JPH11186365A - Apparatus for treatment substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily find intended treatment conditions by grouping the treating conditions and storing them. SOLUTION: An apparatus comprises a substrate treating unit and external magnetic memory for storing treating recipes. This memory has a flow process data 300 and unit process data 350. The unit process data 350 is classified in a spin coater unit process data 310, hot plate unit process data 320, and cleaning plate unit process data 330 every category showing the kind of process in treating units. The flow process data 300 is composed of flow groups having 990 flow treating conditions. The spin coater unit process data 310, hot plate unit process data 320 and cleaning plate unit process data 330 have also 990 pieces of unit treating conditions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology of a substrate processing apparatus composed of a plurality of processing units.
The present invention relates to a technique for processing a substrate according to a series of processing conditions obtained by arbitrarily combining processing conditions in each processing unit.

[0002]

2. Description of the Related Art In a substrate processing apparatus for processing substrates such as a semiconductor substrate, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a substrate for an optical disk, a plurality of processes for performing various processes are performed. Units are combined. For example, a semiconductor substrate processing apparatus used in a process of applying a photoresist to a semiconductor substrate includes a plurality of processing units such as a spin coater, a hot plate, and a cooling plate. Normally, regarding the unit processing conditions in each processing unit,
The user sets in advance for each unit. In addition, the user also sets in advance the flow processing conditions indicating in which unit the substrate is to be processed and in what order the substrate is transported to the unit. A series of processes is executed according to the unit processing conditions and the flow processing conditions set in this way.

[0003]

However, in a conventional substrate processing apparatus, when there are a large number of unit processing conditions for each unit, when setting a specific flow processing condition, the unit processing condition can be easily searched for. There was a problem that can not be. Further, even when there are many flow processing conditions, similarly, there is a problem that a target flow processing condition cannot be easily found. Furthermore, when there is a unit processing condition and a flow processing condition that another person does not want to change or delete, there is a problem that the management cannot be performed accurately.

The present invention has been made to solve the above-mentioned problems in the prior art, and is intended to make it possible to easily find a target processing condition when there are many processing conditions in a substrate processing apparatus. A primary purpose is to provide technology. It is a second object of the present invention to provide a technique for appropriately managing processing conditions.

[0005]

In order to solve at least a part of the above-mentioned problems, a substrate processing apparatus according to the present invention comprises a plurality of processing units for processing a substrate, and a plurality of processing units. A processing condition storage unit for storing a processing recipe including a unit processing condition in a unit, and a flow processing condition indicating an order of sequentially transporting a substrate to some of the plurality of processing units; The processing conditions are classified for each category indicating the type of processing in the processing unit, and the plurality of unit processing conditions for each category are further divided into a plurality of unit groups each including a plurality of unit processing conditions. And the plurality of flow processing conditions include:
It is characterized by being divided into a plurality of flow groups each including a plurality of flow processing conditions.

In the above-described substrate processing apparatus, a plurality of processing conditions are stored separately for each group. Therefore, even when there are many processing conditions, it is possible to easily search for the target processing data. .

[0007] In the above substrate processing apparatus, further, there is provided user group information storage means for storing user group information indicating a plurality of user groups handling the substrate processing apparatus, and at least one user group usable by each user group.
Preferably, one unit group and at least one flow group that can be used by each user group are assigned to each user group.

[0008] In this case, since the use of the unit group and the flow group is determined according to the user group, if there is a unit processing condition and a flow processing condition that are not desired to be changed or deleted by another person, the management thereof is performed. Can be performed accurately.

[0009] In the above substrate processing apparatus, it is preferable that the apparatus further comprises a setting means for setting assignment of a unit group and a flow group to each user group.

By using this setting means, it is possible to arbitrarily set and change the assignment of the unit group and the flow group to each user group.

[0011] In the above substrate processing apparatus, further, an input means for a user who handles the substrate processing apparatus to input his / her own user group information, and the user group information is displayed in accordance with the input user group information. Display means for displaying only the unit group and the flow group assigned to the user group to be used.

