JP2000012504A - Spin processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cleaning agent from remaining on a lower surface of a semiconductor wafer, and from causing a stain upon drying the semiconductor wafer. SOLUTION: A spin processor 1, which rotates a semiconductor wafer 21 before treatment, comprises a rotary table 9 being driven by a motor; a plurality of holding members 11 disposed at a circumference of the rotary table in a circumferential direction with predetermined intervals, so as to have holding parts for holding the edge of the semiconductor wafer on the upper ends; and a nozzle hole 91a disposed on a lower surface of the semiconductor wafer held by the holding members, so as to release air for drying the lower surface of the work from a position other than the center in a diametrical direction to the center in the diametrical direction on the lower surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin processing apparatus for performing processing such as washing and drying while rotating a work.

[0002]

2. Description of the Related Art For example, in a process of manufacturing a semiconductor device or a liquid crystal display device, a film forming process or a photo process for forming a circuit pattern on a semiconductor wafer as a work or a rectangular liquid crystal glass substrate. There is. In these processes, a chemical treatment of the work, a cleaning treatment with a cleaning liquid, a drying treatment, and the like are repeatedly performed.

[0003] A spin processing device is used to perform the various processes described above on the work. This spin processing device has a rotary table that is driven to rotate.
At the periphery of the bull, a plurality of holding members are erected at predetermined intervals in the circumferential direction. At the upper end of each holding member, a pin is provided as a holding portion for holding the periphery of the work.

In processing the work, if the periphery of the work is held by pins of the holding member,
This work is rotated together with the rotating table. By supplying a processing liquid or a cleaning liquid toward the upper surface side and the lower surface side of the work, the work can be processed or cleaned, and further, without supplying the processing liquid or the cleaning liquid.
By rotating the rotary table at a high speed, the work can be dried.

On the upper surface side of the work, a gas flows from the center of the upper surface to the outside in the radial direction due to downflow from the ceiling of the clean room where the spin processing device is installed. Therefore, the cleaning liquid on the upper surface of the work is surely removed by the centrifugal force and the downflow due to the rotation of the work, so that a so-called water mark hardly occurs after the drying process.

However, downflow does not act on the lower surface side of the work. For this reason, the washing liquid cannot be reliably removed only by the centrifugal force accompanying the rotation, so that a water mark may occur in which the remaining washing liquid is stained after the drying treatment.

In order to prevent poor drying of the lower surface of the work,
It is considered that a gas for drying is blown to the lower surface side of the work. However, simply spraying a drying gas on the lower surface of the work does not cause the gas to flow radially outward from the central portion of the lower surface of the work, so that the cleaning liquid can remain and stain. Inevitable.

Further, a relatively large space portion is formed on the lower surface side of the work held by the holding member, and the gas flow in this space portion is caused by the rotation of the rotary table to cause the holding member to blow wind. Turbulence is easy to cut.

As a result, the cleaning liquid may remain on the lower surface of the work, causing stains, or air on the upper surface may be trapped on the lower surface, and mist contained in the gas flow may adhere to the work. The spots and stains may occur.

[0010]

As described above, when the work is held on the rotating table and the work is dried while rotating the rotating table, the lower surface of the work is used. The cleaning liquid tends to remain on the side, which may cause stains. Even if the gas is simply sprayed on the lower surface of the work, the cleaning liquid attached to the lower surface is reliably removed to prevent the occurrence of stains I couldn't do that.

An object of the present invention is to ensure that liquid adhering to the lower surface of a work held on a rotating table can be dried and removed, so that the lower surface of the work is stained by a cleaning liquid. It is an object of the present invention to provide a spin processing apparatus which does not have the same.

[0012]

According to the first aspect of the present invention, there is provided a word processor.
2. Description of the Related Art In a spin processing apparatus for processing by rotating a work, a rotary table driven to rotate and a peripheral portion of the work provided at a predetermined interval in a circumferential direction around the rotary table are held at an upper end. A plurality of holding members provided with holding portions to be provided, and a lower surface of the work, which is provided on the lower surface side of the work held by the holding member and is shifted from a radial center on the lower surface side toward a radial center portion. Gas supply means for ejecting a gas for drying the gas.

