JP5130731B2 - OPTICAL MODULE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL MODULE MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to an optical module, an optical transmission apparatus, and an optical module manufacturing method.

  In recent years, with the further improvement in performance of electronic equipment, it has become difficult to cope with data transfer speed and EMI (Electro Magnetic Interference) noise reduction with conventional electrical wiring, so some electrical wiring has been replaced with optical wiring. Transmission techniques have been adopted.

  Various types of optical modules have been proposed. Among them, there is an optical module using an optical waveguide having an optical path conversion surface (for example, see Patent Document 1).

This optical module includes a substrate, an optical device using a surface emitting laser mounted on the substrate, and a fluorinated polyimide optical waveguide film having a mirror surface at an angle of 45 degrees on the end surface, and the mirror surface of the optical waveguide film After the optical coupling surface provided at the opposing position is positioned and fixed on the optical device by, for example, a bump made of Au / Sn, an ultraviolet curable adhesive is applied from the periphery of the optical device to the optical waveguide film and the optical device. After filling the gap (for example, 40 μm), the film is irradiated with ultraviolet rays and cured to fix the optical waveguide film and the optical device. According to this configuration, it is possible to prevent the positional deviation between the optical waveguide film and the optical device due to the difference in thermal expansion.
JP 2000-214351 A

  An object of the present invention is to provide an optical module, an optical transmission device, and an optical module manufacturing method capable of facilitating the process of positioning and adhering an optical waveguide to an optical element and improving productivity. It is in.

  In order to achieve the above object, an embodiment of the present invention provides the following optical module, optical transmission device, and optical module manufacturing method.

[1] A surface-type optical element having an optical surface that emits or receives light on the opposite side of the mounting surface, an optical coupling surface that optically couples with the optical surface of the optical element, and a position that faces the optical coupling surface an optical waveguide having an optical path changing surface that is, a substrate having the surface on which the mounting surface is mounted in the light emitting element, a substrate wherein the surface is a surface that projects the optical waveguide side, before Symbol optical element The optical surface and the optical coupling surface of the optical waveguide are bonded to each other at a predetermined curing rate, and applied at a predetermined position from a coupling portion between the optical surface of the optical element and the optical coupling surface of the optical waveguide. And an optical adhesive having a second adhesive portion that is supplied to the coupling portion by capillary force from the first adhesive portion and bonds the optical surface and the optical coupling surface. , Portions of the optical waveguide other than the optical coupling surface and the substrate And a temporary fixing adhesive for bonding the protruding surface and a portion other than the optical coupling surface of the optical waveguide, which is bonded at a curing rate faster than the predetermined curing rate. module.

[ 2 ] The optical module according to [1], wherein the temporary fixing adhesive is a cyanoacrylate adhesive.

[ 3 ] The optical module according to [1], wherein the optical adhesive and the temporary fixing adhesive are curable adhesives that are cured by heating or energy rays.

[4] A planar light emitting device having a light emitting surface opposite to the mounting surface, an optical coupling surface optically coupled to the light emitting surface of the light emitting device, and an optical path conversion provided at a position facing the optical coupling surface an optical waveguide having a surface, a substrate having the surface on which the mounting surface is mounted in the light emitting device, and the substrate is the surface a surface which projects the optical waveguide side, and the light emitting surface before Symbol emitting element adhering the said optical coupling surface of the optical waveguide at a predetermined curing rate, first it is applied to a predetermined position from the coupling portion between the light - emitting said light emitting surface and the optical coupling surface of the optical waveguide element An optical adhesive having a first adhesive portion, and a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force to adhere the light emitting surface and the optical coupling surface; The portion other than the optical coupling surface of the waveguide and the substrate are A first optical module comprising a temporary fixing adhesive for adhering the protruding surface and a portion other than the optical coupling surface of the optical waveguide, which adheres at a curing rate higher than the curing rate of the optical waveguide; An optical waveguide having a planar light receiving element on the opposite side of the mounting surface, an optical coupling surface optically coupled to the light receiving surface of the light receiving element, and an optical path conversion surface provided at a position facing the optical coupling surface When, a substrate having the surface on which the mounting surface is mounted in the light emitting element, the surface and the substrate is a surface which projects the optical waveguide side, front Symbol the of the optical waveguide and the light receiving surface of the light receiving element bonding the optical coupling surface at a given cure rate, the first adhesive portion which is applied to a predetermined position from the coupling portion between said light receiving surface and the optical coupling surface of the optical waveguide of the light receiving element, And from the first adhesive portion by capillary force. An optical adhesive having a second adhesion portion for adhering the light receiving surface is supplied to a portion between said optical coupling surface, the predetermined curing the optical coupling surface other than the portion of the optical waveguide and said substrate A second optical module comprising a temporary fixing adhesive for adhering the protruding surface and a portion other than the optical coupling surface of the optical waveguide, which adheres at a curing speed faster than a speed; An optical transmission device comprising: an optical fiber that connects the optical waveguide of the optical module and the optical waveguide of the second optical module.

