JPH11204389A - Substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily set processing and recognize the state of execution in each stage, by providing each input panel with a letter string display part which can display information regarding setting of processing recipe as a letter string. SOLUTION: In lot processing, a letter string display part 452 displays a letter string which accelerates selection of flow processing conditions. In processing on a single-wafer basis, when a processing condition selection button 460 is operated to make a processing condition display part 450 display a single- wafer basis processing mode, a letter display part 452 also displays that a single-wafer basis processing mode is selected. Here, a decision button 468 is selected and set. Then, each flow processing condition is set by operating the processing condition selection button 460. The process is executed recognizing each processing condition by the letter string display part 452. Furthermore, change of setting of flow condition is also made possible while or after a processing recipe is set by selecting a cancellation button 470. In the process, a letter string display part 452 also displays contents, etc., of change.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a technology of a substrate processing apparatus having a plurality of processing units.

[0002]

2. Description of the Related Art In a substrate processing apparatus for processing substrates such as a semiconductor substrate, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a substrate for an optical disk, a plurality of processes for performing various processes are performed. Units are combined. For example, a semiconductor substrate processing apparatus used in a process of applying a photoresist to a semiconductor substrate includes a plurality of processing units such as a spin coater, a hot plate, and a cooling plate. Normally, regarding the unit processing conditions in each processing unit,
The user sets in advance for each unit. In addition, the user also sets in advance the flow processing conditions indicating in which unit the substrate is to be processed and in what order the substrate is transported to the unit. The processing of the substrate is executed according to the processing recipe specified by the flow processing conditions and the unit processing conditions set in this way.

An ordinary substrate processing apparatus includes a plurality of stages for mounting a cassette for storing substrates (also referred to as a “substrate storage cassette”). A substrate to be processed is set on a stage in a state of being stored in a substrate storage cassette. One cassette stores about 25 substrates. Usually, by setting one processing recipe for all the substrates stored in the cassette, all the substrates are processed according to the same processing recipe. In this specification, the processing in which the same processing conditions are set for all the substrates stored in the cassette in this way is referred to as “lot processing”.

Each stage is provided with an input panel. Using this input panel, a user can select a processing recipe to be used in each stage and instruct execution of substrate processing. On the input panel, the number of the selected processing recipe is displayed by a numeral.

[0005]

In the conventional substrate processing apparatus, since the number of the processing recipe is only displayed on the input panel, when the user selects the processing recipe, the contents of the processing recipe are displayed only by the number. It has to be judged, and there is a problem that there is a high possibility of making a wrong selection. In addition, although the processing recipe to be selected cannot be used due to a failure of some processing units or the like, only the processing recipe number is displayed on the input panel. There is a problem that it is not possible to set an appropriate processing recipe.

In some cases, it is desired to execute different processing for each substrate in one cassette. In this specification, a process in which different processing conditions are set for a substrate housed in a cassette in this manner is referred to as “single-sheet processing”, and a processing recipe for single-sheet processing is referred to as “single-sheet processing”. Recipes. " In the single-wafer processing, different processing recipes need not be set for each substrate in the cassette, and the same processing recipe may be set for a plurality of substrates. In such a case, it is necessary to set a processing recipe for each substrate. However, in the conventional input panel, only the number of the processing recipe is displayed. However, there is a problem that a single-wafer processing recipe cannot be set on the input panel.

Further, the execution state of the processing of the substrate in the cassette mounted on each stage cannot be confirmed on the input panel of each stage, but must be confirmed on the main panel of the substrate processing apparatus. There was also a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and provides a technique capable of easily setting processing and confirming an execution state in each stage of a substrate processing apparatus. The purpose is to:

[0009]

In order to solve at least a part of the above-mentioned problems, a substrate processing apparatus according to the present invention comprises a plurality of stages for mounting a plurality of substrate storage cassettes, An input panel provided on each stage to set a processing recipe indicating processing conditions for the substrate in the substrate storage cassette mounted on each stage, and to instruct execution of the processing of the substrate, The input panel includes a character string display unit that can display information on the setting of the processing recipe as a character string when setting the processing recipe for the substrate in the substrate storage cassette mounted on the corresponding stage.

In the above-described substrate processing apparatus, since information on substrate processing settings can be displayed as a character string, processing recipe settings can be made accurately.

