JPH11241158A - 電子線を用いた真空蒸着装置 - Google Patents

電子線を用いた真空蒸着装置

Info

Publication number
JPH11241158A
JPH11241158A JP4650398A JP4650398A JPH11241158A JP H11241158 A JPH11241158 A JP H11241158A JP 4650398 A JP4650398 A JP 4650398A JP 4650398 A JP4650398 A JP 4650398A JP H11241158 A JPH11241158 A JP H11241158A
Authority
JP
Japan
Prior art keywords
target
substrate
electron beam
film
vacuum deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4650398A
Other languages
English (en)
Japanese (ja)
Inventor
Masanori Ono
真徳 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP4650398A priority Critical patent/JPH11241158A/ja
Priority to KR1019997009955A priority patent/KR20010020339A/ko
Priority to PCT/JP1999/000902 priority patent/WO1999043864A1/en
Priority to EP99905319A priority patent/EP0977903A1/en
Priority to TW88103007A priority patent/TW445302B/zh
Publication of JPH11241158A publication Critical patent/JPH11241158A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3178—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP4650398A 1998-02-27 1998-02-27 電子線を用いた真空蒸着装置 Pending JPH11241158A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP4650398A JPH11241158A (ja) 1998-02-27 1998-02-27 電子線を用いた真空蒸着装置
KR1019997009955A KR20010020339A (ko) 1998-02-27 1999-02-26 전자빔을 이용한 진공 증착 장치
PCT/JP1999/000902 WO1999043864A1 (en) 1998-02-27 1999-02-26 Vacuum deposition apparatus using electron beams
EP99905319A EP0977903A1 (en) 1998-02-27 1999-02-26 Vacuum deposition apparatus using electron beams
TW88103007A TW445302B (en) 1998-02-27 1999-02-26 A vacuum deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4650398A JPH11241158A (ja) 1998-02-27 1998-02-27 電子線を用いた真空蒸着装置

Publications (1)

Publication Number Publication Date
JPH11241158A true JPH11241158A (ja) 1999-09-07

Family

ID=12749060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4650398A Pending JPH11241158A (ja) 1998-02-27 1998-02-27 電子線を用いた真空蒸着装置

Country Status (5)

Country Link
EP (1) EP0977903A1 (ko)
JP (1) JPH11241158A (ko)
KR (1) KR20010020339A (ko)
TW (1) TW445302B (ko)
WO (1) WO1999043864A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6216177B2 (ja) * 2013-07-31 2017-10-18 日立造船株式会社 電子ビーム蒸着装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1487425A (fr) * 1966-05-24 1967-07-07 Lokomotivbau Elektrotech Dispositif pour dévier des faisceaux électroniques dans des installations de vaporisation à faisceaux d'électrons, de préférence pour la métallisation sous vide de larges bandes
JPS6260866A (ja) * 1985-08-02 1987-03-17 Fujitsu Ltd マグネトロンスパツタ装置
DE3863725D1 (de) * 1987-08-26 1991-08-22 Balzers Hochvakuum Verfahren zur aufbringung von schichten auf substraten und vakuumbeschichtungsanlage zur durchfuehrung des verfahrens.
US5012064A (en) * 1990-06-29 1991-04-30 The Boc Group, Inc. Electron beam evaporation source

Also Published As

Publication number Publication date
WO1999043864A1 (en) 1999-09-02
TW445302B (en) 2001-07-11
KR20010020339A (ko) 2001-03-15
EP0977903A1 (en) 2000-02-09

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