[0012] In this way, unnecessary flow groups and unit groups that cannot be used by a user at a certain user level are not displayed, so that a desired flow processing condition or unit processing condition can be more easily found.

[0013]

Other Embodiments of the Invention The present invention includes the following other embodiments. A first aspect is a substrate processing method in a substrate processing apparatus including a plurality of processing units for processing a substrate, wherein a unit processing condition in the plurality of processing units and a number of the substrates are determined by the number of the plurality of processing units. And setting a processing recipe including a flow processing condition indicating an order of sequentially transferring the plurality of unit processing conditions, wherein the plurality of unit processing conditions are classified by category indicating a type of processing in the processing unit. The plurality of unit processing conditions for each category are further divided into a plurality of unit groups each including a plurality of unit processing conditions, and the plurality of flow processing conditions are:
A substrate processing method characterized by being divided into a plurality of flow groups each including a plurality of flow processing conditions.

According to a second aspect, there is provided a computer-readable recording medium having recorded thereon a computer program for causing a computer to realize the functions of each step and each means of the above invention.

A third aspect is an aspect as a program supply device for supplying, via a communication path, a computer program for causing a computer to realize the functions of the respective steps or means of the above invention. In such an embodiment, the functions of the above-described steps and units can be realized by placing the program on a server or the like on a network, downloading the necessary program to a computer via a communication path, and executing the program. it can.

[0016]

DETAILED DESCRIPTION OF THE INVENTION Configuration of Apparatus: Hereinafter, embodiments of the present invention will be described based on examples. FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention. The semiconductor substrate processing apparatus 10 includes two modules, a process module 100 and an indexer module 200. The process module 100 is a module used for a process of applying a photoresist on a semiconductor substrate (hereinafter, referred to as a “substrate”).
For example, it is also possible to connect a process module used in the development process of the exposure pattern to the process module 100.

The process module 100 includes two spin coaters SC1 and SC2 and three hot plates HP
1, HP2, HP3 and three cooling plates CP
1, CP2, CP3, and a substrate transport unit 110. The two spin coaters SC1 and SC2 are processing units for applying a photoresist on a substrate.
The three hot plates HP1, HP2, and HP3 are processing units that heat the substrate. The three cooling plates CP1, CP2, and CP3 are processing units that perform a cooling process on the substrate. Substrate transfer unit 110
Is a transport unit that transports a substrate from the indexer module to each processing unit or between processing units.

The indexer module 200 includes four cassette stages 210, 212, 214, 216, an indexer arm 220, and a processing control station 230.
And Four cassette stages 210, 2
Reference numerals 12, 214, and 216 denote stages on which a cassette containing a plurality of substrates is installed. Indexer arm 22
Reference numeral 0 denotes a transfer unit that takes out a predetermined substrate from the cassette provided in the cassette stage and transfers it to the substrate transfer unit 110, and also receives the substrate processed in each processing unit from the substrate transfer unit 110 and stores it in the cassette. is there. The process control station 230 is a computer that controls all processes in the semiconductor substrate processing apparatus 10. The processing control station 230 will be described later.

In this specification, the term "processing unit" particularly refers to a unit that performs processing for processing a substrate. Since the substrate transport unit 110 and the indexer arm 220 are units for transporting substrates, they do not correspond to “processing units” in the present embodiment. Therefore, among the units shown in FIG. 1, those which can be called “processing units” are the process modules 10.
There are eight units of two spin coaters SC1, SC2, three hot plates HP1, HP2, HP3, and three cooling plates CP1, CP2, CP3 in 0.

FIG. 2 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG. The semiconductor substrate processing apparatus 10 includes a processing control station 230, a transfer control unit 240, and a processing control unit 250. The transfer control unit 240 has a function of controlling transfer in the substrate transfer unit 110 and the indexer arm 220 in FIG. The processing control unit 250 controls each processing unit (SC1, SC2, HP1, HP2, HP3, CP1,
CP2, CP3). The transport control unit 240 and the processing control unit 250 control each unit based on a command from the control unit 232.

