line 301, the second scribe line 302, and the fourth scribe line 304 are disposed side by side in the left-right direction.

In order to fix the wavelength division demultiplexer 510 conveniently, a first glue coating layer 330 is arranged between the left and right sides of the first notch 301 and the second notch 302, that is, glue is coated in the region between the first notch 301 and the second notch 302, when the wavelength division demultiplexer 510 is bonded to a metal region, it is required to ensure that the spreading range 331 of the first glue coating layer 330 is located between the third notch 303 and the fourth notch 304, so that the first glue coating layer 330 does not overflow the outer side of the wavelength division demultiplexer 510, and the glue amount of the first glue coating layer 330 can be well controlled.

The boundary set includes a first boundary 305 and a second boundary 306, the first notch 301, the second notch 302, the third notch 303 and the fourth notch 304 are located between the first boundary 305 and the second boundary 306, that is, the first boundary 305 is located at the left side of the third notch 303, the second boundary 306 is located at the right side of the fourth notch 304, and the first boundary 305 and the second boundary 306 are disposed corresponding to the left and right edges of the wavelength division demultiplexer 510.

The second glue layer comprises a first glue region 332 and a second glue region 333, the first glue region 332 is located between the first boundary line 305 and the third groove 303, and the second glue region 333 is located between the second boundary line 306 and the fourth groove 304, so that when the wavelength division demultiplexer 510 is fixed on the metal region, the edge region of the wavelength division demultiplexer 510 is bonded with the metal region through the first glue region 332 and the second glue region 333.

In some embodiments, the first glue region 332 may further cover the region between the first boundary 305 and the third notch 303 and the region of the third notch 303, and the second glue region 333 may further cover the region between the second boundary 306 and the fourth notch 304 and the region of the fourth notch 304, so as to increase the area of the second glue layer.

In some embodiments, the size of the wavelength division demultiplexer 510 is different, for example, when the wavelength division demultiplexer 510 is fixed to the metal region of the circuit board 300 by the first and second adhesive-coated layers between the first and second boundary lines 305 and 306, the size of the wavelength division demultiplexer 510 may be 2.5mm. However, when the size of the wavelength division demultiplexer 510 exceeds this size, for example, when the size of the wavelength division demultiplexer 510 is 4.5mm, the edge of the wavelength division demultiplexer 510 is not fixed by the adhesive layer, which affects the robustness of the wavelength division demultiplexer 510 and the circuit board 300.

Fig. 13 is a second schematic diagram of a partial structure of glue applied to a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 13, the wavelength division demultiplexer 510 has a relatively large size, when the boundary group and the scribe groove are disposed in the metal region of the circuit board 300, the scribe groove may include a first scribe groove 301, a second scribe groove 302, a third scribe groove 303, a fourth scribe groove 304, a fifth scribe groove 307, and a sixth scribe groove 308 that are disposed side by side, the first scribe groove 301, the second scribe groove 302, the third scribe groove 303, the fourth scribe groove 304, the fifth scribe groove 307, and the sixth scribe groove 308 may be disposed along the light receiving direction (left-right direction), the first scribe groove 301 and the second scribe groove 302 are disposed adjacent to each other, the first scribe groove 301 and the second scribe groove 302 are disposed between the third scribe groove 303 and the fourth scribe groove 304, the third scribe groove 303, and the fourth scribe groove 304 are disposed between the fifth scribe groove 307 and the sixth scribe groove 308, that is, the fifth scribe groove 307, the third scribe groove 303, the first scribe groove 301, the second scribe groove 302, the fourth scribe groove 304, and the sixth scribe groove 308 are disposed side by side above and below the sixth groove 308.

In order to fix the wavelength division demultiplexer 510 conveniently, the first glue coating layer includes a first glue coating area 340, a second glue coating area 341 and a third glue coating area 342, the first glue coating area 340 is located between the first notch 301 and the second notch 302, the second glue coating area 341 is located between the third notch 303 and the first notch 301, the third glue coating area 342 is located between the fourth notch 304 and the second notch 302, that is, glue is coated in the areas between the third notch 303 and the first notch 301, between the first notch 301 and the second notch 302, and between the second notch 302 and the fourth notch 304, respectively.

