JPH11211907A - Production of color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the quality of color filters by providing a process for producing color filters capable of well removing development residue without complicating stages. SOLUTION: This process for producing the color filters consists in subjecting the photosensitive colored pigment resist applied on a substrate to pattern exposure through an optical mask, then applying a developer 7 by using a high-pressure fine injection nozzle 5 on the photosensitive colored pigment resist. At this time, the developer 7 is applied thereon and is rested for a prescribed time and thereafter, the substrate 1 is rotated and the high-pressure fine injection nozzle 5 is horizontally moved back and forth at specified height within a range where the nozzle passes at least the center of rotation from the end of the substrate 1. Simultaneously, pure water and gas are sprayed in a mist form from the high-pressure fine injection nozzle 5 to the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter using a photosensitive colored pigment resist, and more particularly to an improvement in a method for removing a development residue.

[0002]

2. Description of the Related Art Hitherto, color filters used in solid-state imaging devices and the like have generally been formed by a dyeing method for dyeing an organic film such as casein or gelatin. However, in recent years,
Due to demands for improving characteristics such as light resistance, heat resistance, and chemical resistance of LCDs and CCDs, the number of methods for manufacturing color filters using a photosensitive colored pigment resist has increased in place of the dyeing method. This photosensitive colored pigment resist uses a finely divided pigment as a pigment, and the pigment satisfies various characteristics required for LCDs and CCDs, and thus has become widely used.

In a method of manufacturing a color filter using a photosensitive color pigment resist, first, a UV curable photosensitive color pigment resist is applied on a substrate such as glass, and ultraviolet rays are applied to the resist through an optical mask. Irradiation and pattern exposure. Next, by performing a developing process by spraying a developing solution onto the pattern exposure surface on the substrate by, for example, a spray developing method or the like, only a portion not masked by the optical mask remains on the substrate to obtain a colored pattern. .

[0004]

However, it is known that a photosensitive colored pigment resist containing a pigment has some problems. One of them is that pigment particles are hard to be miniaturized. Originally, pigment particles have a large particle size,
Even though it can be used for LCDs, there is a problem that the size is too large for the color filters of the CCD, making it difficult to use.
Another problem is that even if the pigment particles can be made smaller, they will agglomerate when they are mixed in the photosensitive solution solvent,
That is, it becomes a so-called gel. Therefore, various exposure and development methods have been proposed in order to eliminate the disadvantageous characteristics of the photosensitive color pigment resist.

For example, in a method for manufacturing a color filter disclosed in Japanese Patent Publication No. 2-118662, a transparent developer is inclined by spraying a pressurized developer to perform development. In the method of manufacturing a color filter disclosed in Japanese Patent Publication No. 4-314002, the developing process is performed at least twice with developing solutions having different concentrations. This is to prevent the photosensitive color pigment resist containing the pigment from leaving particles as residues on the substrate and causing black defects.
As a means for removing this residue, JP-B-63-29824
In the method for manufacturing a color filter disclosed in Japanese Patent Publication No.
After the development, an ultraviolet ozone treatment or an oxygen plasma treatment is performed to decompose and remove the organic pigment fine particles remaining on the substrate.
According to this method, although the pigment residue can be removed, the number of operations for simultaneously shaving the color filter increases, and there is a problem that the process becomes complicated.

The present invention has been made in view of the above circumstances, and provides a method of manufacturing a color filter capable of satisfactorily removing a development residue without complicating the process, thereby improving the quality of the color filter. With the goal.

[0007]

According to the present invention, there is provided a method of manufacturing a color filter, comprising: subjecting a photosensitive colored pigment resist applied on a substrate to pattern exposure through an optical mask; In a method of manufacturing a color filter, a developing solution is applied to a photosensitive color pigment resist using a high-pressure fine spray nozzle, after applying the developing solution and leaving for a predetermined time, rotating the substrate and simultaneously setting the high-pressure fine spray nozzle Horizontal reciprocating movement at a fixed height from an end of the substrate at least passing through the center of rotation, and simultaneously spraying pure water and gas from the high-pressure fine spray nozzle onto the substrate in a spray form. It is.

[0008] The production method according to the present invention is characterized in that the gas is nitrogen or dry air.

Further, in the manufacturing method according to the present invention, a height from the substrate to a discharge port of the high-pressure fine spray nozzle is in a range of 3 to 15 cm.

In the manufacturing method according to the present invention, an angle formed between the substrate and the axis of the high-pressure fine jet nozzle is in a range of 45 to 90 °.