The processing control station 230 includes the control unit 2
32, an external magnetic storage unit 234, an operation unit 236 such as a keyboard, a mouse, and a control panel, and a display unit 238 such as a liquid crystal display. The control unit 232 further includes a CPU (not shown).
And a main memory, and controls processes of the transport control unit 240 and the process control unit 250 by executing a computer program stored in the main memory. The external magnetic storage unit 234 stores user group information, processing conditions, and the like. The details of the user group information and the processing conditions will be described later. Note that the external magnetic storage unit 234 corresponds to a user group information storage unit and a processing condition storage unit in the present invention.

A computer program for realizing the function of each unit shown in FIG.
-Provided in a form recorded on a computer-readable recording medium such as a ROM. Each computer reads the computer program from the recording medium and transfers it to an internal storage device or an external storage device. Alternatively, a computer program may be supplied to a computer via a communication path. When realizing each function of the computer program, the computer program stored in the internal storage device is executed by the microprocessor of the computer. Further, a computer may read a computer program recorded on a recording medium and directly execute the computer program.

In this specification, a computer is
The concept includes a hardware device and an operation system, and means a hardware device that operates under the control of the operation system. In the case where an operation system is unnecessary and a hardware device is operated by an application program alone, the hardware device itself corresponds to a computer. The hardware device includes at least a microprocessor such as a CPU and means for reading a computer program recorded on a recording medium. The computer program includes a program code that causes such a computer to realize the functions of the above-described units. Some of the functions described above may be realized by an operation system instead of the application program.

The "recording medium" in the present invention includes a flexible disk, a CD-ROM, a magneto-optical disk, an IC card, a ROM cartridge, a punched card, a printed matter on which a code such as a bar code is printed, and an internal storage of a computer. Device (RAM, ROM, etc.)
And various computer-readable media such as an external storage device.

B. FIG. 3 is an explanatory diagram showing the contents of the flow processing data and the unit processing data stored in the external magnetic storage unit 234 of FIG. In the external magnetic storage unit 234, a processing recipe including the flow processing data 300 and the unit processing data 350 is stored. The unit processing data 350 is
The processing units are classified by category indicating the type of processing in the processing unit.
10 and unit processing data 320 for hot plate
And the unit processing data 330 for the cooling plate
And the three types of processing data. The flow processing data 300 includes one of the flow groups “A” to “J”.
0, each flow group,
For example, the flow group “A” 302 shown in FIG.
Is composed of 99 flow processing conditions from 1 to 99. Therefore, there are 990 flow processing conditions in the flow processing data 300. The unit processing data 310 for the spin coater includes ten groups of unit groups “A” to “J”, and each unit group, for example, the unit group “A” for the spin coater shown in FIG. 312 is
Further, it is composed of 99 unit processing conditions from 1 to 99. Therefore, the unit processing data 3
In 10, there are 990 unit processing conditions.
Similarly, the unit processing data 320 for the hot plate and the unit processing data 330 for the cooling plate are similarly configured from 990 unit processing conditions. The hatched portions in FIG. 3 will be described later.

Here, the "unit processing condition" is data indicating the processing content in each processing unit. For example, the unit processing conditions of the spin coater include the timing of applying the photoresist to the substrate, the number of rotations of the spinner with respect to the elapsed time from the start of the processing, and the like. The hot plate unit processing conditions include the set temperature of the heating plate. Further, the unit processing condition of the cooling plate also includes the set temperature of the cooling plate.