[5] A surface-type optical element having an optical surface that emits or receives light on the side opposite to the mounting surface, a substrate to which the mounting surface of the optical element is attached, and optical coupling that optically couples with the optical surface of the optical element A preparation step of preparing a surface and an optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface, and an attachment step of attaching the mounting surface of the optical element to the substrate;
And the fixing step of bonding the optical adhesive which is cured by the optical surface and the optical coupling surface and the Jo Tokoro cure rate of the optical waveguide of the optical element, and portions other than the optical coupling surface of the optical waveguide and said substrate, before Symbol a temporary fixing adhesive which cures at a faster curing rate than a predetermined curing rate, the temporary fixing adhesive high coating than the optical element, the said optical waveguide light when positioned on the device, the temporary fixation step height of the temporary fixing adhesive is adhered by the temporary fixing adhesive becomes lower than the time of application, prior to said temporary fixing step and the permanent fixing process, Applying the temporary fixing adhesive at a predetermined position on the substrate, and applying an adhesive for applying the optical adhesive at a predetermined position on the substrate, and using the temporary fixing adhesive After the temporary fixing step, the optical bonding The main fixing step is performed by applying an uncured optical adhesive at a predetermined position from a gap between the optical surface of the optical element and the optical coupling surface of the optical waveguide. The uncured optical adhesive is supplied to the void by the capillary force generated in the void, and the uncured optical adhesive is cured to form the optical surface and the optical coupling surface. A method of manufacturing an optical module, comprising bonding.

[ 6 ] The method for manufacturing an optical module according to [ 5 ], wherein the temporary fixing adhesive is a cyanoacrylate adhesive.

[ 7 ] The method for manufacturing an optical module according to [ 5 ], wherein the optical adhesive and the temporary fixing adhesive are curable adhesives that are cured by receiving heat or energy rays.

According to the optical module of the first aspect, the process of positioning and bonding the optical waveguide with respect to the optical element can be facilitated, and the productivity can be improved. In addition, the curing time of the temporary fixing adhesive can be shortened as compared with the case where no protruding surface is provided on the substrate. Furthermore, it becomes possible to eliminate the need for precise management of the adhesive application amount.

According to the optical module of the second aspect , it is possible to shorten the curing time of the temporary fixing adhesive as compared with other adhesives.

According to the optical module of the third aspect, it is easy to adjust the curing time of the adhesive.

According to the optical transmission device of the fourth aspect , the process of positioning and bonding the optical waveguide with respect to the optical element can be facilitated, and the productivity can be improved.

According to the optical module manufacturing method of the fifth aspect , the process of positioning and bonding the optical waveguide with respect to the optical element can be facilitated, and the productivity can be increased.

According to the method for manufacturing an optical module according to claim 6 , the curing time of the temporary fixing adhesive can be shortened as compared with other adhesives.

According to the optical module manufacturing method of the seventh aspect, it is easy to adjust the curing time of the adhesive.

[First Embodiment]
1 is a perspective view showing a schematic configuration of an optical transmission apparatus according to a first embodiment of the present invention, and FIG. 2A is a plan view of an optical module provided on one side of an optical transmission line. 2B is a cross-sectional view taken along line AA in FIG. 2A, FIG. 3A is a plan view of the optical module provided on the other side of the optical transmission line, and FIG. These are the BB sectional drawing of Fig.3 (a).

  The optical transmission device 100 includes an optical module 1A provided on one side (transmission side) of the optical transmission path, an optical module 1B provided on the other side (reception side) of the optical transmission path, and both optical modules. A plurality of optical fibers 101 connecting between 1A and 1B are provided.

  The optical fiber 101 can be a multimode optical fiber that transmits light in many modes (paths) or a single mode optical fiber that transmits light in a single mode. In the present embodiment, for example, a multimode optical fiber having a core diameter of 50 μm is used.

