JPH11239758A - Substrate treatment apparatus - Google Patents

Substrate treatment apparatus

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Publication number
JPH11239758A
JPH11239758A JP10044893A JP4489398A JPH11239758A JP H11239758 A JPH11239758 A JP H11239758A JP 10044893 A JP10044893 A JP 10044893A JP 4489398 A JP4489398 A JP 4489398A JP H11239758 A JPH11239758 A JP H11239758A
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JP
Japan
Prior art keywords
substrate
portion
member
surface
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10044893A
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Japanese (ja)
Inventor
Manabu Yabe
学 矢部
Original Assignee
Dainippon Screen Mfg Co Ltd
大日本スクリーン製造株式会社
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Application filed by Dainippon Screen Mfg Co Ltd, 大日本スクリーン製造株式会社 filed Critical Dainippon Screen Mfg Co Ltd
Priority to JP10044893A priority Critical patent/JPH11239758A/en
Publication of JPH11239758A publication Critical patent/JPH11239758A/en
Application status is Granted legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus in which the contamination of the substrate by the mist of treating liquid adhered to a member for rotating/ holding the substrate is prevented. SOLUTION: The rotation member 11 of a substrate holding part is equipped with support pins 14 for supporting the substrate and a rotary holding pin 15 for regulating the horizontal position of the substrate, fixed to the upper end of the rotary shaft of a motor, rotated, and driven. A member in which the surface of a metal is coated with a fluororesin or the surface of an aluminum base material is plated with nickel-polytetrafluoroethylene and others are used as the rotation member 11. The pin fixing part 17 of the rotary holding pin 15, a magnet housing part 19, and a fitting member 22 are formed from a water repellent resin such as polypropylene, and the clearances A, B between the fixing part 17 and fitting member 22 and between the magnet housing part 19 and the fitting part 17 are adjusted to be 0.5-1.0 mm.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、基板を回転させつつ処理液を基板に供給して所定の処理を行う基板処理装置に関する。 The present invention relates to relates to a substrate processing apparatus for performing predetermined processing by supplying a processing liquid to a substrate while rotating the substrate.

【0002】 [0002]

【従来の技術】半導体ウエハ、液晶表示装置用ガラス基板、フォトマスク用ガラス基板、光ディスク用ガラス基板等の基板に種々の処理を行うために回転式の基板処理装置が用いられている。 BACKGROUND OF THE INVENTION Semiconductor wafers, glass substrates for liquid crystal display device, the rotation type substrate processing apparatus is used a glass substrate for a photomask, the substrate such as a glass substrate for an optical disc in order to perform various processes. たとえば、基板の表面に形成された感光性膜の現像処理には、回転式の現像装置が用いられている。 For example, in the development processing of the photosensitive film formed on the surface of the substrate, a rotary developing apparatus is used. この現像装置を用いた基板の現像処理は、 Development of the substrate using the developing device,
現像液供給、現像液保持、純水洗浄および乾燥の各工程からなる。 Developer supply, the developer holding, each consisting of steps of washing with pure water and drying.

【0003】図5は従来の現像装置の概略断面図であり、現像液供給工程を示している。 [0003] Figure 5 is a schematic sectional view of a conventional developing device, which is a developing solution supplying step. 図5において、現像装置は基板Wを保持する基板保持部41を備える。 5, the developing device comprises a substrate holder 41 for holding a substrate W. 基板保持部41は、モータ(図示せず)の回転軸50の先端部に水平に固定されかつ鉛直方向の軸の周りで回転駆動される回転部材42を備える。 Substrate holder 41 is provided with a rotary member 42 which is rotationally driven around the motor is horizontally fixed to the tip portion of the rotary shaft 50 (not shown) and the vertical axis. 回転部材42の上面には、基板Wの裏面を支持する複数の支持ピン43が設けられるとともに、基板Wの外周端部に当接して基板Wの水平方向の位置を規制する複数の規制ピン44が設けられている。 The upper surface of the rotary member 42, a plurality of support pins 43 for supporting the back surface of the substrate W is provided, a plurality of restriction pin 44 for restricting the horizontal position of the substrate W in contact with the outer edge of the substrate W It is provided.

【0004】基板保持部41の上方には、現像液を吐出する現像ノズル51が上下方向および水平方向に移動可能に設けられている。 [0004] Above the substrate holding portion 41, the developing nozzle 51 for discharging the developer is provided to be movable in the vertical and horizontal directions. 現像ノズル51は、現像液供給前および現像液供給後に基板Wの上方から外れた位置に待機し、現像液供給時に基板Wの中心部の上方に移動する。 Developing nozzle 51 is on standby at a position deviated from above the substrate W after before the developer supply and developer supply, it moved to above the center portion of the substrate W when the developer supply.

【0005】この現像装置を用いた現像液供給工程では、基板Wが基板保持部41に保持された後、モータにより基板保持部41が回転駆動され、この状態で基板W [0005] In the developer supplying process using the developing apparatus, after the substrate W is held by the substrate holder 41, substrate holder 41 is rotated by a motor, the substrate W in this state
の上方に移動した現像ノズル51から基板W上に現像液30が吐出され、回転に伴う遠心力により基板Wの全面に塗り広げられる。 The developer 30 from the developing nozzle 51 onto the substrate W which has moved upward is discharged, spreadable by a centrifugal force accompanying the rotation on the entire surface of the substrate W.

