JPH11238672A - Substrate production line and projection of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize carrying and transfer which does not give heating effects at all. SOLUTION: This substrate projection line fetches out a substrate one by one from a substrate inlet/outlet part, while its processing plane is kept upward and carries it into a clean room, in which the processing plane is given specified treatments through a plurality of processing devices, and then it is returned to the substrate inlet/outlet part. The projection line is provided with a self- travelling robot device 5 for fetching a substrate and carrying it, a plurality of multi-state type processing chamber 61, 63, 64, and 65 constituting separately and vertically a multi-state type bake furnace 14 for temperature treatment, drying treatment and base treatment in the processing devices with a travelling route 8 in between a substrate inlet/outlet chamber 62 for taking in/out and positioning a substrate carried by the robot device, and a substrate exchanging robot device 15 provided with an elevating function for taking in/out a substrate from/to the substrate inlet/outlet chamber via an opening/closing type opening part 66 in the processing chamber. Due to such a structure, the robot device is given no effects of heat is given to the robot while the substrate is fetched in/out and elevated or lowered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing line and a substrate manufacturing method, and more particularly to a rectangular flat plate-shaped object to be coated (hereinafter, referred to as a substrate W), a semiconductor wafer, and the like, such as a plasma display and a liquid crystal display. The present invention relates to a technology in which various processing devices for applying various liquid coating solutions such as a resist solution and a slurry in a uniform thin film state after drying, drying, pattern exposure, and developing are provided.

[0002]

2. Description of the Related Art According to a "substrate transfer apparatus" disclosed in Japanese Patent Application Laid-Open No. 4-63643, a wafer after a predetermined processing step is taken out from a predetermined processing apparatus, and a wafer before processing is substantially the same as the processing apparatus. A robot device for carrying and transferring has been proposed. According to this proposal, two pairs of arms (forks) are provided in the vertical direction so as to be independently driven in the horizontal direction,
Further, it is shown that a heat transfer between the arms is prevented by disposing a partition plate larger than the outer shape of the arms between the upper and lower arms. From this suggestion, it can be seen that the weight of the heat countermeasure for preventing harmful heat from being transmitted to the substrate in the wafer processing process is heavy. Specifically, it is important in forming a uniform coating film on a wafer.

On the other hand, the applicant of the present application has disclosed Japanese Patent Application Laid-Open No. 07-3266.
No. 51 proposes a "multi-stage processing apparatus". According to this, a baking furnace for performing drying and cooling after the above-described pre-coating cleaning of the substrate, soft drying and cooling after coating, and drying and cooling after exposure and development is proposed. According to this proposal, the processing chambers are arranged in multiple stages in the vertical direction, openings are provided in each of the processing chambers, and a horizontal moving body for moving the substrate horizontally from the front surface of each opening is provided. By moving the substrate in the vertical direction, the substrate is moved in the vertical direction, and is moved into and out of a desired processing chamber through an opening. In addition, it has been proposed to use a robot device to transfer a substrate between processing apparatuses.

[0004]

On the other hand, in a facility configured to apply a predetermined paint on a substrate including a glass substrate and to perform development after exposure, a robot apparatus for transporting and transferring the substrate is directly used. The glass substrate is transferred to the processing chamber in the bake furnace. For this reason, the arm or fork of the robot directly enters the drying path (including the heater) in the baking furnace apparatus, and there is a problem that the fork is affected by the heat of the heater.

[0005] In the "multi-stage processing apparatus" of the above publication,
In a baking furnace that performs drying / cooling after washing before coating of the substrate, soft drying / cooling after coating, and drying / cooling after exposure and development, each opening of each processing chamber disposed in a multi-stage manner. Provide a horizontal moving body to move the substrate horizontally from the front,
By moving the horizontal moving body in the vertical direction, the substrate is moved in the vertical direction, and is moved in and out of the desired processing chamber through the opening, so that heat is not directly transferred to the fork of the robot apparatus. Thereafter, the transfer and transfer are performed by a robot device for transferring the substrate between the respective processing apparatuses, so that the measures against heat are not sufficient.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-described problems, and is directed to a substrate manufacturing line for performing a predetermined process on a substrate including a glass substrate and a wafer.
It is an object of the present invention to provide a substrate manufacturing line and a substrate manufacturing method capable of realizing substrate transfer and transfer without any thermal influence.

[0007]

Means for Solving the Problems The above-mentioned problems are solved,
According to the present invention, in order to achieve the above object, the substrate is taken out of the substrate entrance / exit portion with the processing surface of the substrate facing upward and transported, and a predetermined process is performed on the processing surface via a plurality of processing devices disposed in a clean room. A self-propelled robot device for taking out and transporting a substrate, and the process disposed across a traveling path of the robot device. In the apparatus, a multi-stage baking furnace for performing a temperature process, a drying process, and a base process on the substrate, a plurality of multi-stage processing chambers configured to be vertically separated, and a substrate conveyed from the robot device. Consisting of a substrate access chamber for loading and unloading and positioning, and a substrate exchange robot device having an elevating function for loading and unloading substrates between the substrate access chamber through an openable opening provided in the processing chamber. I Thermal impact of loading and unloading and lifting the substrate between the substrate loading and unloading chamber and the opening by the substrate replacement robot apparatus is characterized by configuring so as not to transmit to the robot device.

[0008] Further, the above-mentioned predetermined processing includes washing of the substrate, drying by heating, application of an adhesion enhancer, constant temperature, application of a predetermined application fluid including a resist solution, and drying and cooling after application after application of the predetermined application fluid ( Soft drying, soft cooling), exposure, development,
Drying and cooling after development (hard drying, hard cooling)
Is included.

[0009] Further, the substrate is taken out one by one from the substrate entrance with the processing surface of the substrate facing upward, conveyed, and subjected to a predetermined processing through a plurality of processing devices disposed in a clean room. A self-propelled first robotic device for taking out and transporting a substrate from the substrate access port, the first robotic device comprising: A self-propelled second robotic device that is disposed so as to be substantially orthogonal to the traveling path and travels along a common traveling path having an exposure device disposed at an end thereof to take out and transport the substrate; (2) a third robot apparatus located downstream of the third robot apparatus, a fourth robot apparatus located downstream of the third robot apparatus, and cleaning of the processing apparatus disposed across the common travel path. Heat drying and adhesion to the substrate after A first multi-stage baking furnace for applying a strong agent and maintaining a constant temperature is provided with a plurality of multi-stage processing chambers configured to be vertically separated, and taking in and out and positioning of a substrate transferred from the second robot device. Through the opening / closing opening provided in the processing chamber,
A first substrate exchange robot device having an elevating function for taking substrates in and out of the substrate entrance and exiting the substrate between the opening and the substrate entrance and exit chamber by the first substrate exchange robot. In addition, the heat effect when ascending and descending is prevented from being transmitted to the second robot device, and after the application of the predetermined application fluid to the substrate after the application of the predetermined application fluid, the drying is performed among the processing devices disposed across the common traveling path. A plurality of multi-stage processing chambers configured to vertically separate a second multi-stage baking furnace for performing cooling (soft drying, soft cooling), and loading and unloading of a substrate transferred from the third robot device; A second substrate exchange robot device having a lifting / lowering function for moving a substrate into and out of the substrate access chamber through an opening / closing opening provided in the processing chamber; And et arrangement, thermal influence at the time of loading and unloading and lifting the substrate between the substrate loading and unloading chamber and the opening by the second substrate replacement robot apparatus, the third
A third multi-stage baking furnace for performing drying and cooling (hard drying, hard cooling) after development on the substrate exposed and developed by the exposure apparatus so as not to be transmitted to the robot apparatus, A plurality of multi-stage processing chambers configured separately, a substrate access chamber for taking in and out and positioning of a substrate transferred from the fourth robot device, and an opening / closing opening provided in the processing chamber. A third substrate exchange robot device having an elevating function for taking a substrate in and out of the substrate entrance / exit chamber, wherein the third substrate exchange robot device uses the third substrate exchange robot device between the opening and the substrate entrance / exit chamber. The thermal effect when the substrate is taken in and out and raised and lowered is the fourth type.
It is characterized in that it is not transmitted to the robot device.