Further, in the manufacturing method according to the present invention, the pressure of the pure water is 0.5 to 2 kgf / cm ² , the flow rate of the pure water is 70 to 150 ml / min, and the pressure of the gas is 0.1 to 2 kgf / cm ² . It is in the range of 5 to 5 kgf / cm ² .

Further, in the manufacturing method according to the present invention, the moving speed of the high-pressure fine spray nozzle is in a range of 10 to 50 mm / sec, and the rotation speed of the substrate is 30 to 100 rpm.
m.

Further, in the manufacturing method according to the present invention, when the substrate is a 5-inch silicon wafer, the rotation time and the time of spraying from the high-pressure fine spray nozzle are 3 times.
The range is 0 to 120 seconds.

In this method of manufacturing a color filter, the substrate is rotated, and at the same time, the high-pressure fine spray nozzle is horizontally reciprocated while spraying pure water and nitrogen gas from the high-pressure fine spray nozzle used for development in a spray form. By doing so, in the rinsing step after the development, the development residue can be removed in a series of processes. Further, at this time, by spraying the two fluids in a spray form, a new liquid is always sprayed, so that the removal efficiency of the development residue is increased, and the removal time can be shortened.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method for manufacturing a color filter according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a view for explaining the procedure of the manufacturing method according to the present invention, and FIG. 2 is a view for explaining the injection conditions of the high-pressure fine injection nozzle of FIG.

As shown in FIG. 1A, a substrate (for example, a silicon wafer) 1 on which a predetermined pattern has been transferred by applying a photosensitive coloring pigment resist and irradiating ultraviolet rays through an optical mask. Is placed and fixed on the rotary table 3. The rotary table 3 has a vacuum suction port on the upper surface, and is configured to suck and fix the lower surface of the substrate 1. The rotary table 3 is rotated via a vertical shaft 3a by, for example, a pulse motor capable of controlling the rotation speed.

A developing solution 7 is sprayed onto a top surface of the substrate 1 fixed to the rotary table 3 by using a developing solution application nozzle 9 and applied. Next, after the application of the developing solution 7, as shown in FIG. 1B, the substrate 1 is left for a certain period of time to accelerate the development reaction of the photosensitive color pigment resist on which the pattern has been transferred.

After standing for a certain period of time, as shown in FIG. 1 (C), the rotation of the turntable 3 is started, and pure water and gas are sprayed from the high-pressure fine spray nozzle 5 used during development.
It is sprayed on the upper surface of the substrate 1. The high-pressure fine spray nozzle 5 is driven by being horizontally reciprocated at a predetermined height h from the substrate 1 and at least within a range passing at least the center of rotation from the end of the substrate 1 simultaneously with the rotation of the substrate 1. The movement of the high-pressure fine spray nozzle 5 may be at least in a range beyond the center of rotation from the end of the substrate 1, but is preferably in a range of about ／ from a diameter end of the rotating substrate 1. In addition, it is preferable that the high-pressure fine injection nozzle 5 is swingable about a horizontal axis.

As the gas sprayed together with the pure water from the high-pressure fine spray nozzle 5, nitrogen or dry air having a large inert element is used. As shown in FIG. 2, the spread width w of the spray 5 a discharged from the high-pressure fine spray nozzle 5 in the direction orthogonal to the nozzle movement direction a is set to be larger than at least the diameter of the rotating substrate 1.

As described above, in the rinsing step after the application of the developing solution 7, the two fluids are sprayed and sprayed onto the substrate 1 to remove the resist and the pigment fine particles while removing the developing solution 7.

At this time, each of the various conditions for spraying the two fluids has an optimum value. The conditions mainly include the height h from the substrate 1 to the discharge port of the high-pressure fine injection nozzle 5, the angle θ between the substrate 1 and the high-pressure fine injection nozzle axis, the pressure of pure water, the flow rate of pure water, There are a gas pressure, a moving speed of the high-pressure fine injection nozzle 5, a rotation speed of the substrate 1, a driving time of the substrate 1 and the high-pressure fine injection nozzle 5, and the like.

When these conditions exceed the optimum values, the pattern is peeled off while the development residue is removed. Further, if the value does not reach the optimum value, the development residue cannot be sufficiently removed. That is. If the height h of the high-pressure fine jet nozzle 5 is too high, the spray pressure of the two fluids becomes small, and the effect of removing the residue is reduced. On the other hand, if the height h is too close, the pressure on the photosensitive color pigment resist increases, and the pressure of the color filter increases. The pattern will be peeled off.