【0006】現像液保持工程では、基板保持部41の回転が停止され、現像液30が基板Wの全面に塗り広げられた状態で基板Wが一定時間静止される。 [0006] In the developer holding step, rotation of the substrate holder 41 is stopped, the substrate W is still a certain time in a state where the developer 30 is spread on the entire surface of the substrate W. これにより、 As a result,
基板Wの感光性膜の現像が進行する。 Development of the photosensitive film on the substrate W progresses.

【0007】純水洗浄工程では、基板保持部41が再び回転駆動され、基板Wの表面に純水供給ノズル(図示せず)から純水が供給され、基板Wの表面の純水洗浄が行われる。 [0007] In pure water washing process is rotated substrate holder 41 again, pure water from the pure water supply nozzle (not shown) is supplied to the surface of the substrate W, pure water washing line of the surface of the substrate W divide.

【0008】乾燥工程では、純水の供給が停止された後、基板保持部41が高速で回転駆動され、回転に伴う遠心力により基板Wの表面から純水が振り切られる。 [0008] In the drying step, after the supply of the pure water is stopped, the substrate holder 41 is rotated at a high speed, the pure water is shaken off from the surface of the substrate W by a centrifugal force accompanying the rotation. これにより、基板Wが乾燥する。 Thus, the substrate W is dried. その後、基板保持部41 Thereafter, the substrate holder 41
の回転が停止し、基板Wの現像処理が終了する。 Rotation of the stops, the development processing of the substrate W is completed.

【0009】 [0009]

【発明が解決しようとする課題】図5に示す現像液供給工程では、基板保持部41に保持された基板Wが低速で回転駆動された状態で現像液ノズル51から現像液30 In the [0006] developing solution supply step shown in FIG. 5, the developer 30 from the developer nozzle 51 with the substrate W held by the substrate holder 41 is rotated at a low speed
が基板Wの表面に吐出される。 There is discharged to the surface of the substrate W. 現像液30が基板Wの全面に均一に行き渡るように多量に吐出されると、現像液30は基板Wの外周部から支持ピン43や規制ピン44 When the developer 30 is discharged so that a large amount distributed uniformly across the entire surface of the substrate W, the developer 30 is a support pin 43 and the restriction pin 44 from the outer periphery of the substrate W
を伝わり回転部材42に流れ落ち、回転部材42の外周部に付着する。 The transmitted flow down to the rotating member 42, attached to the outer peripheral portion of the rotary member 42.

【0010】その後、基板Wの回転が停止されると、回転部材42に落下した現像液30の付着領域が広がり、 [0010] Thereafter, when the rotation of the substrate W is stopped, the attachment region of the developer 30 that has fallen to the rotating member 42 is widened,
現像液30の一部は回転部材42の下面側に回り込み、 Some of the developer 30 is wraparound to the lower surface side of the rotary member 42,
付着する。 Adhere to.

【0011】上記したように、現像液供給工程の後には、現像液保持工程を経て純水洗浄工程が行われる。 [0011] As described above, after the developer supplying step, pure water cleaning step is performed through a developer holding step. 純水洗浄工程では、基板Wの表面に純水が供給され、基板Wの表面が洗浄される。 The pure water cleaning step, pure water is supplied to the surface of the substrate W, the surface of the substrate W is cleaned. このとき、純水は回転部材42 At this time, pure water is rotating member 42
側にも流れ落ち、先の現像液供給工程において回転部材42に付着した現像液30を部分的に洗い流す。 It flows down to the side, the developer 30 attached to the rotating member 42 in the previous developer supplying step partially washed away.

【0012】しかしながら、純水は基板保持部41が回転している状態で供給されるため、基板Wの外方側に向かって遠心力を受ける。 [0012] However, pure water to be supplied in a state where the substrate holder 41 is rotating, subjected to centrifugal force toward the outer side of the substrate W. このため、純水は、静止時に回転部材42の上面や下面に広がった現像液30を完全に洗い流すことができず、回転部材42の上面や下面に現像液30の付着領域が残余する。 Therefore, pure water can not completely wash away the developing solution 30 was spread on the upper surface and the lower surface of the rotary member 42 at rest, the attachment region of the developer 30 on the upper surface and the lower surface of the rotary member 42 are left.

【0013】この現像液の付着領域は、乾燥工程において基板保持部41が高速回転されると、カップ45内にミスト(液体粒子)となって浮遊し、基板Wの表面に再付着して基板Wを汚染する。 [0013] attachment area of ​​the developing solution, the substrate holder 41 is rotated at high speed in the drying process, floating it becomes mist (liquid particles) into the cup 45, and re-attached to the surface of the substrate W substrate contamination of the W. また、長期間にわたって回転部材42の上面および下面に付着した現像液が固化すると、現像液の固化物によるパーティクル(塵埃)が発生し、カップ45内に浮遊して基板Wを汚染する。 Further, when the developer adhered to the upper and lower surfaces of the rotary member 42 over a long period of time is solidified, particle (dust) is generated by solidification of the developer, floating to contaminate the substrate W in the cup 45.

【0014】本発明の目的は、基板を回転保持する部材に付着した処理液のミストによる基板の汚染が防止された基板処理装置を提供することである。 An object of the present invention is to provide a substrate processing apparatus contamination of the substrate is prevented by mist of the processing liquid adhering to member that rotates holding the substrate.

