JPH11233980A - Heat-radiating structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-radiating structure of an electronic device, wherein the latitude in heat-radiation design is increases while allocation of a heat sink is simplified due to fitting space. SOLUTION: In a single module power source, through the use of a case 2 where left and right side wall parts 4 and 5 are formed on the left and right of a rear surface part 3, a rear-surface side heat sink 6 is fixed tightly to the rear-surface part 3 of the case 2, in the same manner as a left-side heat sink 7 to the left sidewall part 4 of it and a right-side heat sink 8 to the right sidewall part 5 of it, respectively, so that heat radiation of a module power source 1 is directed in multiple directions (3-directions).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for electronic equipment such as a module power supply.

[0002]

2. Description of the Related Art A module power supply, which is an electronic device, is a device in which a plurality of semiconductor chips (diodes, thyristors, transistors, etc.) are constituted by specific wires and incorporated into a single package. Therefore, the heat generation is large, and it is necessary to radiate the heat generated by the semiconductor chip.

As a heat dissipation structure in a conventional module power supply, as shown in FIG. 7, a metal heat sink 22 is attached to a case 21 located on the back of the module power supply 20.

[0004]

However, in such a conventional heat dissipation structure of the module power supply 20, since the heat radiation direction is limited to the rear side of the module power supply 20, the degree of freedom in heat radiation design is limited. There is a problem that the increase cannot be achieved and the arrangement of the heat sink cannot be simplified by the mounting space.

The present invention has been made in view of the above-mentioned problems. It is an object of the present invention to increase the degree of freedom in heat radiation design, and to dispose a heat sink by a mounting space. An object of the present invention is to provide a heat radiation structure of an electronic device that can be simplified.

[0006]

According to a first aspect of the present invention, there is provided a heat radiating structure for an electronic device, wherein a main body of the electronic device has a plurality of heat radiating surfaces.

With this configuration, since the device body has a plurality of heat radiating surfaces, the degree of freedom in heat radiating design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

According to another aspect of the present invention, there is provided a heat radiation structure for an electronic device according to the first aspect of the present invention, wherein the heat radiation structure for an electronic device includes a plurality of the heat radiation structures. A heat sink was attached to each of the heat radiating surfaces of the case.

With this configuration, by using a case having a plurality of heat radiating surfaces as a case of one device main body, heat sinks can be attached to each of the heat radiating surfaces of the case, and the heat radiating direction of the device main body can be improved. Can be provided in multiple directions. For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

According to a third aspect of the present invention, there is provided a heat dissipation structure for an electronic device according to the first or second aspect, wherein the device main body comprises a module. A power supply, and the heat radiating surface is 2 or 3.

With this configuration, by using a case having a plurality of heat radiating surfaces as a case of one module power supply, heat sinks can be attached to each of the heat radiating surfaces of the case, and the heat radiating direction of the module power supply can be improved. Can be provided in multiple directions (2 or 3).
For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

In order to achieve the above object, according to a fourth aspect of the present invention, there is provided a heat radiation structure for an electronic device, wherein a heat sink is mounted on the device main body, and heat radiation plates are provided on both sides of the heat sink. A heat sink portion is located on one side of the device main body, and the other heat sink portion is positioned on the other side surface of the device main body to constitute a device unit. It is characterized in that the units are arranged in the opposite direction with respect to the intermediate device unit, and are adhered and fixed to each other.

[0013] With this configuration, it is possible to arrange the other device units on both sides of the intermediate device unit in a direction opposite to the intermediate device unit, and to closely adhere them to each other. The heat radiation of the unit can be made uniform, and the heat radiation direction of the device unit can be provided in multiple directions. For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

According to a fifth aspect of the present invention, there is provided a heat radiation structure for an electronic device, wherein the device main body is a module power supply. The device unit is a power supply unit.

With this configuration, it is possible to arrange the other power supply units on both sides of the intermediate power supply unit in a direction opposite to the intermediate power supply unit, and to adhere and adhere to each other. The heat radiation of the unit can be made uniform, and the heat radiation direction of the power supply unit can be provided in multiple directions. For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view schematically showing a heat dissipation structure (Embodiment 1) of an electronic apparatus according to the present invention, and FIG. 3
FIG. 3 is a perspective view of a heat sink mounting structure in the heat radiation structure.

The module power supply 1, which is the main body of the electronic equipment, includes a plurality of semiconductor chips (diodes, thyristors,
The semiconductor chip 30 is formed by a specific connection and incorporated in one package. Such a semiconductor chip 30 is provided on an inner surface of an aluminum case 2 as shown in FIG. And is mounted on the chip mounting portion 2B formed on the insulating heat dissipation sheet 2A. And this module power supply 1 is, for example,
This is a power supply device that rectifies the AC current AC and converts it into a DC current DC (400 V), and converts the high voltage (400 V) DC current DC into a low voltage (24 V) DC current DC.

