JPH11219979A - Electronic part device - Google Patents
Electronic part deviceInfo
- Publication number
- JPH11219979A JPH11219979A JP2010498A JP2010498A JPH11219979A JP H11219979 A JPH11219979 A JP H11219979A JP 2010498 A JP2010498 A JP 2010498A JP 2010498 A JP2010498 A JP 2010498A JP H11219979 A JPH11219979 A JP H11219979A
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- electronic component
- connection
- adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばフェイスダ
ウン方式により半導体チップを基板と異方導電性接着フ
ィルムで接着固定すると共に両者の電極どうしを電気的
に接続することにより得られる電子部品装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device obtained by, for example, bonding a semiconductor chip to a substrate with an anisotropic conductive adhesive film by a face-down method and electrically connecting both electrodes. .
【０００２】[0002]
【従来の技術】異方導電性接着フィルムは、金属粒子等
の導電粒子を所定量含有した接着剤からなるもので、こ
の異方導電性接着フィルムを電子部品と電極や回路の間
に設け、加圧または加熱加圧手段を構じることによっ
て、両者の電極同士が電気的に接続されると共に、隣接
電極間の絶縁性を付与して、電子部品と回路とが接着固
定されるものである。異方導電性接着フィルムの接続信
頼性を向上するための基本的な考えは、導電粒子の粒径
を隣接電極間のスペース部分よりも小さくすることで隣
接電極間の絶縁性を確保し、併せて導電粒子の含有量を
この導電粒子が接触しない程度とし、かつ電極上に確実
に存在させることにより接続部分における電気的な接続
を得ることである。2. Description of the Related Art An anisotropic conductive adhesive film is made of an adhesive containing a predetermined amount of conductive particles such as metal particles. The anisotropic conductive adhesive film is provided between an electronic component and an electrode or a circuit. By using a pressurizing or heating pressurizing means, the two electrodes are electrically connected to each other, and the insulating property between the adjacent electrodes is provided, so that the electronic component and the circuit are bonded and fixed. is there. The basic idea for improving the connection reliability of the anisotropic conductive adhesive film is to secure the insulation between adjacent electrodes by making the particle size of the conductive particles smaller than the space between adjacent electrodes. Thus, the content of the conductive particles is set to such a degree that the conductive particles do not come into contact with each other, and the electrical connection at the connection portion is obtained by ensuring that the conductive particles are present on the electrodes.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、例えば半導
体チップを基板と異方導電性接着フィルム等で接着固定
すると共に両者の電極どうしを電気的に接続することに
より得られる回路板のように、接続端子を有する回路部
材どうしを優れた接続信頼性で接続した電子部品装置を
提供するものである。SUMMARY OF THE INVENTION The present invention relates to a circuit board obtained by, for example, fixing a semiconductor chip to a substrate with an anisotropic conductive adhesive film or the like and electrically connecting both electrodes. Another object of the present invention is to provide an electronic component device in which circuit members having connection terminals are connected with excellent connection reliability.
【０００４】[0004]
【課題を解決するための手段】本発明の電子部品は、第
一の接続端子を有する電子部品と、絶縁基板の表面に形
成された第二の接続端子を備える実装用基板とを、第一
の接続端子と第二の接続端子を対向して配置し、前記対
向配置した第一の接続端子と第二の接続端子の間に接着
剤を介在させ、加圧して前記対向配置した第一の接続端
子と第二の接続端子を電気的に接続させた電子部品装置
であって、第一の接続端子と対向配置し加圧され電気的
に接続された第二の接続端子は、接続前と比較した変位
が１０〜５０μｍであることを特徴とするものである。
第二の接続端子が形成される実装用基板の絶縁基板面に
は、１５０℃での弾性率が１〜５００ＭＰａの絶縁材
層、さらには１５０℃での弾性率が１〜５００ＭＰａか
つ２５℃での弾性率が５０〜３５００ＭＰａの絶縁材層
が形成されているものが好ましい。接着剤が、異方導電
性接着剤ご使用され、電子部品としたは半導体チップご
好ましい。An electronic component according to the present invention comprises an electronic component having a first connection terminal and a mounting substrate having a second connection terminal formed on the surface of an insulating substrate. The connection terminal and the second connection terminal are arranged to face each other, an adhesive is interposed between the first connection terminal and the second connection terminal arranged opposite to each other, and the first and second connection terminals are pressed and arranged. An electronic component device in which a connection terminal and a second connection terminal are electrically connected, wherein the second connection terminal that is disposed opposite to the first connection terminal and is electrically connected by being pressed is connected before and after connection. The displacement is 10 to 50 μm.