【0015】 [0015]

【課題を解決するための手段および発明の効果】第1の発明に係る基板処理装置は、基板を回転させつつ基板に所定の処理を行う基板処理装置であって、回転自在な回転部材と、基板の外周部に沿うように回転部材上に設けられ、基板の外周端部に当接して基板を保持する複数の保持部材と、回転部材を回転駆動する駆動手段と、複数の保持部材により保持された基板に処理液を供給する処理液供給手段とを備え、複数の保持部材により保持された基板の表面に対向する回転部材の表面が撥水性を有するものである。 [Effect of the means and invention, there is provided a substrate processing apparatus according to the first invention is a substrate processing apparatus for performing predetermined processing on a substrate while rotating the substrate, a rotatable rotary member, provided on the rotary member so as to extend along the outer periphery portion of the substrate holding the plurality of holding members for holding the contact with the substrate to the outer edge of the substrate, and drive means for rotating the rotary member, a plurality of retaining members is a treatment liquid supply means for supplying a substrate to the treatment liquid, the surface of the rotary member facing the surface of the substrate held by the plurality of holding members are those having water repellency.

【0016】第1の発明に係る基板処理装置においては、複数の保持部材によって回転部材上に保持された基板が駆動手段により回転駆動される。 [0016] In the substrate processing apparatus according to the first invention, the substrate held on the rotary member by a plurality of holding members are rotated by a driving means. 処理液供給手段は回転部材上の基板に処理液を供給し、基板に対して所定の処理を行わせる。 Processing solution supplying means supplies the processing solution to the substrate on the rotating member, to perform a predetermined process on the substrate. 処理液供給手段から多量の処理液が基板に供給されると、その一部は基板から回転部材上に流れ落ちる。 When the process liquid supply means a large amount of the processing liquid from is supplied to the substrate, a portion flows down on the rotating member from the substrate. 回転部材の表面は撥水性を有している。 Surface of the rotary member has water repellency. このため、回転部材上に流れ落ちた処理液は回転部材の表面で弾かれ、回転部材の回転により外方へ飛散される。 Thus, the processing liquid flowing down on the rotating member is repelled by the surface of the rotating member, it is scattered outward by the rotation of the rotary member.
これにより、処理液が回転部材の表面に付着することが妨げられ、回転部材の表面に付着した処理液がミストとなって基板表面を汚染することを防止することができる。 Thus, it is prevented that the treatment liquid from adhering to the surface of the rotating member, the processing solution adhering to the surface of the rotary member can be prevented from contaminating the substrate surface becomes mist.

【0017】第2の発明に係る基板処理装置は、第1の発明に係る基板処理装置の構成において、各保持部材が、回転部材を貫通して鉛直方向に延びる回転軸と、回転部材に固定され、回転軸を回転自在に支持する取り付け部と、回転軸の上端に取り付けられた支持部と、支持部の回動に伴って基板の外周端部に当接するように回転軸に対して偏心して支持部上に設けられた保持部と、回転軸の下端に取り付けられ、支持部の回動のための磁力を発生する磁石を収納する磁石収納部とを備える。 A second aspect of the invention a substrate processing apparatus in accordance with, in the structure of the substrate processing apparatus according to the first invention, the holding member, a rotating shaft extending in a vertical direction through the rotating member, fixed to the rotary member is, polarization rotation shaft and a mounting portion for rotatably supporting a support portion attached to the upper end of the rotating shaft, with respect to the rotation axis so as to contact the outer edge of the substrate with the rotation of the support section Kokoroshite comprising a holding portion provided on the support unit, attached to the lower end of the rotary shaft, and a magnet housing section for housing a magnet which generates a magnetic force for rotating the support part. さらに、少なくとも取り付け部と支持部との間の隙間における取り付け部および支持部の表面と、取り付け部と磁石収納部との間の隙間における取り付け部および磁石収納部の表面とが撥水性を有するものである。 Furthermore, those with at least a mounting portion and the support portion of the surface at the gap between the mounting portion and the supporting portion, the mounting portion and the surface and the water repellency of the magnet housing section in the gap between the mounting portion and the magnet housing unit it is.

【0018】各保持部材の保持部は基板の外周端部に当接して基板を水平方向に保持する。 The holding portion of the holding member for holding the substrate horizontally in contact with the outer edge of the substrate. このため、基板に供給された処理液の一部は保持部を通り、取り付け部、支持部および磁石収納部を伝って流れ落ちる。 Therefore, a portion of the processing liquid supplied to the substrate through the holding portion, the mounting portion, the supporting portion and flows down along the magnet housing portion. 保持部材では、回転部材に対して回転軸が回転自在となるように取り付け部と支持部の間および取り付け部と磁石収納部の間に隙間が設けられている。 In the holding member, the rotation axis a gap is provided between and during the mounting portion of the mounting portion support portion and the magnet housing portion so as to be rotatable relative to the rotary member. そして、この隙間における取り付け部と支持部の表面および取り付け部と磁石収納部の表面が撥水性を有するように形成されている。 Then, the surface of the surface and the mounting portion and the magnet housing portion of the support portion mounting section in the gap is formed so as to have water repellency. このため、基板から流れ落ちた処理液はこれら表面の撥水性により隙間内に侵入することが妨げられる。 Thus, the processing liquid flowing down from the substrate are prevented from entering into the gap by the water repellency of the surfaces. それゆえ、 therefore,
取り付け部および磁石収納部と支持部との各隙間に処理液が侵入し、侵入した処理液が後工程においてミストとなって飛散して基板を汚染することが防止される。 Mounting portion and then the treatment liquid penetrate into the gaps between the support portion magnet housing unit, invading the treatment liquid is prevented from contaminating the substrate to scatter it becomes mist in a later step. さらに、各隙間に侵入した処理液が固化して保持部材の回転軸の回転動作を妨げることを防止することができる。 Furthermore, it is possible to process liquid that has entered the respective gap is prevented from interfering with the rotation of the rotary shaft of the holding member solidifies.

