JP4674596B2 - Method for manufacturing optoelectronic circuit board - Google Patents

Description

  The present invention relates to an optoelectronic circuit board and a method for manufacturing the same.

  An optical communication device in which an optical circuit and an electronic circuit are densely mounted has been proposed (see Patent Document 1).

This optical communication device includes an IC chip mounting substrate on which a light emitting element, a light receiving element, and an IC chip are mounted, and a multilayer printed wiring board including an optical waveguide having an optical path conversion mirror at an end portion through a sealing resin layer. Are joined. The periphery of the light emitting element and the light receiving element is sealed with resin, and the optical path conversion mirror of the optical waveguide is sealed with an optical path resin layer. Thereby, dust and foreign matters floating in the air do not enter between the optical element and the optical waveguide, and transmission of the optical signal is not hindered by dust and foreign matters.
Japanese Patent Laid-Open No. 2004-4428

  An object of the present invention is to provide a highly productive optoelectronic circuit board and a method for manufacturing the same that can suppress a reduction in optical transmission loss.

  In order to achieve the above object, the present invention provides the following optoelectronic circuit board and manufacturing method thereof.

[1] A planar optical element having a mounting surface on the side opposite to an optical surface that transmits or receives an optical signal, and a through hole that penetrates the first and second surfaces facing each other, and is located in the through hole A printed circuit board in which an optical waveguide having an optical path conversion surface is embedded; and an attachment surface to which the mounting surface of the planar optical element is attached, and the attachment so that the optical element is optically coupled to the optical path conversion surface. A relay board electrically connected to the first surface of the printed circuit board and a gap between the optical surface and the optical path conversion surface of the surface optical element, and the light An optoelectronic circuit board comprising: an optical resin having a characteristic of transmitting a signal wavelength and being cured when irradiated with energy rays from the second surface side of the printed board through the through hole.

[2] The optical path conversion surface of the optical waveguide is coated with a resin having a refractive index smaller than that of the core of the optical waveguide from the second surface side of the through hole. Optoelectronic circuit board.

[3] The optical path conversion surface of the optical waveguide is coated with a resin having the same refractive index as that of the cladding of the optical waveguide from the second surface side of the through hole. Optoelectronic circuit board.

[4] The optoelectronic circuit board according to [2] or [3], wherein the resin that covers the optical path conversion surface is a curable resin that cures when irradiated with energy rays.

[5] A printed circuit board having a through hole penetrating the opposing first and second surfaces and having an optical waveguide having an optical path conversion surface located in the through hole, and an optical for transmitting or receiving an optical signal a first step of preparing a relay substrate having a mounting surface on which the mounting surface of the surface optical device having a mounting surface on a surface opposite to the side attached, the penetration of the previous SL PCB first surface A second step of filling a region including a hole with an optical resin that has a property of transmitting the wavelength of the optical signal and is cured when irradiated with an energy ray; and the optical element includes the optical path conversion surface and the light. A third step of electrically connecting the mounting surface of the relay substrate on which the planar optical element is mounted so as to be coupled to the first surface of the printed circuit board; and The through hole from the second surface side A fourth step of curing the optical resin of the irradiated first surface through to the through hole of the second surface of the printed circuit board, the optical resin, or translucent to An optoelectronic circuit board manufacturing method comprising: a fifth step of filling a transparent resin; and a sixth step of curing the optical resin on the second surface side or curing the transparent resin .

  According to the optoelectronic circuit board according to the first aspect, it is possible to suppress a decrease in optical transmission loss and to increase productivity.

  According to the optoelectronic circuit board according to the second aspect, it is possible to suppress a decrease in optical transmission loss due to adhesion of dust, foreign matter, and the like to the optical path conversion surface.

  According to the optoelectronic circuit board according to the third aspect, it is possible to suppress a decrease in optical transmission loss due to adhesion of dust, foreign matter, and the like to the optical path conversion surface.

  According to the optoelectronic circuit board according to the fourth aspect, the productivity is further increased by using a common resin for the optical element side and the optical path conversion surface side.

  According to the method for manufacturing an optoelectronic circuit board according to the fifth aspect, it is possible to suppress a decrease in optical transmission loss and increase productivity.