In the above-mentioned substrate processing apparatus, it is preferable that the character string display unit can further display information on the execution state of the processing as a character string when the processing of the substrate is executed.

With this configuration, since information on the execution of the processing of the substrate can be displayed as a character string, the status of the processing can be confirmed when the processing of the substrate is being executed.

In the above substrate processing apparatus, the input panel may be a single wafer processing setting for independently setting a processing recipe for each of a plurality of substrates in a substrate storage cassette mounted on a stage corresponding to the input panel. Is possible,
In the single-wafer processing setting, the character string display unit displays a character string indicating the number of a substrate for which a processing recipe is being set among a plurality of substrates stored in the substrate storage cassette. Is preferably displayed.

This makes it easy to know which substrate in the substrate storage cassette is the substrate for which the processing recipe is being set, thereby facilitating the setting of the single-wafer processing recipe.

In the above-mentioned substrate processing apparatus, the apparatus further comprises a readable recording medium storing a plurality of processing recipes, and the character string display unit is used by a user for processing a substrate stored in the substrate storage cassette. When trying to select one of the plurality of processing recipes using the input panel, it is preferable to display a character string indicating whether or not the processing recipe can be executed.

With this configuration, when a processing recipe is set for a substrate, it is possible to know in advance whether or not the processing recipe is executable, so that the processing recipe can be accurately set and executed.

In the above substrate processing apparatus, it is preferable that the character string display section displays a character string for identifying the set processing recipe when setting the processing recipe on the input panel.

With this configuration, the contents of the processing recipe being set can be easily grasped, so that the processing recipe can be set more accurately.

[0019]

Other Embodiments of the Invention The present invention includes the following other embodiments. A first aspect is a substrate processing method in a substrate processing apparatus having a plurality of stages for mounting a plurality of substrate storage cassettes, wherein a processing condition of a substrate in a substrate storage cassette mounted on each stage is determined. In addition to setting the processing recipe shown, an input panel is provided at each stage to instruct the execution of the processing of the substrate, and when setting the processing recipe for the substrate in the substrate storage cassette mounted on each stage, the input panel is set at each stage. A substrate processing method characterized in that information on processing recipe settings is displayed as a character string on a corresponding input panel.

According to a second aspect, there is provided a computer-readable recording medium having recorded thereon a computer program for causing a computer to realize the functions of each step and each means of the above invention.

The third aspect is an aspect as a program supply device for supplying a computer program for realizing the functions of each step or each means of the above-described invention to a computer via a communication path. In such an embodiment, the functions of the above-described steps and units can be realized by placing the program on a server or the like on a network, downloading the necessary program to a computer via a communication path, and executing the program. it can.

[0022]

DETAILED DESCRIPTION OF THE INVENTION Configuration of Apparatus: Hereinafter, embodiments of the present invention will be described based on examples. FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention. The semiconductor substrate processing apparatus 10 includes two modules, a process module 100 and an indexer module 200. The process module 100 is a module used for a process of applying a photoresist on a semiconductor substrate (hereinafter, referred to as a “substrate”).
For example, it is also possible to connect a process module used in the development process of the exposure pattern to the process module 100.

The process module 100 includes two spin coaters SC1 and SC2 and three hot plates HP
1, HP2, HP3 and three cooling plates CP
1, CP2, CP3, and a substrate transport unit 110. The two spin coaters SC1 and SC2 are processing units for applying a photoresist on a substrate.
The three hot plates HP1, HP2, and HP3 are processing units that heat the substrate. The three cooling plates CP1, CP2, and CP3 are processing units that perform a cooling process on the substrate. Substrate transfer unit 110
Is a transport unit that transports a substrate from the indexer module to each processing unit or between processing units.

The indexer module 200 includes four cassette stages 210, 212, 214, 216, an indexer arm 220, and a processing control station 230.
And Four cassette stages 210, 2
Cassettes containing a plurality of substrates are installed at 12, 214, and 216. The indexer arm 220 takes out a predetermined substrate from the cassette provided on the cassette stage and transfers it to the substrate transport unit 110, and also transfers the substrate processed by each processing unit to the substrate transport unit 11
0 is a transfer unit that stores the data in the receiving substrate storage cassette. The process control station 230 is a computer that controls all processes in the semiconductor substrate processing apparatus 10. The processing control station 230 will be described later.

