JPH11224318A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card loading an IC module having high reliability with which an IC chip is protected from stress such as impulse or pressure from the outside and chip crack hardly occurs. SOLUTION: Concerning this IC card, one part of an IC module substrate composed of insulated resins mounting the IC chip is folded almost into U shape, and an IC chip part 2 is sandwiched and protected by the folded substrate. Such an IC module is loaded and the IC module is loaded while mounting the IC chip sandwiched and protected by the substrate folded almost into U shape in any area of the IC module excepting for just under an external connecting terminal 16 for writing and reading data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact type, a non-contact type, and a composite type IC card combining a contact type and a non-contact type. IC card is protected against external impact, pressure and bending stress.
The present invention relates to a highly reliable IC card that protects a chip and hardly causes chip breakage and the like.

[0002]

2. Description of the Related Art Conventionally, in the fields of credit cards, ID cards, cash cards, and the like, as a card replacing a magnetic card, an IC module including a semiconductor memory such as a microprocessor, RAM, and ROM is mounted on a card material. A so-called IC card has been developed because of its extremely large information recording capacity and high security. These IC cards record information
Reading is roughly classified into a contact type and a non-contact type. The contact type performs power supply and information communication by directly contacting and connecting a reader-side terminal to an external terminal exposed on the surface of the card. Most current IC card types fall into this category. In the reading of this contact type card, the error rate for a good card is extremely low, but if the external terminals are dirty or damaged by abrasion, the electrical conductivity may be lost and reading may not be possible. Was. Another problem is that the IC chip is destroyed by static electricity on the terminal surface.

[0003] Therefore, an IC card using a non-contact type IC module comprising a memory IC chip and a coil having a function as a power supply and communication antenna has been developed. Non-contact type IC used for this card
Since the module performs communication in a non-contact manner, there is no need to expose the communication terminal to the card surface when making the card, so there is no risk of errors due to dirt on the external terminals or static electricity.

Further, at present, there has been proposed a hybrid IC card in which the above-mentioned non-contact type IC card and the contact type IC card are combined to realize the non-contact function and the contact function with one chip. That is, by combining the convenience of the non-contact type and the security of the contact type, for example, a fee payment operation and a charge in a ticket system,
This IC card is suitable for bank transactions, various types of identity confirmation operations, etc., and is intended to realize a convenient application.

In recent years, the trend of IC cards has been to increase the chip size of any of the above-mentioned IC cards due to the addition of encryption technology for improving security and the expansion of memory capacity. . However, as a problem of the IC card, when a load due to external impact, pressure, or bending stress is applied to the card, there is a possibility that the IC chip is cracked and communication is hindered. For example, as shown in FIG.
2 is often fixed directly below the rear surface of the external terminal board, so that its durability against impact, pressure and load stress is limited.

[0006]

However, these problems are closely related to the size of the IC chip to be mounted. In particular, as the chip size increases, chip cracking tends to occur due to external stress. is there. Therefore, an IC card that tends to increase the chip size tends to cause chip breakage.

[0007] Further, the manner in which stress is applied is closely related to chip cracking. In particular, stress locally applied to an IC chip, such as point pressure and linear pressure, causes chip cracking as compared with stress applied to the entire chip. easy.

Accordingly, the present invention has been made to solve the above-mentioned problems, and has been made to protect an IC chip against stresses such as external impacts and pressures, and to achieve high reliability in which chip cracks and the like are less likely to occur. IC card mounted with an IC module having the same.

[0009]

According to the present invention, there is provided an IC card in which at least an IC module substrate on which an IC chip is mounted is bent, and at least an IC chip portion is sandwiched and protected by the bent substrate. An IC card on which an IC module is mounted.

[0010] An IC chip sandwiched and protected by a bent module substrate is electrically connected and mounted in a region other than immediately below external connection terminals for writing and reading data in the IC module. An IC card equipped with an IC module characterized by the following.

In addition, a chip substrate on which at least an IC chip is arranged and a pad substrate on which a plurality of terminal pads are provided are continuously provided on an IC module substrate, and the pad substrate is bent, and at least the IC chip portion is bent. It is sandwiched and protected by the pad substrate and the chip substrate, and is mounted in an electrically connected state in a region directly below the pad substrate under external connection terminals for writing and reading data. This is an IC card on which an IC module is mounted.

Further, the connection pad of the terminal pad substrate penetrates the terminal pad substrate and is electrically connected to the back side.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The IC card of the present invention is formed by bending a part of an IC module substrate made of an insulating resin on which an IC chip is mounted into a substantially U-shape and sandwiching and protecting the IC chip portion by the bent substrate. I characterized in that
An IC card in which a C-module is mounted and an IC card is protected by being sandwiched by a substantially U-shaped substrate in a region other than immediately below external connection terminals for writing and reading data in the IC module. An IC module characterized by mounting a chip is mounted.