[First Embodiment]
1A and 1B show a schematic configuration of an optoelectronic circuit board according to a first embodiment of the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a cross-sectional view along line AA in FIG. c) is a sectional view taken along line BB in FIG.

  The optoelectronic circuit board 1 is obtained by integrating an optical circuit and an electronic circuit, and is configured by embedding an optical waveguide 13 (see FIGS. 1B and 1C) in a printed circuit board 100.

  The printed circuit board 100 includes first and second substrates 10 and 11 disposed via an optical waveguide 13, and the first and second optical modules are formed on the upper surface (first surface) of the first substrate 10. 12A and 12B are mounted, and these optical modules 12A and 12B are optically connected to the optical waveguide 13. Note that the number of layers having wiring in the printed circuit board 100 is not limited to two, and may be three or more.

  In the optoelectronic circuit board 1, the optical waveguide 13 is sealed around the first and second substrates 10 and 11 by a sealing member 200 such as an epoxy resin. The optical waveguide 13 having the same size as the substrates 10 and 11 may be disposed between the first and second substrates 10 and 11 without providing the sealing member 200.

(Optical module)
The first optical module 12A includes a light emitting element array 120 in which a plurality of light emitting elements (planar optical elements) 120a are arranged as an example, a drive circuit that drives the light emitting elements 120a, and the like. The second optical module 12B includes a light receiving element array 121 in which a plurality of light receiving elements (surface light receiving elements) 121a are arranged in a line, a processing circuit for amplifying an output signal from the light receiving element 121a, and the like. The first and second optical modules 12A and 12B are packaged, and their detailed configurations will be described later.

(First substrate)
For example, the first substrate 10 is formed on a base material made of an insulating material such as a glass epoxy resin having a thickness of 0.5 mm, and an upper surface of the base material, and various electronic components, power circuit components, etc. An electrically connected conductive pattern.

  The first substrate 10 has a common light-emitting side opening described later at a position facing the four light-emitting elements 120a, and a common light-receiving side opening described later at a position facing the four light-receiving elements 121a. ing. The common light emitting side opening and light receiving side opening may be four light emitting side openings and four light receiving side openings, respectively.

(Second substrate)
The second substrate 11 is formed on, for example, a base material made of an insulating material such as a glass epoxy resin having a thickness of 1 mm, and a lower surface (second surface) of the base material. A circuit pattern or the like and a conductive pattern electrically connected thereto.

  The second substrate 11 has a light emitting side opening and a light receiving side opening at positions corresponding to the light emitting side opening and the light receiving side opening of the first substrate 10. The light emitting side opening and the light receiving side opening may be four light emitting side openings and four light receiving side openings.

(Optical waveguide)
As shown in FIGS. 1B and 1C, the optical waveguide 13 has, for example, four cores 131 having an overall thickness of 0.2 mm and a rectangular cross section of 50 × 50 μm, and these cores. The clad 132 is formed around the core 131 and has a refractive index smaller than that of the core 131.

(Optical waveguide manufacturing method)
Next, an example of a method for manufacturing the optical waveguide 13 will be described. The optical waveguide 13 can be produced by, for example, a commonly used photolithography method or a method using RIE (reactive ion etching). In particular, it can be efficiently produced by a production process using a mold described in Japanese Patent Application Laid-Open No. 2004-29507 already proposed by the present applicant. The manufacturing process will be described below.

  First, a master on which convex portions corresponding to the four cores 131 are formed is produced using, for example, a photolithography method. Next, a curable resin having a viscosity of, for example, about 500 to 7000 mPa · s and having light transmittance in the ultraviolet region and the visible region, for example, a methylsiloxane group in the molecule, A layer of a curable organopolysiloxane containing an ethylsiloxane group and a phenylsiloxane group is provided by coating or the like, and then cured to form a cured layer. Next, the hardened layer is peeled off from the master and a mold having a concave portion corresponding to the convex portion is produced.