【0019】第3の発明に係る基板処理装置は、第2の発明に係る基板処理装置の構成において、取り付け部と支持部との間の隙間および取り付け部と磁石保持部との隙間が0.5mm以上1.0mm以下であるものである。 A third substrate processing apparatus according to the present invention, in the configuration of a substrate processing apparatus according to the second invention, the gap between the gap and the mounting portion and the magnet holding portion between the mounting portion supporting portion 0. it is what is 5mm or more 1.0mm or less.

【0020】取り付け部と支持部との隙間および取り付け部と磁石保持部との隙間を0.5mm以上1.0mm The mounting portion and the gap between the gap and the mounting portion and the magnet holding portion of the supporting portion 0.5mm or 1.0mm
以下とすることにより、各隙間内の表面の撥水作用により処理液が各隙間に侵入することを防止することができる。 With less, can be processed solution by water repellency of the surface in the gaps is prevented from entering the respective gaps. 各隙間が0.5mmより小さい場合には、取り付け部と支持部および取り付け部と磁石保持部との隙間が微小となり、各部材の取り付けに高精度が要求され、組み立て作業が困難となる。 If the gap is 0.5mm smaller than the gap between the support portion mounting portion and the mounting portion and the magnet holding portion becomes very small, high precision is required in the mounting of the respective members, the assembling work becomes difficult. また、各隙間が1.0mmより大きい場合には、各隙間内の表面の撥水性の作用が小さくなり、各隙間に処理液が侵入する。 Further, each gap when 1.0mm greater than the effect of water repellency of the surface in the gaps is reduced, the treatment liquid from entering the respective gaps. したがって、各隙間を上記の値に設定することにより各隙間への処理液の侵入を防止することができる。 Therefore, each gap can be prevented from entering the processing solution to the gaps by setting the value of the.

【0021】第4の発明に係る基板処理装置は、第1〜 The fourth substrate processing apparatus according to the invention, first to
第3のいずれかの発明に係る基板処理装置の構成において、回転部材の表面における水に対する接触角が70° In the configuration of the substrate processing apparatus according to the third invention of any one of the contact angle to water at the surface of the rotating member is 70 °
以上180°以下であるものである。 It is not more than 180 ° or more.

【0022】この場合、回転部材の表面の水に接する接触角が70°より小さい場合には、処理液を十分に弾くことが困難となる。 [0022] In this case, if the contact angle in contact with water of the surface of the rotary member is smaller than 70 °, it is difficult to play the treating solution sufficiently. したがって、水に対する接触角が7 Therefore, the contact angle with respect to water is 7
0°以上で180°以下とすることにより、回転部材に流れ落ちる処理液を外方へ飛散して処理液の付着を防止することができる。 With 180 ° or less 0 ° or more, it is possible to prevent the processing liquid flowing down the rotating member scattered by deposition of the treatment liquid to the outside.

【0023】 [0023]

【発明の実施の形態】図1は本発明の一実施例による回転式の現像装置の断面図であり、図2は図1中の現像装置の平面図である。 Figure 1 DETAILED DESCRIPTION OF THE INVENTION is a sectional view of a rotary developing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the developing apparatus in FIG.

【0024】図1および図2において、基板保持部1は円形板状の回転部材11を備える。 [0024] In Figures 1 and 2, the substrate holder 1 is provided with a circular plate-shaped rotary member 11. 回転部材11は、アルミニウムを母材に使用し、基板Wの表面に対向する表面にニッケル−ポリテトラフルオロエチレンめっきが施されている。 Rotating member 11, aluminum was used for the base material, nickel on the surface opposite to the surface of the substrate W - polytetrafluoroethylene plating. ニッケル−ポリテトラフルオロエチレンめっきの水に対する接触角は約100°と大きく、現像液を弾くことができる。 Nickel - contact angle with water of polytetrafluoroethylene plating as large as about 100 °, it is possible to play the developer. また、他の例としては、アルマイトに撥水性の樹脂を含浸処理したもの、あるいはチタン合金等の金属材料の表面にフッ素系樹脂をコーティング(被膜処理)したものを用いてもよい。 As another example, those that have been impregnated with the resin of the water-repellent alumite, or may be used in which a fluorine-based resin on the surface of the metal material such as titanium alloy coated (coating process).

【0025】回転部材11は、モータ3の回転軸2の先端に取り付け部材12を介して水平に固定され、鉛直方向の軸の周りで回転駆動される。 The rotary member 11 is fixed horizontally via a member 12 attached to the tip of the rotation shaft 2 of the motor 3 is driven to rotate around a vertical axis.

【0026】回転部材11の上面には、樹脂からなる環状のカバー部材13が形成されており、このカバー部材13の上面から、基板Wの裏面を支持する複数の支持ピン14が突出している。 [0026] upper surface of the rotary member 11, an annular cover member 13 made of resin is formed from the upper surface of the cover member 13, a plurality of support pins 14 for supporting the back surface of the substrate W projects.