  As shown in FIGS. 1 and 2, the optical module 1A provided on the transmission side is optically coupled to the support substrate 2A, the light-emitting element array 3 mounted on the support substrate 2A, and the light-emitting element array 3. The light-emitting surface (optical surface) 3a of the light-emitting element array 3 and the light-coupling surface 4a of the light-guide element 4 are supplied to the optical waveguide 4 and the coupling portion between the light-emitting element array 3 and the optical waveguide 4 by capillary force. An adhesive 5 to be bonded; an adhesive 9 for temporarily fixing the support substrate 2 to a portion other than the optical coupling surface 4a of the optical waveguide 4; and an optical connector 6A attached to one end of the optical waveguide 4; Is provided.

  As shown in FIGS. 1 and 3, the optical module 1B provided on the receiving side is optically coupled to the support substrate 2B, the light receiving element array 7 mounted on the support substrate 2B, and the light receiving element array 7. The light receiving surface (optical surface) 7a of the light receiving element array 7 and the optical coupling surface 4a of the light guide 4 are supplied to the optical waveguide 4 and the coupling portion between the light receiving element array 7 and the optical waveguide 4 by capillary force. An optical adhesive 5 to be bonded and an optical connector 6B attached to one end of the optical waveguide 4 are provided.

  Optical connectors 102A and 102B are fixed to both ends of the optical fiber 101, respectively, and a pair of pins 103 project from the optical connectors 102A and 102B. A pair of pin holes 60 are formed in the optical connectors 6A and 6B. By inserting the pins 103 of the optical connectors 102A and 102B into the pin holes 60 of the optical connectors 6A and 6B, the optical connector 6A and the optical connector 102A, and the optical connector 6B and the optical connector 102B are positioned and optically coupled. The

(Optical waveguide)
The optical waveguide 4 is composed of a core 40 and a clad 41 formed around the core 40, and is a reflection surface as an optical path conversion surface inclined at 45 degrees at the ends of the light emitting element array 3 and the light receiving element array 7 side. 4b is formed, and an end face 4c perpendicular to the end of the optical connectors 6A and 6B is formed. In the optical waveguide 4, for example, the core 40 has a rectangular cross section of 50 μm × 50 μm, and the overall thickness is 150 to 200 μm.

  The optical waveguide 4 can be manufactured, for example, by a method using photolithography or RIE (reactive ion etching) that is generally used. In particular, it can be efficiently produced by a production process using a mold described in Japanese Patent Application Laid-Open No. 2004-29507 already proposed by the present applicant. The manufacturing process will be described below.

  First, a master having a convex portion corresponding to the core is produced using, for example, a photolithography method. Next, a curable resin having a viscosity of, for example, about 500 to 7000 mPa · s and having light transmittance in the ultraviolet region and the visible region, for example, a methylsiloxane group in the molecule, A layer of a curable organopolysiloxane containing an ethylsiloxane group and a phenylsiloxane group is provided by coating or the like, and then cured to form a cured layer. Next, the hardened layer is peeled off from the master and a mold having a concave portion corresponding to the convex portion is produced.

  Next, a clad film substrate made of a resin excellent in adhesion to the mold, for example, an alicyclic acrylic resin film, an alicyclic olefin resin film, a cellulose triacetate film, a fluororesin film, or the like is adhered to the mold. Let Next, the concave portion of the mold is filled with, for example, an ultraviolet curable or thermosetting monomer, an oligomer or a mixture of a monomer and an oligomer, an epoxy type, a polyimide type, an acrylic type ultraviolet curable resin, or the like. . Next, after hardening the curable resin in the recess to form the core 40, the mold is peeled off. This leaves the core 40 on the cladding film substrate.

  Next, a clad layer is provided so as to cover the core 40 on the surface side of the clad film substrate on which the core 40 is formed. Examples of the clad layer include a film, a layer cured by applying a curable resin for clad, and a polymer film formed by applying a solvent solution of a polymer material and drying. Finally, the surface where the core 40 of the optical waveguide is exposed is cut at a predetermined angle by a dicer to form the reflection surface 4b and the end surface 4c. Further, by cutting out with a dicer parallel to the core 40, the optical waveguide 4 having the clad film base material and the clad layer as the clad 41 is completed.

(Light emitting element array)
The light emitting element array 3 may be an array of a plurality of light emitting elements (surface optical elements) such as a surface light emitting diode or a surface laser. In the present embodiment, a VCSEL (surface emitting laser) array is used as the light emitting element array 3. In the surface emitting laser array, for example, an n-type lower reflector layer, an active layer 30, a current confinement layer, a p-type upper reflector layer, a p-type contact layer, and a p-side electrode 31 are formed on an n-type GaAs substrate. The n-side electrode 32 is formed on the back surface of the n-type GaAs substrate. The active layer 30, the current confinement layer, the p-type upper reflector layer, the p-type contact layer, and the p-side electrode 31 are provided for each light emitting element. Is formed. The p-side electrode 31 has an opening 31 a immediately above the light emitting region of the active layer 30. The light emitting element array 3 has, for example, a width of 0.3 mm, a height of 0.2 mm, and a length of 1 mm in the array direction, and four openings 31a are arranged on the light emitting surface 3a with a pitch of 250 μm in the longitudinal direction. Yes.