  Next, a clad film substrate made of a resin excellent in adhesion to the mold, for example, an alicyclic acrylic resin film, an alicyclic olefin resin film, a cellulose triacetate film, a fluororesin film, or the like is adhered to the mold. Let Next, the concave portion of the mold is filled with, for example, an ultraviolet curable or thermosetting monomer, an oligomer or a mixture of a monomer and an oligomer, an epoxy type, a polyimide type, an acrylic type ultraviolet curable resin, or the like. . Next, the curable resin in the recess is cured to form the core 131, and then the mold is peeled off. As a result, the four cores 131 are left on the clad film substrate.

  Next, the clad 132 is provided so as to cover the core 131 on the surface side of the clad film substrate on which the core 131 is formed. Examples of the clad 132 include a film, a layer obtained by applying and curing a clad curable resin, and a polymer film obtained by applying and drying a solvent solution of a polymer material.

  Finally, the surface where the core 131 of the optical waveguide is exposed is cut at a predetermined angle by a dicer to form an optical path conversion surface. Further, by cutting with a dicer parallel to the core 131, the optical waveguide 13 having the clad film base material and the clad layer as the clad 132 is completed.

  FIG. 2 is a cross-sectional view taken along the line CC of FIG.

(First optical module)
The first optical module 12A includes a relay board 129, the above-described light emitting element array 120 mounted on the lower surface of the relay board 129, and a control unit 127A mounted on the upper surface of the relay board 129.

  The relay substrate 129 has a base material made of an insulating material, and terminals 124 are formed on an attachment surface 129a that is the lower surface of the base material. The terminal 124 is electrically connected to the terminal 110 of the first substrate 10 by a solder ball (conductive ball) 125 such as a BGA (Ball Grid Array). Further, the control unit 127 </ b> A is connected to the terminal 124 by the wire 126.

  The control unit 127A includes a drive circuit that drives the light emitting element, and is bonded to the relay substrate 129 with a conductive adhesive or the like.

  The light emitting element 120a of the light emitting element array 120 uses a surface light emitting element having a mounting surface on the side opposite to the light output surface (optical surface) 120b for outputting an optical signal. As the surface light emitting element, for example, a surface light emitting diode, a surface emitting laser, or the like can be used. In the present embodiment, a surface emitting laser is used. A surface emitting laser array using this surface emitting laser has, for example, an n-type lower reflector layer, an active layer, a current confinement layer, a p-type upper reflector layer, a p-type contact layer, and a p-side on an n-type GaAs substrate. An electrode is formed, and an n-side electrode is formed on the back surface of the n-type GaAs substrate. The active layer, the current confinement layer, the p-type upper reflector layer, the p-type contact layer, and the p-side electrode are formed of the light emitting element 120a. It is formed every time.

  The light emitting side opening 10a of the first substrate 10 and the light emitting side opening 11a of the second substrate 11 form a through hole so that the optical path conversion surface 133A is exposed, and the light emitting element array 120 and the optical waveguide 13 are connected to each other. In between and between the optical path conversion surface 133A and the light emitting side opening 11a of the second substrate 11, it is filled with the optical resin 14. The optical resin 14 has, for example, a property of transmitting the wavelength of the optical signal 2 and a refractive index smaller than the refractive index of the core 131 of the optical waveguide 13, desirably the same refractive index as that of the cladding 132 of the optical waveguide 13, and visible. An energy ray curable resin that is cured by irradiation with energy rays such as light rays, ultraviolet rays, electron beams, and radiations can be used. In this embodiment, an ultraviolet curable resin that is cured by irradiation with ultraviolet rays is used.

(Second optical module)
The second optical module 12B includes a relay substrate 129 similar to the first optical module 12A, the above-described light receiving element array 121 mounted on the lower surface of the relay substrate 129, and a control unit mounted on the upper surface of the relay substrate 129. 127B.

  The control unit 127B includes an amplifier circuit that amplifies the electric signals output from the four light receiving elements 121a and a signal processing circuit that converts the output signal of the amplifier circuit into an image signal or the like, and has a conductive adhesive or the like. To the relay substrate 129.

