JPH11241158A - 電子線を用いた真空蒸着装置 - Google Patents
電子線を用いた真空蒸着装置Info
- Publication number
- JPH11241158A JPH11241158A JP4650398A JP4650398A JPH11241158A JP H11241158 A JPH11241158 A JP H11241158A JP 4650398 A JP4650398 A JP 4650398A JP 4650398 A JP4650398 A JP 4650398A JP H11241158 A JPH11241158 A JP H11241158A
- Authority
- JP
- Japan
- Prior art keywords
- target
- substrate
- electron beam
- film
- vacuum deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3178—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4650398A JPH11241158A (ja) | 1998-02-27 | 1998-02-27 | 電子線を用いた真空蒸着装置 |
EP99905319A EP0977903A1 (en) | 1998-02-27 | 1999-02-26 | Vacuum deposition apparatus using electron beams |
PCT/JP1999/000902 WO1999043864A1 (en) | 1998-02-27 | 1999-02-26 | Vacuum deposition apparatus using electron beams |
TW88103007A TW445302B (en) | 1998-02-27 | 1999-02-26 | A vacuum deposition apparatus |
KR1019997009955A KR20010020339A (ko) | 1998-02-27 | 1999-02-26 | 전자빔을 이용한 진공 증착 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4650398A JPH11241158A (ja) | 1998-02-27 | 1998-02-27 | 電子線を用いた真空蒸着装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11241158A true JPH11241158A (ja) | 1999-09-07 |
Family
ID=12749060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4650398A Pending JPH11241158A (ja) | 1998-02-27 | 1998-02-27 | 電子線を用いた真空蒸着装置 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0977903A1 (ko) |
JP (1) | JPH11241158A (ko) |
KR (1) | KR20010020339A (ko) |
TW (1) | TW445302B (ko) |
WO (1) | WO1999043864A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6216177B2 (ja) * | 2013-07-31 | 2017-10-18 | 日立造船株式会社 | 電子ビーム蒸着装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1487425A (fr) * | 1966-05-24 | 1967-07-07 | Lokomotivbau Elektrotech | Dispositif pour dévier des faisceaux électroniques dans des installations de vaporisation à faisceaux d'électrons, de préférence pour la métallisation sous vide de larges bandes |
JPS6260866A (ja) * | 1985-08-02 | 1987-03-17 | Fujitsu Ltd | マグネトロンスパツタ装置 |
ATE65265T1 (de) * | 1987-08-26 | 1991-08-15 | Balzers Hochvakuum | Verfahren zur aufbringung von schichten auf substraten und vakuumbeschichtungsanlage zur durchfuehrung des verfahrens. |
US5012064A (en) * | 1990-06-29 | 1991-04-30 | The Boc Group, Inc. | Electron beam evaporation source |
-
1998
- 1998-02-27 JP JP4650398A patent/JPH11241158A/ja active Pending
-
1999
- 1999-02-26 EP EP99905319A patent/EP0977903A1/en not_active Withdrawn
- 1999-02-26 TW TW88103007A patent/TW445302B/zh active
- 1999-02-26 WO PCT/JP1999/000902 patent/WO1999043864A1/en not_active Application Discontinuation
- 1999-02-26 KR KR1019997009955A patent/KR20010020339A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TW445302B (en) | 2001-07-11 |
WO1999043864A1 (en) | 1999-09-02 |
KR20010020339A (ko) | 2001-03-15 |
EP0977903A1 (en) | 2000-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080205 |
|
A02 | Decision of refusal |
Effective date: 20080701 Free format text: JAPANESE INTERMEDIATE CODE: A02 |