The aluminum case 2 of the module power supply 1 has a U-shape in cross section as shown in FIG. 1, and has left and right side walls 4 and 5 on the left and right sides of a back surface 3. . A rear heat sink 6 is fixed to the rear part 3 of the case 2, a left heat sink 7 is fixed to the left wall part 4 of the case 2, and a right heat sink 8 is fixed to the right wall part 5 of the case 2. is there.

The rear heat sink 6 and the left and right heat sinks 7 and 8 may be fixed to the case 2 by an adhesive, or the rear portion 3 and the left and right wall portions 4 and 5 of the case 2 may be fixed. The mounting groove 9 as shown in FIG.
Are formed, and slide portions 9A are provided on the left and right sides of the rear heat sink 6 and the left and right heat sinks 7 and 8, and the slide portion 9A is slid into the mounting groove 9, so that the mounting groove 9 is inserted into the rear groove. The heat sink 6 and the left and right heat sinks 7, 8 may be mounted.

As described above, by using the case 2 having the left and right side walls 4 and 5 on the left and right sides of the rear portion 3 as the case of one module power supply 1, the rear portion 3 of the case 2 The side heat sink 6, the left heat sink 7 can be fixed to the left wall 4 of the case 2, and the right heat sink 8 can be fixed to the right wall 5 of the case 2 in tight contact with each other. Can be provided in multiple directions (left, right and rear three directions).
For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

In the first embodiment described above, the direction of heat radiation of the module power supply 1 is three directions of left, right and rear. However, as shown in FIG. 6, three directions of left, right and rear are provided. In addition to the above, it is possible to provide the heat radiation direction also in the downward direction. In this case, left and right side walls 4 and 5 are formed on the left and right sides of the back part 3, and a lower side wall part 32 is formed below the back part 3.
The lower heat sink 31 is attached to the lower side wall part 32 using the case 2 formed with the above.

(Embodiment 2) In Embodiment 2, the aluminum case 2 of the module power supply 1 has an L-shaped cross section as shown in FIG.
A right side wall 5 is formed on the right side of the back surface 3. A rear heat sink 6 is fixed to the rear portion 3 of the case 2, and a right heat sink 8 is fixed to the right wall portion 5 of the case 2, respectively.

The rear heat sink 6 and the right heat sink 8 may be fixed to the case 2 by an adhesive or formed on the rear portion 3 and the right wall 5 of the case 2 as shown in FIG. The rear-side heat sink 6 and the right-side heat sink 8 may be slid and mounted in the mounting groove 9 thus formed.

As described above, by using the case 2 in which the right wall 5 is formed on the right side of the rear part 3 as the case of one module power supply 1, the rear heat sink 6 is attached to the rear part 3 of the case 2. The right heat sink 8 can be fixed to the right wall portion 5 of the case 2 in close contact with each other, and the heat radiation direction A of the module power supply 1 can be provided in multiple directions (two directions). For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

(Third Embodiment) In a third embodiment, as shown in FIG.
The left and right side surfaces 6A and 6B of the rear heat sink 6-1 are extended to the left and right edges of the heat sink plates 10 and 11, respectively.
And a heat sink 6 on the rear side
-1 is attached, and the left radiator plate 10 is connected to the module power supply 1
And the right heat radiating plate 11 is positioned on the right side of the module power supply 1, and the unit N (N 1, N 2, N 3) in which the rear heat sink 6-1 is incorporated in one module power supply 1 ), A plurality of these units N are prepared, and the other units N2 and N3 are arranged on the left and right sides of the intermediate unit N1 with the other units N2 and N3 turned upside down with respect to the intermediate unit N1. The left unit N1,
The heat radiating plates 11 and 11 of N2 are brought into contact with each other, and the heat radiating plates 10 and 10 of the middle and right units N1 and N3 are brought into contact with each other and fixed to each other. It is.

Then, the units N1, N2 (N1, N
3) The fixing of each other is performed by providing pieces 12 having mounting holes 13 above and below the left and right heat radiating plates 10 and 11 and screwing these pieces 12 together.

As described above, the rear heat sink 6-1 is attached to the module power supply 1, the left radiator plate 10 is positioned on the left side of the module power supply 1, and the right radiator plate 11 is connected to the module power supply. 1, a unit N (N1, N2, N3) in which the rear heat sink 6-1 is incorporated in one module power supply 1 is configured, and the other units N2, N2, N3 can be arranged in reverse (inverted) with respect to the intermediate unit N1 and fixed, so that the heat radiation of the plurality of module power supplies 1 can be made uniform and the heat radiation direction of the module power supply 1 can be uniform. A can be provided in multiple directions. For this reason, it is possible to increase the degree of freedom of the heat radiation design,
The arrangement of the heat sink can be simplified by the mounting space.