FIG. 2 shows the indexer module 20 of FIG.
FIG. 4 is an explanatory diagram showing a cassette stage of No. 0; The four cassette stages 210, 212, 214, and 216 further include stage panels 260, 262, 264, and 266.
Are provided. In each stage panel of the cassette stage, processing of a substrate in a substrate storage cassette installed on the cassette stage is set. The stage panels 260, 262, 264, 266 will be described later.

In this specification, the term “processing unit” particularly refers to a unit that performs processing for processing a substrate. Since the substrate transport unit 110 and the indexer arm 220 are units for transporting substrates, they do not correspond to “processing units” in the present embodiment. Therefore, among the units shown in FIG. 1, those which can be called “processing units” are the process modules 10.
There are eight units of two spin coaters SC1, SC2, three hot plates HP1, HP2, HP3, and three cooling plates CP1, CP2, CP3 in 0.

FIG. 3 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG. The semiconductor substrate processing apparatus 10 includes a processing control station 230, a transfer control unit 240, and a processing control unit 250. The transfer control unit 240 has a function of controlling transfer in the substrate transfer unit 110 and the indexer arm 220 in FIG. The processing control unit 250 controls each processing unit (SC1, SC2, HP1, HP2, HP3, CP1,
CP2, CP3). The transport control unit 240 and the processing control unit 250 control each unit based on a command from the control unit 232.

The processing control station 230 includes the control unit 2
32, an external magnetic storage unit 234, a keyboard, a mouse, and stage panels 260, 262, 264, 266.
This is a computer including an operation unit 236 such as that shown in FIG. 2 and a display unit 238 such as a liquid crystal display. The control unit 232 includes a CPU and a main memory (not shown), and controls the operations of the transport control unit 240 and the processing control unit 250 by executing a computer program stored in the main memory. External magnetic storage unit 23
Reference numeral 4 stores flow processing conditions for processing the substrate, unit processing conditions, and the like. Each of these processing conditions will be described later.

A computer program for realizing the function of each unit shown in FIG.
-Provided in a form recorded on a computer-readable recording medium such as a ROM. Each computer reads the computer program from the recording medium and transfers it to an internal storage device or an external storage device. Alternatively, a computer program may be supplied to a computer via a communication path. When realizing each function of the computer program, the computer program stored in the internal storage device is executed by the microprocessor of the computer. Further, a computer may read a computer program recorded on a recording medium and directly execute the computer program.

In this specification, a computer is
The concept includes a hardware device and an operation system, and means a hardware device that operates under the control of the operation system. In the case where an operation system is unnecessary and a hardware device is operated by an application program alone, the hardware device itself corresponds to a computer. The hardware device includes at least a microprocessor such as a CPU and means for reading a computer program recorded on a recording medium. The computer program includes a program code that causes such a computer to realize the functions of the above-described units. Some of the functions described above may be realized by an operation system instead of the application program.

The "recording medium" in the present invention includes a flexible disk, a CD-ROM, a magneto-optical disk, an IC card, a ROM cartridge, a punch card, a printed matter on which a code such as a bar code is printed, and an internal storage of a computer. Device (RAM, ROM, etc.)
And various computer-readable media such as an external storage device.

B. Processing content in the embodiment: A processing recipe including flow processing data and unit processing data is stored in the external magnetic storage unit 234 in FIG. FIG.
FIG. 3 is an explanatory diagram showing a processing recipe in the semiconductor substrate processing apparatus 10.

The flow processing data is composed of ten flow groups from "0" to "9". FIG.
(A) shows a flow group “0” 300,
Each flow group contains 99 flow processing conditions. Therefore, the flow processing data includes 990 flow processing conditions.

The unit processing data is classified into categories indicating the type of processing in the processing unit, and includes unit processing data for a spin coater, unit processing data for a hot plate, and unit processing data for a cooling plate. And the three types of processing data. Each unit processing data is composed of ten unit groups from “0” to “9”. FIG. 4B shows a unit group “2” 310 for the spin coater, a unit group “4” 320 for the hot plate, and a unit group “5” 330 for the cooling plate.
Each of 10, 320 and 330 includes 99 unit processing conditions. Therefore, each unit processing data includes 990 flow processing conditions.