Further, the substrate is taken out from the substrate entrance with the processing surface of the substrate facing upward, conveyed, and subjected to a predetermined processing on the processing surface through a plurality of processing devices disposed in a clean room. A substrate manufacturing method comprising the steps of: returning a temperature of a substrate to a substrate by a self-propelled robot device in a processing device disposed across a traveling path of the robot device; , A step of taking in and out of the substrate into and out of the substrate entry / exit chamber provided in a multi-stage bake furnace for performing a drying process and a base treatment, and a step of positioning the substrate, and in a vertical direction of the multi-stage bake oven In order to take the substrate after positioning into and out of the processing chamber through an openable / closable opening provided in a plurality of multistage processing chambers which are separately configured, the multistage processing chamber is provided with the multistage baking furnace. Board replacement robot A step of moving the substrate in and out of the substrate entrance / exit chamber by the substrate exchange robot apparatus so that the thermal effect is not transmitted to the robot apparatus. It is characterized by comprising.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, FIG. 1 shows an overall configuration of the substrate manufacturing line 1 and is an external perspective view seen from the upper left side.

In FIG. 1, a substrate manufacturing line 1 is loaded with a cassette loading / unloading device 2 as a substrate loading / unloading section for mounting and removing a cassette accommodating a plurality of substrates, with the processing surface of the substrate facing upward. As shown, four cassette loading / unloading devices 2 are arranged in a vertical line on the left side of the substrate manufacturing line 1. A pattern exposure device 23 is provided on the right side of the substrate manufacturing line 1 so that the substrate is transported by a self-propelled robot, and the processed substrate is returned to the cassette loading / unloading device 2 again. Then, as shown in the figure, the substrate is washed, a coating process of applying various liquid coating solutions such as a resist solution and a slurry in a uniform thin film state, and a drying process, with the common transport rail 8 disposed in the center therebetween. After the exposure of the desired pattern in the pattern exposure device 23, the processing devices for performing development are arranged in a line (inline shape), thereby realizing mainly space saving and facilitation of maintenance.

FIG. 2 is an external perspective view which also serves as an operation explanatory view of FIG. 1. A clean room 40 shown by a two-dot chain line in the figure is dust-proof and air-conditioned so as to have a class 100 or higher cleanness. For this purpose, as described above, each processing apparatus is disposed at a position symmetrical with respect to the common transport rail 8 as shown in the figure, and the pattern exposure apparatus 23 is disposed at a position facing the cassette loading / unloading apparatus 2. Therefore, the space in the clean room 40 is effectively used without waste. In addition, when maintenance personnel and the like access the control panel 16 and the processing chambers of the multi-stage bake furnaces 14, 21, and 28 and the like in the clean room 40,
It is relatively easy to access.

Further, in order to perform heating / drying after cleaning of the substrate after the cleaning and spraying for applying an adhesion enhancer for enhancing the wettability of the substrate before application of the coating fluid, and to maintain a constant temperature over the entire substrate application surface. A first multi-stage bake oven 14 for drying and cooling after application of a predetermined application fluid including a resist solution and performing a process called soft drying and soft cooling; After exposure by the exposure device 23 and the peripheral exposure device 25, development by the developing device 27 to form an exposure pattern on the substrate is post-development drying / cooling, which is a process called hard drying or hard cooling. The third multi-stage baking furnace 28 for performing the operation is located on one side of the common traveling rail 8 as shown in the figure, and the heater power supply, air-conditioning-related piping, and signal lines are connected thereto. While so as not complicated, power from the utility device 35 which is disposed next to the right of the third multistage baking oven 28, air pressure is thoughtful to be able to receive a supply of cooling water or the like.

Referring again to FIG. 1, a self-propelled first robot unit 3 for taking out each substrate and returning the processed substrate is provided adjacent to the cassette loading / unloading device 2 described above. ,
It is provided so as to be reciprocally driven in the direction of arrow Y on the traveling rail 4 and can be stopped at a predetermined position. After moving to a position facing one of the cassette loading / unloading devices 2, the substrate is transferred from the cassette. It is configured. For this purpose, the first robot device 3 arranges forks described below up and down, and each fork enters and retracts at a high speed in the cassette of the cassette loading / unloading device 2 and is driven up and down in the arrow Z direction. And also has a function of driving to turn in the direction of arrow R. A second robot device 5 described below,
The third robot device 6, the fourth robot device 7, and the fifth robot device 9 also have the same function as the first robot device 3. Therefore, the common use of the robot devices can be achieved, and the maintenance property during operation is enhanced.

A traveling rail 8, which is a common traveling path, is provided so as to extend across the entire length of the substrate manufacturing line 1 as shown in the drawing, so as to be substantially perpendicular to the traveling rail 4, which is the traveling path of the first robot apparatus. ing. The second on the running rail 8
The robot device 5, the third robot device 6 on the downstream side of the second robot device 5, and the fourth robot device 7 on the further downstream side independently run on the traveling rail 8 in the direction of the arrow X by a predetermined program. Is configured. Also, a fork provided in each robot device enters and retracts at a high speed into and out of the substrate positioning section or the substrate positioning table of each processing device, so that the fork is driven up and down in the direction of arrow Z, and pivotally driven in the direction of arrow R. In this way, each robot apparatus traveling on the traveling rail 8 can freely transfer a substrate between the processing apparatuses. In other words, a robot device traveling on the traveling rail 8 can realize the transfer operation of the substrate to various processing devices disposed at symmetrical positions along the longitudinal direction of the traveling rail 8 which is a common traveling path. ing.

At the right end of the running rail 8, a pair of buffer units 20 indicated by hatching in the figure is disposed. A traveling rail 10 is arranged as shown in the drawing so as to be adjacent to the buffer section 20 and substantially perpendicular to the traveling rail 8, and the fifth robot device 9 travels on the traveling rail 10. The buffer unit 20 is not normally used, but is used as a temporary shelter for the substrate when a trouble occurs in the apparatus. The above is the configuration for transferring the substrate.

Next, the arrangement of each processing apparatus is shown in FIG.
The details and functions of each processing device will be described later with reference to the views (a) to (g) of FIG.

First, a positioning table 19, a buffer section 20 indicated by hatching in the figure, and a low-pressure ultraviolet ray cleaning device 11 are vertically arranged adjacent to and opposed to the left running rail 4. Further, two spin scrubbers 12 are disposed opposite the low-pressure mercury-ultraviolet cleaning device 11 with the common traveling rail 8 interposed therebetween. Further, after the substrate is washed with one of the two spin scrubber devices 12 and opposed to one of the spin scrubber devices 12 disposed on the downstream side with the common travel rail 8 interposed therebetween, heating and drying after washing the substrate are performed. A first multi-stage baking furnace 14 is provided for performing spraying for applying an adhesion enhancer for increasing substrate wettability before application of the application fluid, and maintaining a constant temperature over the entire substrate application surface. The multi-stage baking furnace 14 has the first
A substrate exchange robot device 15 is also provided. This first
A control panel 16 accessible from a maintenance space 17 is provided on the right side of the substrate exchange robot device 15.