The "flow processing conditions" are data indicating the contents of a series of processing in which unit processing conditions indicating processing contents in each processing unit are arbitrarily combined. FIG. 4 is an explanatory diagram showing a specific example of the flow processing conditions in the semiconductor substrate processing apparatus 10. FIG. 4 shows the second flow processing condition 400 of the flow group “A” 302 in the flow processing data 300 (FIG. 3). The flow processing conditions include a transport order, processing unit identification information, and unit processing conditions. The transfer order indicates the order of transfer of the substrates in the substrate processing apparatus. The processing unit identification information includes the unit number of the processing unit to which the substrate is transported, and the processing category of the processing unit. The unit processing condition is data indicating the processing content of each processing unit.
In the column of the processing category, “ID” indicates an indexer module, “SC” indicates a spin coater, “HP” indicates a hot plate, and “CP” indicates a cooling plate. “SCB.01” in the unit processing condition column
Indicates the first unit processing condition “01” included in the spin coater unit group “B” 420, and the unit processing condition in the spin coater is determined thereby.

When processing is performed in accordance with the flow processing conditions 400 (FIG. 4), the substrate includes an indexer ID, a spin coater SC, a hot plate HP, and a cooling plate C.
P and the indexer ID are conveyed and processed in this order. The unit number in the third transfer order (third transfer destination unit) is “# 3”, which is the hot plate HP
1 (FIG. 1). The unit number in the fourth transport order is "# 4", which means the cooling plate CP1 (FIG. 1).

As described above, the processing unit identification information defines the transfer order of the substrates by the unit number unique to each processing unit, so that the transfer order of the substrates to the plurality of processing units is set to an arbitrary order. It is possible. In addition,
Since the processing unit identification information only needs to be able to identify each processing unit, it is sufficient that the processing unit identification information includes at least the unit number and does not need to include the processing category.

FIG. 5 is a flowchart showing the overall procedure of the processing in this embodiment. In step S1, a user level is set for various operations in the semiconductor substrate processing apparatus 10. The user level is used to set an access right that determines whether or not various operations can be performed. Here, the “various operations” include operations of using and changing flow groups and unit groups, and operations of performing basic functions of the present apparatus, for example, setting parameters and unit numbers of each processing unit. . In this embodiment, the above setting can be performed only by the person in charge of management. As a result, it is possible to accurately manage the processing recipe of the present apparatus.

FIG. 6 is a flowchart showing details of the processing in step S1 of FIG. In step S1a, the manager performs a predetermined operation on the operation unit 236 (FIG. 2), thereby causing the display unit 23 of the semiconductor substrate processing apparatus 10 to operate.
8 (FIG. 2) to display a user level registration screen.

FIG. 7 is an explanatory diagram showing an example of the user level registration screen displayed in step S1 of FIG. The user level registration screen of FIG. 7 includes a user level number field 500 and a user level name field 510.
, An end button 520, and a setting save button 530.

In step S1b of FIG. 6, the number of user levels to be registered is set in the user level number field 500 (FIG. 7).
To enter. In this embodiment, the number of user levels is 5
Up to four can be set, and “4” is input as the number of user levels here.

In step S1c, the user level name to be registered and its password are entered in the user level name field 510 (FIG. 7). The user level name is a general term of a user group including at least one user who is in charge of a certain task.
Is set as an administrator, user level 2 is set as an experimenter, user level 3 is set as an operator, and user level 4 is set as equipment. Further, by setting a password for each user level, it is possible to easily manage whether or not various operations in the semiconductor substrate processing apparatus 10 can be performed according to the user level.

In step S1d, when the setting save button 530 in FIG. 7 is selected, in step S1e,
The input user group information is stored in the external magnetic storage unit 234.
(FIG. 2). When the end button 520 is selected in step S1d, the registration of the user level ends.

In step S2 of FIG. 5, the flow process data 300 and the unit process data 31 of FIG.
For the plurality of flow groups and the plurality of unit groups included in 0, 320, and 330, usable flow groups and unit groups are assigned for each user level. Note that a program for realizing this assignment function corresponds to the setting means in the present invention.

FIG. 8 is a flowchart showing details of the processing in step S2 in FIG. In step S2a, the user performs a predetermined operation on the operation unit 236 (FIG. 2) to thereby display the display unit 238 of the semiconductor substrate processing apparatus 10.
A processing data setting screen is displayed on (FIG. 2), and processing data to be set is selected.