(Light receiving element array)
For the light receiving element array 7, for example, a planar optical element such as a planar photodiode can be used. In this embodiment, a GaAs PIN photodiode excellent in high-speed response is used as the light receiving element. The light receiving element array 7 includes, for example, a P-layer, a I-layer and an N-layer which are PIN-bonded on a GaAs substrate, a p-side electrode 71 connected to the P layer, and an n-side electrode 72 formed on the N layer. The P layer, the I layer, the N layer, the p-side electrode 71 and the n-side electrode 72 are formed for each light receiving element. The p-side electrode 71 has an opening 71a, and the inside of the opening 71a serves as a light receiving unit 70 that receives laser light. The light receiving element array 7 has, for example, a width of 0.3 mm, a height of 0.2 mm, and a length of 1 mm in the array direction, and four light receiving portions 70 are arranged on the light receiving surface 7a with a pitch of 250 μm in the longitudinal direction. ing.

(Support substrate)
The transmission-side support substrate 2 </ b> A includes a base material 20 formed of an insulating material such as glass epoxy resin, and a ground 21 and a pad 22 formed of a conductive material such as copper on the upper surface of the base material 20. The n-side electrode 32 and the ground 21 of the light emitting element array 3 are bonded by a conductive adhesive (not shown), and the p-side electrode 31 and the pad 22 are connected by a bonding wire 8 made of gold or the like.

  The support substrate 2B on the receiving side includes a base material 20 formed of an insulating material such as glass epoxy resin, and a p-side pad 23 and an n-side pad 24 formed on the upper surface of the base material 20 from a conductive material such as copper. And have. The p-side electrode 71 and the p-side pad 23 and the n-side electrode 72 and the n-side pad 24 are connected to each other by bonding wires 8 made of gold or the like.

  The support substrates 2A and 2B may be configured so that they can be mounted on other circuit boards. For example, the ground 21 formed on the surfaces of the support substrates 2A and 2B and the pads 22, 23 and 24 are connected to the BGA (ball grid array) provided on the back surfaces of the support substrates 2A and 2B through the through holes. The support substrates 2A and 2B may be mounted on the circuit board via the BGA.

(Optical adhesive)
The optical adhesive 5 includes a first adhesive part 5a to which the uncured optical adhesive 5 is first applied, and the light emitting surface 3a of the light emitting element array 3 by capillary force from the first adhesive part 5a, or It consists of a second adhesive portion 5 b supplied to a gap (coupling portion) G between the light receiving surface 7 a of the light receiving element array 7 and the optical coupling surface 4 a of the optical waveguide 4. The position of the first bonding portion 5a is on the support substrates 2A and 2B, and the uncured optical adhesive 5 is supplied to the gap G between the light emitting surface 3a and the optical coupling surface 4a by capillary force. Is at a distance to get.

  The optical adhesive 5 has a property of transmitting the light emission wavelength of the light emitting element array 3 and is capable of receiving a thermosetting adhesive that is cured by heating, energy rays such as visible light, ultraviolet light, electron beam, and radiation. An energy ray curable adhesive that is cured by irradiation can be used. In the present embodiment, an ultraviolet curable adhesive that is cured, for example, in 10 minutes to 60 minutes by irradiation with ultraviolet rays is used.

(Adhesive for temporary fixing)
The temporary fixing adhesive 9 does not need to have the characteristic of transmitting the light emission wavelength of the light emitting element array 3 unlike the optical adhesive 5, but the optical adhesive 5 is more suitable for positioning with high accuracy. It is preferable that the curing time is short. The temporary fixing adhesive 9 is a thermosetting adhesive that cures by heating, an energy ray curable adhesive that cures by irradiating energy rays such as visible light, ultraviolet rays, electron beams, and radiation, or a cyanoacrylate adhesive. An agent (instant adhesive) can be used. In this embodiment, an ultraviolet curable adhesive that is cured in 1 minute or less by irradiation with ultraviolet rays is used.

(Assembly method of optical module)
Next, an example of an assembly method of the optical modules 1A and 1B will be described with reference to FIGS. 4A and 4B. 4A and 4B show an example of an assembly process of the optical module 1A.