A coating device 13 for uniformly applying a coating fluid while moving the coating head relative to the substrate is provided opposite the first substrate exchange robot device 15 with the common traveling rail 8 interposed therebetween. ing. Further, a vacuum drying device 18 having a substrate positioning table 19 is provided on the right side of the coating device 13. On the right side of the reduced-pressure drying device 18, an inspection device 30 for inspecting a substrate pattern formed after development, which will be described later, by non-contact by photoelectric conversion and automatically inspecting an abnormal portion by image processing is provided.

The drying and cooling after the application after the application fluid including the resist solution is applied by the application device 13 is opposed to the reduced-pressure drying device 18 and the inspection device 30 with the common traveling rail 8 interposed therebetween. A second multi-stage baking furnace 21 for soft drying and soft cooling is provided. Further, a second substrate exchange robot device 22 is provided in the second multi-stage baking furnace 21. On the right side of the second substrate exchange robot device 22, a third multi-stage baking furnace 28 for performing processing called hard drying and hard cooling as described above is provided. Is the third
A substrate exchange robot device 29 is also provided.

The above-mentioned utility device 35 is disposed adjacent to the third substrate exchange robot device 29, and the positioning table 19 and the buffer unit 20 are further disposed as shown in FIG. An enabled control panel 16 is arranged opposite as shown. In addition, near the right end of the common travel rail 8, the two positioning tables 1 are surrounded by the control panel 16.
9 is disposed along the longitudinal direction of the common travel rail 8, and by positioning the board between the two buffer sections 20 disposed at the right end of the common travel rail 8, the fourth
While the substrate is taken in and out by the robot device 7,
The substrate is made to stand by in the buffer unit 20 and the traveling rail 1
Exposure device 23 by the fifth robot device 9 traveling on
It is configured to be able to exchange a substrate with an entrance / exit portion 24 provided at the base. Here, the horizontal positioning table 19 of the fourth robot device 7 has a positioning function, but further has a transfer function of moving the substrate between the position A and the position B in FIG.

Further, with the common traveling rail 8 interposed therebetween, the third
Three spin developing devices 27 are provided facing the multi-stage baking furnace 28 and the third substrate exchange robot device 29. Further, an i-line exposure device 26 is disposed opposite to the utility device 35 with the common travel rail 8 interposed therebetween. On the right side of the i-line exposure device 26, a peripheral exposure device 25 for exposing the peripheral portion of the substrate is provided.

In the arrangement described above, as shown in FIG. 2, the first robot unit 3 which runs on the traveling rail 4 and the downstream side of the second robot unit 5 which runs on the common traveling rail 8 And the third robot device 6 located at
Fourth robot device 7 located downstream of robot device 6
Then, the fifth robot device 9 which runs on the traveling rail 10 moves and turns in the directions of arrows X, Y, Z, and R, and the substrate access chamber 62 provided in each of the multi-stage baking furnaces 14, 21, and 28.
(See FIG. 6) through an opening (shown by a broken line) 33. Further, the first substrate exchange robot apparatus 15 and the second
Forks provided in the substrate exchange robot device 22 and the third substrate exchange robot device 29 move in the directions of arrows X and Z, and transfer the substrate transferred to the substrate access chamber 62 to the upper and lower processing chambers 6.
1, 62, 63, 64, 65, 82, 85 (see FIG. 7)
After the transfer, the substrate is returned to the substrate entrance chamber 62 again, and thereafter, the transfer is performed by the second robot device 5 and the third robot device 6, so that there is no thermal effect at the time of transfer and each multi-stage bake is performed. The continuous operation is not affected by the waiting time due to the substrate processing in the furnaces 14, 21, and 28.

Next, each processing unit will be described with reference to the arrows (a) through (g) in FIG. FIG. 3 is a perspective view of the cassette loading / unloading device 2 as viewed in the direction of the arrow (a) in FIG. In this figure, as described above, 4
The cassette loading / unloading device 2 in which the components are arranged along the transport rail 4 is provided on a frame 100 serving as a base of the line, and is shown by a two-dot chain line in which a plurality of substrates W are stored in a multi-stage manner. The cassette 31 to be replaced is used as a replacement unit and transported from an upstream process by a robot device (not shown). The transported cassette 31 is set at a predetermined position by the positioning device 102, positions the substrate W incorporated in the cassette 31, reads the type recognition code of the substrate provided in the cassette, and relays the optical communication unit. Then, the substrate W is transported into the clean room by opening the shutter 101. When the transfer is completed, the shutter 101 is closed, and when the processed substrate is transferred, the shutter 101 is opened and the fork provided in the first robot device 3 enters the cassette 31 to transfer to the cassette. When the cassette 31 is full of processed substrates, it is transported to the next process by a robot device (not shown).

FIG. 4 is a perspective view taken along the arrow (b) of FIG. 1 and is a perspective view showing the appearance of the low-pressure ultraviolet ray cleaning device 11 with the buffer section 20 and the positioning table 19 omitted. In this figure, the apparatus 11 is a container 1 that moves in a direction indicated by an arrow on a guide rail 103 provided on a frame 100.
05, the substrate W is inserted from the opening 105a of the container 105, whereby the substrate W is transferred by the elevating operation of the robot device itself, and the substrate W set in the container 105 is irradiated with ultraviolet rays. Thus, the organic substance is converted into an organic compound, and the metal film formed on the substrate is uniformly appeared by plasma CVD or a sputtering apparatus in the previous process, and the organic compound is converted into an organic compound, whereby the cleaning action in the next spin scrubber apparatus 12 is performed. To make it easier. The container 105 can be moved to the positions shown by broken lines and solid lines in consideration of maintenance, and is provided with an open / close lid so that the inside can be accessed at any time.

When ultraviolet light is irradiated by the low-pressure ultraviolet light cleaning device 11, the ultraviolet light is conveyed to a spin scrubber device 12, which is a view taken in the direction of arrow C in FIG. This apparatus 12 converts the substrate W loaded in the transfer unit that moves up and down as shown in FIG.
5B, the rinsing liquid flows out of the three circuits onto the surface of the substrate while being sucked and held on the rotary table 110 shown in FIG. . Following this, the arm 107 provided with a rotating brush at the tip protrudes and brushes while rotating the surface of the substrate from the center to the outside while flowing out the rinsing liquid, so that dust having a size of 10 μm or more is obtained. Get rid of. The moving speed of the arm 107 is computer-controlled so that the relative moving speed is constant between the central portion and the outer peripheral portion, and the brushing time can be set arbitrarily. Following this, the arm provided with an ultrasonic oscillator at the tip protrudes, and submerged particles are applied by applying pure water to which ultrasonic vibration of 1 MHz or more is applied from the center to the outer periphery on the substrate surface. Is washed. At this time, the rinsing liquid is also sprayed on the back side of the substrate. Following this, the cup is lowered and rotated at about 2,000 RPM, thereby spraying nitrogen gas onto the back surface while shaking off the cleaning liquid on the surface of the substrate, and drying the substrate while preventing the mist from scattering by the suppression plate. In addition to the spin scrubber device 12 configured as described above, a cleaning device that cleans by mixing air in high-pressure water and spraying the same onto the substrate, and an air knife that sprays high-pressure air from the slit-shaped opening to the substrate surface A cleaning device of the type can be used as appropriate.