The DIN of the units N1, N2, N3
Mounting on rails (not shown)
2, the module power supply 1 of N3 is provided with rail engaging portions (not shown), and these rail engaging portions are detachably engaged with the DIN rail.

[0030]

As described above, according to the heat radiating structure for an electronic device according to the present invention, since the device main body has a plurality of heat radiating surfaces, the degree of freedom in heat radiation design can be increased. The arrangement of the heat sink can be simplified by the mounting space.

Further, by using a case having a plurality of heat radiating surfaces as a case of one device main body, heat sinks can be attached to each of the heat radiating surfaces of the case, and the heat radiating direction of the device main body can be increased. Direction. For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

Further, by using a module power supply for the equipment body, it is possible to use a case having a plurality of heat radiating surfaces for a case of one module power supply, and attach a heat sink to each heat radiating surface of the case. In addition, the heat radiating surface of the module power supply can be provided in multiple directions (2 or 3). For this reason, the degree of freedom of the heat radiation design can be increased, and the arrangement of the heat sink can be simplified by the mounting space.

According to the heat radiating structure for an electronic device according to the present invention, a heat sink is mounted on the device main body, heat radiating portions are provided on both sides of the heat sink, and one heat radiating portion is connected to one side of the device main body. A device unit is configured by positioning the other heat dissipation plate portion on the other side surface of the device main body while positioning the other device unit on both sides of the intermediate device unit with respect to the intermediate device unit. The other unit is placed on both sides of the intermediate device unit in the opposite direction to the intermediate device unit and adhered to each other. Therefore, the heat radiation of the plurality of device units can be made uniform, and the heat radiation direction of the device units can be provided in multiple directions. For this reason, it is possible to increase the degree of freedom of the heat radiation design,
The arrangement of the heat sink can be simplified by the mounting space.

Further, by using a module power supply for the device main body and using a power supply unit for the device unit, other power supply units are arranged on both sides of the intermediate power supply unit in a direction opposite to the intermediate power supply unit. As a result, it is possible to make the heat radiation of the plurality of power supply units uniform, and the heat radiation directions of the power supply units can be provided in multiple directions. For this reason, it is possible to increase the degree of freedom of the heat radiation design,
The arrangement of the heat sink can be simplified by the mounting space.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a heat dissipation structure (first embodiment) of an electronic device according to the present invention.

FIG. 2 is an explanatory diagram in which a part of a module power supply is omitted.

FIG. 3 is a perspective view of a heat sink mounting structure in the heat radiation structure.

FIG. 4 is a perspective view schematically showing a heat dissipation structure (Embodiment 2) of an electronic device according to the present invention.

FIG. 5 is a perspective view schematically showing a heat dissipation structure (third embodiment) of an electronic device according to the present invention.

FIG. 6 is an explanatory diagram of a heat radiation direction of the heat radiation structure of the electronic device according to the present invention.

FIG. 7 is a perspective view schematically showing a heat dissipation structure of a conventional electronic device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Module power supply (device main body) 2 Case 3 Back side 4 Left side wall 5 Right side wall 6 Back side heat sink 7 Left side heat sink 8 Right side heat sink

Continuing on the front page (72) Inventor Takatoshi Oban, Omron Co., Ltd. 10 Hanazono Todocho, Ukyo-ku, Kyoto-shi, Kyoto

Claims (5)

[Claims] 1. A heat radiating structure for an electronic device, wherein the device main body has a plurality of heat radiating surfaces. 2. The heat radiating structure for an electronic device according to claim 1, wherein a case having a plurality of heat radiating surfaces is used as a case of one device main body, and a heat sink is attached to each of the heat radiating surfaces of the case. 3. The apparatus main body is a module power supply,
The heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation surface is two or three. 4. A heat sink is mounted on the device main body, heat radiating portions are provided on both sides of the heat sink, one heat radiating portion is positioned on one side surface of the device main body, and the other heat radiating portion is connected to the heat radiating portion. Configure the device unit by positioning it on the other side of the device body, and on both sides of the intermediate device unit,
A heat dissipating structure for an electronic device, wherein another device unit is disposed in an opposite direction to an intermediate device unit, and is closely adhered and fixed to each other. 5. The apparatus main body is a module power supply,
The heat dissipation structure for an electronic device according to claim 4, wherein the device unit is a power supply unit.