Here, the "flow processing conditions" are data indicating the contents of a series of processing in which unit processing conditions indicating processing contents in each processing unit are arbitrarily combined. Each flow processing condition is, as shown in FIG.
It includes a transfer order, processing unit identification information, and a unit processing condition number. The transfer order indicates the order of transfer of the substrates in the substrate processing apparatus. The processing unit identification information includes the unit number of the processing unit to which the substrate is transported, and the processing category of the processing unit.
In the column of the processing category, “ID” indicates an indexer module, “SC” indicates a spin coater, “HP” indicates a hot plate, and “CP” indicates a cooling plate. The unit processing condition number indicates one unit processing condition in the unit processing data. “SC2.1” in the column of the unit processing condition number indicates the first unit processing condition included in the unit group “2” 310 for the spin coater, and the unit processing condition in the spin coater is thereby determined. .

The "unit processing conditions" are data indicating the processing contents in each processing unit. For example, the unit processing conditions of the spin coater include the timing of applying the photoresist to the substrate, the number of rotations of the spinner with respect to the elapsed time from the start of the processing, and the like. The hot plate unit processing conditions include the set temperature of the heating plate. Further, the unit processing condition of the cooling plate also includes the set temperature of the cooling plate.

The substrate processing conditions defined by the flow processing conditions and the unit processing conditions are called "processing recipes". The single-wafer processing recipe is a processing recipe in which a plurality of different processing conditions are set for the substrates stored in the cassette. In the single-wafer processing recipe, different flow processing conditions can be set for each substrate in the cassette.

The flow group "0" 300 in FIG.
When the processing is performed according to the flow processing condition “No. 1” shown at the top of the table, the substrate is transported and processed in the order of the indexer ID, the spin coater SC, the hot plate HP, and the cooling plate CP. The unit number in the third transfer order (third transfer destination unit) is “# 7”, which is the hot plate HP3 (FIG. 1).
Means The unit number in the fourth transport order is “# 8”, which means the cooling plate CP3 (FIG. 1).

As described above, since the processing unit identification information defines the transfer order of the substrates by the unit number unique to each processing unit, the transfer order of the substrates to the plurality of processing units is set to an arbitrary order. It is possible. In addition,
Since the processing unit identification information only needs to be able to identify each processing unit, it is sufficient that the processing unit identification information includes at least the unit number and does not need to include the processing category.

The substrates stored in the substrate storage cassette are processed according to a processing recipe. The setting of the processing recipe is performed on the stage panels 260, 262, 264, 266 (FIG. 2).
It is performed in.

FIG. 5 is an explanatory diagram showing an example of a stage panel provided on the cassette stage. FIG. 5 (a)
Shows a stage panel in the prior art.
The stage panel shown in FIG.
, Processing condition selection button 410 and start button 41
2, sending stop button 414, stop button 4
16, operation indicator lamp 420, end indicator lamp 4
22. The processing condition selection button 410 is a button for selecting a flow processing condition for a substrate stored in the substrate storage cassette, and a sign indicating the selected flow processing condition is displayed on the processing condition display unit 400. In the related art, the flow processing condition is “01”.
Since there are only 99 items from to "99", that is, since the above-described flow processing data is composed of only one flow group, there is no need to specify a flow group, and a two-digit number is displayed. If so, the flow processing conditions could be selected. The start button 412 is
This button is used to start processing according to the set flow processing conditions. The stop button 416 is a button for temporarily stopping the process being executed. The unloading stop button 414 is a button for storing a substrate under processing in a cassette after the processing is completed, and preventing unprocessed substrates in the cassette from being carried out to each processing unit for processing. The in-operation indicator lamp 420 is a lamp indicating that the processing of the substrate in the cassette is being executed.
The end indicator lamp 422 is a lamp indicating that the processing of the substrate in the cassette has been completed.

In the prior art, only the lot processing is set by operating the processing condition selection button 410 on the stage panel of FIG. 5A to display the number of the target flow processing condition on the processing condition display section 400. And was able to run. FIG. 5A shows the single-wafer processing.
Cannot set a single-wafer processing recipe because the substrate in the cassette cannot be specified on the stage panel of the operation panel 23 of the processing control station 230 (FIG. 1).
In 6, the single-wafer processing recipe can be set without using the stage panel. However, since the execution is performed by displaying the number indicating the single-wafer processing recipe on the stage panel, it is difficult to accurately set the target processing conditions.

FIG. 5B shows a stage panel in this embodiment. This stage panel is also provided with a number of display units, buttons, and lamps as described below.

