JPH11217489A - Insulation layer resin composition for multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation layer resin composition which can inexpensively form a resin insulation layer having excellent heat resistance and can form an electrolessly plated film in good reliability when used in a multilayer printed wiring board having a conductor circuit comprising a plurality of electrolessly plated films electrically insulated with a resin insulation layer. SOLUTION: This composition essentially consists of (A) an ultraviolet-curing resin obtained by reacting a reaction product of a bisphenol epoxy compound with an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic acid anhydride, (B) a polyfunctional epoxy compound, (C) an epoxy compound having at least two alicyclic epoxy groups, (D) an epoxy compound having a (meth)acrylic group and an epoxy group in the molecule, (E) a photopolymerization initiator, (F) a filler, and (G) a diluent, is developable with an dilute alkali solution, and has photocurability and heat curability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and its manufacture, and more particularly, to a conductor circuit comprising a plurality of electroless plating films electrically insulated by a resin insulating layer made of a heat-resistant resin. The present invention relates to a resin composition for an insulating layer for a multilayer printed wiring board, comprising:

[0002]

2. Description of the Related Art In recent years, with the advance of electronic technology, electronic devices such as large-sized computers have been increased in density or operation functions. As a result, multilayer printed wiring boards in which wiring circuits are formed in multiple layers have been spotlighted for the purpose of increasing the density of printed wiring boards.

Conventionally, a typical multilayer printed wiring board is, for example, a multilayer printed wiring board in which an internal circuit is connected and made conductive. However, such a multilayer printed wiring board has a plurality of internal circuits that pass through. Since the connection is conducted through the holes, the wiring circuit becomes too complicated, and it has been difficult to realize high density and high speed.

[0004] As a multilayer printed wiring board capable of overcoming such problems, a multilayer printed wiring board in which conductive circuits and organic insulating films are alternately built up has been developed recently. This multilayer printed wiring board is suitable for ultra-high density and high speed, but has a drawback in that it is difficult to form an electroless plating film on an organic insulating film with high reliability.

For this reason, in such a multilayer printed wiring board, a conductor circuit is formed by a PV such as evaporation or sputtering.
Although the formation is performed by the D method or the combined use of the PVD method and the electroless plating, such a method of forming a conductor circuit by the PVD method is inferior in productivity and increases cost.

[0006] Recently, as a method for forming an electroless plating film on such an organic insulating film with high reliability, a component soluble in an acid or an oxidizing agent is mixed into a resin insulating layer and dissolved and removed. A method of roughening a surface in contact with electroless plating has been proposed. For example, as described in JP-A-64-47095, a heat-resistant resin insulating layer is used as a matrix, and an epoxy resin soluble in an oxidizing agent is contained in the resin layer.
By mixing a resin such as bismaleimide / triazine resin or polyester resin with a resin or filler insoluble in an oxidizing agent, the surface of the resin insulating layer can be roughened with an oxidizing agent to enhance the anchor effect of electroless plating film formation. Proposed.

In order to further enhance these effects, for example, as described in Japanese Patent Application Laid-Open No. 7-34505, pseudo particles having different sizes of resin particles soluble in an oxidizing agent are used. And mixed with a heat-resistant matrix resin layer.

[0008]

However, in these methods, the heat resistance of the resin modifier itself such as resin particles dissolved in the heat-resistant resin insulating layer with an oxidizing agent or the like is inferior. There has been a problem that the heat resistance of the resin insulating layer formed as described above is reduced.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to provide a plurality of electroless plating films which are electrically insulated by a resin insulating layer made of a heat-resistant resin. An object of the present invention is to provide an insulating layer resin composition for a multilayer printed wiring board which can form a resin insulating layer at low cost, has excellent heat resistance, and reliably forms an electroless plated film in a multilayer printed wiring board having a conductor circuit.