When the wavelength division demultiplexer 510 is bonded to the metal region, it is necessary to ensure that the glue spreading range 343 of the first glue coating region 340, the second glue coating region 341, and the third glue coating region 342 is located between the fifth notch 307 and the sixth notch 308, so that the first glue coating layer does not overflow the outside of the wavelength division demultiplexer 510, and the glue amount of the first glue coating layer can be well controlled.

The boundary group comprises a first boundary 305, a second boundary 306, a third boundary 309 and a fourth boundary 310, the first boundary 305 and the third boundary 309 are located at two sides of the fifth groove 307, the first boundary 305 is located between the fifth groove 307 and the third groove 303; the second boundary 306 and the fourth boundary 310 are located at two sides of the sixth notch 308, and the second boundary 306 is located between the sixth notch 308 and the fourth notch 304. Namely, the third boundary 309, the fifth boundary 307, the first boundary 305, the third boundary 303, the first boundary 301, the second boundary 302, the fourth boundary 304, the second boundary 306, the sixth boundary 308 and the fourth boundary 310 are disposed side by side in the vertical direction, and the third boundary 309 and the fourth boundary 310 are disposed corresponding to the upper and lower edges of the wavelength division demultiplexer 510.

The second glue layer comprises a third glue area 344 and a fourth glue area 345, the third glue area 344 is located between the third boundary 309 and the fifth notch 307, and the fourth glue area 345 is located between the fourth boundary 310 and the sixth notch 308, so that when the wavelength division demultiplexer 510 is fixed on the metal area, the edge area of the wavelength division demultiplexer 510 is bonded with the metal area through the third glue area 344 and the fourth glue area 345.

In some embodiments, the third glue area 344 may also cover the area between the third boundary 309 and the fifth notch 307 and the area of the fifth notch 307, and the fourth glue area 345 may also cover the area between the fourth boundary 310 and the sixth notch 308 and the area of the sixth notch 308, which can increase the area of the second glue layer.

Fig. 14 is a second schematic diagram of a partial structure of another circuit board on which glue is applied in an optical module according to an embodiment of the present application. As shown in fig. 14, the wavelength division demultiplexer 510 has a relatively large size, when the boundary group and the notch are disposed in the metal region of the circuit board 300, the notch may also include a first notch 301, a second notch 302, a third notch 303, a fourth notch 304, a fifth notch 307, and a sixth notch 308, the first notch 301, the second notch 302, the third notch 303, and the fourth notch 304 are disposed along a direction perpendicular to the light receiving direction (vertical direction), the first notch 301 and the second notch 302 are disposed adjacent to each other, the first notch 301 and the second notch 302 are located between the third notch 303 and the fourth notch 304, that is, the third notch 303, the first notch 301, the second notch 302, and the fourth notch 304 are disposed side by side in the horizontal direction. The fifth notch 307 and the sixth notch 308 are disposed along the light receiving direction (left-right direction), and the first notch 301, the second notch 302, the third notch 303, and the fourth notch 304 are located between the fifth notch 307 and the sixth notch 308.

In order to fix the wavelength division demultiplexer 510 conveniently, the first glue coating layer includes a first glue coating area 340, a second glue coating area 341 and a third glue coating area 342, the first glue coating area 340 is located between the first notch 301 and the second notch 302, the second glue coating area 341 is located between the third notch 303 and the first notch 301, the third glue coating area 342 is located between the fourth notch 304 and the second notch 302, that is, glue is coated in the areas between the third notch 303 and the first notch 301, between the first notch 301 and the second notch 302, and between the second notch 302 and the fourth notch 304, respectively.