【0027】また、回転部材11には、基板Wの水平位置を規制する複数の回転式保持ピン15が鉛直方向の軸の周りで回動可能に取り付けられている。 Further, the rotary member 11, a plurality of rotary retaining pin 15 for restricting the horizontal position of the substrate W is mounted rotatably around a vertical axis. 図3は回転式保持ピン(a)および取り付け部材(b)の斜視図である。 Figure 3 is a perspective view of a rotary holding pins (a) and the mounting member (b). さらに、図4は現像装置における回転式保持ピン近傍の拡大断面図である。 Further, FIG. 4 is an enlarged sectional view of the rotary holding pin vicinity in the developing device. 図3(a)および図4において、回転式保持ピン15は、円柱状のピン固定部17、 In FIG. 3 (a) and FIG. 4, the rotary holding pins 15, cylindrical pin fixing portion 17,
円柱状(棒状)のピン部材16、連結軸18および磁石収納部19を備える。 Pin member 16 of cylindrical (rod-like), and a connecting shaft 18 and the magnet housing section 19. ピン部材16は、ピン固定部17 Pin member 16, pin fixing portion 17
の上面に、ピン固定部17の中心に対して偏心して設けられている。 To the upper surface, it is provided eccentrically with respect to the center of the pin fixing portion 17. 磁石収納部19は、ピン固定部17の下部に連結軸18を介して固定されている。 Magnet housing section 19 is fixed through a connecting shaft 18 to the lower portion of the pin fixing portion 17. 磁石収納部19 Magnet housing section 19
内には棒状の永久磁石20が収納されている。 Permanent magnets 20 of the bar-shaped is housed within.

【0028】回転式保持ピン15は取り付け部材22により回転部材11に取り付けられる。 The rotary holding pin 15 is attached to the rotating member 11 by the mounting member 22. 図3(b)において、取り付け部材22は1対の取り付け孔22aを有し、回転部材11(図1参照)の下面外周にねじ止め固定される。 3 (b), the attachment member 22 has a pair of mounting holes 22a, is screwed to the underside periphery of the rotary member 11 (see FIG. 1). 取り付け部材22はベアリング収納部21を有し、ベアリング収納部21内に収納されたベアリング23の軸孔内に回転式保持ピン15の連結軸18が挿通される。 Mounting member 22 includes a bearing housing portion 21, the connecting shaft 18 of the rotary holding pin 15 in the axial bore of the bearing housing part bearing 23 housed in 21 is inserted. これにより、図4に示すように、回転式保持ピン15のピン部材16およびピン固定部17が回転部材11の上面側に突出し、回転式保持ピン15の磁石収納部19が回転部材11の下面側に突出する。 Thus, as shown in FIG. 4, protrude on the upper surface of the pin member 16 and the pin fixing portion 17 of the rotary holding pin 15 is the rotating member 11, the lower surface of the magnet housing portions 19 of the rotary holding pin 15 is rotatable member 11 protruding to the side.

【0029】回転式保持ピン15において、ピン部材1 [0029] In the rotary holding pin 15, the pin member 1
6、ピン固定部17、取り付け部材22および磁石収納部19は撥水性を有するポロプロピレン、あるいはポリテトラフルオロエチレン等の樹脂から形成されている。 6, the pin fixing portion 17, the attachment member 22 and the magnet housing section 19 is formed from polypropylene or polytetrafluoroethylene or the like of the resin, water-repellent.
ポリプロピレンの水に対する接触角は約80°、ポリテトラフルオロエチレンの接触角は90〜100°であり、共に高い撥水性を有している。 The contact angle of about 80 ° with respect to water of polypropylene, the contact angle of polytetrafluoroethylene is 90 to 100 °, has both high water repellency. このため、被着した現像液を弾き、流下させることができる。 Therefore, playing the developing solution deposited, it can be made to flow. なお、これらの部材は上記の撥水性を有する樹脂材料で形成するのみならず、金属材料の表面にポリテトラフルオロエチレン等の撥水性材料をコーティングしたもの、あるいはフッ化グラファイト等の表面処理を施したものを用いてもよい。 Note that these members are not only formed of a resin material having the water repellency, those that have been coated with a water-repellent material such as polytetrafluoroethylene on the surface of the metal material, or facilities to surface treatment such as graphite fluoride it may be used after. フッ化グラファイトの水に対する接触角は140〜 Contact angle 140 to to water of the fluorinated graphite
180°である。 Is 180 °.

【0030】また、図4において、ピン固定部17と取り付け部材21との間に形成される隙間Aおよび取り付け部材22と磁石収納部19との間に形成される隙間B Further, in FIG. 4, the gap formed between the gap A and the mounting member 22 and the magnet housing section 19 formed between the member 21 mounted with the pin fixing portion 17 B
の間隔d1,d2は0.5mm以上1mm以下に調整される。 Intervals d1, d2 is adjusted to 0.5mm to 1mm. 各隙間A,Bにおけるピン固定部17、取り付け部材22および磁石収納部19の表面は撥水性を有している。 Pin fixing portion 17 in the gaps A, B, the surface of the mounting member 22 and the magnet housing section 19 has water repellency. このため、各隙間の間隔d1,d2を1mm以下に調整することにより、隙間A,Bを介して対向する各部材の表面の撥水性により現像液が弾かれ、隙間A,B Therefore, by adjusting the distance d1, d2 of the gap 1mm or less, the developer is repelled gap A, the water repellency of the surface of each member facing via B, the gap A, B
を通過することが妨げられる。 It is prevented to pass through the. これにより、ベアリング保持部21内に現像液が侵入して滞留したり、非撥水性のベアリング23に現像液が被着することが防止される。 This enables you to stay developer in the bearing retaining part 21 intrudes, the developer is prevented from depositing on the bearing 23 of the non-water repellent. また、各隙間の間隔d1,d2が0.5mmより小さくなると、隙間の調整に高い精度が要求され、組み立て作業が困難となる。 Further, if the interval d1, d2 of the gaps is less than 0.5 mm, is required to have high accuracy in the adjustment of the gap, the assembling operation becomes difficult.