[0010]

Means for Solving the Problems In order to achieve the above object in the present invention, first, in the invention of claim 1, at least a reaction product of a bisphenol type epoxy compound and an unsaturated monocarboxylic acid is saturated or unsaturated. UV-curable resin (A) obtained by reacting with saturated polybasic anhydride, polyfunctional epoxy compound (B), epoxy compound having two or more alicyclic epoxy groups (C), It comprises an epoxy compound (D) having a (meth) acrylic group and an epoxy group, a photopolymerization initiator (E), a filler (F), and a diluent (G). An insulating layer resin composition for a multilayer printed wiring board characterized by having thermosetting properties.

In the invention of claim 2, the epoxy compound (C) having two or more alicyclic epoxy groups is
The insulating layer resin composition for a multilayer printed wiring board according to claim 1, which has a 3,4-epoxycyclohexyl group or a 3,4-epoxycyclohexylmethyl group.

In the invention according to claim 3, the epoxy compound (D) having a (meth) acrylic group and an epoxy group in the molecule is an acrylate or methacrylate having a 3,4-epoxycyclohexylmethyl group. The resin composition for an insulating layer for a multilayer printed wiring board according to claim 1 or 2, wherein

Further, in the invention of claim 4, the polyfunctional epoxy compound (B) has a general formula

Embedded image 4. The insulating layer resin composition for a multilayer printed wiring board according to claim 1, wherein m and n are natural numbers, and R represents an alkyl group or an amine. It was done.

[0014]

Embodiments of the present invention will be described below. First, a reaction product of a bisphenol type epoxy compound and an unsaturated monocarboxylic acid as a photocurable resin constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention,
In the ultraviolet-curable resin (A) obtained by reacting a saturated or unsaturated polybasic anhydride, bis (4-hydroxyphenyl) is a specific example of the bisphenol component.
Ketone, bis (4-hydroxy-3,5-dimethylphenyl) ketone, bis (4-hydroxy-3,5-dichlorophenyl) ketone, bis (4-hydroxyphenyl)
Sulfone, bis (4-hydroxy-3,5-dimethylphenyl) sulfone, bis (4-hydroxy-3,5
-Dichlorophenyl) sulfone, bis (4-hydroxyphenyl) methane, bis (4-hydroxy-3,5-
Dimethylphenyl) methane, bis (4-hydroxy-3,
5-dichlorophenyl) methane, bis (4-hydroxyphenyl) hexafluoropropane, bis (4hydroxy-3,5-dimethylphenyl) hexafluoropropane, bis (4-hydroxy-3,5-dichlorophenyl) hexafluoropropane, Bis (4-hydroxyphenyl) dimethylsilane, bis (4-hydroxy-3,
5-dimethylphenyl) dimethylsilane, bis (4-hydroxy-3,5-dichlorophenyl) dimethylsilane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dimethyl Phenyl) propane, 2,2-bis (4-hydroxy-
3,5-dichlorophenyl) propane, bis (4-hydroxyphenyl) ether, bis (4-hydroxy-
3,5-dimethylphenyl) ether, bis (4-hydroxy-3,5-dichlorophenyl) ether and the like.

[0015] Specific examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, and cinnamic acid.

Specific examples of the above-mentioned saturated or unsaturated polybasic anhydrides include, for example, maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, Dibasic acid anhydrides such as methylhexahydrophthalic anhydride, endmethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride; trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, etc. Aromatic polycarboxylic acid anhydrides; and other accompanying compounds, for example, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1
And polyvalent carboxylic acid anhydride derivatives such as 2-dicarboxylic acid anhydride.

The polyfunctional epoxy compound (B) constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention.
Specific examples of epoxy resins include phenyl novolak epoxy resin, cresol novolak epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, and alicyclic epoxy resin. And
Compounds having at least three or more epoxy groups such as phenyl glycidyl ether, p-butylphenol glycidyl ether, triglycidyl isocyanate, diglycidyl isocyanate, allyl glycidyl ether, and glycidyl methacrylate are exemplified. In addition, a system using various derivatives of cyclohexene oxide, a hydrogenated compound of the aromatic epoxy, or an alicyclic epoxy compound having the structure shown in claim 4 has a high glass transition temperature, and thus has a high heat resistance. Excellent, especially desirable.