FIG. 9 is an explanatory diagram showing an example of the processing data setting screen displayed in step S2 of FIG.
The processing data setting screen of FIG. 9 includes a processing data selection button field 600, a group selection field 610,
A user level selection button field 620, an end button 630, and a setting save button 640 are included. The user level registered on the user level registration screen of FIG. 7 is displayed in the user level selection button field 620.

In step S2a of FIG. 8, processing data to be set is selected from the processing data selection button field 600 (FIG. 9). In FIG. 9, “flow” with hatching is selected, and at this time, flow groups “A” to “J” are displayed in the group selection field 610.

In step S2b, a user level for which flow processing data is to be set is specified in a user level selection button field 620 (FIG. 9). In this embodiment, the person in charge of the experiment is designated.

Further, in step S2c, at least one of the flow groups "A" to "J" of the flow processing data 300 (FIG. 3) for which use permission is given to the designated user level is selected in the group selection field. Select at 610 (FIG. 9). Here, only the flow group “A” is selected.

When the setting save button 640 is selected in step S2d, the input flow processing data information is registered in the external magnetic storage unit 234 (FIG. 2) in step S2e. With this registration, the access right of the selected flow group is set for the specified user level. When the end button 630 is selected in step S2d, the setting of the flow processing data ends.

Next, in step S2a of FIG. 8, when "unit SC" is selected in the processing data selection button field 600 (FIG. 9), the group selection field 6
10, the unit groups “A” to “J” for the spin coater in the unit processing data 310 (FIG. 3) are displayed. In step S2f, a user level for which unit processing data for a spin coater is to be set is specified in a user level selection button field 620.
Further, in step S2g, from the unit groups "A" to "J", at least one unit group that is permitted to use the specified user level is selected in the group selection field 610 (FIG. 9). In step S2h, a setting save button 640
Is selected, the input unit processing data information is registered in the external magnetic storage unit 234 (FIG. 2) in step S2i. By this registration, the access right of the selected unit group for the spin coater is set for the specified user level. When the end button 630 is selected in step S2h, the setting of the unit processing data ends.

In step S2a, the "unit H" in the processing data selection button field 600 (FIG. 9) is displayed.
When “P” and “unit CP” are selected, the unit processing data 320 for the hot plate and the unit processing data 330 for the cooling plate have the same access rights as the unit processing data 310 for the spin coater for the specified user level. Can be set. In the present embodiment, the user who can perform the operation in step 2 (FIG. 5) is limited to the person in charge of the management of this apparatus.

By the above operation, access rights are set for each user level for a plurality of flow groups and a plurality of unit groups included in each piece of processing data.
In the present embodiment, the flow groups and the unit groups for which the experimenter has the access right are shown in the shaded portions in FIG. In FIG. 3, the access right is set for the experimenter in the flow group “A” for the flow processing data 300.
Only. Similarly, the unit groups “A”, “B”,
"C" and unit processing data 32 for hot plate
The access right is set to the unit group “J” of “0” and the unit groups “B” and “D” of the unit processing data 330 for the cooling plate. The experimenter can freely use and change only the flow processing conditions of the flow group to which the access right is set and the unit processing conditions of the unit group. The unit processing conditions of the unit group cannot be used or changed. Therefore, for example, when the flow processing conditions of the flow group “A” are configured by combining the unit processing conditions of the unit group “D” for the spin coater, the access right is not granted to the unit group “D” for the spin coater. Since it is not set, processing cannot be performed according to the flow processing conditions.

By setting the access right for each user level for the flow group and the unit group of each processing unit, the access right is set when a user of a certain user level uses the semiconductor substrate processing apparatus 10. Only the performed flow group and unit group may be displayed on the display unit 238 (FIG. 2). In this way, useless flow groups and unit groups that cannot be used by a user at a certain user level are not displayed, so that a desired flow processing condition or unit processing condition can be easily found.