【0031】回転部材11の下方には環状磁石6が配設されている。 [0031] Below the rotary member 11 annular magnet 6 is disposed. この環状磁石6は、駆動装置(図示せず) The annular magnet 6, the drive device (not shown)
により上下動自在に設けられた磁石支持部材7に固定されている。 It is fixed to the magnet support member 7 provided vertically movable by.

【0032】磁石支持部材7が上昇すると、環状磁石6 [0032] magnet support member 7 is raised, annular magnet 6
と回転式保持ピン15の永久磁石20とが引き合い、回転式保持ピン15が回転してピン部材16が基板Wの外周端部に当接して基板Wの水平方向の位置を保持する。 And the permanent magnet 20 of the rotary holding pins 15 attract the pin member 16 rotating holding pin 15 rotates and holds the horizontal position of contact with the substrate W to the outer edge of the substrate W and.
また、磁石支持部材7が下降すると、回転式保持ピン1 Further, when the magnet support member 7 is moved downward, rotating the retaining pin 1
5が逆方向に回動し、ピン部材16が基板Wの外周端部から離間する。 5 is rotated in the reverse direction, the pin member 16 is separated from the outer edge of the substrate W. このような動作により、基板Wの外周端部が回転式保持ピン15により保持され、あるいは開放される。 By this operation, the outer peripheral edge of the substrate W is held by the rotary holding pins 15, or is opened.

【0033】モータ3の回転軸2は中空軸により構成され、その内部に基板の裏面洗浄用のバックリンスノズル9(図2参照)が挿入されている。 The rotary shaft 2 of the motor 3 is constituted by a hollow shaft, a back rinse nozzle 9 for the back surface cleaning of the substrate (see FIG. 2) is inserted therein. このバックリンスノズル9は取り付け部材12を貫通して基板Wの裏面側に突出している。 The back rinse nozzle 9 is protruded from the back surface of the substrate W through the mounting member 12. バックリンスノズル9の先端には、円錐台状のキャップ8が取り付けられている。 The tip of the back rinse nozzle 9, is mounted truncated cone-shaped cap 8. キャップ8 Cap 8
は、バックリンスノズル9から吐出されるリンス液(純水)が回転軸2の内部に侵入することを防止するために取り付けられている。 Is rinsing liquid discharged from the back rinse nozzle 9 (pure water) is attached in order to prevent the entering the interior of the rotary shaft 2.

【0034】また、基板保持部1の上方には、現像液を吐出する現像ノズル10が上下方向および水平方向に移動可能に設けられている。 [0034] Above the substrate holder 1, a developing nozzle 10 for discharging the developer is provided movably in the vertical and horizontal directions. この現像ノズル10は、現像処理前および現像処理後に基板Wの上方から外れた位置に待機し、現像処理時に基板Wの中心部の上方に移動する。 The developing nozzle 10 stands by at a position off from above the substrate W after before development process and development process, moved to above the center portion of the substrate W during the development process.

【0035】さらに、基板保持部1の周囲を取り囲むように中空のカップ4が配設されている。 Furthermore, hollow cup 4 is disposed so as to surround the periphery of the substrate holder 1. カップ4は上下方向に移動可能な上カップ4aと、上カップ4aの下方に固定された下カップ4bとからなる。 Cup 4 consists of an upper cup 4a movable in the vertical direction, the lower cup 4b which is fixed below the upper cup 4a. 下カップ4bの下部には現像装置の上方からカップ4内に下降される清浄な空気の下降流(ダウンフロー)を排気するための排気口4cが設けられている。 At the bottom of the lower cup 4b are exhaust port 4c is provided for discharging downflow clean air is lowered into the cup 4 from above the developing device (downflow).

【0036】本実施例において、回転式保持ピン15が本発明の保持部材に相当し、モータ3が駆動手段に相当し、現像ノズル10が処理液供給手段に相当する。 [0036] In this embodiment, the rotary holding pin 15 corresponds to the holding member of the present invention, the motor 3 corresponds to the drive means, developing nozzle 10 corresponds to the processing solution supply means. また、回転式保持ピン15のピン部材16が本発明の保持部に相当し、ピン固定部17が支持部に相当し、連結軸18が回転軸に相当し、磁石収納部19が磁石収納部に相当し、取り付け部材22が取り付け部に相当する。 The pin member 16 of the rotary holding pin 15 corresponds to the holding portion of the present invention, the pin fixing portion 17 corresponds to the supporting portion, the connecting shaft 18 corresponds to the rotary shaft, the magnet housing section 19 is the magnet housing section It corresponds to the mounting member 22 corresponds to the mounting portion.

