JPH11251496A - Cooling structure of ic - Google Patents

Cooling structure of ic

Info

Publication number
JPH11251496A
JPH11251496A JP6448898A JP6448898A JPH11251496A JP H11251496 A JPH11251496 A JP H11251496A JP 6448898 A JP6448898 A JP 6448898A JP 6448898 A JP6448898 A JP 6448898A JP H11251496 A JPH11251496 A JP H11251496A
Authority
JP
Japan
Prior art keywords
heat
heat sink
nut
bolt
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6448898A
Other languages
Japanese (ja)
Inventor
Fumio Tabata
文大 田畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ando Electric Co Ltd
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Priority to JP6448898A priority Critical patent/JPH11251496A/en
Publication of JPH11251496A publication Critical patent/JPH11251496A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a chilling structure of an IC which is easy to replace, good in thermal efficiency and low in mounting height by adhering the heat of a bolt to a package of the IC and bonding the bolted IC to a heat sink with a nut. SOLUTION: A package 1A of an IC 1 is coated with an adhesive 5, connected to a heat 2A and coated with a heat conductive agent 6, the threaded IC is connected to a heat sink 3 with a nut 4, and the package 1A is tightly contacted to the heat sink 3 through the heat conducting agent 6 because of the heat sink 3 forming a hole 3A for embedding the head 2A. When the IC 1 is replaced, the connection by the nut 4 is released. Because the IC 1 can not be separated from the bolt 2, it is replaced as a bolted IC. The heat sink 3 is of a reusable structure. This immediately conducts the generated heat of the IC 1 to the heat sink 3 via the heat conductive agent 6, thus heat radiating it. Hence the replacement is made easy, heat efficiency becomes high and also mounting height becomes low.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、ＩＣの冷却構造
についてのものである。特に、ヒートシンクを使用する
ＩＣの冷却構造についてのものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC cooling structure. In particular, it relates to a cooling structure of an IC using a heat sink.

【０００２】[0002]

【従来の技術】ＩＣの外形とほぼ同形のヒートシンクを
ＩＣに接着し、ＩＣを冷却する。しかし、ＩＣの発熱量
が大きい場合は、ＩＣの外形より大きいヒートシンクを
取りつける必要がある。また、ＩＣが破損した場合に交
換容易な構造が要求される。次に、従来のＩＣの冷却構
造を図４と図５により説明する。図４は斜視分解組立
図、図５は図４の実装状態での断面図である。2. Description of the Related Art A heat sink having substantially the same shape as the outer shape of an IC is bonded to the IC to cool the IC. However, when the heat value of the IC is large, it is necessary to attach a heat sink larger than the outer shape of the IC. In addition, a structure that can be easily replaced when the IC is damaged is required. Next, a conventional IC cooling structure will be described with reference to FIGS. FIG. 4 is an exploded perspective view, and FIG. 5 is a sectional view of the mounted state of FIG.

【０００３】図４の１はＩＣ、３はヒートシンク、５は
接着剤、６は熱伝導剤、７は板ナット、８は雄ねじであ
る。In FIG. 4, 1 is an IC, 3 is a heat sink, 5 is an adhesive, 6 is a heat conductive agent, 7 is a plate nut, and 8 is a male screw.

【０００４】ＩＣ１のパッケージ部１Ａに接着剤５を塗
布し、板ナット７と結合させる。熱伝導剤６を板ナット
７の表面に塗布する。雄ねじ８でヒートシンク３と板ナ
ットつきＩＣを連結する。[0006] An adhesive 5 is applied to the package portion 1 A of the IC 1 and bonded to the plate nut 7. The heat conductive agent 6 is applied to the surface of the plate nut 7. The male screw 8 connects the heat sink 3 to the IC with the plate nut.

【０００５】ＩＣ１を交換するときは、雄ねじ８による
連結を解除する。ＩＣ１と板ナット７は分離できないの
で、前記板ナットつきＩＣにして交換する。ヒートシン
ク３は再利用できる構造である。When replacing the IC 1, the connection by the male screw 8 is released. Since the IC 1 and the plate nut 7 cannot be separated, the IC with the plate nut is replaced. The heat sink 3 has a reusable structure.

【０００６】図５において、ＩＣ１の発生熱は、接着剤
５、板ナット７、熱伝導剤６、ヒートシンク３の順に伝
導し、放熱される。In FIG. 5, the heat generated by the IC 1 is conducted in the order of the adhesive 5, the plate nut 7, the heat conductive agent 6, and the heat sink 3, and is radiated.