According to a second aspect of the present invention, in the first aspect of the present invention, the rotary table is provided with a regulating member for restricting a gas flow on the lower surface side of the work, and the regulating member is provided with the gas supply means. An opening for guiding gas from the work to the lower surface side of the work is formed.

According to the first aspect of the present invention, the drying gas is ejected from the position below the center of the lower surface toward the center in the radial direction on the lower surface of the work. The gas can flow outward from the radial center. Therefore, the cleaning liquid adhered to the lower surface of the work can be reliably removed from the lower surface, so that it is possible to prevent occurrence of a stain due to drying.

According to the second aspect of the present invention, since the rotary table is provided with the regulating member for regulating the gas flow on the lower surface side of the work, turbulence is less likely to be generated on the lower surface side of the work, and furthermore, the regulation is restricted. By supplying a drying gas from the opening formed in the member toward the lower surface of the work, the gas can be used to efficiently dry the lower surface of the work.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The spin processing apparatus of the present invention shown in FIG. The main body base 1 is provided with a cylindrical support 2 penetrating vertically. The support 2 has a cylindrical rotary shaft 3 rotatably supported at an intermediate portion by a pair of upper and lower bearings 4.

The lower end of the rotary shaft 3 protrudes from the support 2, and a driven pulley 5 is fitted to the lower end. A step motor 6 is provided near the driven pulley 5. A drive pulley 7 is fitted on the rotating shaft 6a of the step motor 6, and a belt 8 is stretched between the drive pulley 7 and the driven pulley 5. Therefore, if the step motor 6 operates, the rotation shaft 3
Are driven to rotate.

A rotary table 9 is detachably attached to the upper end of the rotary shaft 3 by screws 9a. FIG.
As shown in FIG. 3, four holding members 11 are rotatably mounted on the rotary table 9 via bushes 12 at intervals of 90 degrees in the circumferential direction. The holding member 11 has a cylindrical portion 13 as shown in FIG. The cylindrical part 13 has an upper end closed and an open lower end. A support shaft 14 from the cylindrical portion 13
The support shaft 14 is rotatably supported by the bush 12 with its lower end protruding.

On the upper surface of the cylindrical portion 13, a support pin 16 forming a holding portion and an inverted tapered lock pin 17 which is taller than the support pin 16 are erected. The support pin 16 has the shaft center substantially aligned with the support shaft 14, and the lock pin 17 is provided eccentrically with respect to the axis.

As shown in FIGS. 1 and 2, a semiconductor wafer 21 as a work is held by the four holding members 11 having the above structure. That is, the semiconductor wafer 21 is provided with the peripheral portion of the back surface supported by the support pins 16. With the semiconductor wafer 21 supported by the support pins 16, the holding member 11 is urged in the rotational direction by a spring (not shown).

As a result, the lock pin 17 provided on the holding member 11 is eccentrically rotated to rotate the semiconductor wafer 2.
Since the semiconductor wafer 21 abuts on the outer peripheral surface of the semiconductor wafer 1, the semiconductor wafer 21 is held without shifting in the radial direction.

A through hole 25 is formed in the center of the rotary table 9 as shown in FIG. A conical lower nozzle body 26 is provided at the location of the through hole 25.
The lower nozzle body 26 includes a central portion 26a that is inserted into the through hole 25 in a non-contact state, and an umbrella portion 26b that is screwed to the outer peripheral surface of the central portion 26a and has a diameter larger than the through hole 25. Become.

An annular first seal wall 20a protrudes around the through hole 25 of the rotary table 9, and the first seal wall 20b is formed on the lower surface of the umbrella portion 26b. An annular second seal wall 20b is vertically provided on the outer peripheral surface of the second seal wall 20a.

Since the umbrella portion 26b of the lower nozzle body 26 covers the upper end surface of the rotary shaft 3, the cleaning liquid for cleaning the semiconductor wafer 21 is prevented from entering the inside of the rotary shaft 3.