【0037】次に、図1の現像装置における現像処理時の動作について説明する。 Next, the operation at the time of development processing in the developing apparatus of FIG. この現像装置においては、上方から清浄なダウンフローがカップ4の内外に供給されつつ現像処理が行われる。 In this developing device, a developing process is performed while a clean downflow from above is supplied to the inside and outside of the cup 4. 現像処理では、現像液供給、 In developing process, the developing solution supply,
現像液保持、純水洗浄および乾燥の各工程が順に行われる。 Developer holding, each step of washing with pure water and drying are carried out sequentially.

【0038】まず、基板Wが基板保持部1の支持ピン1 [0038] First, the substrate W of the substrate holder 1 support pin 1
4上に載置される。 4 is placed on. 次に、環状磁石6が上昇して複数の回転式保持ピン15が基板Wを水平方向に保持する。 Then, a plurality of rotary retaining pin 15 annular magnet 6 is raised to hold the substrate W in a horizontal direction.

【0039】現像液供給工程では、モータ3により基板保持部1が低速で回転駆動された状態で、現像ノズル1 [0039] In the developer supplying step, in a state where the substrate holder 1 is rotated at a low speed by the motor 3, developing nozzle 1
0から基板W上に現像液が吐出される。 Developer is discharged from 0 onto the substrate W. 吐出された現像液は基板Wの全面に均一に塗り広げられる。 The discharged developer is evenly spread over the entire surface of the substrate W.

【0040】現像ノズル10からは比較的多量の現像液が吐出される。 The relatively large amount of developer liquid is discharged from the developer nozzle 10. このため、現像液の一部は回転式保持ピン15を伝わり回転部材11に流れ落ちる。 Therefore, part of the developer flows down to the rotating member 11 transmitted to the rotary holding pins 15. 回転式保持ピン15および回転部材11の表面は撥水性を有している。 Surface of the rotary holding pins 15 and the rotary member 11 has water repellency. このため、基板Wから流れ落ちた現像液は回転式保持ピン15および回転部材11の表面に付着することなく基板保持部1の回転により外方に飛散される。 Therefore, the developer flowing down from the substrate W is scattered outward by the rotation of the substrate holder 1 without adhering to the surface of the rotary holding pins 15 and the rotary member 11.

【0041】さらに、現像液保持工程では、基板保持部1の回転が停止される。 [0041] Further, in the developer holding step, rotation of the substrate holder 1 is stopped. 基板保持部1が停止されると、 When the substrate holder 1 is stopped,
環状磁石6が下降して回転式保持ピン15が開放状態となる。 Rotating the holding pin 15 enters an open state annular magnet 6 is lowered. この状態で、現像液が基板W上に一定時間静止保持される。 In this state, the developer is fixed time still held on the substrate W. これにより、基板W上の感光性膜の現像が進行する。 Thus, development of the photosensitive film on the substrate W progresses. この場合には、現像液は回転式保持ピン15および回転部材11の表面に付着することなくはじかれた状態で回転部材11の表面に載っており、回転部材11 In this case, the developing solution is placed on the surface of the rotary member 11 in a state of being repelled without adhering to the surface of the rotary holding pins 15 and the rotary member 11, rotary member 11
の回転により遠心力が働けば、速やかに流れ落ちる。 If you work the centrifugal force by the rotation of rapidly flows down.

【0042】次に、洗浄工程では、環状磁石6が再び上昇して回転式保持ピン15により基板Wが水平方向に保持される。 Next, the cleaning step, the substrate W by rotating the retaining pin 15 annular magnet 6 is raised again is held in the horizontal direction. そして、モータ3により基板保持部1が回転駆動され、基板Wが所定の速度で回転する。 Then, the substrate holder 1 is rotated by the motor 3, the substrate W is rotated at a predetermined speed. この洗浄工程では純水供給ノズル(図示せず)から基板W上に純水が吐出されて基板Wの表面が洗浄されるとともに、バックリンスノズル9(図2参照)からリンス液(純水)が吐出されて基板Wの裏面が洗浄される。 Pure water is discharged surface of the substrate W is cleaned in pure water supply nozzle (not shown) from the substrate W in this washing process, the rinsing liquid from the back rinse nozzle 9 (see FIG. 2) (pure water) It is the back surface of the discharged and the substrate W is cleaned.

【0043】基板Wの表面および裏面の洗浄処理が終了すると、乾燥工程に移行する。 [0043] When the cleaning of the surface and the back surface of the substrate W is finished, the routine proceeds to a drying step. 乾燥工程では、モータ3 In the drying step, the motor 3
の回転数が高められ、基板Wが高速で回転される。 Rotational speed is increased, the substrate W is rotated at a high speed. これにより、基板Wの表面に供給された純水が外方に振り切られ、基板Wの表面が乾燥される。 Thus, pure water is supplied to the surface of the substrate W is spun off outward, the surface of the substrate W is dried.

【0044】このように、回転部材11の表面あるいは回転式保持ピン15の表面を撥水性に形成したことにより、現像液が付着し、後工程においてミストとなって基板Wの表面を汚染することが防止される。 [0044] Thus, by the surface of the surface or rotating the holding pin 15 of the rotary member 11 is formed on the water-repellent, the developer adheres, contaminating the surface of the substrate W becomes mist in a later step There is prevented. また、回転式保持ピン15のピン固定部17および磁石保持部19と取り付け部材22との隙間に現像液が侵入して固化し、 The developing solution is solidified by entering the gap between the pin fixing portion 17 and the magnet retaining portion 19 of the rotary holding pin 15 and the attachment member 22,
回転式保持ピン15の回動動作を妨げることを防止することができる。 It is possible to prevent interfering with the rotation of the rotary holding pins 15.