The epoxy compound (C) having two or more alicyclic epoxy groups constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention is, for example, 3,4-epoxycyclohexylmethyl-3. 3,4-epoxycyclohexanecarboxylate and its caprolactone modified product, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate trimethylcaprolactone modified product, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane And valerolactone modified carboxylate. Also, the general formula

Embedded image (Wherein, n1 and n2 represent 0 or a natural number of 1 or more, and may be the same or different from each other) and a general formula

Embedded image (Where n1 to n4 represent 0 or a natural number of 1 or more,
They may be the same or different. )).

The epoxy compound (D) having a (meth) acrylic group and an epoxy group in the molecule constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention includes, for example, glycidyl acrylate and glycidyl. Methacrylate, methyl glycidyl acrylate, methyl glycidyl methacrylate, 9,10-epoxystearyl acrylate, 9,10-epoxystearyl methacrylate, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl Examples include methylcaprolactone acrylate and 3,4-epoxycyclohexylmethylcaprolactone methacrylate. Among these, a system having a 3,4-epoxycyclohexylmethyl group is excellent in stability when mixed with other materials, and is particularly desirable.

Further, as the photopolymerization initiator (E) constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention, for example, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p- Dimethylaminopropiophenone, dichloroacetophenone,
Acetophenones such as trichloroacetophenone and p-tert-butylacetophenone; benzophenone;
Benzophenones such as chlorobenzophenone and p, p'-bisdimethylaminobenzophenone; benzoin ethers such as benzoin, benzoin methyl ether, benzoin isopropyl ether and benzoin isobutyl ether; benzyldimethyl ketal, thioxanthone, and 2-chlorothioxanthone , 2,4-diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone and other sulfur compounds, 2-ethylanthraquinone, octamethylanthraquinone, 1,2-
Anthraquinones such as benzanthraquinone and 2,3-diphenylanthraquinone; organic peroxides such as azobisisobutyronitrile, benzoyl peroxide and cumene peroxide; 2-mercaptobenzimidazole; 2-mercaptobenzoxazole; Thiol compounds such as mercaptobenzothiazole; These compounds may be used in combination of two or more. In addition, although it does not act as a photopolymerization initiator (C) by itself, a compound that increases the ability of the photopolymerization initiator by using in combination with the above compound can also be added. Such compounds include, for example, tertiary amines such as triethanolamine, which are effective when used in combination with benzophenone.

As the filler (F) constituting the insulating layer resin composition for a multilayer printed wiring board of the present invention, for example, an organic filler such as a fluororesin, a polyimide resin or a benzoguanamine resin, or silica or talc, Inorganic fillers such as alumina, clay, calcium carbonate, titanium oxide and barium sulfate can be blended.

As the diluent (G) suitable for preparing a solution of the insulating layer resin composition for a multilayer printed wiring board of the present invention, usually, a solvent such as methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, etc.
Butyl cellosolve, butyl cellosolve acetate, butyl carbitol, butyl cellulose, tetralin, dimethylformamide, normal methylpyrrolidone and the like.

Further, in the resin composition for the insulating layer, if necessary, an epoxy group curing accelerator, a thermal polymerization inhibitor, a plasticizer, a leveling agent, a defoaming agent, an ultraviolet absorber, a flame retardant, etc. It is possible to add an additive or a coloring pigment.

Next, a method for manufacturing a multilayer printed wiring board according to the present invention will be specifically described. First, the above-mentioned photosensitive resin insulating layer is formed on a substrate on which a conductive circuit is formed. As the substrate, for example, a plastic substrate, a ceramic substrate, a metal substrate, a film substrate, or the like can be used.Specifically, a glass epoxy substrate, a bismaleimide-triazine substrate, an aluminum substrate, an iron substrate, a polyimide substrate, or the like is used. can do.

As a method of forming the resin insulating layer on the substrate on which the conductor circuit is formed, a solution of the above-described photosensitive insulating layer resin composition is coated by, for example, a roller coating method.
A method of applying by various methods such as a dip coating method, a spray coating method, a spinner coating method, a curtain coating method, a slot coating method, a screen printing method, or a resin film obtained by processing the insulating layer resin composition into a film. It is also possible to apply the method.

The preferable thickness of the resin insulating layer in the present invention is usually about 20 to 100 μm, but it can be larger when particularly high insulating property is required.