(1) Processing condition display section 450: Displays the identification code of the selected processing mode (described later) and the number of the flow processing condition. This display is divided by a period.
It is composed of a digit and two-digit seven-segment LEDs. In this embodiment, the symbols that can be displayed on the processing condition display section 450 are only the numerals “0” to “9”, some English characters such as “F”, and “−”.

(2) Character string display section 452: at the time of setting flow processing conditions, information indicating the number of substrates to be set, information indicating whether the set flow processing conditions can be executed, and the like. Is displayed. When the process is executed, information indicating that the process is being executed, information indicating the number of the substrate being processed, and the like are displayed. This display unit is constituted by a liquid crystal display. In this embodiment,
The characters displayed on the character string display unit 452 are only numbers, English characters, and kana characters, but may be kanji characters. Further, the character string display unit 452 can display a character string of up to 16 characters.

(3) Processing condition selection button 460: Selects a processing mode (to be described later) and a flow processing condition. By pressing the upper button, "01" to "99" and "FF"
Are increased in this order and displayed on the processing condition display section 450, and when the lower button is pressed, the symbols are decreased. When the middle button is pressed, the eleven symbols “0” to “9” and “F” are displayed in this order in the processing condition display section 45.
Displayed as 0. The upper and lower buttons change the display of the two-digit portion of the processing condition display section 450 separated by a period, and the middle button changes the display of the one-digit portion separated by a period.

(4) Start button 464: Starts processing according to the set processing recipe.

(5) Sending stop button / decision button 4
68: This button has two functions according to the use situation. It functions as a “delivery stop button” when processing is performed, and functions as a “decision button” when processing is set.
The “delivery stop button” is a button for storing a substrate under processing in a cassette after the processing is completed and preventing unprocessed substrates in the cassette from being carried out to each processing unit for processing. The “enter button” is a button for deciding to adopt the flow processing conditions displayed on the processing condition display section 450. Hereinafter, it is referred to as a “sending stop button” or a “decision button” according to the use situation.

(6) Stop button / cancel button 470: This button has two functions according to the use situation. It functions as a "stop button" when processing is performed, and functions as a "cancel button" when processing is set. The “stop button” is a button for temporarily stopping the processing being executed. The “cancel button” is a button for canceling the setting of the flow processing condition displayed on the processing condition display unit 450. Hereinafter, it is referred to as a "stop button" or a "cancel button" depending on the usage status.

(7) Interrupt button 472: A button for preferentially executing processing of a substrate of a different cassette during processing of a substrate of a certain cassette.

(8) In-operation indicator lamp 480: A lamp for indicating that the processing of the substrate of the cassette is being executed.
The lamp is turned on during execution.

(9) End indicator lamp 482: A lamp for indicating that all the substrates in the cassette have been processed. At the end, the lamp lights up.

(10) Pause display lamp 484: A lamp for indicating that the processing of the substrate in the cassette is temporarily stopped. The lamp lights up during the pause.

Since the character string display section 452 is provided on the stage panel of FIG. 5B, information indicating the number of substrates in the cassette can be displayed, and this information is sequentially displayed. By doing so, flow processing conditions can be set for each substrate. This makes it possible to set a processing recipe for single-wafer processing. Note that the stage panel in FIG. 5B corresponds to the input panel in the present invention.

FIG. 6 is a flowchart showing the overall procedure of the processing in this embodiment. The processing of the substrates stored in the substrate storage cassette is performed by using each cassette stage 210 shown in FIG.
(Or 212, 214, 216) stage panel 262 (or 262, 264, 266)
Set in.

In step S1, a processing mode of "lot processing" or "single wafer processing" is selected for the substrate storage cassette. FIG. 7 is an explanatory diagram showing an example of the display of the stage panel in step S1. In this embodiment, since the lot processing mode is selected in advance as the initial setting, there is no need to select the mode when performing lot processing. FIG. 7A shows the stage panel in the lot processing mode. The character string display section 452 displays a character string “No. FIG. 7B shows the stage panel when the single-wafer processing mode is selected. By operating the processing condition selection button 460,
"F.F" indicating the single-wafer processing mode is displayed on the processing condition display section 450.
F ”is displayed. At this time, the character string display section 452 displays
A character string “Mayoshori mode” indicating that the single-wafer processing mode has been selected is displayed. Here, by selecting the decision button 468, the mode becomes the single-wafer processing mode, and the flow processing conditions can be set for each substrate.