On the insulating substrate surface of the mounting substrate on which the second connection terminals are formed, an insulating layer having an elastic modulus at 150 ° C. of 1 to 500 MPa, and an elastic modulus at 150 ° C. of 1 to 500 MPa and 25 ° C. Preferably, an insulating material layer having an elastic modulus of 50 to 3500 MPa is formed. As the adhesive, an anisotropic conductive adhesive is used, and the electronic component is preferably a semiconductor chip.
【０００５】[0005]
【発明の実施の形態】本発明において、電子部品として
は半導体チップ、トランジスタ、ダイオ−ド、サイリス
タ等の能動素子、コンデンサ、抵抗体、コイル等の受動
素子等のチップ部品、プリント基板等の基板等が用いら
れる。電子部品を実装用基板に加熱加圧することによ
り、対向配置した接続端子どうしは、直接接触により又
は異方導電性接着剤の導電粒子を介して電気的に接続す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, electronic components include semiconductor chips, transistors, diodes, thyristors and other active devices, capacitors, resistors, and passive components such as coils, chip components such as printed circuit boards, and the like. Are used. When the electronic component is heated and pressurized on the mounting substrate, the connection terminals arranged opposite to each other are electrically connected by direct contact or via conductive particles of an anisotropic conductive adhesive.
【０００６】本発明における実装用基板は、絶縁層の最
外層となる絶縁層にガラスクロスを含まない樹脂フィル
ムを用いることもできる。この樹脂フィルムはエポキシ
樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、変成ポ
リフェニレンエーテル樹脂、フェノキシ樹脂、アミドエ
ポキシ樹脂、フェノール樹脂やこれらの混合物、共重合
物等が使用できる。またポリサルフォン、ポリエーテル
サルフォン、ポリエーテルエーテルケトン、全芳香族液
晶ポリエステル、フッ素系樹脂などの耐熱性熱可塑性エ
ンジニヤリングプラスチックのフィルムも使用できる。
前記樹脂フィルム中に有機もしくは無機のフィラーを含
むものが使用できる。In the mounting substrate of the present invention, a resin film containing no glass cloth can be used for the insulating layer which is the outermost layer of the insulating layer. As the resin film, an epoxy resin, a polyimide resin, a polyamide imide resin, a modified polyphenylene ether resin, a phenoxy resin, an amide epoxy resin, a phenol resin, a mixture thereof, a copolymer, or the like can be used. Further, a film of a heat-resistant thermoplastic engineering plastic such as polysulfone, polyethersulfone, polyetheretherketone, wholly aromatic liquid crystal polyester, or a fluorine resin can also be used.
A resin film containing an organic or inorganic filler can be used.
【０００７】本発明において用いられる接着剤として
は、フィルム状、液状を用いることができるが、フィル
ム状は、液状のように塗付または印刷法で基板に形成す
るのではなく、配置するだけで接着工程に入ることがで
き取扱性が容易であるだけでなく、接続端子の高さを考
慮した膜厚の制御が容易であるという特徴を有しており
好適である。接着剤としては、熱可塑性高分子や熱、電
子線、光などのエネルギによって硬化する架橋型高分子
が好ましく、中でもエポキシ系樹脂、シアネートエステ
ル樹脂、イミド系樹脂が好ましい。また、これらの樹脂
に可とう性、フィルム形成性を付与する目的で熱可塑性
高分子を混合することができる。接着は、加圧、加熱に
よって行われるので、加熱時の接着剤の溶融粘度が高す
ぎると接着剤が排除されず、電気的導通を確保できない
ので、接着剤の接着加熱温度における溶融粘度は１００
０ポイズ以下にするのが好ましい。The adhesive used in the present invention may be in the form of a film or a liquid, but the film is not formed on the substrate by coating or printing as in the case of a liquid, but is merely arranged. It is suitable because it has a feature that it can enter the bonding step and is easy to handle, and it is easy to control the film thickness in consideration of the height of the connection terminal. As the adhesive, a thermoplastic polymer or a crosslinked polymer that is cured by energy such as heat, electron beam, or light is preferable, and among them, an epoxy resin, a cyanate ester resin, and an imide resin are preferable. Further, a thermoplastic polymer can be mixed with these resins for the purpose of imparting flexibility and film formability. Since the bonding is performed by applying pressure and heating, if the melt viscosity of the adhesive at the time of heating is too high, the adhesive is not removed, and electrical conduction cannot be secured. Therefore, the melt viscosity of the adhesive at the bonding heating temperature is 100.
