JPH11239758A - Substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus in which the contamination of the substrate by the mist of treating liquid adhered to a member for rotating/ holding the substrate is prevented. SOLUTION: The rotation member 11 of a substrate holding part is equipped with support pins 14 for supporting the substrate and a rotary holding pin 15 for regulating the horizontal position of the substrate, fixed to the upper end of the rotary shaft of a motor, rotated, and driven. A member in which the surface of a metal is coated with a fluororesin or the surface of an aluminum base material is plated with nickel-polytetrafluoroethylene and others are used as the rotation member 11. The pin fixing part 17 of the rotary holding pin 15, a magnet housing part 19, and a fitting member 22 are formed from a water repellent resin such as polypropylene, and the clearances A, B between the fixing part 17 and fitting member 22 and between the magnet housing part 19 and the fitting part 17 are adjusted to be 0.5-1.0 mm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for performing a predetermined process by supplying a processing liquid to a substrate while rotating the substrate.

[0002]

2. Description of the Related Art Rotary substrate processing apparatuses are used to perform various processes on substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for photomasks, and glass substrates for optical disks. For example, a rotary developing device is used for developing a photosensitive film formed on the surface of a substrate. The development processing of the substrate using this developing device is as follows.
It comprises the steps of developer supply, developer maintenance, pure water washing and drying.

FIG. 5 is a schematic sectional view of a conventional developing device, showing a developing solution supply step. In FIG. 5, the developing device includes a substrate holding unit 41 that holds a substrate W. The substrate holding unit 41 includes a rotating member 42 fixed horizontally to a distal end of a rotating shaft 50 of a motor (not shown) and driven to rotate around a vertical axis. A plurality of support pins 43 for supporting the back surface of the substrate W are provided on the upper surface of the rotating member 42, and a plurality of restriction pins 44 for contacting the outer peripheral edge of the substrate W to regulate the horizontal position of the substrate W. Is provided.

[0004] Above the substrate holding section 41, a developing nozzle 51 for discharging a developing solution is provided so as to be movable in the vertical and horizontal directions. The developing nozzle 51 stands by at a position deviated from above the substrate W before supplying the developing solution and after supplying the developing solution, and moves above the central portion of the substrate W when supplying the developing solution.

In the developing solution supply step using this developing device, after the substrate W is held by the substrate holding portion 41, the substrate holding portion 41 is driven to rotate by a motor.
The developer 30 is discharged onto the substrate W from the developing nozzle 51 that has moved upward, and is spread over the entire surface of the substrate W by centrifugal force due to rotation.

In the developing solution holding step, the rotation of the substrate holding portion 41 is stopped, and the substrate W is stopped for a certain time while the developing solution 30 is spread over the entire surface of the substrate W. This allows
The development of the photosensitive film on the substrate W proceeds.

In the pure water cleaning step, the substrate holding section 41 is driven to rotate again, pure water is supplied to the surface of the substrate W from a pure water supply nozzle (not shown), and the surface of the substrate W is cleaned with pure water. Will be

In the drying step, after the supply of the pure water is stopped, the substrate holding unit 41 is driven to rotate at a high speed, and the pure water is shaken off from the surface of the substrate W by the centrifugal force accompanying the rotation. Thereby, the substrate W is dried. Thereafter, the substrate holding unit 41
Stops, and the development processing of the substrate W ends.

[0009]

In the developing solution supply step shown in FIG. 5, the developing solution 30 is supplied from the developing solution nozzle 51 to the developing solution nozzle 51 while the substrate W held by the substrate holding portion 41 is rotated at a low speed.
Is discharged onto the surface of the substrate W. When a large amount of the developer 30 is discharged so as to uniformly spread over the entire surface of the substrate W, the developer 30 is supplied from the outer peripheral portion of the substrate W to the support pins 43 and the regulating pins 44.
And flows down to the rotating member 42 and adheres to the outer peripheral portion of the rotating member 42.

Thereafter, when the rotation of the substrate W is stopped, the area of the developer 30 which has fallen on the rotating member 42 is expanded,
Part of the developer 30 goes around the lower surface of the rotating member 42,
Adhere to.

As described above, after the developing solution supply step, the pure water washing step is performed through the developing solution holding step. In the pure water cleaning step, pure water is supplied to the surface of the substrate W, and the surface of the substrate W is cleaned. At this time, pure water is supplied to the rotating member 42.
The developer 30 also flows down to the side, and the developer 30 attached to the rotating member 42 in the previous developer supply step is partially washed away.