FIG. 6 is a view taken in the direction of the arrow (d) of FIG. 1, and FIG. 7 is a view taken in the direction of the arrow (e) of FIG. However, since the second and third multi-stage bake furnaces 22 and 28, which will be described later, have substantially the same configuration except for each processing chamber, the first multi-stage bake oven 14 is a representative example. State. First, in FIG. 6, while the common traveling rail 8 described above is provided on a frame 100 serving as a base of the production line, the filter device 44 is disposed so as to be substantially continuous between the rails. Is kept clean by exhausting the downflow air to the floor below this floor. Further, the first multi-stage baking furnace 14 is fixed on the frame 100,
A substrate access chamber 62 having an opening 33 (shown by a broken line) for transferring a substrate by a robot device is provided at a position shown in the figure. On the right side of the first multi-stage baking furnace 14, an opening 66 having an opening / closing lid which is opened / closed by an air cylinder device is provided in each chamber. It is configured to take out and in through the opening 66. Further, on the side opposite to the common traveling rail 8, the first multi-stage baking furnace 14 is provided with lids 111 which are opened and closed mainly when performing maintenance, individually in the respective chambers. The apparatus in the processing chamber can be pulled out from the open state as shown in FIG.

Next, in FIG. 7, the functions of the first multi-stage baking furnace 14 are to perform a temperature treatment, a drying treatment, and a base treatment on the washed substrate. For this purpose, two hot plate chambers 65 for performing proximity heating for heating the substrate by providing a gap with ruby balls provided on the hot plate from the upper stage, and hexamethyl which is an adhesion enhancer A base treatment chamber 6 for performing a treatment for improving the wettability of the substrate before application by spraying dithirazane;
4 and an air cooling plate chamber 63 for cooling the substrate by air cooling
, The second robot device 5 and the first substrate exchange robot device 1
5, a substrate entrance / exit chamber 62 for exclusive use of taking in / out and positioning of the substrate, and uniform cooling of the entire substrate by liquid cooling to eliminate a temperature distribution so that the application state in the application apparatus does not change. The liquid cooling plate chamber 61 and the liquid cooling plate chamber 61 are provided so as to be of a multistage type as shown in the figure. By providing each room in this way, the private space can be reduced.

On the other hand, a substrate access chamber 63 is opened and closed through an opening 66 provided in the processing chambers 65, 64, 62 and 61.
The first substrate exchange robot device 15 for taking in and out the substrate W between the second substrate exchange robot device 22 and the third substrate exchange robot device 29 for performing soft drying / cooling and hard drying / cooling described later. Therefore, when the first substrate exchange robot device 15 is described as a representative,
A base plate 60 is fixed on the frame 100,
An upright column 70 is provided on the base plate 60 so as to be adjacent to the common travel rail 8 from the right corner. The upright support column 70 has substantially the same height as the baking furnace 14, and drives the lifting base 69 in the direction of the arrow Z so that the upper and lower forks 71, 72 provided on the lifting base 69 can be moved in the vertical direction. The upper and lower forks 71 and 72 are configured to be able to exchange substrates by sneaking into each processing chamber via the opening 66. A pair of horizontal correcting devices 79 for positioning the left and right edges of the substrate W are mounted on the lifting base 69.

A second self-propelled rail on the common travel rail 8
Since the fourth to fifth robot devices 5, 6, and 7 have substantially the same configuration, the robot device 5 will be described as a representative of the second robot device 5 shown in FIG.
4 and a spin scrubber device 1 which is mounted on the base 54 and raises and lowers the vertically rotating swivel base 50 in the vertical direction.
Lifting base 53 having a function of rotating the substrate between the base 2
And a drive unit that is mounted on the elevating and lowering base 50 and transfers the substrates mounted on the upper and lower forks 51 and 52 by making the upper and lower forks 51 and 52 sneak into the processing chamber.

FIG. 8 is a view taken in the direction of the arrow (i) of FIG.
FIG. 2 is an external perspective view showing a main part of the substrate exchange robot device 15 cut away. In this drawing, the components already described with reference to FIGS. 6 and 7 are denoted by the same reference numerals, and the description thereof will be omitted. Above the upright support 70, the upper end portion of the ball screw 74 is rotatably supported to prevent dropping. Electromagnetic brake 7
3 is fixed, and the lower end of the ball screw 74 is supported by a bearing to fix a toothed pulley 75. Further, the motor 77 is fixed to the upright support column 70, and is configured to transmit the rotational driving force to the toothed pulley 75 via the toothed belt 76 to drive the ball screw 74 forward and reverse. A ball nut (not shown) meshes with the ball screw 74, and the ball nut is fixed to the elevating base 69 so as to be driven up and down. Also, in the event of an accident, the emergency operation of the electromagnetic brake 73 stops the rotation of the ball screw 74, thereby preventing the lifting base 69 from falling under its own weight. A cover 80 is provided on the ball screw 74 so as to extend along the longitudinal direction. The cover 80 shields dust generated during driving with the cover 80, and the lower filter device 78 takes care that dust does not go outside. ing.

On the other hand, a pair of claw bodies 71a, 72a made of special resin are fixed to the upper and lower forks 71, 72 at positions where clearances are provided in the width of the board. The transfer is carried out by holding between the bodies.

FIG. 9 shows running rails 4, 8, 10
FIG. 9 is an external perspective view of the first to fifth robot devices that are self-propelled on the top, and components already described are given the same reference numerals and description thereof is omitted, and as can be seen from a comparison with FIG. The base 69 and the vertically rotating base 50 are formed substantially the same. The lifting / lowering turning base 50 turns in the direction of arrow R about the rotation shaft 55 as a turning center, and is driven in the vertical direction. As shown in the figure, claw bodies 51a and 52a substantially the same as those provided in the substrate exchange robot apparatus are also fixed to upper and lower forks 51 and 52 of the robot apparatus, and motors 57 and 58 mounted on the moving body 56 are provided. Thus, when driven independently in the direction of arrow Y, the substrate is held between the claw bodies 51a and 52a.

FIG. 10 is a sectional view taken along the line XX of FIG. 1 showing the substrate transfer operation performed by the robot device 5 and the substrate exchange robot device configured as described above.
12 is a cross-sectional view taken along the line YY of FIG. 1 and is a cross-sectional view of a main part of FIG.

First, in FIG. 10A, the substrate W shown by the broken line after the cleaning by the spin scrubber device 12 is completed.
After being mounted between the claw bodies 51a of the upper fork 51, the upper fork 51 turns and moves (self-propelled) to a position facing the opening 33 as shown in the drawing, and stops. Before or after this, the horizontal correction of the substrate is performed by the horizontal correction device 79.

Thereafter, the upper fork 51 sneaks into the substrate access chamber 62 through the opening 33 of the baking furnace, and
As shown in (b), it stops on the upper and lower pins 90. Similarly, the lower fork 52 includes a drive unit that reciprocates as described with reference to FIGS. Common base 103
Is mounted on the elevating and lowering base 50, and the common base 103 is also provided with a driving unit, so that the common base 103 is simultaneously driven in the same direction as the first and second moving bodies, thereby obtaining a sum speed. . For this purpose, a first driving unit for reciprocatingly driving the upper fork 51 for mounting and holding the substrate W as described above at the maximum stroke Y1 is a ball screw which obtains a driving force from a motor fixed to the common base 103. The first moving body 111 that is horizontally moved by a linear guide is mounted while a ball nut meshing with is fixed to the bottom surface. The second driving unit for reciprocating the lower fork 52 at the maximum stroke Y2 is a common base 1
And a second moving member 107 horizontally fixed by a linear guide and fixed to a bottom surface of a ball nut meshing with a ball screw that obtains driving force from a motor fixed to the lower fork 52. Move left and right as shown in the figure.