It is preferable to make it 0 poise or less.
【０００８】本発明における接着剤は、チップと基板の
熱膨張係数の違いに基づく応力を緩和する目的で接着後
の４０℃での弾性率が１００〜４０００ＭＰａが好まし
く、特に１００〜１５００ＭＰａであれば特に好まし
い。例えば、接着剤として、エポキシ樹脂とイミダゾー
ル系、ヒドラジド系、三フッ化ホウ素-アミン錯体、ス
ルホニウム塩、アミンイミド、ポリアミンの塩、ジシア
ンジアミド等の潜在性硬化剤の混合物に、接着後の４０
℃での弾性率が１００〜１５００ＭＰａになるようにア
クリルゴムを配合した接着剤があげられる。接着フィル
ム硬化物の弾性率は、例えば、レオロジ（株）製レオス
ペクトラＤＶＥ−４（引っぱりモード、周波数１０Ｈ
ｚ、５℃／ｍｉｎで昇温）を使用して測定できる。The adhesive in the present invention preferably has an elastic modulus at 40 ° C. of 100 to 4000 MPa after bonding for the purpose of relieving the stress based on the difference in the thermal expansion coefficient between the chip and the substrate, especially if it is 100 to 1500 MPa. Particularly preferred. For example, as an adhesive, a mixture of an epoxy resin and a latent curing agent such as an imidazole-based, hydrazide-based, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, etc.
An adhesive compounded with an acrylic rubber so that the elastic modulus at 100 ° C. is 100 to 1500 MPa can be used. The modulus of elasticity of the cured adhesive film is, for example, Rheological Co., Ltd. Rheospectra DVE-4 (pulling mode, frequency 10H).
z, the temperature is raised at 5 ° C./min).
【０００９】本発明で用いるアクリルゴムとしては、ア
クリル酸、アクリル酸エステル、メタクリル酸エステル
またはアクリロニトリルのうち少なくともひとつをモノ
マー成分とした重合体または共重合体があげられ、中で
もグリシジルエーテル基を含有するグリシジルアクリレ
ートやグリシジルメタクリレートを含む共重合体系アク
リルゴムが好適に用いられる。これらアクリルゴムの分
子量は、接着剤の凝集力を高める点から２０万以上が好
ましい。アクリルゴムの接着剤中の配合量は、１５ｗｔ
％以下であると接着後の４０℃での弾性率が１５００Ｍ
Ｐａを越えてしまい、また４０ｗｔ％以上になると低弾
性率化は図れるが接続時の溶融粘度が高くなり接続電極
界間、または接続電極と導電粒子界面の溶融接着剤の排
除性が低下するため、接続電極間または接続電極と導電
粒子間の電気的導通を確保できなくなる。このため、ア
クリル配合量としては１５〜４０ｗｔ％が好ましい。接
着剤に配合されたこれらのアクリルゴムは、ゴム成分に
起因する誘電正接のピーク温度が４０〜６０℃付近にあ
るため、接着剤の低弾性率化を図ることができる。The acrylic rubber used in the present invention is a polymer or copolymer containing at least one of acrylic acid, acrylic acid ester, methacrylic acid ester and acrylonitrile as a monomer component. Among them, it contains a glycidyl ether group. A copolymer acrylic rubber containing glycidyl acrylate or glycidyl methacrylate is preferably used. The molecular weight of these acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive. The amount of acrylic rubber in the adhesive is 15 wt.