When performing lot processing, flow processing conditions are set in step S2 (FIG. 6). The flow processing condition is selected by operating the processing condition selection button 460. FIG. 8 is an explanatory diagram showing an example of a display on the stage panel when the flow processing condition is selected in step S2. In the embodiment of FIG. 8, "0.03" is displayed on the processing condition display section 450. This is because “0.03” is the flow processing condition for the lot processing, that is, FIG.
This indicates that the flow processing condition “No. 3” of the flow group “0” 300 in FIG. At this time, the character string "flow group 0" is displayed in the character string display section 452.
No. 3 "is displayed.

When performing the single-wafer processing, step S3
In FIG. 6, a single-wafer processing recipe is set. FIG.
FIG. 7 is a flowchart illustrating details of a process of step S3 in FIG. 6. In step S3a, flow processing conditions are set for the first substrate. FIG. 10 is an explanatory diagram showing an example of a display on the stage panel when a flow processing condition is selected for each substrate in step S3 of FIG. FIG. 10A shows the stage panel when the flow processing condition is selected for the first substrate. Character string display section 4
52 displays a character string “1 My Menu No. ヲ Setup” that prompts the user to select the flow processing conditions for the first substrate. In the embodiment of FIG. 10A, the flow processing condition “No. 81” of the flow group “0” of FIG. 4A is selected. Here, by selecting the enter button 468, the flow processing conditions for the first substrate are set, and the flow shifts to step S3b.

In step S3b, flow processing conditions are set for the second substrate. FIG.
7 shows a stage panel when a flow processing condition is selected for a second substrate. In the example of FIG. 10B, the flow processing condition “No. 7” of the flow group “8” is selected. Here, by selecting the OK button 468, the flow processing conditions for the second substrate are set. In this way, the flow processing conditions are sequentially set for each substrate.

In step S3c, flow processing conditions are set for the 25th substrate. FIG. 10 (c)
Shows a stage panel when the flow processing condition is selected for the 25th substrate. In the example of FIG. 10C, the flow processing condition “No.
9 "has been selected. Here, by selecting the OK button 468, the flow processing conditions for the 25th substrate are set, and the setting of the single wafer processing recipe is completed. FIG. 11 is an explanatory diagram showing an example of a display on the stage panel when the setting of the single-wafer processing recipe in step S3 of FIG. 6 is completed. In FIG. 11, the character string display section 452 displays a character string "START Digit Kano" that prompts the execution of single-wafer processing, and the processing condition display section 450 displays "F.FF" indicating the single-wafer processing mode. Is displayed.

In the stage panel of this embodiment, the cancel button 47 is set during or after the setting of the single-wafer processing recipe.
By selecting 0, the settings can be changed for a substrate for which the flow processing conditions have already been set. Also at this time, the character string display unit 452 displays a character string indicating the number of the substrate whose setting is to be changed. Thereby, the setting of the flow processing conditions for each substrate can be reliably executed.

In this embodiment, when an unexecutable flow processing condition is selected, a character string indicating that the flow processing condition cannot be used is displayed. The unexecutable flow processing condition is, for example, a spinner SC1 (FIG. 1) of the unit number “# 1” included in the flow processing condition “No. 1” of the flow group “0” in FIG. There is a case where the unit is out of order. This also makes it possible to accurately set the flow processing conditions for the substrate, and to surely perform the substrate processing.

In this embodiment, the setting of the flow processing conditions is as follows:
Although the process is performed only by selecting a code indicating the flow processing condition, a name may be assigned to each flow processing condition, and the name may be displayed on the character string display unit 452. This way,
The setting of the flow processing conditions for the substrate can be performed more accurately.

In step S4 (FIG. 6), step S2
Alternatively, the processing is executed according to the processing conditions set in step S3. FIG. 12 is a flowchart showing details of the processing in step S4 in FIG.

In step S4a, the lot processing or the single-wafer processing is started by selecting the start button 464 in FIG. 8 or FIG. FIG.
FIG. 9 is an explanatory diagram showing an example of a display on a stage panel when processing of a substrate is being performed in step S4a of FIG. FIG. 13A shows a stage panel when a lot process is being performed. The character string display section 452 displays a character string “SHORICHU” indicating that the process is being executed.
Is displayed, and the processing condition display unit 450 displays “0.0” indicating the flow processing condition “No. 3” of the flow group “0”.
3 "is displayed. FIG. 13B shows a stage panel when the single-wafer processing is being performed. The character string display section 452 displays a character string “Shochu” indicating that processing is being performed, and the processing condition display section 450 displays “F.FF” indicating single-wafer processing. When the processing is being performed, the operating display lamp 480 is turned on.