However, since the pure water is supplied while the substrate holder 41 is rotating, the pure water receives a centrifugal force toward the outside of the substrate W. For this reason, the pure water cannot completely wash away the developer 30 that has spread on the upper and lower surfaces of the rotating member 42 at rest, leaving a region where the developer 30 adheres to the upper and lower surfaces of the rotating member 42.

When the substrate holding portion 41 is rotated at a high speed in the drying step, the developing liquid adheres to the developing region and floats as mist (liquid particles) in the cup 45, and re-adheres to the surface of the substrate W to be re-adhered. Contaminates W. When the developer adhering to the upper and lower surfaces of the rotating member 42 is solidified for a long period of time, particles (dust) due to the solidified product of the developer are generated, and float in the cup 45 to contaminate the substrate W.

It is an object of the present invention to provide a substrate processing apparatus in which contamination of a substrate by a mist of a processing liquid adhered to a member for holding a substrate in rotation is prevented.

[0015]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus for performing a predetermined process on a substrate while rotating the substrate. A plurality of holding members provided on the rotating member along the outer peripheral portion of the substrate and holding the substrate in contact with the outer peripheral edge of the substrate, driving means for rotating and driving the rotating member, and holding by the plurality of holding members And a processing liquid supply means for supplying a processing liquid to the substrate, wherein the surface of the rotating member facing the surface of the substrate held by the plurality of holding members has water repellency.

In the substrate processing apparatus according to the first invention, the substrate held on the rotating member by the plurality of holding members is rotationally driven by the driving means. The processing liquid supply unit supplies the processing liquid to the substrate on the rotating member, and causes the substrate to perform predetermined processing. When a large amount of processing liquid is supplied to the substrate from the processing liquid supply unit, a part of the processing liquid flows down from the substrate onto the rotating member. The surface of the rotating member has water repellency. For this reason, the processing liquid that has flowed down onto the rotating member is repelled on the surface of the rotating member and is scattered outward by the rotation of the rotating member.
This prevents the processing liquid from adhering to the surface of the rotating member, thereby preventing the processing liquid adhering to the surface of the rotating member from becoming mist and contaminating the substrate surface.

According to a second aspect of the present invention, in the configuration of the substrate processing apparatus according to the first aspect, each of the holding members is fixed to the rotating member by a rotating shaft extending vertically through the rotating member. A mounting portion for rotatably supporting the rotating shaft, a supporting portion mounted on the upper end of the rotating shaft, and a biasing portion with respect to the rotating shaft such that the rotating shaft is in contact with the outer peripheral end of the substrate with the rotation of the supporting portion. A holding portion is provided on the supporting portion while being centered, and a magnet storage portion is provided at a lower end of the rotating shaft and stores a magnet for generating a magnetic force for rotating the supporting portion. Further, at least the surfaces of the mounting portion and the support portion in the gap between the mounting portion and the support portion and the surfaces of the mounting portion and the magnet storage portion in the gap between the mounting portion and the magnet storage portion have water repellency. It is.

The holding portion of each holding member contacts the outer peripheral end of the substrate to hold the substrate in the horizontal direction. For this reason, a part of the processing liquid supplied to the substrate passes through the holding unit, and flows down along the mounting unit, the support unit, and the magnet storage unit. In the holding member, gaps are provided between the mounting portion and the support portion and between the mounting portion and the magnet housing portion so that the rotation shaft is rotatable with respect to the rotating member. Then, the surfaces of the mounting portion and the support portion and the surfaces of the mounting portion and the magnet housing portion in this gap are formed so as to have water repellency. For this reason, the treatment liquid that has flowed down from the substrate is prevented from entering the gap due to the water repellency of these surfaces. therefore,
The processing liquid intrudes into each of the gaps between the mounting part and the magnet housing part and the support part, and the infiltrating processing liquid is prevented from becoming a mist in a later step and scattering and contaminating the substrate. Further, it is possible to prevent the processing liquid that has entered each gap from solidifying and hindering the rotation operation of the rotation shaft of the holding member.

A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the second aspect of the present invention, wherein the gap between the mounting section and the support section and the gap between the mounting section and the magnet holding section are set to 0. It is not less than 5 mm and not more than 1.0 mm.