% Or less, the elastic modulus at 40 ° C. after bonding is 1500M.
If it exceeds Pa, and if it exceeds 40 wt%, the modulus of elasticity can be reduced, but the melt viscosity at the time of connection increases, and the removability of the molten adhesive between the connection electrode boundaries or at the interface between the connection electrode and the conductive particles decreases. As a result, it becomes impossible to secure electrical continuity between the connection electrodes or between the connection electrodes and the conductive particles. Therefore, the acrylic compounding amount is preferably 15 to 40% by weight. These acrylic rubbers compounded in the adhesive have a peak temperature of dielectric loss tangent due to the rubber component in the vicinity of 40 to 60 ° C., so that the elastic modulus of the adhesive can be reduced.
【００１０】本発明に用いられる接着剤には、チップの
バンプや回路電極の高さばらつきを吸収するために、異
方導電性を積極的に付与する目的で導電粒子を分散する
こともできる。本発明において導電粒子は例えばＡｕ、
Ｎｉ、Ａｇ、Ｃｕ、Ｗやはんだなどの金属粒子またはこ
れらの金属粒子表面に金やパラジウムなどの薄膜をめっ
きや蒸着によって形成した金属粒子であり、ポリスチレ
ン等の高分子の球状の核材にＮｉ、Ｃｕ、Ａｕ、はんだ
等の導電層を設けた導電粒子を用いることができる。In the adhesive used in the present invention, conductive particles can be dispersed for the purpose of positively imparting anisotropic conductivity in order to absorb height variations of chip bumps and circuit electrodes. In the present invention, the conductive particles are, for example, Au,
Metal particles such as Ni, Ag, Cu, W and solder, or metal particles formed by plating or depositing a thin film of gold or palladium on the surface of these metal particles. , Cu, Au, a conductive particle provided with a conductive layer of solder or the like can be used.
【００１１】粒径は基板の電極の最小の間隔よりも小さ
いことが必要で、電極の高さばらつきがある場合、高さ
ばらつきよりも大きいことが好ましく、１μｍ〜１０μ
ｍが好ましい。また、接着剤に分散される導電粒子量
は、０．１〜３０体積％であり、好ましくは０．２〜１
５体積％である。It is necessary that the particle size is smaller than the minimum distance between the electrodes of the substrate, and if there is a variation in the height of the electrodes, it is preferably larger than the variation in the height.
m is preferred. The amount of the conductive particles dispersed in the adhesive is 0.1 to 30% by volume, preferably 0.2 to 1%.
5% by volume.
【００１２】本発明における半導体チップの接続電極に
は、金、ニッケル、ハンダ等をめっきし突起電極とした
めっきバンプ、また 金、アルミニウム等の金属ワイヤ
の先端を熱エネルギによりボール状としこのボールを接
続端子が構成される半導体チップの電極パッド上に圧着
した後前記金属ワイヤを切断して構成された突起電極で
あるボールバンプ、はんだボール、溶融はんだ成形バン
プ、カラムの半田付け等による突起電極が使用できる。The connection electrodes of the semiconductor chip according to the present invention are plated bumps formed by plating gold, nickel, solder, or the like, and the tips of metal wires, such as gold and aluminum, are formed into a ball shape by thermal energy. The bump electrodes formed by cutting the metal wire after being pressed onto the electrode pads of the semiconductor chip on which the connection terminals are formed are ball bumps, solder balls, molten solder molding bumps, and bump electrodes formed by column soldering. Can be used.