On the other hand, the common base 103 is provided with
A ball nut meshing with a ball screw that obtains power from a motor fixed on the top is fixed via a bracket, and is moved left and right with a maximum stroke Y3 as shown by a linear guide provided between the base and the base 50. It is configured as follows.

In the above configuration, as shown in FIG. 10A, the robot apparatus 5 moves to the position of the opening 33 of the substrate access chamber 62 of the first baking furnace 14, and removes the processed substrate W. A case in which the substrate is taken out of the bake furnace 14 and, at the same time, the substrate before processing is placed on the upper and lower pins 90 will be described. The substrate W is placed between the claw portions 51a of the upper fork 51 of the robot device 5, and the upper and lower forks 51 and 52 are located at the standby position as illustrated.

In this state, as shown in FIG. 10B, the common base 103 and the second moving body 107 are driven at the same time, so that a maximum speed of both the moving speeds of the two is 2.25 m / sec. The lower fork 52 is moved, moves below the substrate W placed on the upper and lower pins 90 in the baking furnace, and stops. At this time, the upper fork 51 is not driven, and is moved toward the opening 33 only by the movement of the common base 103 as shown in the figure.

Subsequently, as shown in FIG. 10 (c), the robot device 5 is moved up in the direction of arrow Z, so that the substrate W placed on the upper and lower pins 90 is transferred onto the lower fork. Put on. At this time, the movable range of the fork 52 can be set to be larger than the size of the robot device due to the movement of the common base 103.

Subsequently, as shown in FIG. 11 (a), the second mobile unit 10
7 is moved in the direction of the arrow. Before or after this, the first moving body 111 is driven in the direction of the arrow to prepare to transfer the substrate W placed on the upper fork 51 onto the upper and lower pins 90. Subsequently, as shown in FIG. 11 (b), the lifting / lowering swivel base 50 is lowered in the arrow Z direction, and the substrate W is transferred onto the upper and lower pins 90. Thereafter, the common base 103 and the first moving body 111 are simultaneously driven, so that the upper fork 51 is moved at a maximum speed of 2.25 m / sec, which is the sum of the moving speeds thereof.
Moves to end the transfer into the baking furnace.

Next, FIG. 12 shows that the upper and lower pins 90 are driven upward by an air cylinder (not shown) so that
FIG. 5 is an operation explanatory view showing a state where a substrate is placed on a reference numeral 0;

In FIG. 12, first, in FIG. 12 (a), when the substrate is transferred to the substrate access chamber 62 of the baking furnaces 14, 21, 28, the substrate exchange robot units 15, 22, 29 move up and down the base 69. Moves up and down to the position of the substrate access chamber 62, and the lower fork 72 sneaks through the opening 66 and sneaks under the upper and lower pins 90 to obtain the state shown in FIG.

Subsequently, as shown in FIG. 12B, the upper and lower pins 90 are moved downward to transfer the substrate to the lower fork. At about the same time, the processed substrate is placed in the substrate entrance 62 by the upper fork 71 sneaking in. Thereafter, as shown in FIG. 12C, the substrate exchange robot apparatus is moved up and down to a desired processing chamber, and the substrate is exchanged when the lid 67 of the opening / closing opening 66 is opened by an air cylinder.

As described above, in the substrate entry / exit chamber 62, the substrate transfer by the self-propelled robot device and the dedicated substrate exchange robot device that performs only elevating and lowering are performed individually.
Since the waiting time for waiting for the end of the processing in the processing chamber can be eliminated or minimized, the processing time can be shortened (speeded up). Further, by using a multi-stage baking furnace, a large number of processing chambers requiring processing time can be provided in the vertical direction, so that the occupied area can be minimized. Also, the substrate access chamber 62
Is provided, it is not necessary for each robot device to operate after waiting for the operation of the other robot device to end.

Further, when soft drying and hard drying are performed in the processing chamber of the baking furnace, the thermal influence on the upper and lower forks 71 and 72 of the substrate exchange robot apparatus cannot be normally avoided. By performing substrate transfer individually by the self-propelled robot device and a dedicated substrate exchanging robot device that only moves up and down, at least the other first to fourth self-propelled robots that exchange substrates between other processing devices
Heat transfer to the robotic device can be completely shut off.

Next, FIG. 13 is a view for explaining the operation of transferring the substrate as described above, and FIG. 14 is a sectional view taken along the line AA of FIG. FIG. As described above, the upright support 70 is disposed on the base 60 near the common travel rail 8. The center position CL1 of the substrate sneaked and transferred from the opening 33 to the substrate entrance chamber 62 and the center position CL of the substrate sneaked and transferred from the opening 66 to the substrate entrance chamber 62.
2, a deviation D occurs. Therefore, the substrate access room 6
A centering device 44 driven by an air cylinder (not shown) is provided on the diagonal line of the substrate in the diagonal line to perform the centering, so that the substrate can be exchanged at a common position.

FIG. 15 is an external perspective view of an air-cooling plate chamber 63 incorporated in a baking furnace. A typical configuration common to other processing chambers will be described. Opening / closing lids 67 that are opened and closed with the operation are provided, respectively, so that the room can be maintained at a processing temperature or a predetermined atmosphere. The substrate W is basically processed in a state of surrounding four sides, so that a blower 98 communicating with a cable guide 99 and a heater (not shown) perform drying or spraying of a base treatment agent. .

FIG. 16 shows a drive mechanism of the upper and lower pins 90 in the case of the pin elevating type driven vertically in order to transfer a substrate as described above. This drive mechanism is fixed so as to be located below the substrate W in FIG. 15, and is configured such that the upper and lower pins 90 move up and down from the through holes. For this purpose, a large number of upper and lower pins 90 are implanted on a common plate 91 as shown in FIG.
The motor driving force is converted into the vertical movement of the plate 91 via the link 92 in accordance with the rotation drive of the motor 3. That is, as shown in the external perspective view of FIG. 17, the substrate is placed so that the upper and lower pins 90 come out from below the substrate W.

Referring again to FIG. 1, a substrate coated with a predetermined coating fluid such as a resist solution by a coating device 13 is a second multi-stage type for performing a soft temperature process and a soft cooling process with a low temperature on the coated substrate. It is transferred to the bake oven 21,
For this purpose, the second multistage baking furnace 21 is provided with a soft hot plate chamber 82 provided with a soft hot plate in the upper four stages, and a soft cool plate chamber 83 provided with a soft cool plate below the substrate access chamber 62. Have been.

On the other hand, a third multi-stage baking furnace 28 for performing high-temperature hard temperature processing and hard cooling of the substrate after being exposed by the downstream exposure apparatus 23 is transported from the fourth robot apparatus 7. The third substrate exchange robot device 29 is configured to perform loading / unloading and positioning of substrates in the substrate loading / unloading chamber 62, and to perform transfer by the third substrate exchange robot device 29 through an opening / closing opening 66 provided in the processing chamber. A hard hot plate chamber 85 provided with a hard hot plate is provided in the upper four stages, and a hard cool plate chamber 86 provided with a hard cool plate is provided below the substrate access chamber 62.