The gap between the mounting part and the support part and the gap between the mounting part and the magnet holding part are 0.5 mm or more and 1.0 mm or more.
By doing so, it is possible to prevent the treatment liquid from entering the gaps due to the water repellency of the surface in each gap. If each gap is smaller than 0.5 mm, the gap between the mounting portion and the supporting portion and between the mounting portion and the magnet holding portion becomes very small, and high accuracy is required for mounting each member, and assembling work becomes difficult. When each gap is larger than 1.0 mm, the effect of water repellency on the surface in each gap is reduced, and the processing liquid enters each gap. Therefore, by setting each gap to the above value, it is possible to prevent the processing liquid from entering each gap.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus comprising:
In the configuration of the substrate processing apparatus according to any one of the third inventions, the contact angle of water on the surface of the rotating member is 70 °.
At least 180 °.

In this case, if the contact angle of the surface of the rotating member in contact with water is smaller than 70 °, it becomes difficult to sufficiently repel the processing liquid. Therefore, the contact angle with water is 7
By setting the angle to 0 ° or more and 180 ° or less, the processing liquid flowing down to the rotating member can be scattered outward to prevent the processing liquid from adhering.

[0023]

FIG. 1 is a sectional view of a rotary developing device according to an embodiment of the present invention, and FIG. 2 is a plan view of the developing device in FIG.

In FIGS. 1 and 2, the substrate holder 1 includes a rotating member 11 having a circular plate shape. The rotating member 11 uses aluminum as a base material, and has a surface facing the surface of the substrate W plated with nickel-polytetrafluoroethylene. The contact angle of nickel-polytetrafluoroethylene plating with water is as large as about 100 °, and can repel the developer. Further, as another example, a material obtained by impregnating a water-repellent resin into alumite or a material obtained by coating (coating) a fluorine-based resin on the surface of a metal material such as a titanium alloy may be used.

The rotating member 11 is horizontally fixed to the tip of the rotating shaft 2 of the motor 3 via a mounting member 12, and is driven to rotate around a vertical axis.

An annular cover member 13 made of resin is formed on the upper surface of the rotating member 11, and a plurality of support pins 14 for supporting the back surface of the substrate W project from the upper surface of the cover member 13.

A plurality of rotatable holding pins 15 for regulating the horizontal position of the substrate W are attached to the rotating member 11 so as to be rotatable around a vertical axis. FIG. 3 is a perspective view of the rotary holding pin (a) and the mounting member (b). FIG. 4 is an enlarged sectional view of the vicinity of the rotary holding pin in the developing device. In FIG. 3A and FIG. 4, the rotary holding pin 15 includes a cylindrical pin fixing portion 17,
It includes a columnar (rod-shaped) pin member 16, a connecting shaft 18 and a magnet housing 19. The pin member 16 includes a pin fixing portion 17.
Are provided eccentrically with respect to the center of the pin fixing portion 17. The magnet housing portion 19 is fixed to a lower portion of the pin fixing portion 17 via a connecting shaft 18. Magnet storage unit 19
A rod-shaped permanent magnet 20 is housed therein.

The rotating holding pin 15 is attached to the rotating member 11 by an attaching member 22. 3B, the mounting member 22 has a pair of mounting holes 22a, and is fixed to the outer periphery of the lower surface of the rotating member 11 (see FIG. 1) by screwing. The mounting member 22 has a bearing housing 21, and the connecting shaft 18 of the rotary holding pin 15 is inserted into a shaft hole of a bearing 23 housed in the bearing housing 21. Thereby, as shown in FIG. 4, the pin member 16 and the pin fixing portion 17 of the rotary holding pin 15 protrude toward the upper surface side of the rotating member 11, and the magnet housing portion 19 of the rotary holding pin 15 moves to the lower surface of the rotating member 11. Project to the side.

In the rotary holding pin 15, the pin member 1
6, the pin fixing portion 17, the mounting member 22, and the magnet housing portion 19 are made of water-repellent resin such as polypropylene or polytetrafluoroethylene.
The contact angle of polypropylene to water is about 80 °, and the contact angle of polytetrafluoroethylene is 90 to 100 °, both of which have high water repellency. Therefore, the applied developer can be repelled and flow down. These members are not only formed of the above-mentioned water-repellent resin material, but are also made of a metal material having a surface coated with a water-repellent material such as polytetrafluoroethylene, or subjected to a surface treatment such as graphite fluoride. You may use what was done. The contact angle of graphite fluoride to water is 140 ~
180 °.