【０００７】[0007]

【発明が解決しようとする課題】従来のＩＣの冷却構造
には次のような問題点がある。 （１）ＩＣ１とヒートシンク３に板ナット７が介在する
ので実装高が必要であす。 （２）ＩＣ１の発生熱は、接着剤５、ブロック７、熱伝
導剤６、ヒートシンク３の順で伝導する。そのため、放
熱効率が悪いので、形状が大きいヒートシンク３を必要
とする。The conventional IC cooling structure has the following problems. (1) Since the plate nut 7 is interposed between the IC 1 and the heat sink 3, a mounting height is required. (2) The heat generated by the IC 1 is conducted in the order of the adhesive 5, the block 7, the heat conductive agent 6, and the heat sink 3. Therefore, since the heat radiation efficiency is poor, the heat sink 3 having a large shape is required.

【０００８】この発明は、交換容易であり、放熱効率が
良く、実装高の低いＩＣの冷却構造を提供することを目
的とする。An object of the present invention is to provide an IC cooling structure that is easy to replace, has good heat radiation efficiency, and has a low mounting height.

【０００９】[0009]

【課題を解決するための手段】この目的を達成するた
め、請求項１に係わる発明は、ＩＣ１のパッケージ部１
Ａにボルト２の頭部２Ａを接着し、前記ボルト２つきＩ
Ｃ１がヒートシンク３とナット４で結合する。In order to achieve this object, the invention according to claim 1 is directed to a package 1 of an IC 1.
A, the head 2A of the bolt 2 is adhered to
C1 is connected to the heat sink 3 by the nut 4.

【００１０】請求項２に係わる発明は、請求項１記載の
発明において、ボルト２の頭部２Ａが埋まる穴３Ａをヒ
ートシンク３に形成し、ＩＣ１のパッケージ部１Ａが熱
伝導剤６でヒートシンク３と密接する。According to a second aspect of the present invention, in the first aspect, a hole 3A in which the head 2A of the bolt 2 is buried is formed in the heat sink 3, and the package portion 1A of the IC 1 is connected to the heat sink 3 by the heat conductive agent 6. Be close.

【００１１】[0011]

【発明の実施の形態】次に、この発明の実施の形態を図
面を参照して説明する。図１から図３は、この発明によ
るＩＣの冷却構造の一実施の形態を示す図面である。Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 3 are views showing an embodiment of an IC cooling structure according to the present invention.

【００１２】図１はこの発明の斜視分解組立図である。
図１において、１はＩＣ、２はボルト、３はヒートシン
クである。ボルト２は頭部２Ａとねじ部２Ｂから形成さ
れている。FIG. 1 is an exploded perspective view of the present invention.
In FIG. 1, 1 is an IC, 2 is a bolt, and 3 is a heat sink. The bolt 2 is formed from a head 2A and a screw portion 2B.

【００１３】図２は図１の実装状態での断面図である。
ヒートシンク３はフィン３Ｂが形成されている。FIG. 2 is a sectional view of the mounting state of FIG.
The heat sink 3 has fins 3B.

【００１４】図１において、ＩＣ１のパッケージ部１Ａ
に接着剤５を塗布し、頭部２Ａと連結させる。熱伝導剤
６をパッケージ部１Ａに塗布する。ナット４でヒートシ
ンク３とねじつきＩＣを連結する。In FIG. 1, a package section 1A of IC1
To the head 2A. The thermal conductive agent 6 is applied to the package section 1A. The nut 4 connects the heat sink 3 to the threaded IC.

【００１５】また、図３は図１の実装状態での断面図で
あり、ヒートシンク３がＩＣと連結する状態を表した説
明図である。図３において、ヒートシンク３は頭部２Ａ
が埋まる穴３Ａを形成しているため、パッケージ部１Ａ
が熱伝導剤６でヒートシンク３と密接する。FIG. 3 is a cross-sectional view in the mounted state of FIG. 1, and is an explanatory view showing a state where the heat sink 3 is connected to the IC. In FIG. 3, the heat sink 3 has a head 2A.
Is formed, so that the package portion 1A
Are in close contact with the heat sink 3 with the heat conductive agent 6.

【００１６】ＩＣ１を交換するときは、ナット４による
連結を解除する。ＩＣ１とボルト２は分離できないの
で、前記ボルトつきＩＣにして交換する。ヒートシンク
３は再利用できる構造である。When replacing the IC 1, the connection by the nut 4 is released. Since the IC 1 and the bolt 2 cannot be separated, the IC with the bolt is replaced. The heat sink 3 has a reusable structure.