  The light receiving element 121a of the light receiving element array 121 uses a surface light receiving element having a mounting surface on the opposite side to the light input surface (optical surface) 121b for inputting an optical signal. As the surface light receiving element, for example, a surface photodiode can be used. In this embodiment, a GaAs PIN photodiode having excellent high-speed response is used. The light receiving element array 121 using the PIN photodiode is formed, for example, on a GaAs substrate on a P-layer, I-layer, and N-layer that are PIN-bonded, a p-side electrode connected to the P-layer, and an N-layer. The P layer, the I layer, the N layer, the p side electrode, and the n side electrode are formed for each light receiving element 121a.

  The light-receiving side opening 10b of the first substrate 10 and the light-emitting side opening 11b of the second substrate 11 form a through hole so that the optical path conversion surface 133B is exposed, and the light receiving element array 121 and the optical waveguide 13 Between the optical path conversion surface 133B and the light receiving side opening 11b of the second substrate 11, it is filled with the optical resin 14 similar to that of the first optical module 12A.

(Optical module mounting method)
3A, 3B, and 3C show a method of mounting the first optical module on the first substrate, and FIG. 3A (a ₁ ), FIG. 3B (b), (c), and FIG. 3C (d) to FIG. (f) is a fragmentary sectional view, FIG. 3A _{(a 2)} is a plan view corresponding to FIG. 3A _{(a 1).}

First, as shown in FIGS. 3A (a ₁ ) and (a ₂ ), the first substrate 10 on which the light emitting side opening 10a, the light receiving side opening 10b and the like are formed, the light emitting side opening 11a, the light receiving side opening 11b and the like are provided. A printed circuit board 100 in which the optical waveguide 13 is disposed between the formed second substrate 11 is prepared.

The light emitting side opening 10a of the first substrate 10 and the light emitting side opening 11a of the second substrate 11 are formed slightly larger than the width of the optical waveguide 13 as shown in FIG. 3A (a ₂ ).

  Next, as shown in FIG. 3B (b), the uncured optical resin 14 is applied from the dispenser needle 50 to a region including the light emitting side opening 10 a of the first substrate 10.

  Next, as shown in FIG. 3B (c), the first module 12A is mounted, and as shown in FIG. 3C (d), the first module 12A is electrically connected to the first substrate 10 by the solder balls 125. The optical resin 14 is irradiated with ultraviolet rays emitted from the ultraviolet light source 51 from the lower surface (second surface) side of the second substrate 11 through the light emitting side opening 11a, and the optical resin 14 is cured.

  After the optical resin 14 is cured, the uncured optical resin 14 is applied from the dispenser needle 50 to the light emission side opening 11a of the second substrate 11 as shown in FIG. 3C (e). Subsequently, as shown in FIG. 3C (f), the optical resin 14 is irradiated with ultraviolet rays from the ultraviolet light source 51 through the light emitting side opening 11a of the second substrate 11 to cure the optical resin 14 on the second substrate 11 side.

  In the above description, the first optical module 12A has been described. However, the second optical module 12B is mounted on the first substrate 10 in the same manner.

(Operation of the first embodiment)
The operation of the optoelectronic circuit board according to the first embodiment of the present invention will be described below with reference to FIGS.

  Here, as an example, a case where an image signal is transmitted from the first optical module 12A to the second optical module 12B will be described. The drive circuit of the control unit 127A of the first optical module 12A transmits a drive signal to the light emitting element 120a of the light emitting element array 120 based on the image signal. The light emitting element 120a transmits the optical signal 2 toward the optical path conversion surface 133A of the optical waveguide 3 through the light emission side opening 10a based on the drive signal. At this time, the voltage of the drive signal is applied between the p-type electrode and the n-type electrode of the light emitting element 120a, and for example, laser light having a wavelength of 850 nm is output as the optical signal 2 from the light emitting region of the light emitting layer.

  The optical path conversion surface 133A converts the optical path of the optical signal 2 transmitted from the light emitting element 120a, and propagates the optical signal 2 to the core 131 of the optical waveguide 13. The optical signal 2 propagated to the core 131 has its optical path converted by the optical path conversion surface 133B, passes through the light receiving side opening 10b, and is received by the light receiving element array 121 of the second optical module 12B. The light receiving element 121a converts the received optical signal 2 into an electrical signal and outputs it to the control unit 127B.