In FIG. 4, a gap A formed between the pin fixing portion 17 and the mounting member 21 and a gap B formed between the mounting member 22 and the magnet housing portion 19.
Are adjusted to 0.5 mm or more and 1 mm or less. The surfaces of the pin fixing portion 17, the mounting member 22, and the magnet housing portion 19 in each of the gaps A and B have water repellency. Therefore, by adjusting the gaps d1 and d2 between the gaps to 1 mm or less, the developer is repelled by the water repellency of the surfaces of the members facing each other via the gaps A and B, and the gaps A and B are adjusted.
Is prevented from passing through. This prevents the developer from entering and staying in the bearing holding portion 21 and preventing the developer from adhering to the non-water-repellent bearing 23. If the distances d1 and d2 between the gaps are smaller than 0.5 mm, high precision is required for adjusting the gaps, and the assembling work becomes difficult.

An annular magnet 6 is provided below the rotating member 11. This annular magnet 6 is driven by a driving device (not shown).
Are fixed to a magnet support member 7 provided to be vertically movable.

When the magnet support member 7 rises, the annular magnet 6
And the permanent magnet 20 of the rotary holding pin 15 attracts, the rotary holding pin 15 rotates, and the pin member 16 abuts on the outer peripheral end of the substrate W to hold the horizontal position of the substrate W.
When the magnet supporting member 7 is lowered, the rotary holding pin 1 is moved.
5 rotates in the opposite direction, and the pin member 16 separates from the outer peripheral end of the substrate W. By such an operation, the outer peripheral end of the substrate W is held or opened by the rotary holding pins 15.

The rotating shaft 2 of the motor 3 is constituted by a hollow shaft, and a back rinse nozzle 9 (see FIG. 2) for cleaning the back surface of the substrate is inserted therein. The back rinse nozzle 9 penetrates through the mounting member 12 and protrudes to the back side of the substrate W. At the tip of the back rinse nozzle 9, a truncated conical cap 8 is attached. Cap 8
Is mounted to prevent the rinsing liquid (pure water) discharged from the back rinsing nozzle 9 from entering the inside of the rotating shaft 2.

Above the substrate holder 1, a developing nozzle 10 for discharging a developing solution is provided so as to be movable in the vertical and horizontal directions. The developing nozzle 10 waits at a position deviated from above the substrate W before the developing process and after the developing process, and moves above the central portion of the substrate W during the developing process.

Further, a hollow cup 4 is provided so as to surround the periphery of the substrate holding section 1. The cup 4 includes an upper cup 4a that can move in the vertical direction, and a lower cup 4b fixed below the upper cup 4a. An exhaust port 4c is provided below the lower cup 4b for exhausting a downward flow (downflow) of clean air descending into the cup 4 from above the developing device.

In this embodiment, the rotary holding pin 15 corresponds to the holding member of the present invention, the motor 3 corresponds to the driving means, and the developing nozzle 10 corresponds to the processing liquid supply means. Further, the pin member 16 of the rotary holding pin 15 corresponds to the holding portion of the present invention, the pin fixing portion 17 corresponds to the supporting portion, the connecting shaft 18 corresponds to the rotating shaft, and the magnet housing portion 19 corresponds to the magnet housing portion. , And the mounting member 22 corresponds to a mounting portion.

Next, the operation of the developing device of FIG. 1 during the developing process will be described. In this developing device, the developing process is performed while a clean downflow is supplied into and out of the cup 4 from above. In the development process, the developer supply,
The steps of holding the developing solution, washing with pure water, and drying are sequentially performed.

First, the substrate W is supported by the support pins 1 of the substrate holder 1.
4. Next, the annular magnet 6 is raised, and the plurality of rotary holding pins 15 hold the substrate W in the horizontal direction.

In the developing solution supply step, the developing nozzle 1 is rotated while the substrate holder 1 is rotated at a low speed by the motor 3.
From 0, the developer is discharged onto the substrate W. The discharged developer is uniformly spread over the entire surface of the substrate W.

A relatively large amount of developing solution is discharged from the developing nozzle 10. For this reason, a part of the developer flows down the rotary holding pin 15 and flows down to the rotating member 11. The surfaces of the rotary holding pin 15 and the rotary member 11 have water repellency. For this reason, the developer flowing down from the substrate W is scattered outward by the rotation of the substrate holding unit 1 without adhering to the surfaces of the rotary holding pins 15 and the rotating member 11.