Subsequently, on the resin insulating layer obtained above,
The exposed portion is cured by irradiating with an actinic ray through a negative film, and further, a so-called alkali development is performed using a weak alkaline aqueous solution to elute the unexposed portion.

Examples of the actinic ray include light oscillated from a lamp such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, and a metal halide lamp, and are preferably used for curing an exposed portion.

Examples of the alkaline aqueous solution include an aqueous sodium carbonate solution, an aqueous sodium hydrogen carbonate solution, an aqueous diethanolamine solution, an aqueous triethanolamine solution,
An aqueous solution of ammonium hydroxide, an aqueous solution of sodium hydroxide, and the like can be given. Among them, an aqueous solution of sodium carbonate has an appropriate alkalinity, and is safe and particularly preferable in a work environment unlike strong alkalis such as sodium hydroxide.

Next, after alkali development, it is desirable to carry out an epoxy curing treatment by heating to improve alkali resistance. In the insulating resin composition for a multilayer printed wiring board of the present invention, by performing the heat treatment, not only the durability against strong alkaline water is remarkably improved, but also the adhesion to metals such as glass and copper, heat resistance, Various properties such as surface hardness are also improved.

Subsequently, after the surface of the resin insulation layer which has been subjected to the heat treatment as described above is subjected to a surface roughening treatment using an acid or an oxidizing agent, electroless plating and electrolytic plating are performed.
A multilayer printed wiring board is manufactured by forming a conductor circuit.

The electroless plating method is preferably, for example, at least one of electroless copper plating, electroless nickel plating, electroless gold plating, electroless silver plating, and electroless tin plating. is there. It should be noted that, after the electroless plating is performed, a different type of electroless or electrolytic plating may be performed, or a solder may be coated.

According to the present invention, a conductive circuit can be formed by various methods conventionally used for a printed wiring board. For example, after a substrate is subjected to electroless plating and electrolytic plating, A method of etching a circuit, a method of directly forming a circuit when performing electroless plating, and the like can be applied.

As described above, in the multilayer printed wiring board having a conductor circuit composed of a plurality of electrically insulated electroless plated films, the low insulating resin composition for a multilayer printed wiring board according to the present invention described above. By using as a resin insulating layer, it is possible to provide a multilayer printed wiring board that is inexpensive, has excellent heat resistance, and is formed with an electroless plated film with high reliability.

[0035]

Next, the present invention will be described more specifically with reference to examples. <Example 1> An acid value of about 158 (mg KOH / mg) obtained by reacting bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Polymer Co., Ltd.) with phthalic anhydride
g) 50 parts by weight of an ultraviolet curable resin (A), 12 parts by weight of an epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B), 5 parts by weight of an alicyclic epoxy resin celloxide 2021 (manufactured by Daicel Chemical), (C) 14 parts by weight of 3,4-epoxycyclohexylmethyl methacrylate (M-100, manufactured by Daicel Chemical Industries) (D), 15 parts by weight of silica fine powder as a filler (F), 0.5 part by weight of a leveling agent (manufactured by BYK-Chemie), Photopolymerization initiator (E) TPO (BA
3.5 parts by weight (manufactured by SF Corporation) were mixed with a propylene glycol monomethyl ether acetate solvent (G) and stirred, and then kneaded with three rolls to obtain a solution of a photosensitive insulating layer resin composition.

Using a slot coater, the solution of the insulating layer resin composition obtained above was applied to a degreased and washed copper-clad glass epoxy substrate to a thickness of about 40 μm and dried. / Cm ² at 30 ° C. and 1 ° C. with an organic amine-based alkaline developer.
For a minute, and unexposed portions were removed. After that, heat curing was performed at 100 ° C. for 1 hour and further at 200 ° C. for 1 hour using a drying oven to form a resin insulating layer.

The substrate on which the resin insulating layer was formed was plated with copper having a thickness of 25 μm in a normal copper plating step of a printed circuit board to obtain a printed wiring board.