【００１３】[0013]
【実施例】実施例 金ワイヤから作製したワイヤバンプ（直径：５０μｍ
Φ、スペース３０μｍ、高さ：30μｍ、バンプ数２８
８）付きチップ（１０ｍｍ ｘ１０ｍｍ、厚み：０．５
ｍｍ）を半導体チップとして用いた。ガラスクロス・エ
ポキシ樹脂両面銅張り積層板であるMCL−E−679（日立
化成工業株式会社製、商品名）の表面銅はくを既存のサ
ブトラクト法で内層回路加工、内層接着処理を施す。次
に、該内層回路表面に先にドリル穴加工を施したガラス
クロスを有さない銅はく付エポキシ接着フィルムＭＣＦ
−３０００Ｅ（日立化成工業株式会社製、商品名）を１
７０℃、４０ｋｇｆ／ｃｍ2、６０分プレス積層接着
し、スルホール穴あけ、無電解銅めっき、サブトラクト
法による外層回路加工及び無電解ニッケル／金めっきを
施し実装基板を得た。ニッケル粒子（直径：５μｍ）を
２ｖｏｌ％分散したエポキシ系接着フィルムからなる異
方導電フィルム（厚み：５０ミクロン）を実装基板に８
０℃、１０ｋｇｆ／ｃｍ2で貼りつけた後、半導体チッ
プのバンプと実装基板（厚み：０．８ｍｍ）の位置あわ
せを行った。ついで、１８０℃、３０ｇ／バンプ、２０
秒の条件でチップ上方から加熱、加圧を行い、本接続を
行った。本接続後、半導体チップのバンプと電気的に接
続された実装基板の電極は、接続前に比較し、１５〜２
０ミクロン絶縁層中に埋設していた。本接続後の接続抵
抗は、１バンプあたり最高で６ｍΩ、平均で２ｍΩ、絶
縁抵抗は１０8Ω以上であり、これらの値は−５５〜１
２５℃の熱衝撃試験１０００サイクル処理、ＰＣＴ試験
（１２１℃、２気圧）２００時間、２６０℃のはんだバ
ス浸漬１０秒後においても変化がなく、良好な接続信頼
性を示した。EXAMPLE A wire bump (diameter: 50 μm) made from a gold wire
Φ, space 30 μm, height: 30 μm, number of bumps 28
8) With tip (10mm x 10mm, thickness: 0.5)
mm) was used as a semiconductor chip. The surface copper foil of MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.), a glass-cloth / epoxy resin double-sided copper-clad laminate, is subjected to inner layer circuit processing and inner layer bonding by the existing subtract method. Next, an epoxy adhesive film MCF having no glass cloth and having a drilled hole previously formed on the inner layer circuit surface.
-3000E (manufactured by Hitachi Chemical Co., Ltd., trade name) 1
Press-lamination bonding was performed at 70 ° C., 40 kgf / cm 2 for 60 minutes, through-hole drilling, electroless copper plating, outer layer circuit processing by a subtract method, and electroless nickel / gold plating were performed to obtain a mounting substrate. An anisotropic conductive film (thickness: 50 μm) made of an epoxy-based adhesive film in which nickel particles (diameter: 5 μm) are dispersed by 2 vol% is mounted on a mounting substrate.
After bonding at 0 ° C. and 10 kgf / cm 2 , the bumps of the semiconductor chip and the mounting substrate (thickness: 0.8 mm) were aligned. Then, at 180 ° C., 30 g / bump, 20
Heating and pressurizing were performed from above the chip under the condition of seconds, and the main connection was performed. After the actual connection, the electrodes of the mounting substrate electrically connected to the bumps of the semiconductor chip are 15 to 2 times smaller than before the connection.
It was embedded in a 0 micron insulating layer. The connection resistance after the main connection is 6 mΩ at the maximum per bump, 2 mΩ on average, and the insulation resistance is 10 8 Ω or more.
Even after 1000 cycles of a thermal shock test at 25 ° C., 200 hours of PCT test (121 ° C., 2 atm), and 10 seconds after immersion in a solder bath at 260 ° C., good connection reliability was exhibited.