FIG. 18 is a view taken in the direction of the arrow (f) in FIG. This coating device 1
No. 3 is for applying various coating fluids such as a photoresist solution, an insulating material, and a solder resist. Conventionally, a coating solution is dripped from a nozzle to a central portion of a substrate, or a nozzle is moved from a center to an outer peripheral direction. After drawing a spiral trajectory while moving to the surface, the substrate is rotated at high speed, and the applied coating solution dropped by the action of centrifugal force due to the rotation is diffused around to form a uniform thin film by spin coating method. However, according to this method, three times or more of the actually required amount is wasted. Therefore, when the application target is a rectangular substrate, a slit having a total length of a width corresponding to the short side of the substrate is used. Using a coating head 120 having an opening of
The coating head 12 discharges a predetermined amount of coating liquid from the opening.
0 is driven in the vertical direction, the substrate side is suction-held on the suction plate 121, and is relatively moved with respect to the coating head 120 by driving of the motor 123 so as to form a uniform thin film. Incidentally, the coating head moving type is becoming the mainstream rather than the substrate moving type.

FIG. 19 is a view taken in the direction of the arrow (g) in FIG. 1 and shows a part of the i-line exposure device 26 in a cutaway manner. The apparatus 26 is for irradiating the entire surface of the resist pattern remaining after development with ultraviolet rays again to print the pattern. The substrate W is configured to be transferred by the vertical movement of the upper and lower pins 90.

FIG. 20 is a view taken in the direction of the arrow (h) in FIG. 1 and shows a part of the developing device 27 in which three units are disposed, in a cutaway manner. This device 27 is for dissolving the unexposed part of the resist by the exposure device 23 with a developing solution to form a pattern by the resist. The fourth robot device 7 having the above-mentioned upper and lower forks
Moving mechanism 1 provided with a flat nozzle 125 for receiving and holding a substrate from a suction tank 129 in a tank.
By moving 26 on rail 130, a developing solution is applied to the entire surface of the substrate, and the surface is made wet. Subsequently, development is performed while moving the flat nozzle 125 to the center, switching the discharge flow rate, and rotating the substrate. At the same time, the washing nozzle unit 1
27 is performed. Next, the flat nozzle 125
To the standby position, move the washing nozzle to the center,
In order to clean the surface of the substrate, the number of rotations is increased, the cup is cleaned, then the cover 128 is lowered, and then spin drying is performed by high-speed rotation. Thereafter, the rotation is stopped, drying air is sent from the drying nozzle to dry, and development is performed.

FIG. 21 is a plan view of the inspection apparatus 30, and FIG. 22 is a view taken along line XX of FIG. In both figures,
The inspection device 30 includes a base 1 fixed on a frame 100.
A moving stage 143 provided on the base 40 and configured to obtain a driving force from a motor (not shown) for moving the substrate in the direction of the arrow shown in the drawing, and a member 141 provided so as to straddle the base 140. An illumination device 142 for performing overall illumination of the substrate below the member 141, a micropattern inspection head 145 fixed to a substantially central portion of the member 141, and light from the illumination device 142 which is reflected on the substrate. It is composed of a reflecting mirror 147 that reflects a formed image to enter a line image sensor camera 146 having a high SN ratio, and a probe 144.

In the above configuration, the substrate transferred by the robot apparatus is read by the line image sensor camera 146 while being moved with the movement of the moving stage 143, and is sent as an image signal to an image processing unit (not shown). ,
Matching with a desired pattern is performed. When it is determined that there is no abnormality in the inspection result, the result is transferred to the positioning table 19 on the reduced-pressure drying device 18, and then the positioning table 19 on the low-pressure ultraviolet cleaning device 11 is
To the cassette 31 of the cassette loading / unloading device 2 by the first robot device 3. on the other hand,
When a defective product is detected by the inspection device 30, the substrate is transferred to a rework stocker (not shown).

FIGS. 23, 24, 25 and 26 are flow charts for explaining the operation of the substrate manufacturing line constructed as described above.
FIG. 3 is a diagram together with a substrate exchange robot device.

First, in FIG. 1 and FIG. 23, the production line 1 is activated and ready, and the first step is to execute the first robot apparatus 3 when the cassette 31 is supplied to the cassette loading / unloading apparatus 2. The wafer W is moved on the rail 4 by itself, and one substrate W is taken out and transferred to the cleaning device 11 in step S2. Thereafter, after cleaning by the cleaning device 11, the wafer is transferred onto the positioning table 19 in step S3 and waits.

Next, proceeding to step S4, the second robot device 5 traveling on the common traveling rail 8 takes out the substrate in the standby state, and lifts and lowers the turning base 50 of the second robot device 5.
After turning, the substrate is made to face the spin scrubber devices 12 provided for the two machines, and then transported and transferred to any one of the spin scrubber devices 12 to wait for the completion of the cleaning. Immediately after the startup, both are in the standby state. For example, during the continuous operation for 24 hours, the substrate is transferred to the apparatus in the standby state after the cleaning. The same applies to a device in which a plurality of devices are provided as described above. The reason why a plurality of the same devices are provided in this manner is that the processing time is longer than other processing devices. When the cleaning is completed, the second robot device 5 takes out the substrate, and moves the elevating and lowering swivel base 50 to a position facing the opening 33 provided in the substrate access chamber 62 of the first multi-stage bake furnace 14 after the swivel base 50 is swiveled. The transfer operation is performed as described with reference to FIG.

Next, in step S6, as shown in FIG. 13, the substrate is transferred from the substrate entrance / exit chamber 62 of the first multi-stage bake oven 14 by the first substrate exchanging robot device 15 attached to the first multi-stage bake oven 14. The substrate is taken out, transferred to one of the hot plate chambers 65, dried, and then transferred to the lower air-cooled plate chamber 63 by the first substrate exchange robot device 15 in step S7, and waits for cooling. It is transferred to the chamber 64 and sprayed with the adhesion enhancer. In the following step S9, in order to equalize the temperature of the application surface of the substrate on which the adhesion enhancer has been sprayed, the substrate is transferred to the lowermost liquid cooling plate chamber 61 and is prepared before application.

Here, if the temperature is not sufficiently uniformized, for example, the viscosity of the coating material for forming a resist film becomes low at a high temperature portion, so that the coating film becomes thin, and at a low temperature portion, the viscosity becomes high. As a result, a thick coating film is formed, and thus it is necessary to sufficiently uniform the temperature. For this purpose, temperature sensors are provided at a plurality of predetermined portions of the liquid cooling plate, and the cooling water channel is feedback-controlled by temperature detection. When the temperature equalization is completed in the liquid cooling plate chamber 61 configured as described above,
In step S10, the first substrate exchange robot device 15 transfers the substrate again to the substrate access chamber 62 of the first multi-stage baking furnace 14.

Next, proceeding to step S11, the second robot device 5 transfers the substrate transferred to the substrate access chamber 62 to the coating device 13, and makes the resist liquid uniform on the substrate with the relative movement of the coating head. Wait for the application to finish. At the time of this transfer, the substrate is completely separated thermally in the substrate access chamber 62, so that heat conduction between the upper and lower forks provided in each robot device is completely prevented.

Subsequently, in step S12 in the flowchart of FIG. 24, after the uniform coating by the coating device 13 is completed, the second robot device 5 transfers the substrate to the reduced-pressure drying device 18 and waits for the completion of the reduced-pressure drying. When the drying under reduced pressure is completed, the second robot device 5 transfers the substrate to the positioning table 19, and in step S14, the second robot device 5 takes out the substrate, and after the lifting / lowering rotating base 50 has been rotated, the second robot device 5 The multi-stage baking furnace 21 is moved to a position facing the opening 33 provided in the substrate access chamber 62, and the transfer operation is performed as described with reference to FIGS.