<Example 2> Bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Polymer Co., Ltd.)
Value obtained by reacting phthalic anhydride with phthalic anhydride
(MgKOH / g) 50 parts by weight of an ultraviolet curable resin (A), 11 parts by weight of epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B), alicyclic epoxy resin celloxide 2081 (manufactured by Daicel Chemical) (C) 7 Parts by weight, 3,
4-epoxycyclohexylmethyl methacrylate (M
-100, manufactured by Daicel Chemical Industries, Ltd.) (D) 13 parts by weight, 15 parts by weight of silica fine powder as a filler (F), 0.5 parts by weight of a leveling agent (manufactured by Big Chemie), photopolymerization initiator (E) TPO (BASF 3.5 parts by weight of propylene glycol monomethyl ether acetate solvent (G)
Was added and stirred, and kneaded with three rolls to obtain a solution of a photosensitive insulating layer resin composition.

Thereafter, a resin insulating layer was formed by the same material, operation and the like as in Example 1, and copper plating was performed to obtain a printed wiring board.

<Example 3> Bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Polymer Co., Ltd.)
Value obtained by reacting phthalic anhydride with phthalic anhydride
(MgKOH / g) UV curable resin (A) 50 parts by weight, epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B) 10 parts by weight, alicyclic epoxy resin celloxide 2083 (manufactured by Daicel Chemical) (C) 10 Parts by weight,
3,4-epoxycyclohexylmethyl methacrylate (M-100, manufactured by Daicel Chemical Industries, Ltd.) (D) 11 parts by weight,
15 parts by weight of silica fine powder as filler (F), 0.5 parts by weight of a leveling agent (manufactured by BYK-Chemie), 3.5 parts by weight of photopolymerization initiator (E) TPO (manufactured by BASF), and propylene glycol monomethyl ether acetate solvent After adding (G) and stirring, the mixture was kneaded with three rolls to obtain a solution of a photosensitive insulating layer resin composition.

Thereafter, a resin insulating layer was formed by the same material, operation, and the like as in Example 1, and copper plating was performed to obtain a printed wiring board.

Example 4 Bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Polymer Co., Ltd.)
Value obtained by reacting phthalic anhydride with phthalic anhydride
(MgKOH / g) 50 parts by weight of an ultraviolet-curable resin (A), 12 parts by weight of an epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B), and 12 parts by weight of an alicyclic epoxy resin Epode GT301 (manufactured by Daicel Chemical) (C) 6 Parts by weight, 3,
4-epoxycyclohexylmethyl methacrylate (M
-100, manufactured by Daicel Chemical Industries, Ltd.) (D) 13 parts by weight, 15 parts by weight of silica fine powder as a filler (F), 0.5 parts by weight of a leveling agent (manufactured by Big Chemie), photopolymerization initiator (E) TPO (BASF 3.5 parts by weight of propylene glycol monomethyl ether acetate solvent (G)
Was added and stirred, and kneaded with three rolls to obtain a solution of a photosensitive insulating layer resin composition.

Thereafter, a resin insulating layer was formed by the same material, operation and the like as in Example 1, and copper plating was performed to obtain a printed wiring board.

Example 5 Bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Kogyo KK)
Value obtained by reacting phthalic anhydride with phthalic anhydride
(MgKOH / g) 50 parts by weight of an ultraviolet curable resin (A), 11 parts by weight of an epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B), and 7 parts by weight of an alicyclic epoxy resin Epode GT401 (manufactured by Daicel Chemical) (C) 7 Parts by weight, 3,
4-epoxycyclohexylmethyl methacrylate (M
-13, 13 parts by weight (D), 15 parts by weight of silica fine powder as filler (F), 0.5 part by weight of leveling agent (by Big Chemie), photopolymerization initiator (E) TPO (BASF) 3.5 parts by weight of propylene glycol monomethyl ether acetate solvent (G)
Was added and stirred, and kneaded with three rolls to obtain a solution of a photosensitive insulating layer resin composition.

Thereafter, a resin insulating layer was formed by the same material, operation and the like as in Example 1, and copper plating was performed to obtain a printed wiring board.