【0045】さらに、基板保持部1に現像液が付着しにくくなり、基板保持部1が清浄な状態に維持されることにより基板保持部1の洗浄等の保守作業の周期を長くすることができる。 [0045] Further, the developer is unlikely to adhere to the substrate holder 1, it is possible to lengthen the period of maintenance work such as cleaning of the substrate holder 1 by the substrate holder 1 is maintained in a clean state .

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例における回転式の現像装置の断面図である。 1 is a cross-sectional view of a rotary developing apparatus according to an embodiment of the present invention.

【図2】図1の現像装置の平面図である。 2 is a plan view of the developing apparatus of FIG.

【図3】回転式保持ピンおよび取り付け部材の斜視図である。 3 is a perspective view of a rotary holding pin and the mounting member.

【図4】現像装置における回転式保持ピン近傍の拡大断面図である。 4 is an enlarged sectional view of the rotary holding pin vicinity in the developing device.

【図5】従来の現像装置の断面模式図である。 5 is a cross-sectional schematic view of a conventional developing apparatus.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 基板保持部 11 回転部材 14 支持ピン 15 回転式保持ピン 16 ピン部材 17 ピン固定部 18 連結軸 19 磁石収納部 21 ベアリング収納部 22 取り付け部材 23 ベアリング 1 substrate holder 11 rotating member 14 supporting pin 15 rotating holding pin 16 pin member 17 the pin fixing portion 18 connecting shaft 19 magnet housing section 21 bearing housing 22 mounting member 23 bearing

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基板を回転させつつ基板に所定の処理を行う基板処理装置であって、 回転自在な回転部材と、 基板の外周部に沿うように前記回転部材上に設けられ、 1. A substrate processing apparatus for performing predetermined processing on a substrate while rotating the substrate, a rotatable rotary member, provided on said rotary member so as to extend along the outer periphery portion of the substrate,
    基板の外周端部に当接して基板を保持する複数の保持部材と、 前記回転部材を回転駆動する駆動手段と、 前記複数の保持部材により保持された基板に処理液を供給する処理液供給手段とを備え、 前記複数の保持部材により保持された基板の表面に対向する前記回転部材の表面が撥水性を有することを特徴とする基板処理装置。 A plurality of holding members for holding the substrate in contact with the outer edge of the substrate, and driving means for rotating said rotary member, the processing solution supplying means for supplying a processing liquid to the substrate held by the plurality of holding members preparative comprising, a substrate processing apparatus in which the surface of the rotating member facing the surface of the substrate held by the plurality of holding members and having water repellency.
  2. 【請求項2】 前記各保持部材は、 前記回転部材を貫通して鉛直方向に延びる回転軸と、 前記回転部材に固定され、前記回転軸を回転自在に支持する取り付け部と、 前記回転軸の上端に取り付けられた支持部と、 前記支持部の回動に伴って基板の外周端部に当接するように前記回転軸に対して偏心して前記支持部上に設けられた保持部と、 前記回転軸の下端に取り付けられ、前記支持部の回動のための磁力を発生する磁石を収納する磁石収納部とを備え、 少なくとも前記取り付け部と前記支持部との間の隙間における前記取り付け部および前記支持部の表面と、前記取り付け部と前記磁石収納部との間の隙間における前記取り付け部および前記磁石収納部の表面とが撥水性を有することを特徴とする請求項1記載の基板処理装置。 Wherein each holding member includes a rotary shaft extending in the vertical direction through the rotary member is fixed to said rotary member, and a mounting portion for rotatably supporting the rotary shaft, said rotary shaft a support portion attached to the upper end, said eccentric to the rotation axis provided on the support portion holding portion so as to abut the outer edge of the substrate with the rotation of said support portion, said rotating attached to the lower end of the shaft, and a magnet housing section for housing a magnet which generates a magnetic force for rotating the support part, the attachment portion and the gap between at least the attachment portion and the supporting portion and the and the surface of the support portion, the substrate processing apparatus according to claim 1, wherein said mounting portion and surface of the magnet housing section in the gap and having a water repellency between the mounting portion and the magnet housing portion.
  3. 【請求項3】 前記取り付け部と前記支持部との間の隙間および前記取り付け部と前記磁石保持部との隙間が0.5mm以上1.0mm以下であることを特徴とする請求項2記載の基板処理装置。 3. A according to claim 2, wherein the gap between the gap and the mounting portion and the magnet holding portion between the support portion and the mounting portion is 0.5mm or more 1.0mm or less the substrate processing apparatus.
  4. 【請求項4】 前記回転部材の表面における水に対する接触角が70°以上180°以下であることを特徴とする請求項1〜3のいずれかに記載の基板処理装置。 4. The substrate processing apparatus according to claim 1, wherein the contact angle to water at the surface of the rotating member is 180 ° or less than 70 °.
JP10044893A 1998-02-26 1998-02-26 Substrate treatment apparatus Granted JPH11239758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10044893A JPH11239758A (en) 1998-02-26 1998-02-26 Substrate treatment apparatus

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Application Number Priority Date Filing Date Title
JP10044893A JPH11239758A (en) 1998-02-26 1998-02-26 Substrate treatment apparatus

Publications (1)

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JPH11239758A true JPH11239758A (en) 1999-09-07

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Cited By (18)

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