If the angle θ of the high-pressure fine jet nozzle 5 is small, the possibility of peeling off the pattern increases.
The residue at the foot of the reverse tapered pattern cannot be removed. The pure water pressure, the liquid volume, and the nitrogen pressure are not appropriate. If the spray is mainly composed of water, the water particles will not accurately collide with the development residue, and the removal rate will decrease. Conversely, even when the spray is mainly composed of gas, the water particles do not hit the development residue, and the removal rate decreases.

If the moving speed of the high-pressure fine spray nozzle 5 is too high, uneven development tends to occur. If the moving speed is too low, the number of times of scanning the entire substrate 1 is reduced, and the removal of the developing residue becomes insufficient. If the driving time of the high-pressure fine injection nozzle 5 is short, sufficient residue cannot be removed, and if it is long, pattern peeling may occur.

If the rotation of the substrate 1 is slow, the removal of the entire development residue will not be widespread, and if the rotation is too fast, it will be missed. If the rotation time of the substrate 1 is short, the removal of the entire development residue will not be widespread, and if it is long, it will cause pattern peeling. If the spread width w of the high-pressure fine jet nozzle 5 is smaller than the rotation diameter of the substrate 1, it causes development unevenness.

In the method of manufacturing a color filter according to the present embodiment, by setting these various condition values to predetermined values, it is possible to remove the developing solution and prevent the pattern from peeling off while developing the resist and pigment fine particles. Removal of the residue was sufficient. In the present embodiment, these predetermined values are obtained from those that are suitable for actually manufacturing a color filter.

That is, the height from the substrate 1 to the discharge port of the high-pressure fine spray nozzle 5 was in the range of 3 to 15 cm. The angle between the substrate 1 and the axis of the high-pressure fine jet nozzle 5 was in the range of 45 to 90 °. Pure water pressure is 0.5 ~ 2k
gf / cm ² , the flow rate of pure water is 70 to 150 ml / m
The pressure of in and nitrogen was in the range of 0.5 to 5 kgf / cm ² . The moving speed of the high-pressure fine spray nozzle 5 is in the range of 10 to 50 mm / sec, and the rotational speed of the substrate 1 is 3
The range was 0 to 100 rpm. Further, when the substrate 1 is a 5-inch silicon wafer, the rotation time of the substrate 1 and the spraying time from the high-pressure fine injection nozzle 5 are given under the moving speed of the high-pressure fine injection nozzle 5 and the rotation speed of the substrate 1 described above. The range was 30 to 120 seconds.

As described above, according to the above-described method of manufacturing a color filter, when a color filter of a solid-state imaging device or a liquid crystal display device is formed using a photosensitive colored pigment resist,
Since the high-pressure fine injection nozzle 5 used at the time of development is used to move the high-pressure fine injection nozzle 5 while rotating the substrate 1, pure water and nitrogen gas are sprayed from the high-pressure fine injection nozzle 5 in a spray form. The development residue can be satisfactorily removed without complicating the process. Then, since the two fluids are sprayed in a spray state, a new liquid can be sprayed at all times, the removal efficiency of the development residue can be increased, and as a result, the removal time can be shortened.

Further, by setting the various condition values for spraying the two fluids within the above-mentioned optimum range, the removal efficiency of the development residue can be maximized while preventing the pattern from peeling.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the manufacturing method according to the present invention will be described. 5 inch silicon wafer (125m diameter
m), a UV-curable photosensitive coloring pigment resist was applied to form a resist layer, and then a pre-baking treatment was performed at a predetermined heating temperature. Next, the pattern was transferred to the resist layer by irradiating ultraviolet rays through an optical mask. The wafer after pattern transfer is placed and fixed on a rotary table,
The developer was applied by a high-pressure fine jet nozzle.

After the application of the developing solution, the developing reaction of the resist layer was allowed to proceed by being left for a certain period of time. Thereafter, the wafer was rotated at 80 rpm, and at the same time, spraying from the high-pressure fine spray nozzle was started, and the high-pressure fine spray nozzle was reciprocated in parallel from the wafer end toward the wafer rotation center. Various condition values for spraying the two fluids at this time were as follows.・ Rotation time 60sec ・ Spread width w 125 to 135mm ・ Movement speed of high-pressure fine spray nozzle 25mm / sec ・ Nozzle height h 7cm ・ Nozzle angle θ 70 ° ・ Pure water pressure 2kgf / cm ²・ Liquid quantity 100ml / min・ Nitrogen pressure 2kgf / cm ²・ High pressure fine spray nozzle driving time 60sec

After the wafer and the high-pressure fine spray nozzle were driven under the above conditions, the driving of the wafer and the high-pressure fine spray nozzle was stopped, and the wafer was washed with a pure water nozzle shower to complete the residue removal process.