【００１７】図２において、ＩＣ１の発生熱は、熱伝導
剤６を介してヒートシンク３に直ちに伝導し、放熱され
る。In FIG. 2, the heat generated from the IC 1 is immediately conducted to the heat sink 3 via the heat conducting agent 6 and is radiated.

【００１８】[0018]

【発明の効果】この発明は、ボルトの頭部が埋まる穴を
ヒートシンクに形成し、ＩＣのパッケージ部が熱伝導剤
でヒートシンクと密接するため、放熱効率が良く、実装
高が低くなる。According to the present invention, a hole for burying the head of the bolt is formed in the heat sink, and the package portion of the IC is in close contact with the heat sink with a heat conductive agent, so that the heat radiation efficiency is good and the mounting height is low.

【００１９】さらに、ナットによる連結を解除し、ボル
トつきＩＣにして交換するため、交換容易である。Furthermore, since the connection by the nut is released and the IC is replaced with a bolted IC, the replacement is easy.

【００２０】[0020]

【図面の簡単な説明】[Brief description of the drawings]

【図１】この発明の一実施形態によるＩＣの冷却構造の
斜視分解組立図である。FIG. 1 is an exploded perspective view of a cooling structure of an IC according to an embodiment of the present invention.

【図２】図１の実装状態での断面図である。FIG. 2 is a sectional view of the mounting state of FIG.

【図３】図１の実装状態での断面図であり、ヒートシン
クがＩＣと連結する状態を表した説明図である。FIG. 3 is a cross-sectional view in a mounting state of FIG. 1 and is an explanatory view showing a state where a heat sink is connected to an IC.

【図４】従来技術によるＩＣの冷却構造の斜視分解組立
図である。FIG. 4 is an exploded perspective view of a conventional cooling structure for an IC.

【図５】図４の実装状態での断面図である。FIG. 5 is a cross-sectional view of the mounting state of FIG. 4;

【符号の説明】[Explanation of symbols]

１ ＩＣ ２ ボルト ２Ａ 頭部 ２Ｂ ねじ部 ３ ヒートシンク ３Ａ 穴 ４ ナット ５ 接着剤 ６ 熱伝導剤 DESCRIPTION OF SYMBOLS 1 IC 2 Bolt 2A Head 2B Screw part 3 Heat sink 3A Hole 4 Nut 5 Adhesive 6 Thermal conductive agent

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 ＩＣ(1) のパッケージ部(1A)にボルト
(2) の頭部(2A)を接着し、 前記ボルト(2) つきＩＣ(1) がヒートシンク(3) とナッ
ト(4) で結合することを特徴とするＩＣの冷却構造。1. A bolt is attached to a package portion (1A) of an IC (1).
2. A cooling structure for an IC, wherein the head (2A) of (2) is adhered, and the IC (1) with the bolt (2) is connected by a heat sink (3) and a nut (4). 【請求項２】 ボルト(2) の頭部(2A)が埋まる穴(3A)を
ヒートシンク(3) に形成し、 ＩＣ(1) のパッケージ部(1A)が熱伝導剤(6) でヒートシ
ンク(3) と密接することを特徴とする請求項１記載のＩ
Ｃの冷却構造。2. A hole (3A) in which a head (2A) of a bolt (2) is buried is formed in a heat sink (3), and a package portion (1A) of an IC (1) is heated with a heat conductive agent (6). 3. The method according to claim 1, wherein
C cooling structure.
JP6448898A 1998-02-27 1998-02-27 Cooling structure of ic Pending JPH11251496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6448898A JPH11251496A (en) 1998-02-27 1998-02-27 Cooling structure of ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6448898A JPH11251496A (en) 1998-02-27 1998-02-27 Cooling structure of ic

Publications (1)

Publication Number Publication Date
JPH11251496A true JPH11251496A (en) 1999-09-17

Family

ID=13259658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6448898A Pending JPH11251496A (en) 1998-02-27 1998-02-27 Cooling structure of ic

Country Status (1)

Country Link
JP (1) JPH11251496A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006191962A (en) * 2005-01-11 2006-07-27 Pentax Corp Light source device for endoscope
US7990716B2 (en) 2008-12-12 2011-08-02 Advantest Corporation Heat sink structure and test head with same
US11852919B1 (en) 2022-07-12 2023-12-26 Sharp Display Technology Corporation Backlight unit and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006191962A (en) * 2005-01-11 2006-07-27 Pentax Corp Light source device for endoscope
US7990716B2 (en) 2008-12-12 2011-08-02 Advantest Corporation Heat sink structure and test head with same
US11852919B1 (en) 2022-07-12 2023-12-26 Sharp Display Technology Corporation Backlight unit and display device

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