  The amplifier of the control unit 127B amplifies the converted electric signal, and the signal processing circuit processes the signal from the amplifier to generate an image signal, and performs predetermined electrons on the first or second substrate 10 or 11. Output to parts.

[Second Embodiment]
4A and 4B are cross-sectional views illustrating the main part of the method for mounting the first optical module on the first substrate according to the second embodiment of the present invention.

  In the first embodiment, the arrays 120 and 121 and the optical path conversion surfaces 133A and 133B are sealed with the same optical resin 14. However, in this embodiment, the arrays 120 and 121 are sealed with the optical resin 14. The transparent resin 15 having translucency is arranged on the optical path conversion surfaces 133A and 133B side, and the others are configured in the same manner as in the first embodiment.

  The transparent resin 15 has a characteristic that transmits energy rays for curing the optical resin 14 on the first substrate 10 side and a refractive index of the core 131 of the optical waveguide 13, preferably the same as the cladding 132 of the optical waveguide 13. For example, an inexpensive thermosetting resin can be used as long as the resin has a refractive index.

  In the second embodiment configured as described above, in order to mount the first optical module 12A on the first substrate 10A, first, the first light emitting side opening 10a, the light receiving side opening 10b and the like are formed. A printed circuit board 100 in which an optical waveguide 13 is disposed between the substrate 10 and the second substrate 11 on which the light emitting side opening 11a, the light receiving side opening 11b and the like are formed is prepared.

  Next, as shown in FIG. 4A (a), as the transparent resin 15, for example, a thermosetting resin is filled in the light emitting side opening 11a of the second substrate 11 to seal the optical path conversion surface 133A, and thermosetting is performed. The curing resin is heated to be cured.

  Next, as shown in FIG. 4A (b), the uncured optical resin 14 is applied from the dispenser needle 50 to the region including the light emitting side opening 10 a of the first substrate 10.

  Next, as shown in FIG. 4A (c), the first module 12A is mounted, and as shown in FIG. 4B (d), the first module 12A is electrically connected to the first substrate 10 by the solder balls 125. The optical resin 14 on the first substrate 10 side is irradiated with ultraviolet rays from the ultraviolet light source 51 through the transparent resin 15 disposed in the light emitting side opening 11 a of the second substrate 11 to cure the optical resin 14.

  In the above description, the first optical module 12A has been described. However, the second optical module 12B is mounted on the first substrate 10 in the same manner.

[Third Embodiment]
FIG. 5 is a cross-sectional view of a main part showing a method for mounting the first optical module on the first substrate according to the third embodiment of the present invention.

  This embodiment has the same configuration as that of the first embodiment, but the filling method of the optical resin 14 is different from that of the first embodiment as described below.

  Similar to the first embodiment, the first substrate 10 on which the light emitting side opening 10a, the light receiving side opening 10b, etc. are formed, and the second substrate 11 on which the light emitting side opening 11a, the light receiving side opening 11b, etc. are formed. A printed circuit board 100 in which the optical waveguide 13 is disposed between the two is prepared.

Next, as shown in FIG. 5A, the uncured optical resin 14 is supplied from the dispenser needle 50 to the light emitting side opening 10 a of the first substrate 10 through the light emitting side opening 11 a of the second substrate 11. To do. At this time, the uncured optical resin 14 passes through a slight gap (see FIG. 3A (a ₂ )) provided between the side surface of the optical waveguide 13 near the optical path conversion surface 133A and the light emission side openings 10a and 11a. The light is supplied to the light emitting side opening 10a side of the first substrate 10.

  Next, as shown in FIG. 5B, the first module 12A is mounted, and as shown in FIG. 5C, the first module 12A is electrically connected to the first substrate 10 by the solder balls 125. The optical resin 14 is irradiated with ultraviolet rays from the ultraviolet light source 51 through the light emitting side opening 11a of the second substrate 11 to cure the optical resin 14.