(1) As shown in the attachment process drawing 4 A (a), bonding the n-side electrode 32 of the light emitting element array 3 and the ground 21 of the supporting substrate 2A using a conductive adhesive. Next, the four p-side electrodes 31 of the light emitting element array 3 and the four pads 22 on the support substrate 2A are connected by the bonding wires 8, and the light emitting element array 3 is mounted on the support substrate 2A.

  The lower surface of the light receiving element array 7 is fixed to a predetermined position on the support substrate 2B with an adhesive or the like, and the p side electrode 71 of the light receiving element array 7, the p side pad 23 of the support substrate 2B, and the n side electrode of the light receiving element array 7 72 and the n-side pad 24 of the support substrate 2B are respectively connected by the bonding wires 8, and the light receiving element array 7 is mounted on the support substrate 2B.

(2) the adhesive coating step Then, as shown in FIG. 4 A (b), applying a temporary fixing adhesive 9 in a predetermined position on the supporting substrate 2A from the first dispenser needle 201A. The coating height H ₁ is set higher than the height of the light emitting element array 3. Subsequently, the optical adhesive 5 is applied to a predetermined position on the support substrate 2A from the second dispenser needle 201B. The coating height H ₂ is set higher than the height of the light emitting element array 3. The portion of the applied optical adhesive 5 is a first adhesive portion 5a.

(3) temporary fixing step Next, as shown in FIG. 4 A (c), and positioned at a desired position while the optical waveguide 4 was observed by camera 204 of the light guide 4 is adsorbed by the suction tool 202, the suction tool 202 is lowered to set the gap G between the light emitting surface 3a and the optical coupling surface 4a to a predetermined value (for example, 30 to 60 μm). At this time, as shown in FIG. 4 A (d), (e ), optical adhesive 5 uncured state by capillary force generated in the air gap G is supplied to the gap G from the first adhesive portion 5a. The portion of the optical adhesive 5 supplied to the gap G becomes the second adhesive portion 5b. Further, the temporary fixing adhesive 9 is also crushed.

Next, as shown in FIG. 4 A (f), irradiated with ultraviolet rays from the left ultraviolet light source 203, an optical waveguide 4 sucked and held by the suction tool 202 to the temporary fixing adhesive 9. Thereby, the temporarily fixing adhesive 9 is cured and the optical waveguide 4 is bonded (temporarily fixed) to the support substrate 2A. That is, the optical waveguide 4 is fixed to the support substrate 2 with the temporary fixing adhesive 9 having a short curing time while positioning the optical waveguide 4.

(4) The fixing step Next, as shown in FIG. 4 A (g), is irradiated from the ultraviolet light source 203 with ultraviolet optical adhesive 5. Thereby, the optical adhesive 5 is cured and the optical waveguide 4 is bonded (mainly fixed) to the light emitting element array 3 and the support substrate 2A.

  The optical module 1B on the reception side is coated and cured with the optical adhesive 5 and the temporary fixing adhesive 9 in the same manner as the optical module 1A on the transmission side, and the optical waveguide 4 is replaced with the light receiving element array 7 and the support substrate. Adhere to 2B. Thereafter, the optical connectors 6A and 6B are attached to the end face 4c side of the optical waveguide 4 of the optical modules 1A and 1B. When handling the optical modules 1 </ b> A and 1 </ b> B, even if tension or compression force is applied to the end face 4 c side of the optical waveguide 4, the tension or compression force is absorbed by the temporary fixing adhesive 9 and the load on the optical adhesive 5 is increased. It is reduced.

(5) Temporary fixing when the optical waveguide is warped FIG. 5 shows temporary fixing when the optical waveguide 4 is warped. When temporarily fixing, as shown in FIG. 5 (a), even when the reflection surface 4b side of the optical waveguide 4 is warped upward, as shown in FIG. 5 (b), the warping amount is temporarily fixed adhesive. 9, the gap G between the optical coupling surface 4a of the optical waveguide 4 and the light emitting surface 3a of the light emitting element array 3 can be set to the predetermined value.

(Operation of optical transmission equipment)
FIG. 6 is a diagram for explaining an optical transmission path. When a voltage is applied between the p-side electrode 31 and the n-side electrode 32 of the light emitting element array 3 of the optical module 1A, a laser beam having a wavelength of 850 nm, for example, is emitted in the light emitting region of the light emitting layer 30. After passing through the opening 31a of 31 and being reflected by the reflecting surface 4a of the optical waveguide 4 via the second adhesive portion 5a, it propagates through the core 40 of the optical waveguide 4 and is emitted from the end surface 4c. The laser light emitted from the end face 4c of the optical waveguide 4 enters the core 101a of the optical fiber 101, propagates through the core 101a, and is emitted from the other end face. The laser light emitted from the optical fiber 101 enters the end face 4c of the optical waveguide 4 of the optical module 1B, propagates through the core 40, is reflected by the reflecting surface 4b, and then received through the second bonding portion 5b. The light enters the light receiving portion 70 of the element array 7. A current corresponding to the amount of light incident on the light receiving unit 70 flows between the p-side electrode 71 and the n-side electrode 72.