In this embodiment, when the lot processing or the single-wafer processing is being executed, the character string display section 452 (FIG. 13)
Displays a character string indicating that processing is in progress, but instead displays a character string indicating how many substrates are being processed, and how many substrates are being processed. A character string indicating whether the processing has been completed, a character string indicating a flow processing condition being executed, or the like may be displayed. In this way, the progress of the processing of the substrate can be confirmed.

In step S4b (FIG. 12), it is determined whether a function is selected during the processing of the substrate storage cassette.
If there is no function selection during the process, the process is continued and the process proceeds to step S4c.

In step S4b, if the function "stop feeding" is selected, the flow shifts to step S4d. The selection of the delivery stop function is executed by selecting the delivery stop button 468 (FIG. 5) on the stage panel for the substrate storage cassette being processed. At this time, in step S4d, sending out the unprocessed substrate to the processing unit is stopped, the substrate being processed is accepted after the processing in the processing unit is completed, and the substrate is temporarily stopped. FIG. 14 is an explanatory diagram showing an example of a display on the stage panel when the processing is temporarily stopped in step S4d of FIG. FIGS. 14 (a) and (b)
The stage panel when the lot processing and the single-wafer processing are temporarily stopped is shown. The character string display section 452 displays a character string “SHORT POSITION” indicating that the processing is temporarily stopped. When the vehicle is paused, the pause display lamp 484 is turned on. In step S4e, the process is restarted by selecting the sending stop button 468 in FIGS. 14A and 14B again.

If the function "interrupt" is selected in step S4b (FIG. 12), the flow shifts to step S4f. The selection of the interrupt function is executed by selecting the interrupt button 472 (FIG. 5) on the stage panel for another cassette different from the cassette being processed. At this time, in step S4f, sending out the unprocessed substrates of the cassette being processed to the processing unit is stopped, and the substrates being processed are accepted after the processing in the processing unit is completed, and then temporarily stopped. At this time, on the stage panel, as in step S4f,
The character string display section 452 displays a character string “SHORT POSITION” indicating that the processing is temporarily stopped, and the pause display lamp 484 is turned on. In step S4g, a process for another cassette is executed. After the processing for the other cassette is completed, in step S4h, the processing is resumed for the cassette for which the processing has been temporarily stopped.

In step S4c, the processing of all the substrates in the substrate storage cassette ends. FIG.
FIG. 11 is an explanatory diagram showing an example of a display on the stage panel when the process is completed in step S4c of FIG. FIG.
(A) and (b) show the stage panel when the lot processing and the single-wafer processing are completed, respectively. The character string display section 452 displays a character string “SHORT” indicating that the processing has been completed. When the operation is completed, the end indicator lamp 482 is turned on.

In the stage panel of the present embodiment, a character string indicating a communication error between the stage panel and the control unit 232 (FIG. 3), for example, "NOT CONNECTION" is displayed on the character string display unit 452 (FIG. 5). can do. Thereby, the stage panel or the control unit 232 is
You can know the abnormalities.

As described above, in the above embodiment, by providing the character string display section, it is possible to display various information on the setting and execution state of the processing recipe. Therefore, a processing recipe can be set while confirming information on the substrate, the processing recipe, and the substrate processing apparatus. As a result, accurate setting of the processing recipe and execution of the processing become possible.

It should be noted that the present invention is not limited to the above examples and embodiments, but can be implemented in various modes without departing from the gist of the invention.
For example, the following modifications are possible.

(1) In the above embodiment, the character string displayed on the character string display section 452 is limited to 16 characters, but the number of characters to be displayed may be increased. In this case, more detailed information can be displayed. (2) In the above embodiment, the character string display unit 452
Although the processing condition display section 450 is provided separately, information displayed on the processing condition display section 450 may be displayed on the character string display section 452. In this way, necessary information can be displayed only by providing a character string display field. (3) In the above embodiment, a part of the configuration realized by hardware may be replaced with software, and conversely, a part of the configuration realized by software may be replaced with hardware. Is also good.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention.