Further, the IC card has a chip substrate on which at least an IC chip is arranged on an IC module substrate and a pad substrate on which a plurality of terminal pads are provided, and the pad substrate is bent to form at least an IC chip portion. It is sandwiched and protected by the bent pad substrate and the chip substrate, and is mounted in an electrically connected state in a region directly below the pad substrate under external connection terminals for writing and reading data. On which an IC module is mounted.

That is, in order to suppress chip breakage, it is necessary to disperse the load when concentrated load is applied. Therefore, the IC chip portion is sandwiched between the bent substrates made of insulating resin. Even if the chip size is increased, the protected IC module is sandwiched and protected by the substrate, so that the chip is prevented from being cracked by the stress locally applied to the IC chip, for example, the point pressure and the linear pressure. It is possible to Further, by bending a module substrate made of an insulating resin into a substantially U-shape, the substrate has a cushioning property, thereby dispersing impact and pressure over the surface. Furthermore, by mounting these IC modules on the card base material by injection molding, the IC modules are firmly fixed and the IC chips are surely protected.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

<First Embodiment> A first embodiment will be described with reference to FIGS. 1A and 1B show an embodiment of a non-contact type IC module according to the IC card of the present invention. FIG. 1A is an explanatory view of a module substrate on which an IC chip and an antenna coil are mounted, and FIG. It is explanatory drawing of the IC module which shows the state which bent a part of board | substrate and protected the IC chip. FIG. 2 is an explanatory diagram showing a non-contact type IC card according to the embodiment of the present invention.

First, as shown in FIG. 1A, a non-contact type IC module includes a communication antenna coil 15 on a module substrate 11 having a protection plate 13 provided on one side of a square through a bent portion t. And place an IC chip 1
Then, as shown in FIG. 1 (B), the protection plate 13 is bent in a substantially U-shape on the IC chip so as to cover the IC chip 12 from the bent portion t. Of the IC module 10.

Next, as shown in FIG. 2, this non-contact type IC module 10 is embedded in a card base 21 by injection molding to form a non-contact type IC card 2.
0 was obtained. This IC module 10 can obtain an IC card by bonding a card base material, but is not limited thereto, but is preferably firmly embedded by injection molding.

<Embodiment 2> An embodiment 2 will be described with reference to FIGS. FIG. 3 shows an example of a contact type IC module according to the IC card of the present invention.
FIG. 3B is an explanatory view of an IC module substrate on which a chip and a terminal pad are mounted, and FIG.
It is explanatory drawing of the IC module which shows the state which protected the chip, (C) is explanatory drawing which shows the state which embedded the said IC module in the card base material. FIG. 4 is an explanatory diagram showing a cross section of a contact type IC card according to the embodiment of the present invention.

First, as shown in FIG. 3A, a plurality of IC boards 12 are mounted on an IC module board 11 via a chip board 11a and a bent portion t provided substantially at the center of the module board. This is an IC module in which a pad substrate 11b having terminal pads 14 provided at predetermined positions is continuously provided, and a conductive pattern 18 for connecting each terminal pad 14 and the IC chip 12 is mounted. At this time, each of the terminal pads 14 is provided so as to penetrate the terminal pad substrate 11b, and the terminal pads can be electrically connected from both sides of the pad substrate.

Next, the module substrate 11 is bent into two substantially U-shapes from the bent portion t,
As shown in FIG. 3B, the terminal pad substrate 11b and the IC
The contact type IC module 10 in which the IC chip 12 is protected by being sandwiched between the chip substrate 11a is obtained. Further, as shown in FIG. 3 (C), the terminal pad substrate 11b is buried at a position slightly lower than the surface of the card base material 21, and the external connection terminals 16 are adhered on the terminal pad substrate 11b. Thus, a contact type IC card having almost the same height as the surface was obtained.

As described above, the external connection terminal 1
6 can be attached after the module 10 is embedded, but it is preferable to attach the module 10 to the pad substrate 11b before embedding the module 10; Embedding by molding becomes easy.

Further, as shown in FIG. 4, the IC module 10 was embedded in the card base 21 by injection molding to obtain a contact type IC card. That is, the IC chip 12 in the IC module 10
It is protected by a terminal pad substrate and external connection terminals.

Third Embodiment A third embodiment will be described with reference to FIGS. FIG. 5 shows an example of a contact type IC module according to the IC card of the present invention.
FIG. 3 is an explanatory view of a module substrate on which a chip and terminal pads are mounted, and FIG. 2B is an explanatory view of an IC module showing a state in which the IC chip substrate is folded to protect the IC chip. FIG. 6 is an explanatory diagram showing a cross section of a contact type IC card according to another embodiment equipped with the IC module.

As shown in FIG. 5A, a plurality of terminal pads 14 are provided at predetermined positions on an IC module substrate 11 via an IC chip 12 and a bent portion t. 6 is an IC module showing a state where a conductive pattern 18 for connecting to a chip 12 is mounted.