The umbrella portion 26b of the lower nozzle body 26 covers the upper surface of the rotary table 9, and the umbrella portion 26b is detachably screwed to the center portion 26a. Therefore, by removing the umbrella portion 26b from the center portion 26a, the screw 9a for attaching the rotating table 9 to the upper end of the rotating shaft 3 can be exposed. Thus, the screw 9a can be loosened to remove the rotary table 9 from the rotary shaft 3.

Steps are formed on the outer peripheral surface of the central portion 26a and the inner peripheral surface of the umbrella portion 26b, respectively, and liquid-tightness between the central portion 26a and the umbrella portion 26b is ensured between these steps. Packing 26c is provided. Further, a first nozzle hole 27 opened to the upper surface thereof is formed in the center portion 26a of the lower nozzle body 26 so as to penetrate vertically.

A bracket 31 is fitted to the lower end of the central portion 26a of the lower nozzle body 26. The bracket 31 is rotatably supported by an upper part of the rotary shaft 3 by a bearing 29.

The bracket 3 inside the rotary shaft 3
1 and the other bearing 32 shown in FIG.
Thus, a housing 33 whose upper and lower ends are rotatably supported is inserted. The housing 33 and the bracket 31 are integrally combined to form a fixed shaft. A lower end of the housing 33 protrudes from the rotation shaft 3 and is attached to a lower surface of the base body 1.
It is fixed to.

A through hole 36a is formed in the housing 33, and the first nozzle hole 27 is formed in the through hole 36a.
A supply tube 35 having one end connected thereto is inserted therethrough.
The lower nozzle body 26 is integrally connected to the housing 33 by a connecting rod (not shown).
Thus, even if the rotary table 9 is driven to rotate together with the rotary shaft 3, the lower nozzle body 26 and the housing 33 do not rotate.

The other end of the supply tube 35 communicates with a cleaning liquid supply unit (not shown). Therefore, the cleaning liquid from the supply tube 35 can flow from the first nozzle hole 27 along the lower surface side of the semiconductor wafer 21 held by the holding member 11.

An upper nozzle body 38 is disposed on the upper surface side of the semiconductor wafer 21. The cleaning liquid is sprayed from the upper nozzle body 38 toward the center of the upper surface of the semiconductor wafer 21. Thereby, the upper surface of the semiconductor wafer 21 is cleaned. That is, the semiconductor wafer 21 can be simultaneously cleaned not only on the upper surface but also on the rear surface.

A chemical solution may be sprayed from the upper nozzle body 38 to the semiconductor wafer 21 instead of the cleaning solution, or a chemical solution may be sprayed from the first nozzle hole 27 instead of the cleaning solution.

On the lower surface side of the rotary table 9, a cylindrical lock cylinder 41 is rotatably provided by a pair of upper and lower bearings 40 on the upper outer peripheral surface of the rotary shaft 3. FIG.
As shown in the figure, a flange 42 is provided at the upper end of the lock cylinder 41, and four arms 39 (only two are shown) are provided on the flange 42 in the circumferential direction.
The arm 39 is projected at 0 degree intervals, and a slide groove 36 is formed at the tip of each arm 39 along the radial direction.
In each slide groove 36, a top 37 having a fitting hole 37a formed therein is slidably provided.

A locking pin 43 is removably fitted in the fitting hole 37a of the top 37. The locking pin 43 protrudes from one end of the lever 44. The other end of the lever 44 is connected and fixed to a lower end of the support shaft 14 of the holding member 11 protruding from the lower surface of the rotary table 9.

Therefore, if the lock cylinder 41 is rotated in a predetermined direction, for example, clockwise, and the lever 44 is rotated through the top 37 and the locking pin 43, the lock cylinder 41 is connected to the lever 44. The holding member 11 can be rotated via the support shaft 14.

As a result, the lock pins 17 rotate eccentrically, and the semiconductor wafer 21 supported by the support pins 16 is rotated.
The lock pins 17 are brought into contact with the outer peripheral surface of the semiconductor wafer 21 to lock the support state of the semiconductor wafer 21. That is, the lock pins 17 prevent the semiconductor wafer 21 supported by the support pins 16 from moving in the radial direction.