Next, in step S15, as shown in FIG. 13, the second multi-stage bake oven 21 is provided by the second substrate exchange robot unit 22 provided in parallel with the second multi-stage bake oven 21.
The substrate is taken out from the substrate entry / exit chamber 62, and transferred to one of the soft hot plate chambers 82 provided in the upper four stages,
After the soft drying, in step S16, the substrate is transferred to the lower soft cool plate chamber 83 by the second substrate exchange robot device 22 and waits for cooling. In step S17, the substrate is returned to the substrate access chamber 62 of the second multi-stage bake furnace 21. Transfer to

Next, in step S18, the third robot device 6 which travels by itself on the common travel rail 8
Then, the substrate is transferred and transferred to the positioning table 19 on the right side of the utility device 35. Next, step S
At 19, the substrate is transferred to the buffer unit 20, and the process waits for the subsequent processing.

In the following step S20, the fourth robot device 7, which travels by itself on the common travel rail 8, transfers the substrate to the two transfer devices 19 arranged at the most downstream of the common travel rail 8 in FIG. Convey and transfer. Next, step S2
In step 1, the fifth robot device 9 which moves perpendicularly to the common travel rail 8 transfers the substrate to the entrance 24 of the exposure device 23 and waits for exposure of the predetermined pattern by the exposure device 23.

Subsequently, in step S22 of the flowchart of FIG. 25, when the exposure is completed, the fifth robot device 5 transfers the substrate to the transfer device 19. Next, in order to transfer the substrate to the peripheral exposure device 25, the fourth robot device 7 takes out the exposed substrate from the transfer device 19, and transfers the substrate to the peripheral exposure device 25 after the elevating and rotating base 50 has been turned. And wait for peripheral exposure. In step S <b> 24, the fourth robot device 7 transfers the substrate after the peripheral exposure to the positioning table 19 on the right side of the utility device 35 and waits in the adjacent buffer unit 20.

Subsequently, proceeding to step S25, the third robot device 6 is transferred to any one of the spin developing devices 27 provided for the three machines, waits for development, and after development, proceeds to step S2.
In step 6, the wafer is transferred to the i-line exposure device 26 and irradiated with ultraviolet rays. Thereafter, the process proceeds to step S27, in which the third robot device 6 transfers the substrate from the opening 33 of the third multi-stage bake furnace 28 for performing hard drying and cooling to the substrate access chamber 62.

Next, the substrate is taken out of the substrate loading / unloading chamber 62 of the third multi-stage bake oven 28 by the third substrate exchange robot unit 29 provided in the third multi-stage bake oven 28, and the hardware provided in the upper four stages is provided. After being transferred to one of the hot plate chambers 85 and hard-dried, in step S29, it is transferred to the lower hard cool plate chamber 86 by the third substrate exchange robot device 29, and waits for cooling.
The substrate is transferred again to the substrate entrance / exit chamber 62 of the third multi-stage baking furnace 28 at.

Next, in step S 31 of the flowchart in FIG. 26, the third robot device 6 that travels by itself on the common travel rail 8 conveys and transfers the substrate to the inspection device 30. If it is determined that the substrate is non-defective after the inspection, the third robot device 6 removes the substrate from the vacuum drying device 18 in step S32.
Is transferred to the positioning table 19 located at.

Next, in step S33, the second robot device 5 is transferred to the positioning table 19 adjacent to the first robot device 3. Thereafter, the first robot device 3 transfers the substrate to the cassette loading / unloading device 2 and ends the processing.

A predetermined pattern is formed on the substrate by the above series of processes. Here, each robot device and each processing device eliminates the standby time (idle time),
Parallel dispersion processing is performed to minimize it.

FIG. 27 is a timing chart showing the state of such parallel distribution processing, in which the vertical axis shows the above robot apparatus and the horizontal axis shows the elapsed time.

In this figure, each robot device performs the processing for each substrate by performing the above steps S1 to S34. These steps S1 to S34 are performed in parallel as shown, so that the standby time (idle time)
Centralized control to eliminate

FIG. 28 is a flowchart showing step S31 in FIG.
Is a flowchart after it is determined that the product is defective. If it is determined that the product is non-defective in step S40, the process proceeds to step S32 as described above and returns. If a defect is detected in step S40 and it is determined that the product is defective, the process proceeds to step S41, and is transferred to a rework stocker (not shown). Then, step S
At 42, the resist film is peeled off, and the process again proceeds to step S4 in FIG. If a defective product occurs, the line is stopped and maintenance personnel take equipment inspection and recovery measures. Stripping of the resist is performed on a line different from the production line.

As described above, by arranging the substrate manufacturing line to minimize the occupied area in the clean room, the cost for installing and maintaining the clean room can be greatly reduced, and the substrate can be moved. By installing a dedicated substrate exchange robot device for loading on the baking furnace, it is possible to eliminate the waiting time for the arrival of a robot device that transfers substrates to other processing steps after completion of processing in the baking furnace. It is possible to provide a substrate manufacturing line capable of realizing a short processing time.

In other words, conventionally, in order to increase the tact time, it is necessary to set a large number of vertical transfer positions from the transfer robot to the horizontal moving body, which makes the control of the robot apparatus complicated and increases the cost. Inconvenience has occurred, but the problem is solved at the same time. In particular, in each processing apparatus in the photolithography process equipment, the transfer height of the glass substrate with the first to fifth robot apparatuses for transfer is set to be as high as possible, and the pass area of the bake furnace is set. Since the substrate entry / exit chamber is set at the same height, the transfer robot itself does not need to be moved up and down as much as possible so that the tact time can be shortened. In particular, by providing the substrate entrance / exit chamber and the substrate exchange robot device, the load on the transfer robot device is greatly reduced, and the overall speed can be increased. It should be noted that the substrate manufacturing line is not limited to the above-described configuration, and it goes without saying that various configurations are possible within the scope defined in the claims. For example, steps until a soft bake is performed, The step of performing exposure and the step of performing hard baking may be provided on another floor or another building.

[0079]

As described above, according to the present invention,
A substrate manufacturing line and a substrate manufacturing method capable of realizing substrate transfer and transfer without any thermal influence on the substrate during substrate transfer and transfer in a substrate manufacturing line for performing predetermined processing on a substrate including a glass substrate and a wafer Can be provided.

[0080]

[Brief description of the drawings]

FIG. 1 is an external perspective view showing the entire configuration of a production line 1. FIG.

FIG. 2 is an operation explanatory diagram of the production line 1.

FIG. 3 is an external perspective view of the cassette loading / unloading device 2.

FIG. 4 is an external perspective view of the low-pressure ultraviolet ray cleaning device 11;

FIG. 5 is an external perspective view of the main part of the spin scrubber device, in which the main part is broken.

FIG. 6 is an external perspective view of the multi-stage baking furnace 14.

FIG. 7 is an external perspective view showing a multi-stage bake furnace 14 and a second robot device 5;

FIG. 8 is an external perspective view of the first substrate exchange robot device, partially cut away.

FIG. 9 is an external perspective view illustrating an operation of the robot apparatus.

FIG. 10 is a cross-sectional view taken along line XX of FIG. 1, illustrating the operation of transferring a substrate by the robot apparatus.

FIG. 11 is a cross-sectional view taken along line XX of FIG. 1, illustrating the operation of transferring a substrate by the robot apparatus.

FIG. 12 is a cross-sectional view taken along the line YY of FIG. 1, illustrating an operation for transferring a substrate by raising and lowering upper and lower pins.

FIG. 13 is an external perspective view showing a multi-stage baking furnace 14 and a second robot device 5;

14 is a cross-sectional view taken along line AA of FIG. 13 and also serves to explain the operation of the substrate access chamber 62. FIG.