When white display was performed using a CCD of predetermined pixels (350,000 pixels) provided with a color filter formed under the above conditions, the number of defective pixels was reduced to a specified number (100 pixels).
), And it is confirmed that
It was found that the rate of occurrence of defects due to peeling of the pattern and the like was kept low.

Further, the nozzle height h, the nozzle angle θ, and the two-fluid ejection time were variously changed, and the relationship between these values and the occurrence of defects was examined. The number of defective pixels was determined by performing white display using a CCD having predetermined pixels (350,000 pixels) and generating defective pixels. The case where the number of defective pixels is less than 100 is regarded as a good practical range of the color filter.

As a result, as shown in FIG. 3, the nozzle height h is less than 100 at 3 cm, the number of defective pixels is 10 at 11 cm, and the number of defective pixels is 65 at 15 cm. It became. That is, the nozzle height h is 3 to 1
A range of 5 cm was found to be the optimal value.

The nozzle angle θ is, as shown in FIG.
The number of defective pixels becomes 50 at °, and the number of defective pixels becomes 3 at 70 °.
The number was a minimum of about 0, and 90 resulted in 80 defective pixels. That is, it was found that the optimum value of the nozzle angle θ was in the range of 45 to 90 °.

When the substrate is a 5-inch silicon wafer, the rotation time of the wafer and the spraying time from the high-pressure fine spray nozzle (two-fluid spraying time) are 30 times as shown in FIG.
The number of defective pixels was less than 100 in seconds, the number of defective pixels was 40 in 60 seconds, the number of defective pixels was 90, and the number of defective pixels was 10 in 90 seconds, and was 30 in 120 seconds. That is, it has been found that the optimum value of the two-fluid injection time is in the range of 30 to 120 seconds. In this case, the moving speed of the high-pressure fine jet nozzle 5 and the number of rotations of the wafer are 25 mm / sec and 80 rpm.
pm.

[0038]

As described above in detail, according to the method of manufacturing a color filter according to the present invention, when forming a color filter of a solid-state imaging device or a liquid crystal display device using a photosensitive colored pigment resist, The high-pressure fine injection nozzle used at the time is used, the high-pressure fine injection nozzle is moved while rotating the substrate, and pure water and nitrogen gas are sprayed from the high-pressure fine injection nozzle in a spray form, which complicates the process. The development residue can be satisfactorily removed by a series of processes without any problems. As a result, the quality of the color filter can be improved, and the yield at the time of manufacturing the color filter can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a procedure of a manufacturing method according to the present invention.

FIG. 2 is a diagram illustrating injection conditions of a high-pressure fine injection nozzle of FIG. 1;

FIG. 3 is a correlation diagram showing a relationship between a nozzle height and the number of defects.

FIG. 4 is a correlation diagram showing a relationship between a nozzle angle and the number of defects.

FIG. 5 is a correlation diagram showing the relationship between the two-fluid ejection time and the number of defects.

[Explanation of symbols]

 1: substrate, 5: high-pressure fine spray nozzle, 7: developer

Claims (7)

[Claims] 1. A method of manufacturing a color filter, comprising pattern-exposing a photosensitive color pigment resist applied on a substrate through an optical mask and applying a developing solution to the photosensitive color pigment resist using a high-pressure fine jet nozzle. In the method, after the developer is applied and left for a predetermined time, the substrate is rotated and the high-pressure fine spray nozzle is horizontally reciprocated within a range that passes at least a rotation center from an end of the substrate at a constant height. And simultaneously spraying pure water and gas in a spray form from said high-pressure fine spray nozzle to said substrate. 2. The method according to claim 1, wherein the gas is nitrogen or dry air. 3. The method according to claim 1, wherein a height from the substrate to a discharge port of the high-pressure fine spray nozzle is in a range of 3 to 15 cm. 4. The method according to claim 1, wherein an angle formed between the substrate and the axis of the high-pressure fine spray nozzle is in a range of 45 to 90 °. 5. The pressure of the pure water is 0.5 to 2 kgf.
^{2. The method of claim 1} , wherein a flow rate of the pure water is in a range of 70 to 150 ml / min, and a pressure of the gas is in a range of 0.5 to 5 kgf / cm ^2. . 6. The moving speed of the high-pressure fine injection nozzle is 1
2. The method according to claim 1, wherein the rotation speed of the substrate is in the range of 0 to 50 mm / sec and the rotation speed of the substrate is in the range of 30 to 100 rpm. 7. When the substrate is a 5-inch silicon wafer, the rotation time and the time of spraying from the high-pressure fine spray nozzle are in the range of 30 to 120 seconds. Method for manufacturing a color filter.