Further, in the developing solution holding step, the rotation of the substrate holding unit 1 is stopped. When the substrate holding unit 1 is stopped,
The annular magnet 6 descends, and the rotary holding pin 15 is opened. In this state, the developer is kept stationary on the substrate W for a certain period of time. Thereby, development of the photosensitive film on the substrate W proceeds. In this case, the developer is placed on the surface of the rotating member 11 in a state where the developer is repelled without adhering to the surfaces of the rotating holding pin 15 and the rotating member 11.
If centrifugal force acts due to the rotation of, it flows down quickly.

Next, in the cleaning step, the annular magnet 6 is raised again and the substrate W is held in the horizontal direction by the rotary holding pins 15. Then, the substrate holding unit 1 is rotationally driven by the motor 3, and the substrate W rotates at a predetermined speed. In this cleaning step, pure water is discharged from the pure water supply nozzle (not shown) onto the substrate W to clean the surface of the substrate W, and the rinse liquid (pure water) is supplied from the back rinse nozzle 9 (see FIG. 2). Is discharged to clean the back surface of the substrate W.

Upon completion of the cleaning process for the front and back surfaces of the substrate W, the process proceeds to a drying step. In the drying process, the motor 3
Is increased, and the substrate W is rotated at a high speed. Thereby, the pure water supplied to the surface of the substrate W is shaken outward, and the surface of the substrate W is dried.

As described above, since the surface of the rotating member 11 or the surface of the rotary holding pin 15 is formed to be water-repellent, the developing solution adheres and becomes a mist in a later step to contaminate the surface of the substrate W. Is prevented. Further, the developer enters the gap between the pin fixing portion 17 and the magnet holding portion 19 of the rotary holding pin 15 and the mounting member 22 and solidifies,
It is possible to prevent the rotation operation of the rotary holding pin 15 from being hindered.

Furthermore, the developer is less likely to adhere to the substrate holder 1, and the substrate holder 1 is maintained in a clean state, so that the period of maintenance work such as cleaning of the substrate holder 1 can be lengthened. .

[Brief description of the drawings]

FIG. 1 is a sectional view of a rotary developing device according to an embodiment of the present invention.

FIG. 2 is a plan view of the developing device of FIG.

FIG. 3 is a perspective view of a rotary holding pin and a mounting member.

FIG. 4 is an enlarged sectional view of the vicinity of a rotary holding pin in the developing device.

FIG. 5 is a schematic sectional view of a conventional developing device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate holding part 11 Rotating member 14 Support pin 15 Rotating holding pin 16 Pin member 17 Pin fixing part 18 Connecting shaft 19 Magnet storing part 21 Bearing storing part 22 Mounting member 23 Bearing

Claims (4)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate while rotating the substrate, comprising: a rotatable rotary member; and a rotatable rotary member provided on the rotary member along an outer peripheral portion of the substrate.
A plurality of holding members that abut against an outer peripheral end of the substrate and hold the substrate; a driving unit that rotationally drives the rotating member; and a processing liquid supply unit that supplies a processing liquid to the substrate held by the plurality of holding members. Wherein the surface of the rotating member facing the surface of the substrate held by the plurality of holding members has water repellency. 2. Each of the holding members includes: a rotating shaft extending vertically through the rotating member; a mounting portion fixed to the rotating member and rotatably supporting the rotating shaft; A support portion attached to an upper end, a holding portion provided on the support portion eccentrically with respect to the rotation axis so as to contact an outer peripheral end portion of the substrate with the rotation of the support portion, and the rotation A magnet accommodating portion attached to a lower end of a shaft and accommodating a magnet that generates a magnetic force for rotating the support portion, wherein the attaching portion and the attaching portion at least in a gap between the attaching portion and the supporting portion. 2. The substrate processing apparatus according to claim 1, wherein a surface of the support part and a surface of the mounting part and the magnet storage part in a gap between the mounting part and the magnet storage part have water repellency. 3. 3. The gap according to claim 2, wherein a gap between the mounting portion and the support portion and a gap between the mounting portion and the magnet holding portion are 0.5 mm or more and 1.0 mm or less. Substrate processing equipment. 4. The substrate processing apparatus according to claim 1, wherein a contact angle of the surface of the rotating member with water is 70 ° or more and 180 ° or less.