<Comparative Example 1> Bisphenol A type epoxy acrylate (Lipoxy VR-90, manufactured by Showa Polymer Co., Ltd.)
Value obtained by reacting phthalic anhydride with phthalic anhydride
(MgKOH / g) UV curable resin (A) 50 parts by weight, epoxy resin EHPE3150 (manufactured by Daicel Chemical) (B) 14 parts by weight, 3,4-epoxycyclohexylmethyl methacrylate (M-100, manufactured by Daicel Chemical) ) (D) 17 parts by weight, 15 parts by weight of silica fine powder as filler (F), leveling agent (by Big Chemie)
0.5 parts by weight of a photopolymerization initiator (E) 3.5 parts by weight of TPO (manufactured by BASF) was added to a propylene glycol monomethyl ether acetate solvent (G), and the mixture was stirred. Was obtained.

Thereafter, a resin insulating layer was formed by the same material, operation, and the like as in Example 1, and plated with copper to obtain a printed wiring board.

The adhesive strength between the insulating resin layer and the copper plating layer of the printed wiring boards obtained in the above Examples and Comparative Examples was measured by JI.
The values measured by the method of SC-6481 are shown in Table 1 as peel strength. In addition, the glass transition temperature was also measured by a dynamic viscoelasticity measurement device at the same time, and is shown in Table 1. The heat resistance was evaluated.

[0049]

[Table 1]

As is clear from Table 1, in Examples 1 to 5, the desired physical properties, that is, the properties excellent in heat resistance and adhesion of electroless plating were able to be obtained. Although the heat resistance value was sufficient, the peel strength of the electroless plating layer was low, and the formation of the electroless plating layer was unreliable.

[0051]

As described above, the present invention has the following effects. That is, at least an ultraviolet curable resin (A) obtained by reacting a reaction product of a bisphenol type epoxy compound with an unsaturated monocarboxylic acid with a saturated or unsaturated polybasic anhydride, and a polyfunctional epoxy compound (B) Epoxy compound (C) having two or more alicyclic epoxy groups, epoxy compound (D) having (meth) acrylic group and epoxy group in the molecule, photopolymerization initiator (E), filler (F) ), Diluent (G),
Conductive circuit consisting of a plurality of electroless plating films electrically insulated by a resin insulating layer because it is a photocurable and thermosetting insulating layer resin composition for multilayer printed wiring boards that can be developed with a dilute alkaline solution. In the multilayer printed wiring board having the above, an inexpensive multilayer printed wiring board having an electroless plated film formed with high reliability and excellent adhesion can be provided at low cost. Therefore, the present invention exhibits excellent practical effects in applications as a multilayer printed wiring board.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Takuzo Watanabe 1-5-1, Taito, Taito-ku, Tokyo Inside Toppan Printing Co., Ltd. (72) Inventor Shinji Kawachi 1-1-5-1 Taito, Taito-ku, Tokyo Letterpress Printing Co., Ltd.

Claims (4)

[Claims] An ultraviolet curable resin (A) obtained by reacting at least a reaction product of a bisphenol type epoxy compound with an unsaturated monocarboxylic acid and a saturated or unsaturated polybasic anhydride, and a polyfunctional epoxy compound. (B), an epoxy compound (C) having two or more alicyclic epoxy groups,
It comprises an epoxy compound (D) having a (meth) acrylic group and an epoxy group in the molecule, a photopolymerization initiator (E), a filler (F), and a diluent (G), and can be developed with a dilute alkali solution. An insulating layer resin composition for a multilayer printed wiring board, having photocurability and thermosetting properties. 2. The epoxy compound (C) having two or more alicyclic epoxy groups has a 3,4-epoxycyclohexyl group or a 3,4-epoxycyclohexylmethyl group. 2. The resin composition for an insulating layer for a multilayer printed wiring board according to 1. 3. The epoxy compound (D) having a (meth) acryl group and an epoxy group in the molecule is an acrylate or a methacrylate having a 3,4-epoxycyclohexylmethyl group. Claim 1
Or the insulating resin composition for a multilayer printed wiring board according to 2 above. 4. The polyfunctional epoxy compound (B) has a general formula: 4. The resin composition according to claim 1, wherein m and n are natural numbers, and R represents an alkyl group or an amine.