[Second Embodiment]
FIG. 7 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the second embodiment of the present invention. In the first embodiment, the optical adhesive 5 is applied on the support substrates 2A and 2B. However, in the present embodiment, the optical adhesive 5 is used as the bonding wire 8 for sealing the bonding wire 8. The other components are the same as those in the first embodiment. The description of the same configuration as that of the first embodiment is omitted.

  The optical adhesive 5 includes a first adhesive part 5a to which the uncured optical adhesive 5 is first applied, and the light emitting surface 3a of the light emitting element array 3 or the light receiving element array 7 from the first adhesive part 5a. The second bonding portion 5b is supplied to the gap (coupling portion) G between the light receiving surface 7a and the optical coupling surface 4a of the optical waveguide 4 by capillary force. The position of the 1st adhesion part 5a exists on the bonding wire 8, Comprising: It exists in the distance which can supply the adhesive agent 5 of a non-hardened state to the space | gap G between the light emission surface 3a and the optical coupling surface 4a by capillary force. .

(Assembly method of optical module)
Next, an example of a method for assembling the optical modules 1A and 1B will be described with reference to FIGS. 8A, 8B, and 8C. 8A, 8B, and 8C show an example of an assembly process of the optical module 1A.

(1) Mounting Step As in the first embodiment, the light emitting element array 3 is mounted on the support substrate 2A, and the light receiving element array 7 is mounted on the support substrate 2B.

(2) Temporary fixing step Next, as shown in FIG. 8A, the temporary fixing adhesive 9 is applied from the first dispenser needle 201A. The coating height H ₁ is set higher than the height of the light emitting element array 3.

  Next, as shown in FIG. 8B, the optical waveguide 4 is adsorbed by the adsorption tool 202 and the optical waveguide 4 is positioned at a desired position while being observed by the camera 204. Subsequently, as shown in FIG. 8C, the suction tool 202 is lowered, and the gap G between the light emitting surface 3a and the optical coupling surface 4a is set to a predetermined value (for example, 30 to 60 μm).

  Next, as illustrated in FIG. 8D, the temporary fixing adhesive 9 is irradiated with ultraviolet rays from the ultraviolet light source 203 while the optical waveguide 4 is held by suction with the suction tool 202. Thereby, the temporarily fixing adhesive 9 is cured and the optical waveguide 4 is bonded (temporarily fixed) to the support substrate 2A.

(3) Main Fixing Step Next, as shown in FIG. 8E, the optical adhesive 5 is applied from the second dispenser needle 201B, and the bonding wire 8 is sealed. This sealed position becomes the first adhesive portion 5a. Next, as shown in FIGS. 8F and 8G, the uncured optical adhesive 5 is supplied to the gap G from the first bonding portion 5a by the capillary force generated in the gap G. The optical adhesive 5 supplied to the gap G becomes the second adhesive portion 5b.

  Next, as shown in FIG. 8H, the optical adhesive 5 is irradiated with ultraviolet rays from the ultraviolet light source 203 while the optical waveguide 4 is held by suction with the suction tool 202. As a result, as shown in FIG. 8I, the optical adhesive 5 is cured and the optical waveguide 4 is bonded (fixed) to the light emitting element array 3 and the support substrate 2A.

  The optical module 1B on the reception side is coated and cured with the optical adhesive 5 and the temporary fixing adhesive 9 in the same manner as the optical module 1A on the transmission side, and the optical waveguide 4 is replaced with the light receiving element array 7 and the support substrate. Adhere to 2B. Thereafter, the optical connectors 6A and 6B are attached to the end face 4c side of the optical waveguide 4 of the optical modules 1A and 1B.

[Third Embodiment]
FIG. 9 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the third embodiment of the present invention, and FIG. 10A is a plan view of an optical module provided on one side of the optical transmission line. 10 (b) is a cross-sectional view taken along line AA of FIG. 10 (a), FIG. 11 (a) is a plan view of the optical module provided on the other side of the optical transmission line, and FIG. 11 (b). FIG. 12 is a cross-sectional view taken along line BB in FIG.