Next, as shown in FIG.
From the bent portion t provided on the C module substrate 11, the IC
The chip substrate 11a on which the chip is mounted is bent inward into a substantially U-shape to protect the IC chip 12 so as to be sandwiched between the module substrate 11 and the chip substrate 11a.
Module 10 was obtained.

Next, as shown in FIG. 5 (C), the contact type IC module 10 is embedded in a card base 21 by injection molding to form a contact type IC card 2.
0 could be obtained. At this time, the substrate portion on which the terminal pads 14 are provided is buried at a position slightly lower than the surface of the card base 21, and the external connection terminals 1 are placed on the terminal pads 14.
6 is connected to the terminal pad and bonded so that the height is substantially the same as the height of the surface of the card base 21. It should be noted that the external connection terminal can be attached first in the IC module formation stage.

Further, as shown in FIG. 6, the IC chip 12 sandwiched and protected by the substrates is bent downward near the boundary with the terminal pad substrate, so that the IC chip 12 is lower than the terminal pads 14 and is connected to the external connection. FIG. 2 shows a contact type IC card in which this module is embedded and formed in a card base material 21 by injection molding.

[0030]

According to the IC card of the present invention, since the IC chip is mounted in the card base in a state of being substantially U-shaped by the module substrate from both sides, a protective layer thicker than the conventional IC module is used. When a load due to a point pressure or a linear pressure is applied to the module, the stress due to the load or the like is dispersed on the substrate for protecting the chip, and the concentrated load on the chip portion can be reduced.

In the IC card according to another example, the IC chip is mounted in another area without being disposed immediately below the external connection terminal for writing and reading, so that writing and reading can be performed by a reader / writer. This eliminates the risk of directly receiving the pressure of the head, and at the same time, since the IC chip is mounted in a position different from the external connection terminal portion in a state protected by the substrate, a more reliable IC card can be obtained. It has an excellent effect.

[Brief description of the drawings]

FIG. 1 shows an example of a non-contact type IC module according to an IC card of the present invention, in which (A) is an explanatory view of a module substrate on which an IC chip and an antenna coil are mounted,
(B) is an explanatory view of the IC module showing a state where a part of the module substrate is bent to protect the IC chip.

FIG. 2 is an explanatory diagram of an IC card according to an embodiment of the present invention, on which a non-contact type IC module is mounted.

3A and 3B show an example of a contact type IC module according to the IC card of the present invention, wherein FIG. 3A is an explanatory view of an IC module substrate on which an IC chip and terminal pads are mounted, and FIG. It is explanatory drawing of the IC module which shows the state which protected the chip, (C) is explanatory drawing which shows the state which embedded the said IC module in the card base material.

FIG. 4 is an explanatory diagram showing a cross section of a contact type IC card according to an embodiment of the present invention.

5A and 5B show a contact type IC module according to another embodiment of the IC card of the present invention, wherein FIG. 5A is an explanatory view of an IC module substrate on which an IC chip and terminal pads are mounted, and FIG. Bending part of module board I
It is explanatory drawing of the IC module which shows the state which protected the C chip, (C) is explanatory drawing which shows the state which embedded the said IC module in the card base material.

FIG. 6 is an explanatory view showing a contact type IC card according to another embodiment of the present invention in a cross section.

FIG. 7 is an explanatory diagram showing an example of a conventional IC card.

[Explanation of symbols]

 Reference Signs List 10 IC module 11 Module substrate 11a Chip substrate 11b Terminal pad substrate 12 IC chip 13 Protective plate 14 Terminal pad 15 Antenna coil 16 External connection terminal 18 ... Conduction pattern 21 ... Card base material t ... Bending part

Claims (4)

[Claims] In a contact type, a non-contact type and a combined type of a contact type and a non-contact type in which an IC module on which an IC chip is mounted is mounted, at least I
Bending the IC module board on which the C chip is mounted,
An IC card, wherein at least an IC chip portion is mounted with an IC module that is sandwiched and protected by a bent substrate. 2. The IC card according to claim 1, wherein
An IC chip sandwiched and protected by the bent module substrate is provided in a region other than immediately below the external connection terminals for writing and reading data in the C module.
IC characterized by being electrically connected and mounted
IC card equipped with a module. 3. The IC card according to claim 1, wherein
A chip substrate on which at least an IC chip is arranged on a C module substrate and a pad substrate on which a plurality of terminal pads are provided are connected in series, and the pad substrate is bent to form at least an IC.
The chip portion is sandwiched and protected by the bent pad substrate and the chip substrate, and is mounted in an electrically connected state in a region directly below the pad substrate below the external connection terminal for writing and reading data. I characterized by the following:
An IC card equipped with a C module. 4. The IC card according to claim 3, wherein the connection pad of the terminal pad substrate penetrates the terminal pad substrate and is electrically connected to the back surface side.