The locked state of the semiconductor wafer 21 by the lock pins 17 can be released by rotating the lock cylinder 41 counterclockwise. The lock pin 17 locks and releases the semiconductor wafer 21, that is, the rotation of the lock cylinder 41 is performed by the release mechanism 51. The release mechanism 51 includes a first locking piece 52 provided on the outer peripheral surface of the rotary shaft 3 as shown in FIG.
And a second locking piece 53 provided on the outer peripheral surface of the lock cylinder 41.

A spring (not shown) is stretched between the first locking piece 52 and the second locking piece 53. This spring urges the lock cylinder 41 toward the first locking piece 52 via the second locking piece 53. That is, the lock cylinder 4
1 is urged in a counterclockwise direction. Therefore, since the spring rotates the lock cylinder 41, the holding member 11 provided on the rotary table 9 is rotated via the locking pin 43 and the lever 44, and the lock pin 17 is moved to the semiconductor wafer. 21 is brought into a locked state in contact with the outer peripheral surface.

The lock state of the semiconductor wafer 21 by the lock pin 17 is released when the rotary shaft 3 is stopped at a predetermined rotation angle, and the first locking piece 52 is held. The second locking piece 53 is pressed against the urging force of the spring.

As a result, the lock cylinder 41 is rotated against the urging force of the spring, so that the holding member 11 is rotated via the locking pin 43 and the lever 44 in the direction opposite to the locking direction. . Therefore, the lock pin 17 is eccentrically rotated to release the locked state of the semiconductor wafer 21.

As shown in FIG. 2, a dog 71 is provided on the outer peripheral surface of the lower end of the rotary shaft 3, and the dog 71 is detected by a microphoto sensor 72. The rotation angle of the rotary shaft 3 by the step motor 6 is controlled by the detection signal of the micro photo sensor 72. That is, when the locked state of the semiconductor wafer 21 is released, the rotation angle of the rotating shaft 3 can be controlled so that the first locking piece 52 and the second locking piece 53 are at predetermined positions. I have.

A through hole 75a into which the upper part of the rotary shaft 3 is loosely inserted is formed on the upper surface side of the main body base 1, and a lower cup 75 in which the rotary shaft 3 is housed, and the holding member 11
And an upper cup 76 that covers the peripheral portion on the upper surface side of the semiconductor wafer 21 held at the top and has an opening 76a formed on the upper surface. The upper cup 76 is provided so as to be vertically movable, and is connected to a rod 77 of a vertical driving cylinder (not shown). By operating this cylinder, the upper cup 76
Is driven up and down.

When the upper cup 76 is lowered, the upper part of the holding member 11 protrudes from the upper surface opening. Therefore, an unprocessed semiconductor wafer 21 can be supplied to the holding member 11 by a robot (not shown), and the semiconductor wafer 21 that has been dried can be taken out. Further, a discharge pipe 78 is connected to the lower cup 75. The discharge pipe 78 discharges the cleaning liquid and the atmosphere inside the lower cup 75.

As shown in FIG. 1, a ring-shaped facing member 81 facing the periphery of the lower surface of the rotary table 9 is provided around the through hole 75a of the lower cup 75. An inner peripheral wall 82a is provided around the upper surface of the facing member 81.
And an outer peripheral wall 82b shorter than the inner peripheral wall 82a form an annular groove 83. A liquid L supply pipe 84 is connected to the bottom of the annular groove 83 so as to supply the liquid L to the annular groove 83. Since the outer peripheral wall 82b forming the annular groove 83 is shorter than the inner peripheral wall 82a, the liquid L supplied to the annular groove 83 overflows outward.

At the periphery of the lower surface of the rotary table 9, a seal wall 85 which enters the annular groove 83 is provided all around. By inserting the seal wall 85 into the annular groove 83 containing the liquid L, the lower surface side and the outer peripheral side of the rotary table 9 are airtightly shut off.

As a result, outside air containing dust is prevented from flowing into the lower cup 75 from the through hole 75a of the lower cup 75, and at the same time, a cleaning solution or a chemical solution scattered into the upper and lower cups 75 and 76 is prevented. The processing solution is the lower cup 7
5 is prevented from flowing out of the through hole 75a.