When processing is actually performed in accordance with the flow processing conditions, first, the user inputs the user level to which the user belongs via the operation unit 236 of the processing control station 230 (FIG. 2). Usually, a password is set, so the password is also entered. Thus, the operation of the semiconductor substrate processing apparatus 10 can be performed within the range in which the access right is set. The user inputs a flow group and flow processing conditions on the control panel of the operation unit 236, and performs processing in the present apparatus.

FIG. 10 is an explanatory diagram showing an example of a control panel for selecting and executing flow processing conditions. The control panel of FIG. 10 includes a flow processing condition display field 700 and a flow group selection button 7.
10, a flow processing condition selection button 720, a start button 730, a stop button 740, a cancel button 750, and a pause button 760. The flow group selection button 710 and the flow processing condition selection button 720 are buttons for selecting a flow processing condition, and a sign indicating the selected flow processing condition is displayed in the flow processing condition display field 700. The start button 730 is a button for executing the selected flow processing condition. Stop button 74
0 is a button for forcibly stopping the process being executed. The cancel button 750 is a button for canceling the setting of the selected flow processing condition. The pause button 760 is a button for temporarily interrupting the process being executed.

When the target flow processing condition is the flow processing condition 400 shown in FIG. 4, the user can select the flow group selection button 710 on the control panel shown in FIG.
The flow group "A" is selected by the button, and the second flow group "A" is selected by the flow processing condition selection button 720.
Select the second flow processing condition. At this time, “A.02” is displayed in the flow processing condition display field 700. When the start button 730 is pressed, the semiconductor substrate processing apparatus 10 according to the selected flow processing condition of “A.02”, that is, the flow processing condition 400 (FIG. 4).
Each processing unit (SC1, SC2, HP1,
HP2, HP3, CP1, CP2, and CP3) are started.

The flow processing conditions 400 shown in FIG. 4 are constituted by processings in a five-stage transport sequence. In the first stage, the indexer arm 220 of FIG.
Cassette stage 210 (or 212, 214, 2)
16), a predetermined substrate is taken out, and the substrate transport unit 110 receives the substrate from the indexer arm 220 in the indexer module 200 with the unit number “# 0”. In the second stage, the substrate transport unit 110
Transports the substrate to the spin coater SC1 with the unit number "# 1" and transfers it to the spin coater SC1. The spin coater SC1 performs processing according to the first unit processing condition of the unit group “B” 420 for spin coaters. In the third stage, the substrate transport unit 110
The substrate on which the processing in the spin coater SC1 has been completed is received, and the hot plate HP having the unit number “# 3” is received.
Transport to 1 and hand over. The hot plate HP 1 performs processing according to the second unit processing condition of the hot plate unit group “J” 430. In the fourth stage, the substrate transport unit 110 moves the hot plate HP1
Receives the substrate on which the processing in is completed, transports the substrate to the cooling plate CP1 having the unit number “# 4”, and delivers it. The cooling plate CP1 performs processing according to the 99th unit processing condition of the cooling plate unit group “D” 440. In the fifth stage,
The substrate transport unit 110 includes a cooling plate CP1.
Is received, and is transferred to the indexer arm 220 in the indexer module 200 having the unit number “# 0”. Indexer arm 2
20 stores the substrate received from the substrate transport unit 110 at a predetermined location on the cassette stage 210, and the processing under the flow processing conditions 400 ends.

As described above, in the above embodiment, a plurality of unit processing conditions are divided into a plurality of unit groups for each processing unit, and a plurality of flow processing conditions are also divided into a plurality of flow groups. I have. Therefore, it is possible to set the use permission for each unit group and each flow group according to the user level. As a result, it is possible to accurately manage the processing recipe of the semiconductor substrate processing apparatus.

The present invention is not limited to the above examples and embodiments, but can be implemented in various modes without departing from the gist thereof.
For example, the following modifications are possible.