When the wavelength division demultiplexer 510 is bonded to the metal region, it is necessary to ensure that the glue spreading range 343 of the first glue coating region 340, the second glue coating region 341, and the third glue coating region 342 is located between the fifth notch 307 and the sixth notch 308, so that the first glue coating layer does not overflow the outside of the wavelength division demultiplexer 510, and the glue amount of the first glue coating layer can be well controlled.

The boundary group includes a first boundary 305, a second boundary 306, a third boundary 309 and a fourth boundary 310, the first boundary 305 is located at the left side of the third groove 303, the second boundary 306 is located at the right side of the fourth groove 304, the third boundary 309 is located at the upper side of the fifth groove 307, the fourth boundary 310 is located at the lower side of the sixth groove 308, that is, the first boundary 305 and the second boundary 306 are disposed along the left-right direction, and the third boundary 309 and the fourth boundary 310 are disposed along the up-down direction.

The first and second boundaries 305 and 306 are corresponding to the left and right edges of the wavelength division demultiplexer 510, and the third and fourth boundaries 309 and 310 are corresponding to the upper and lower edges of the wavelength division demultiplexer 510.

The second glue layer comprises a third glue area 344 and a fourth glue area 345, the third glue area 344 is located between the third boundary 309 and the fifth notch 307, and the fourth glue area 345 is located between the fourth boundary 310 and the sixth notch 308, so that when the wavelength division demultiplexer 510 is fixed on the metal area, the edge area of the wavelength division demultiplexer 510 is bonded with the metal area through the third glue area 344 and the fourth glue area 345.

In some embodiments, the arrangement of the notches and the boundaries in the metal region is not limited to the arrangement described in the above embodiments, as long as the notches and the boundaries do not exceed the boundaries of the wavelength division demultiplexer 510, and the metal region can be divided into several parts, which facilitates controlling the glue amount of the glue layer in the metal region.

The optical module provided by the embodiment of the application comprises a circuit board, an optical receiving assembly and an optical fiber adapter, wherein the optical receiving assembly comprises a wavelength division demultiplexer and an optical receiving chip, the wavelength division demultiplexer is arranged on a metal area and is connected with the optical fiber adapter through an optical fiber, so that external receiving light is transmitted to an optical transmission device through the optical fiber; the light receiving chip is arranged on the circuit board, one end of the wavelength division demultiplexer is provided with an inclined surface, and the inclined surface is used for reflecting received light output by the wavelength division demultiplexer to the light receiving chip. The metal area of the circuit board is provided with boundary line groups and dividing lines, the boundary line groups comprise parallel boundary lines, the dividing lines are positioned between the boundary lines, and the boundary lines correspond to the edges of the wavelength division demultiplexer, so that the boundary lines are positioned on the periphery of the dividing lines to define the edges of the wavelength division demultiplexer by the boundary lines; the base material of the circuit board is exposed through the notch, namely, part of the base material of the circuit board is exposed on the metal area, so that the smoothness of the metal area is reduced; the grooving area is provided with first rubber coating layer, be provided with the second rubber coating layer between grooving and the boundary group, the curing time on first rubber coating layer is greater than the curing time on second rubber coating layer, so wavelength division multiplexer carries out the pre-fixing through first rubber coating layer and circuit board, then wavelength division demultiplexer is fixed in on the circuit board through first rubber coating layer, second rubber coating layer, thereby wavelength division demultiplexer passes through first rubber coating layer, second rubber coating layer and metallic segment, the substrate bonding of exposing, the adhesion of wavelength division demultiplexer has been promoted. According to the method, the notch and the boundary group are arranged on the metal area, the metal area is divided into a plurality of parts, the first glue coating layer is coated on the area where the notch is located, and the second glue coating layer is coated on the area between the notch and the boundary group, so that the glue amount of the first glue coating layer and the second glue coating layer is conveniently controlled, and the process stability is improved; the substrate of the circuit board is exposed through the notch, the wavelength division demultiplexer is bonded with the substrate through the glue coating layer, the bonding force of the wavelength division demultiplexer is improved, the wavelength division demultiplexer is directly fixed on the circuit board, and the assembly complexity of the light receiving assembly is reduced.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims (10)