When the processing liquid is a liquid having a high acidity, the cups 75 and 76 and the rotary table 9 are made of a material having acid resistance, such as a fluorine resin, and are not corroded. However, when the cleaning liquid flows out of the lower cup 75 and adheres to other parts made of metal,
The parts may be corroded, and if the parts enter a movable part such as a bearing part, the movable part may be damaged early. However, the above-described seal structure prevents the cleaning liquid from flowing out of the lower cup 75 to the outside, so that such inconvenience does not occur.

The housing 3 provided in the rotating shaft 3
3 is provided with a supply pipe 91 for an inert gas such as nitrogen. The supply pipe 91 is provided in a first space 92a between the upper surface of the bracket 31 and the lower surface of the lower nozzle body 26.
Is in communication with A second space 92b between the outer peripheral surface and the inner peripheral surface of the rotating shaft 3 is provided on the peripheral wall of the bracket 31.
Is formed with a communication hole 93 communicating with.

Therefore, the first supply pipe 91
The inert gas supplied to the space 92a of the communication hole 9a
3 to the second space 92b, and the second space 9
2b flows out along the lower surface side of the lower nozzle body 26.
In other words, since the second space 92b is made to have a positive pressure by the inert gas, the pressure prevents the cleaning liquid from flowing into the second space 92b.

Further, the lower nozzle body 26 is provided with a second nozzle hole 91a as a gas supply means. The second nozzle hole 91a blows a part of the inert gas supplied from the supply pipe 91 to the second space 92b toward the lower surface of the semiconductor wafer 21.

That is, the second nozzle hole 91a is formed at a position radially outwardly displaced from the central axis of the lower nozzle body 26 by a predetermined dimension, that is, at a position off the radial center of the semiconductor wafer 21. The tip portion of the lower nozzle body 26 that opens to the upper surface is inclined toward the center of the lower surface of the semiconductor wafer 21.

Therefore, the inert gas is injected obliquely downward from the second nozzle hole 91a to the center of the lower surface of the semiconductor wafer 21, so that the lower surface of the semiconductor wafer 21 is dried by the inert gas. It is supposed to be.

As shown in FIG. 2, a first suction hole 95a connected to a suction pump (not shown) is formed in a peripheral wall of the support 2 rotatably supporting the rotary shaft 3. A second suction hole 95b is formed in a portion of the peripheral wall of the rotating shaft 3 facing the first suction hole 95a. further,
A third suction hole 95c is formed in a portion of the peripheral wall of the rotating shaft 3 facing the lock cylinder 41.

Therefore, by the suction force of the suction pump connected to the first suction hole 95 a, the bearing 4, which rotatably supports the rotating shaft 3 on the support 2, and the rotating shaft 3 is rotated by the housing 33. Freely supported bearings 29, 32
And the dust generated by the bearing 40 that rotatably supports the lock cylinder 41 on the rotary shaft 3 is discharged, so that the dust generated by each bearing is prevented from scattering around. Has become.

The rotating table 9 has the holding member 1
A regulating member 101 for regulating the generation of an air flow is provided on the lower surface of the semiconductor wafer 21 held at 1. The restricting member 101 has a cylindrical peripheral wall portion 102 having an inner diameter substantially equal to the outer diameter of the rotary table 9.
And the end plate portion 10 in which the upper end opening of the peripheral wall portion 102 is closed.
3 are integrally formed.

As shown in FIG. 3, four first openings 104 for projecting the support pins 16 and the lock pins 17 are formed at the peripheral portion of the end plate 103 at intervals of 90 degrees in the circumferential direction, as shown in FIG. A second opening 105 is formed at the center for ejecting the cleaning liquid from the first nozzle hole 27 and the inert gas from the second nozzle hole 91a to the lower surface side of the semiconductor wafer 21. .

As shown in FIG. 1, the lower end of the peripheral wall 102 of the regulating member 101 is fitted to the outer peripheral surface of the rotary table 9 and these joints are joined by screws 106. The holding member 11 is accommodated therein, and the support pin 1 is inserted through the opening 104 of the end plate 103.
6 and the lock pin 17 are projected so that the rotation table 9 is rotated.
It is provided in.