FIG. 15 is an external perspective view of a processing chamber of a baking furnace.

FIG. 16 is an external perspective view of an upper and lower pin mechanism of a processing chamber.

FIG. 17 is an external perspective view of a processing chamber of the baking furnace shown together with the upper and lower pin mechanisms.

FIG. 18 is an external perspective view of a coating device 13.

19 is an external perspective view of the i-line exposure device 26. FIG.

20 is an external perspective view of the developing device 27. FIG.

21 is a plan view of the inspection device 30. FIG.

FIG. 22 is a view taken along line XX of FIG. 21.

FIG. 23 is a flowchart of an initial stage for explaining the operation of the manufacturing line 1.

FIG. 24 is a flowchart of an intermediate stage for explaining the operation of the manufacturing line 1;

FIG. 25 is a flowchart after exposure for explaining the operation of the manufacturing line 1;

FIG. 26 is a final flowchart for explaining the operation of the manufacturing line 1;

FIG. 27 is a flowchart for explaining a distributed process of the production line 1;

FIG. 28 is a flowchart of the production line 1 after inspection.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate manufacturing line 2 Cassette loading / unloading device 3 First robotic device 4 Traveling rail 5 Second robotic device 6 Third robotic device 7 Fourth robotic device 8 Common traveling rail 9 Fifth robotic device 10 Traveling rail 11 Low-pressure ultraviolet ray cleaning device 12 Spin scrubber device 13 Coating device 14 First multistage baking furnace 15 First substrate exchange robot device 16 Control panel 18 Decompression drying device 19 Positioning table, transfer device 20 Buffer unit 21 Second multistage bake oven 22 Second substrate exchange robot device Reference Signs List 23 Exposure device 25 Peripheral exposure device 26 i-line exposure device 27 Spin developing device 28 Third multi-stage baking furnace 29 Third substrate exchange robot device 30 Inspection device 31 Cassette 33 Opening 40 Clean room 48 Motor 50 Elevating turning base 51 Upper fork 51a Claw body 52 lower fore 52a claw body 61 liquid cooling plate chamber 62 substrate access chamber 63 air cooling plate chamber 64 base treatment chamber 65 hot plate chamber 66 opening 67 opening / closing lid 69 elevating base 70 upright support column 71 upper fork 71a claw body 72 lower fork 72a claw body 73 Electromagnetic brake 74 Ball screw 77 Motor 79 Horizontal straightening device 82 Soft hot plate room 83 Soft cool plate room 85 Hard hot plate room 86 Heart cool plate room 90 Upper and lower pins 91 Plate 92 Link 93 Motor 100 Frame 120 Coating head W Substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/30 562

Claims (4)

[Claims] 1. A substrate is taken out of a substrate entrance / exit section with the processing side of the substrate facing upward, conveyed, and subjected to predetermined processing on the processing surface via a plurality of processing devices disposed in a clean room. A self-propelled robotic device that takes out and transports a substrate; and a processing device that is disposed across a traveling path of the robotic device. A multi-stage baking furnace for performing temperature processing, drying processing, and base processing is provided with a plurality of multi-stage processing chambers that are vertically separated, and a substrate unloading and positioning substrate that is transferred from the robot device. An entrance and a substrate exchange robot device having an elevating function for moving substrates in and out of the substrate entrance and exit through an openable / closable opening provided in the processing chamber; Board production line thermal impact of loading and unloading and lifting the substrate between the substrate loading and unloading chamber and the opening, characterized in that configured not transmitted to the robot device by device. 2. The predetermined treatment includes at least cleaning of a substrate, heat drying after cleaning after cleaning, heat drying, application of an adhesion enhancer, constant temperature, application of a predetermined application fluid including a resist liquid, and application of a predetermined application fluid. After application, drying / cooling after application, exposure,
2. The substrate manufacturing line according to claim 1, further comprising development, post-development drying / cooling after development. 3. The substrate is taken out of the substrate entrance with the processing surface of the substrate facing upward, transported, and subjected to predetermined processing on the processing surface through a plurality of processing devices provided in a clean room. A self-propelled first robotic device that takes out and transports a substrate from the substrate ingress and egress portion, the substrate production line being configured to be returned to the substrate ingress / egress portion, and a traveling path of the first robotic device. A self-propelled second robot device that travels along a common travel path that is disposed substantially orthogonally and that has an exposure device disposed at an end thereof, and that takes out and transports a substrate; A third robot device located on the downstream side, a fourth robot device located on the downstream side of the third robot device, and the processing device disposed across the common travel path;
A first multi-stage baking furnace for heating and drying a substrate after cleaning, applying an adhesion enhancer, and maintaining a constant temperature; a plurality of multi-stage processing chambers vertically separated from each other; A substrate entry / exit chamber for taking in / out and positioning of a substrate conveyed from the apparatus, and a lifting / lowering function for taking a substrate in and out of the substrate entry / exit chamber through an opening / closing opening provided in the processing chamber are provided. A first substrate exchange robot device, wherein the first substrate exchange robot device transfers a thermal effect when the substrate is moved in and out of the opening and the substrate access chamber and moves up and down by the first substrate exchange robot device to the second robot device. So that the processing devices disposed on both sides of the common traveling path
A second multi-stage bake furnace for performing drying and cooling after application of the predetermined application fluid to the substrate after application is transferred from a plurality of multi-stage processing chambers vertically separated from each other and the third robot device. A substrate entrance / exit chamber for taking in / out and positioning of a substrate, and an opening / closing opening provided in the processing chamber, and a lifting / lowering function for taking a substrate in / out of the substrate entrance / exit chamber. A second substrate exchange robot device, wherein the second substrate exchange robot device does not transmit the thermal effect when the substrate is moved in and out of the opening and the substrate access chamber and ascends and descends to the third robot device. A third multi-stage baking furnace for performing post-development drying and cooling after development on the substrate after being exposed to light by the exposure apparatus and after development, a plurality of multi-stage processing chambers vertically configured and separated. , The fourth robot A substrate access chamber for taking in and out and positioning a substrate conveyed from a cutting apparatus, and a substrate opening / closing opening provided in the processing chamber, for taking the substrate in and out of the substrate access chamber. A third substrate exchange robot device having an elevating function, wherein the third substrate exchange robot device allows the substrate to move in and out of the substrate between the opening and the substrate entrance and out of the substrate entrance / exit chamber, and the fourth substrate exchange robot device has a fourth effect. A substrate manufacturing line characterized in that it is not transmitted to a robot device. 4. A substrate is taken out of the substrate entrance with the processing surface of the substrate facing upward, transported, and subjected to predetermined processing on the processing surface through a plurality of processing devices disposed in a clean room. A substrate manufacturing method comprising the steps of: returning each substrate to a substrate by using a self-propelled robot device; and performing temperature processing on the substrate in the processing device disposed across a traveling path of the robot device. A step of loading and unloading a substrate into and from a substrate access chamber disposed in a multi-stage bake furnace for performing a drying process and a base treatment; and a step of positioning a substrate; Through an openable / closable opening disposed in a plurality of multistage processing chambers configured separately,
A step of moving the substrate after the positioning into and out of the processing chamber by a substrate exchanging robot apparatus provided in the multi-stage baking furnace, and moving the substrate up and down by the substrate exchanging robot apparatus. A substrate manufacturing method, wherein a thermal effect when a substrate is moved in and out of the substrate entrance / exit chamber and when the substrate is moved up and down is not transmitted to the robot apparatus.