1. A light module, comprising:

a circuit board on which a metal region is disposed;

the light receiving assembly comprises a light transmission device and a light receiving chip, wherein the light transmission device is arranged on the metal area, one end of the light transmission device is provided with an inclined plane, the light receiving chip is arranged below the inclined plane, and the inclined plane is used for reflecting received light output by the light transmission device to the light receiving chip;

a fiber optic adapter connected to the optical transmission device by an optical fiber for transmitting the received light to the optical transmission device via the optical fiber;

wherein, the metal area is provided with boundary line groups and carved grooves, the boundary line groups comprise parallel boundary lines, the boundary lines correspond to the edges of the light transmission device, and the carved grooves are positioned between the boundary lines; the substrate of the circuit board is exposed through the notch groove, and a first glue coating layer is arranged in the area where the notch groove is located; the notch groove and the boundary line group are provided with a second glue coating layer, the curing time of the first glue coating layer is longer than that of the second glue coating layer, and the light transmission device is fixed on the circuit board through the first glue coating layer and the second glue coating layer.

2. The optical module according to claim 1, wherein the optical transmission device includes a first wavelength division multiplexer, the groove includes a first groove, a second groove, a third groove and a fourth groove arranged side by side, the first groove, the second groove, the third groove and the fourth groove are all arranged along a light receiving direction, the first groove and the second groove are arranged adjacently, and the first groove and the second groove are located between the third groove and the fourth groove;

the first rubber coating layer is arranged between the first notch groove and the second notch groove, the spreading range of the first rubber coating layer is located between the third notch groove and the fourth notch groove, and the first wavelength division multiplexer is pre-fixed in the metal area through the first rubber coating layer.

3. The optical module of claim 2, wherein the boundary line group comprises a first boundary line and a second boundary line which are parallel to each other, and the first notch, the second notch, the third notch and the fourth notch are located between the first boundary line and the second boundary line;

the second glue coating layer comprises a first glue area and a second glue area, the first glue area is located between the first boundary line and the third notch, and the second glue area is located between the second boundary line and the fourth notch.

4. The optical module of claim 3, wherein the first glue area covers the third notch, and the second glue area covers the fourth notch.

5. The optical module of claim 4, wherein the first wavelength division multiplexer has a size of 2.5mm.

6. The optical module according to claim 1, wherein the optical transmission device comprises a second wavelength division multiplexer, the notches comprise a first notch, a second notch, a third notch, a fourth notch, a fifth notch and a sixth notch which are arranged side by side, the first notch and the second notch are arranged adjacently, the first notch and the second notch are located between the third notch and the fourth notch, and the third notch and the fourth notch are located between the fifth notch and the sixth notch;

the first glue coating layer comprises a first glue coating area, a second glue coating area and a third glue coating area, the first glue coating area is located between the first grooving and the second grooving, the second glue coating area is located between the third grooving and the first grooving, the third glue coating area is located between the fourth grooving and the second grooving, the first glue coating area, the second glue coating area and the spreading range of the third glue coating area are located between the fifth grooving and the sixth grooving.

7. The optical module of claim 6, wherein the boundary group comprises a first boundary, a second boundary, a third boundary and a fourth boundary, the first boundary and the third boundary are located at two sides of the fifth notch, and the first boundary is located between the fifth notch and the third notch; the second boundary line and the fourth boundary line are positioned on two sides of the sixth notch, and the second boundary line is positioned between the sixth notch and the fourth notch;

the second glue coating layer comprises a third glue area and a fourth glue area, the third glue area is located between the third boundary line and the fifth notch, and the fourth glue area is located between the fourth boundary line and the sixth notch.

8. The optical module of claim 7, wherein the third glue area covers the fifth notch, and the fourth glue area covers the sixth notch.

9. An optical module according to claim 8, characterized in that the size of the second wavelength division multiplexer is 4.5mm.

10. The optical module of claim 1, wherein the first glue layer is a UV glue layer and the second glue layer is a black glue layer.

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