FIG. 2 is an explanatory view showing a cassette stage of the indexer module 200 of FIG.

FIG. 3 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG.

FIG. 4 is an explanatory view showing a processing recipe in the present semiconductor substrate processing apparatus 10.

FIG. 5 is an explanatory view showing an example of a stage panel provided on the cassette stage.

FIG. 6 is a flowchart illustrating an overall procedure of a process according to the embodiment.

FIG. 7 is an explanatory diagram showing an example of a display on a stage panel in step S1.

FIG. 8 is an explanatory diagram showing an example of a display on a stage panel when a flow processing condition is selected in step S2.

FIG. 9 is a flowchart showing details of the process of step S3 in FIG. 6;

FIG. 10 is an explanatory diagram showing an example of a display on a stage panel when a flow processing condition is selected for each substrate in step S3 of FIG. 6;

FIG. 11 is an explanatory diagram showing an example of a display on a stage panel when setting of a single-wafer processing recipe in step S3 of FIG. 6 is completed.

FIG. 12 is a flowchart showing details of the process of step S4 in FIG. 6;

FIG. 13 is an explanatory diagram showing an example of a display on a stage panel when processing of a substrate is being performed in step S4a of FIG. 12;

FIG. 14 is an explanatory diagram showing an example of a display on the stage panel when the processing is temporarily stopped in step S4d of FIG. 12;

FIG. 15 is an explanatory diagram showing an example of a display on the stage panel when the processing is completed in step S4c of FIG. 12;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Semiconductor substrate processing apparatus 100 ... Process module 110 ... Substrate transfer unit 200 ... Indexer module 210,212,214,216 ... Cassette stage 220 ... Indexer arm 230 ... Processing control station 232 ... Control part 234 ... External magnetic storage part 236 ... Operation unit 238 Display unit 240 Transfer control unit 250 Processing control unit 260, 262, 264, 266 Stage panel 300 Flow group "0" 310 Unit group for spin coater "2" 320 Unit for hot plate Group "4" 330 ... Unit group "5" for cooling plate 400 ... Processing condition display section 410 ... Processing condition selection button 412 ... Start button 414 ... Sending stop button 416 ... Stop button 420 ... Middle display lamp 422 ... End display lamp 450 ... Processing condition display section 452 ... Character string display section 460 ... Processing condition selection button 464 ... Start button 468 ... Sending stop button / decision button 470 ... Stop button / Cancel button 472 ... Interruption button 480 … Indicator lamp 482… end indicator lamp 484… pause indicator lamp SC1, SC2… spin coater HP1, HP2, HP3… hot plate CP1, CP2, CP3… cooling plate

Claims (5)

[Claims] 1. A substrate processing apparatus for processing a substrate stored in a substrate storage cassette, comprising: a plurality of stages for mounting a plurality of substrate storage cassettes; and a substrate mounted on each stage. An input panel provided at each stage for setting a processing recipe indicating processing conditions of the substrate in the storage cassette and for instructing execution of the processing of the substrate; and each input panel is provided at a corresponding stage. What is claimed is: 1. A substrate processing apparatus, comprising: a character string display unit capable of displaying information regarding setting of a processing recipe as a character string when setting a processing recipe for a substrate in a mounted substrate storage cassette. 2. The substrate processing apparatus according to claim 1, wherein the character string display unit is further capable of displaying information on an execution state of the processing as a character string when executing the processing of the substrate. 3. The substrate processing apparatus according to claim 1, wherein the input panel is provided for each of a plurality of substrates in a substrate storage cassette mounted on a stage corresponding to the input panel. In the single-wafer processing setting, the character string display unit displays a processing recipe among a plurality of substrates stored in the substrate storage cassette in the single-wafer processing setting. A substrate processing apparatus for displaying a character string indicating the number of a substrate being set. 4. The substrate processing apparatus according to claim 1, further comprising: a readable recording medium storing a plurality of processing recipes; Regarding the processing of the substrates stored in the substrate storage cassette, when the user attempts to select one of the plurality of processing recipes using the input panel, it is determined whether or not the processing recipe can be executed. A substrate processing apparatus that displays a character string. 5. The substrate processing apparatus according to claim 1, wherein the character string display unit displays a set processing recipe when setting the processing recipe on the input panel. A substrate processing device that displays a character string for identification.