(1) In the above embodiment, the number of registered user levels is limited to five. However, a larger number of user levels may be registered. By doing so, the user group can be registered as a further subdivided group, and registration for each user is also possible. (2) In the above embodiment, each processing data is divided into 10 flow groups or 10 unit groups for each processing unit.
It may be possible to classify into a smaller number of groups. Further, the number of processing conditions that can be stored in one group may be arbitrarily set for each group. This makes it possible to set more appropriate access rights for the present apparatus. (3) In the above embodiment, the processing control station 230 of the semiconductor substrate processing apparatus 10 sets the user level, executes the flow processing conditions, and the like. The above operation may be performed by executing the client program on another computer. In this case, the same effect as in the above-described embodiment can be obtained, and further, there is an advantage that remote operation can be performed. (4) In the above embodiment, a part of the configuration realized by hardware may be replaced by software, and conversely, a part of the configuration realized by software may be replaced by hardware. Is also good.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention.

FIG. 2 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG.

FIG. 3 is an explanatory diagram showing contents of flow processing data and unit processing data stored in an external magnetic storage unit 234 of FIG. 2;

FIG. 4 is an explanatory view showing a specific example of flow processing conditions in the semiconductor substrate processing apparatus 10.

FIG. 5 is a flowchart illustrating an overall procedure of a process according to the embodiment.

FIG. 6 is a flowchart showing details of a process in step S1 of FIG. 5;

FIG. 7 is an explanatory diagram showing an example of a user level registration screen displayed in step S1 of FIG.

FIG. 8 is a flowchart showing details of the processing in step S2 in FIG. 5;

FIG. 9 is an explanatory diagram showing an example of a processing data setting screen displayed in step S2 of FIG. 5;

FIG. 10 is an explanatory diagram showing an example of a control panel for selecting and executing a flow processing condition.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor substrate processing apparatus 100 ... Process module 110 ... Substrate transfer unit 200 ... Indexer module 210,212,214,216 ... Cassette stage 220 ... Indexer arm 230 ... Processing control station 232 ... Control part 234 ... External magnetic storage part 236 ... Operation unit 238 Display unit 240 Transport control unit 250 Processing control unit 300 Flow processing data 302 Flow group A 310 Unit processing data for spin coater 312 Unit group A for spin coater 320 Unit processing for hot plate Data 330: Unit processing data for cooling plate 350: Unit processing data 400: Flow processing conditions 420: Unit group B (spin coater) 430: Unit group J (hot Rate) 440 ... unit group D (cooling plate) 500 ... user level number field 510 ... user level name field 520 ... end button 530 ... setting save button 600 ... processing data selection button field 610 ... group selection field 620 ... user level selection button Field 630 ... End button 640 ... Setting save button 700 ... Flow processing condition display field 710 ... Flow group selection button 720 ... Flow processing condition selection button 730 ... Start button 740 ... Stop button 750 ... Cancel button 760 ... Pause button SC1, SC2 ... Spin coater HP1, HP2, HP3 ... Hot plate CP1, CP2, CP3 ... Cooling plate

Claims (4)

[Claims] 1. A substrate processing apparatus for processing a substrate, comprising: a plurality of processing units for processing a substrate; unit processing conditions in the plurality of processing units;
And a processing condition storage means for storing a processing recipe including a flow processing condition indicating an order in which the substrate is sequentially transferred to some of the plurality of processing units. And a plurality of unit processing conditions relating to each category are further divided into a plurality of unit groups each including a plurality of unit processing conditions. The substrate processing apparatus, wherein the conditions are divided into a plurality of flow groups each including a plurality of flow processing conditions. 2. The substrate processing apparatus according to claim 1, wherein:
The apparatus further includes a user group information storage unit that stores user group information indicating a plurality of user groups that handle the substrate processing apparatus. At least one unit group that each user group can use, and at least one unit group that each user group can use A substrate processing apparatus, wherein one flow group is assigned to each user group. 3. The substrate processing apparatus according to claim 2, wherein
The substrate processing apparatus further comprises setting means for setting assignment of a unit group and a flow group to each user group. 4. The substrate processing apparatus according to claim 3, wherein:
Further, input means for a user who handles the substrate processing apparatus to input his / her own user group information, and a unit group assigned to the user group indicated by the user group information according to the input user group information And a display unit for displaying only the flow group.