  In the above description, the first optical module 12A has been described. However, the second optical module 12B is mounted on the first substrate 10 in the same manner.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

1A and 1B show a schematic configuration of an optoelectronic circuit board according to a first embodiment of the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a cross-sectional view along line AA in FIG. c) is a sectional view taken along line BB in FIG. FIG. 2 is a cross-sectional view taken along the line CC of FIG. FIG. 3A shows a method of mounting the first optical module according to the first embodiment of the present invention on the first substrate, (a ₁ ) is a cross-sectional view of the main part, and (a ₂ ) is ( it is a plan view corresponding to a _1). FIGS. 3B (b) and 3 (c) are cross-sectional views showing the main part of the method for mounting the first optical module on the first substrate according to the first embodiment of the present invention. 3C (d) to 3 (f) are cross-sectional views illustrating the main part of the method for mounting the first optical module on the first substrate according to the first embodiment of the present invention. 4A (a) to 4 (c) are cross-sectional views illustrating the main part of the mounting method of the first optical module according to the second embodiment of the present invention on the first substrate. FIG. 4B (d) is a cross-sectional view illustrating the main part of the mounting method of the first optical module according to the second embodiment of the present invention on the first substrate. FIGS. 5A to 5C are cross-sectional views illustrating the main part of the method for mounting the first optical module according to the third embodiment of the present invention on the first substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optoelectronic circuit board, 2 ... Optical signal, 10 ... 1st board | substrate, 10a ... Light emission side opening, 10b ... Light reception side opening, 11 ... 2nd board | substrate, 11a ... Light emission side opening, 11b ... Light reception side opening, 12A DESCRIPTION OF SYMBOLS 1st optical module, 12B ... 2nd optical module, 13 ... Optical waveguide, 14 ... Optical resin, 15 ... Transparent resin, 100 ... Printed circuit board, 110 ... Terminal, 120 ... Light emitting element array, 120a ... Light emitting element, 120b ... light output surface, 121 ... light receiving element array, 121a ... light receiving element, 121b ... light input surface, 122 ... wire, 123 ... pad, 124 ... terminal, 125 ... solder ball, 126 ... wire, 127A ... control unit, 127B ... Control part, 129 ... Relay substrate, 129a ... Mounting surface, 131 ... Core, 132 ... Cladding, 133A ... Optical path conversion surface, 133B ... Optical path conversion surface, 200 ... Sealing member

Claims (5)

A printed circuit board having a through hole penetrating the opposing first and second surfaces and having an optical waveguide having an optical path conversion surface located in the through hole, and opposite to an optical surface for transmitting or receiving an optical signal A first step of preparing a relay substrate having a mounting surface to which the mounting surface of the surface optical element having a mounting surface on the side is attached;
The area including the through hole of the first surface side of the front Symbol PCB has a characteristic of transmitting the wavelength of the optical signal, a second for filling the optical resin energy ray is cured by being irradiated And the process of
A third step of electrically connecting the mounting surface of the relay substrate on which the surface optical element is mounted to the first surface of the printed circuit board so that the optical element is optically coupled to the optical path conversion surface. When,
A fourth step of curing the optical resin on the first surface side by irradiating the energy beam from the second surface side of the printed circuit board through the through hole ;
A fifth step of filling the through hole on the second surface side of the printed circuit board with the optical resin or a transparent resin having translucency;
And a sixth step of curing the optical resin on the second surface side or curing the transparent resin . 2. The method of manufacturing an optoelectronic circuit board according to claim 1, wherein the second process, the third process, the fourth process, the fifth process, and the sixth process are performed in this order. . The fifth step, the sixth step, the second step, the third step, and the fourth step are performed in this order, and in the fifth step, the penetration on the second surface side is performed. 2. The method of manufacturing an optoelectronic circuit board according to claim 1, wherein the hole is filled with the transparent resin having a characteristic of transmitting the energy rays. The second and fifth steps, the third step, the fourth and sixth steps are performed in this order. In the fifth step, the optical resin is formed in the through hole on the second surface side. The method for manufacturing an optoelectronic circuit board according to claim 1, wherein: The filling in the second step is performed from the first surface side, and the filling in the fifth step is performed from the second surface side. A method of manufacturing an optoelectronic circuit board.

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