  In the first embodiment, the temporary fixing adhesive 9 is applied to the flat support substrates 2A and 2B. However, in the present embodiment, a pedestal 25 is provided on the support substrates 2A and 2B, and the pedestal 25 is provided on the pedestal 25. By applying and reducing the application amount of the temporary fixing adhesive 9, the curing time is shortened, and the others are configured in the same manner as in the first embodiment. The description of the same configuration as that of the first embodiment is omitted.

  The pedestal 25 is made of, for example, a resin such as glass epoxy resin, and is joined to the base material 20 by adhesion or fusion with an adhesive. The thickness of the pedestal 25 is, for example, 1/5 to 1/2 of the height of the light emitting element array 3 and the light receiving element array 7 depending on the amount of the temporary fixing adhesive 9 applied and the degree of warping of the optical waveguide 4. Select within the range.

[Other embodiments]
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. In addition, it is possible to arbitrarily combine the constituent elements of each embodiment without departing from the spirit of the present invention.

  For example, the angle of the reflection surface of the optical waveguide is not limited to 45 degrees. Further, a metal film such as aluminum, gold, silver, and titanium, or a dielectric multilayer film having wavelength selectivity may be formed on the surface of the reflection surface of the optical waveguide.

  In each of the above embodiments, the light emitting element array 3 is used for one optical module 1A and the light receiving element array 7 is used for the other optical module 1B. , 1B, a light emitting element and a light receiving element may be arranged to perform bidirectional communication. The optical module may use a single optical element.

FIG. 1 is a perspective view showing a schematic configuration of the optical transmission apparatus according to the first embodiment of the present invention. FIG. 2A is a plan view of the optical module provided on one side of the optical transmission line, and FIG. 2B is a cross-sectional view taken along line AA in FIG. FIG. 3A is a plan view of the optical module provided on the other side of the optical transmission line, and FIG. 3B is a cross-sectional view taken along line BB in FIG. 4A to 4C are cross-sectional views illustrating an example of the assembly process of the optical module. 4B to 4G are cross-sectional views illustrating an example of an assembly process of the optical module. FIGS. 5A and 5B are cross-sectional views showing a temporary fixing process when the optical waveguide is warped. FIG. 6 is a diagram for explaining an optical transmission path. FIG. 7 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the second embodiment of the present invention. 8A (a) to 8 (c) are cross-sectional views showing an example of the assembly process of the optical module. 8B (d) to 8 (f) are cross-sectional views showing an example of the assembly process of the optical module. 8C (g) to 8 (i) are cross-sectional views illustrating an example of the assembly process of the optical module. FIG. 9 is a perspective view showing a schematic configuration of an optical transmission apparatus according to the third embodiment of the present invention. FIG. 10A is a plan view of an optical module provided on one side of the optical transmission line, and FIG. 10B is a cross-sectional view taken along line AA in FIG. FIG. 11A is a plan view of an optical module provided on the other side of the optical transmission line, and FIG. 11B is a cross-sectional view taken along line BB of FIG. 11A.

Explanation of symbols

1A, 1B Optical modules 2A, 2B Support substrate 3 Light emitting element array 3a Light emitting surface 4 Optical waveguide 4a Optical coupling surface 4b Reflecting surface 4c End surface 5 Optical adhesive 5b First adhesive portion 5a Second adhesive portion 6A, 6B Light Connector 7 Light-receiving element array 7a Light-receiving surface 8 Bonding wire 9 Temporary fixing adhesive 20 Base material 21 Ground 22 Pad 23 p-side pad 24 n-side pad 25 Base 30 Active layer 31 p-side electrode 31a Opening 32 n-side electrode 40 Core 41 Cladding 60 Pin hole 70 Light receiving part 71 P side electrode 71a Opening 72 N side electrode 100 Optical transmission device 101 Optical fibers 102A and 102B Optical connector 103 Pin 201A First dispenser needle 201B Second dispenser needle 202 Adsorption tool 203 Ultraviolet light source G Gap

Claims (7)