Thus, the regulating member 101 is provided in the first space S at a small space between the lower surface of the semiconductor wafer 21 and the upper surface of the end plate 103, for example, a space of about several mm.
The second space S2 on the upper surface side of the rotary table 9 except 1
Is closed. That is, the regulating member 101 is the holding member 1
The second space S2 between the upper surface side of the rotary table 9 and the lower surface side of the semiconductor wafer 21 is closed by housing the inside.

Next, a case where the semiconductor wafer 21 is cleaned and dried by the spin processing apparatus having the above configuration will be described with reference to FIGS. First, the semiconductor wafer 21 is held by four holding members 11 erected on the upper surface of the rotating table 9. That is, while supporting the peripheral portion of the lower surface of the semiconductor wafer 21 with the support pins 16,
The semiconductor wafer 21 is held on the rotating table 9 by bringing the lock pins 17 into contact with the outer peripheral surface. Since the lock pin 17 has an inverted tape shape, the lock pin 17 not only holds the semiconductor wafer 21 so as not to be displaced in the radial direction, but also prevents the semiconductor wafer 21 from floating from the support pin 16.

When the semiconductor wafer 21 is held on the rotary table 9, the step motor 6 is operated to rotate the rotary table 9 together with the rotary shaft 3. At the same time, the cleaning liquid is ejected from the first nozzle holes 27 of the upper nozzle body 38 and the lower nozzle body 26 toward the upper surface and the lower surface of the semiconductor wafer 21, respectively.
1 can be cleaned simultaneously with the upper surface and the lower surface.

The second space S2 on the upper surface of the rotary table 9 is closed by the restricting member 101 except for the first space S1, and the first space on the lower surface of the semiconductor wafer 21. S1 is the end plate 103 of the regulating member 101
Thereby, the interval (height dimension) is sufficiently reduced.

Therefore, even if the rotating table 9 rotates,
By the holding member 11, the second surface on the lower surface side of the semiconductor wafer 21 is
The generation of turbulence in the space S2 is not only restricted, but also the air flow hardly occurs in the first space S1.

Therefore, even if particles and mist are generated by cleaning the upper surface side of the semiconductor wafer 21 with the cleaning liquid, they are prevented from flowing into and adhering to the lower surface side of the semiconductor wafer 21. Further, the cleaning liquid supplied to the lower surface side of the semiconductor wafer 21 flows out of the first space S1 along the lower surface and the upper surface of the end plate portion 103 of the regulating member 101, and the flow is not disturbed. 2
Particles contained in the cleaning liquid for cleaning the lower surface of the first surface do not adhere to the lower surface again.

After the upper and lower surfaces of the semiconductor wafer 21 have been cleaned, pure water is supplied to the upper surface of the semiconductor wafer 21 from the upper nozzle body 38 or another nozzle body 38 (not shown). Semiconductor wafer 21
Pure water is supplied to the lower surface of the, and the upper and lower surfaces are rinsed. Next, a drying process is performed by rotating the semiconductor wafer 2 at a high speed.

At this time, the upper surface side of the semiconductor wafer 21 is favorably dried because there is a clean air flow due to the downflow in the clean room. On the other hand, the first space S1 on the lower surface side of the semiconductor wafer 1
Is sufficiently narrowed by the end plate 103 of the regulating member 101, so that almost no air flow is generated.

Therefore, although the cleaning liquid for cleaning the upper surface of the semiconductor wafer 1 does not flow into the first space S1 to stain the lower surface, the lower surface of the semiconductor wafer 21 is hardly dried. However, by supplying the inert gas from the second nozzle hole 91a, the lower surface of the semiconductor wafer 21 is favorably dried.