【００１４】[0014]
【発明の効果】本発明により、半導体チップ等の電子部
品と実装基板との接続信頼性に優れる半導体装置等の電
子部品装置を得ることができる。本発明によれば、実装
基板の電極が接続後基板中に埋没するため、半導体チッ
プのバンプや実装基板電極のばらつきを吸収できるとと
もにチップと実装基板の熱膨張係数差に基づく応力を低
弾性率の実装基板表層によって緩和できるため、熱衝
撃、ＰＣＴやはんだバス浸漬試験などの信頼性試験後に
おいても接続部での接続抵抗の増大や接着剤の剥離がな
く、回路板の接続信頼性が大幅に向上する。According to the present invention, it is possible to obtain an electronic component device such as a semiconductor device having excellent connection reliability between an electronic component such as a semiconductor chip and a mounting board. According to the present invention, since the electrodes of the mounting substrate are buried in the substrate after connection, it is possible to absorb variations in the bumps of the semiconductor chip and the electrodes of the mounting substrate, and to reduce the stress based on the difference in thermal expansion coefficient between the chip and the mounting substrate with a low elastic modulus. The reliability of the circuit board is not increased even after reliability tests such as thermal shock, PCT and solder bath immersion tests, because there is no increase in connection resistance or adhesive peeling at the connection part. To improve.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浦崎 直之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 島田 靖 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 中祖 昭士 茨城県つくば市和台48 日立化成工業株式 会社筑波開発研究所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoyuki Urasaki 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd. Inside the Shimodate Research Laboratory (72) Inventor Akishi Nakaso 48 Tsudai, Tsukuba, Ibaraki Prefecture Tsukuba Development Laboratory, Hitachi Chemical Co., Ltd.
Claims (5)
装用基板とを、 第一の接続端子と第二の接続端子を対向して配置し、 前記対向配置した第一の接続端子と第二の接続端子の間
に接着剤を介在させ、加圧して前記対向配置した第一の
接続端子と第二の接続端子を電気的に接続させた電子部
品装置であって、 第一の接続端子と対向配置し加圧され電気的に接続され
た第二の接続端子は、接続前と比較した変位が１０〜５
０μｍであることを特徴とする電子部品装置。An electronic component having a first connection terminal, and a mounting substrate having a second connection terminal formed on a surface of an insulating substrate, wherein the first connection terminal and the second connection terminal are opposed to each other. An adhesive is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, and the first connection terminal and the second connection terminal disposed opposite each other by applying pressure to electrically connect the first connection terminal and the second connection terminal. The electronic component device is connected to the first connection terminal, and the second connection terminal, which is disposed opposite to the first connection terminal and is electrically connected under pressure, has a displacement of 10 to 5 compared to before connection.
An electronic component device having a thickness of 0 μm.
基板の絶縁基板面には、１５０℃での弾性率が１〜５０
０ＭＰａの絶縁材層が形成されている請求項１記載の電
子部品装置。2. An elastic substrate at 150 ° C. having an elastic modulus of 1 to 50 on a surface of an insulating substrate of a mounting substrate on which a second connection terminal is formed.
2. The electronic component device according to claim 1, wherein an insulating material layer of 0 MPa is formed.
の絶縁基板面には、１５０℃での弾性率が１〜５００Ｍ
Ｐａかつ２５℃での弾性率が５０〜３５００ＭＰａの絶
縁材層が形成されている請求項１記載の電子部品装置。3. An elastic substrate at 150 ° C. having an elastic modulus of 1 to 500 M on an insulating substrate surface of a mounting substrate on which a second connection terminal is formed.
The electronic component device according to claim 1, wherein an insulating material layer having a Pa and an elastic modulus at 25 ° C. of 50 to 3500 MPa is formed.
項１〜３各項記載の電子部品装置。4. The electronic component device according to claim 1, wherein the adhesive is an anisotropic conductive adhesive.
〜４各項記載の電子部品装置。5. The electronic component according to claim 1, wherein the electronic component is a semiconductor chip.
An electronic component device according to any one of Items 4 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02010498A JP3835583B2 (en) | 1998-02-02 | 1998-02-02 | Electronic component equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02010498A JP3835583B2 (en) | 1998-02-02 | 1998-02-02 | Electronic component equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11219979A true JPH11219979A (en) | 1999-08-10 |
| JP3835583B2 JP3835583B2 (en) | 2006-10-18 |
Family
ID=12017815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02010498A Expired - Fee Related JP3835583B2 (en) | 1998-02-02 | 1998-02-02 | Electronic component equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3835583B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005020018A (en) * | 2004-07-30 | 2005-01-20 | Sony Chem Corp | Adhesive and electrical device |
-
1998
- 1998-02-02 JP JP02010498A patent/JP3835583B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005020018A (en) * | 2004-07-30 | 2005-01-20 | Sony Chem Corp | Adhesive and electrical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3835583B2 (en) | 2006-10-18 |
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