A surface-type optical element having an optical surface for emitting or receiving light on the side opposite to the mounting surface;
An optical waveguide having an optical coupling surface optically coupled with the optical surface of the optical element, and an optical path conversion surface provided at a position facing the optical coupling surface;
A substrate having a surface to which the mounting surface of the light emitting element is attached , wherein the surface is a surface protruding to the optical waveguide side ; and
From coupling portion between the bonding the optical surface and the optical coupling surface of the optical waveguide at a predetermined curing rate, the optical surface and the optical coupling surface of the optical waveguide of the optical element before Symbol optical element A first adhesive portion applied at a predetermined position; and a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force to adhere the optical surface and the optical coupling surface. An optical adhesive;
The portion other than the optical coupling surface of the optical waveguide and the substrate are bonded at a curing rate faster than the predetermined curing rate, and the protruding surface and the portion other than the optical coupling surface of the optical waveguide are bonded. An optical module comprising a temporary fixing adhesive.   The optical module according to claim 1, wherein the temporary fixing adhesive is a cyanoacrylate adhesive.   The optical module according to claim 1, wherein the optical adhesive and the temporary fixing adhesive are curable adhesives that are cured by receiving heat or energy rays. A planar light emitting device having a light emitting surface opposite to the mounting surface; an optical coupling surface optically coupled to the light emitting surface of the light emitting device; and an optical path conversion surface provided at a position facing the optical coupling surface. and an optical waveguide, a substrate having the surface on which the mounting surface is mounted in the light emitting element, a substrate wherein the surface is a surface that projects the optical waveguide side, the optical waveguide and the light emitting surface before Symbol emitting element adhesion of adhering the said optical coupling surface at a predetermined curing rate, first applied to a predetermined position from the coupling portion between the light emitting surface and the optical coupling surface of the optical waveguide of the light - emitting element And an optical adhesive having a second adhesive portion that is supplied from the first adhesive portion to the coupling portion by capillary force and adheres the light emitting surface and the optical coupling surface, and the optical waveguide A portion other than the optical coupling surface and the substrate are connected to the predetermined hardness. Bonding at a high curing rate than a first optical module that includes a temporary fixing adhesive for bonding the said projecting surface with portions other than the optical coupling surface of the optical waveguide,
A planar light-receiving element having a light-receiving surface opposite to the mounting surface; an optical coupling surface optically coupled to the light-receiving surface of the light-receiving element; and an optical path conversion surface provided at a position facing the optical coupling surface and an optical waveguide, a substrate having the surface on which the mounting surface is mounted in the light emitting element, a substrate wherein the surface is a surface that projects the optical waveguide side, the optical waveguide and the light-receiving surface before Symbol receiving element bonding of the said optical coupling surface adhered at a predetermined curing rate, first applied to a predetermined position from the coupling portion between said light receiving surface and the optical coupling surface of the optical waveguide of the light receiving element And an optical adhesive having a second adhesive portion that is supplied to the coupling portion by capillary force from the first adhesive portion and bonds the light receiving surface and the optical coupling surface, and the optical waveguide A portion other than the optical coupling surface and the substrate are connected to the predetermined hardness. Bonding at a high curing rate than a second optical module including a temporary fixing adhesive for bonding the said projecting surface with portions other than the optical coupling surface of the optical waveguide,
An optical transmission device comprising: an optical fiber connecting the optical waveguide of the first optical module and the optical waveguide of the second optical module. A surface-type optical element having an optical surface for emitting or receiving light on the side opposite to the mounting surface, a substrate to which the mounting surface of the optical element is attached, an optical coupling surface optically coupled to the optical surface of the optical element, and A preparation step of preparing an optical waveguide having an optical path conversion surface provided at a position facing the optical coupling surface;
An attachment step of attaching the mounting surface of the optical element to the substrate;
A main fixing step of adhering the optical surface of the optical element and the optical coupling surface of the optical waveguide with an optical adhesive that cures at a predetermined curing rate;
A temporary fixing adhesive for curing the portion other than the optical coupling surface of the optical waveguide and the substrate at a curing rate faster than the predetermined curing rate, wherein the temporary fixing adhesive is more than the optical element. A temporary fixing step in which the height of the temporary fixing adhesive is lower than that during application when the optical waveguide is positioned on the optical element.
Prior to the temporary fixing step and the main fixing step, the temporary fixing adhesive is applied to a predetermined position on the substrate, and the optical adhesive is applied to the predetermined position on the substrate. Application process,
After the temporary fixing step with the temporary fixing adhesive, a main fixing step with the optical adhesive is performed, and the main fixing step includes the optical surface of the optical element and the optical coupling surface of the optical waveguide. The uncured optical adhesive is supplied to the gap by the capillary force generated in the gap by applying an uncured optical adhesive to the predetermined position from the gap between the gap, and the uncured state A method for producing an optical module, comprising: curing the optical adhesive and bonding the optical surface and the optical coupling surface.   The method for manufacturing an optical module according to claim 5, wherein the temporary fixing adhesive is a cyanoacrylate adhesive.   The method for manufacturing an optical module according to claim 5, wherein the optical adhesive and the temporary fixing adhesive are curable adhesives that are cured by receiving heat or energy rays.