That is, on the lower surface of the semiconductor wafer 21, an inert gas is injected obliquely from the second nozzle hole 91a from the position shifted from the radial center of the semiconductor wafer 21 toward the radial center. You. Therefore, on the lower surface of the semiconductor wafer 21, the inert gas injected from the second nozzle hole 91 a flows from the radial center toward the outer periphery, and adheres to the lower surface of the semiconductor wafer 21 by the flow of the inert gas. The cleaning liquid will be well drained from its lower surface. In addition, since the semiconductor wafer 21 is rotated at a high speed and generates a centrifugal force, the cleaning liquid is also removed from the lower surface of the semiconductor wafer 21 by the centrifugal force.

As a result, the cleaning liquid is reliably removed from the lower surface of the semiconductor wafer 1 and the cleaning liquid does not remain, so that the water mark does not occur on the lower surface of the semiconductor wafer 21.

Moreover, since the lower surface side of the semiconductor wafer 21 is formed in the first space S1 having a height of several millimeters by the regulating member 101, the lower surface side of the semiconductor wafer 21 is jetted from the second nozzle hole 91a. Even if the amount of the inert gas to be performed is small, the inert gas can flow at a predetermined flow rate along the lower surface of the semiconductor wafer 1, so that the lower surface of the semiconductor wafer 1 can be efficiently dried. it can.

The present invention is not limited to the above embodiment. For example, the work may be a liquid crystal glass substrate instead of a semiconductor wafer, and the regulating member has a peripheral wall portion and a mirror plate portion. The regulating member may be either an integral part or a separate part, and the regulating member may be only a mirror plate part for reducing the gap on the lower surface side of the semiconductor wafer.

Further, the gas blown to the lower surface of the work is not limited to the inert gas, but may be clean air or the like. In short, any gas which does not impair the quality required for the work may be used.

[0072]

As described above, according to the first aspect of the present invention, the drying gas is ejected from the position deviated from the center of the lower surface toward the radial center from the lower surface of the work. In addition, gas can flow outward from the center in the radial direction to the lower surface of the work.

As a result, the cleaning liquid adhering to the lower surface of the work can be reliably removed, so that the occurrence of stains due to the cleaning liquid remaining on the lower surface of the work is prevented. According to the invention of claim 2, the rotary table is provided with the regulating member for regulating the flow of gas on the lower surface side of the work.

As a result, turbulence is less likely to be generated on the lower surface side of the work, so that it is possible to prevent not only the gas including mist and particles from flowing from the upper surface side to the lower surface side, but also contaminating the lower surface. The space on the lower surface side of the work is regulated by the regulating member, so that the drying gas supplied from the opening formed in the regulating member toward the lower surface of the work can be efficiently converted to the work in terms of flow velocity and flow rate. Since it can act, the drying of the lower surface of the work can also be performed efficiently.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view showing a main part of an embodiment of the present invention.

FIG. 2 is a sectional view showing the overall structure of the processing apparatus.

FIG. 3 is a perspective view of the regulating member.

[Explanation of symbols]

 Reference numeral 9: rotating table 11: holding member 16: support pin (holding means) 17: lock pin (holding means) 21: semiconductor wafer (work) 91a: second nozzle hole (gas supply means) 101: regulation Member 105: second opening

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3B201 AA02 AA03 AB34 AB42 AB48 BB24 BB26 BB88 BB92 BB93 BB99 CB01 CC01 CC13 CD36 CD43 3L113 AA01 AB08 AC24 AC28 AC45 AC46 AC48 AC54 AC57 AC63 AC67 AC76 BA34 CA06 DA02 DA10 DA24 DA26

Claims (2)

[Claims] 1. A spin processing apparatus for processing a work by rotating the work, comprising: a rotary table driven to rotate; and a circumferentially provided peripheral portion of the rotary table at a predetermined interval in the circumferential direction. A plurality of holding members provided with a holding portion for holding a peripheral portion of the workpiece, and a radial center portion provided at a lower surface side of the work held by the holding member and deviated from a radial center of the lower surface side. And a gas supply means for ejecting a gas for drying a lower surface of the work toward the workpiece. 2. The rotating table is provided with a restricting member for restricting a flow of gas on a lower surface side of the work, and the restricting member has an opening for guiding gas from the gas supply means to a lower surface side of the work. The spin processing device according to claim 1, wherein a portion is formed.