JPH11186366A - Apparatus for treatment substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily set and execute a sheet freed treatment by detecting exis tence of a substrate in each of slots of a substrate cassette, and executing only the treatment of each of substrates housed in the cassette according to sheet-feed treating recipes. SOLUTION: A substrate detector sensor detects the existence of as substrate in each of slots of a substrate cassette. Sheet feed treatment recipes contrg. information representing the carrying order of treating units and information representing the treating condition of the treating units are set in an external magnetic memory 234 for each of the hosed and detected substrates, so that only those substrates detected being housed in the cassette are treated in accordance with the sheet feed treatment recipes. Even if housed in only a part of the slots of the cassette, the treatment recipes can be set quickly for executing the sheet feed treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique of a substrate processing apparatus having a plurality of processing units, and more particularly, to a technique of performing a single-wafer processing for continuously performing a different processing for each of a plurality of substrates. About.

[0002]

2. Description of the Related Art In a substrate processing apparatus for processing substrates such as a semiconductor substrate, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a substrate for an optical disk, a plurality of processes for performing various processes are performed. Units are combined. For example, a semiconductor substrate processing apparatus used in a process of applying a photoresist to a semiconductor substrate includes a plurality of processing units such as a spin coater, a hot plate, and a cooling plate. Normally, regarding the unit processing conditions in each processing unit,
The user sets in advance for each unit. In addition, the user also sets in advance the flow processing conditions indicating in which unit the substrate is to be processed and in what order the substrate is transported to the unit. The processing of the substrate is executed according to the processing recipe specified by the flow processing conditions and the unit processing conditions set in this way.

A substrate to be processed is set in a substrate processing apparatus in a state of being stored in a cassette for storing substrates (hereinafter, referred to as a “substrate storage cassette” or simply a “cassette”). One cassette has a slot for accommodating about 25 substrates. Usually, all the substrates stored in the cassette are processed according to the same processing recipe.

However, when confirming whether the operation state of the substrate processing apparatus is good or not, and whether the processing conditions are good or not, it is sometimes necessary to execute the process on only a small number of substrates. In such a case, a cassette containing only a small number of substrates is set in the substrate processing apparatus, and processing is performed by setting processing conditions for each of the substrates. In this specification, a process in which different processing conditions are set for some or all of the substrates stored in the cassette in this manner is referred to as “single-sheet processing”, and a processing recipe for single-wafer processing is referred to. Is referred to as a “sheet-fed processing recipe”. In the single-wafer processing, different processing recipes need not be set for each substrate in the cassette, and the same processing recipe may be set for a plurality of substrates.

[0005]

In the conventional substrate processing apparatus, when performing single-wafer processing, it is necessary to set flow processing conditions for all slots of a substrate storage cassette capable of storing a plurality of substrates. was there.
Therefore, even when the substrates are stored only in some of the slots of the substrate storage cassette, the flow processing conditions must be set for all the slots, and it takes time to set the conditions for the single-wafer processing. There was a problem.

The present invention has been made to solve the above-mentioned problems in the prior art, and has as its object to provide a technique capable of easily setting and executing single-wafer processing in a substrate processing apparatus. I do.

[0007]

In order to solve at least a part of the above-mentioned problems, a substrate processing apparatus according to the present invention includes a plurality of processing units for processing a substrate and the substrate storage cassette. Detecting means for detecting whether or not a substrate is stored in each of the slots, and for each of the substrates detected to be stored in the substrate storage cassette, the order in which the substrates are sequentially conveyed to a plurality of processing units. A processing recipe setting means for setting a single-wafer processing recipe including transport order information indicating the processing order and unit processing information indicating processing conditions in each processing unit; and the single-wafer processing recipe being stored in the substrate storage cassette. And control means for executing the processing of each of the substrates for which is detected.

In the above-described substrate processing apparatus, the processing recipe can be set only for the slots in the substrate storage cassette where the substrates are stored. Therefore, even when the substrates are stored only in some of the slots of the substrate storage cassette, It is possible to quickly set a processing recipe and execute a single-wafer processing.

In the above-mentioned substrate processing apparatus, it is preferable that the processing recipe setting means includes non-processing setting means for setting not to perform processing on an arbitrary substrate stored in the substrate storage cassette.

In this case, even when a substrate that does not need to be processed is stored in the slot of the substrate storage cassette, the single-wafer processing of only the target substrate can be quickly performed.

Further, in the above-mentioned substrate processing apparatus, the processing recipe setting means sets an execution of a processing corresponding to a lot change of the substrate in accordance with processing of an arbitrary substrate stored in the substrate storing cassette. It is preferable to include processing setting means.

In this case, a process corresponding to a lot change can be performed on the substrates stored in the same substrate storage cassette without using another substrate storage cassette, so that a quick single-wafer processing can be performed. be able to.

[0013]

Other Embodiments of the Invention The present invention includes the following other embodiments. A first aspect is a substrate processing method in a substrate processing apparatus including a plurality of processing units for processing substrates stored in a plurality of slots of a substrate storage cassette, wherein each of the slots of the substrate storage cassette has A step of detecting whether or not a substrate is stored, and for each substrate detected to be stored in the substrate storage cassette, transfer order information indicating an order of sequentially transferring to a plurality of processing units, A step of setting a single-wafer processing recipe including unit processing information indicating processing conditions in each processing unit, and processing of each substrate detected to be stored in the substrate storage cassette according to the single-wafer processing recipe. And a step of executing the substrate processing method.

According to a second aspect, there is provided a computer-readable recording medium having recorded thereon a computer program for causing a computer to realize the functions of each step and each means of the above invention.

A third aspect is an aspect as a program supply device for supplying, via a communication path, a computer program for causing a computer to realize the functions of the respective steps or means of the above invention. In such an embodiment, the functions of the above-described steps and units can be realized by placing the program on a server or the like on a network, downloading the necessary program to a computer via a communication path, and executing the program. it can.

[0016]

DETAILED DESCRIPTION OF THE INVENTION Configuration of Apparatus: Hereinafter, embodiments of the present invention will be described based on examples. FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention. The semiconductor substrate processing apparatus 10 includes two modules, a process module 100 and an indexer module 200. The process module 100 is a module used for a process of applying a photoresist on a semiconductor substrate (hereinafter, referred to as a “substrate”).
For example, it is also possible to connect a process module used in the development process of the exposure pattern to the process module 100.

The process module 100 includes two spin coaters SC1 and SC2 and three hot plates HP
1, HP2, HP3 and three cooling plates CP
1, CP2, CP3, and a substrate transport unit 110. The two spin coaters SC1 and SC2 are processing units for applying a photoresist on a substrate.
The three hot plates HP1, HP2, and HP3 are processing units that heat the substrate. The three cooling plates CP1, CP2, and CP3 are processing units that perform a cooling process on the substrate. Substrate transfer unit 110
Is a transport unit that transports a substrate from the indexer module to each processing unit or between processing units.

The indexer module 200 includes four cassette stages 210, 212, 214, 216, an indexer arm 220, and a processing control station 230.
And Four cassette stages 210, 2
Reference numerals 12, 214, and 216 denote stages on which a cassette containing a plurality of substrates is installed. Indexer arm 22
Reference numeral 0 denotes a transfer unit that takes out a predetermined substrate from the cassette provided in the cassette stage and transfers it to the substrate transfer unit 110, and also receives the substrate processed in each processing unit from the substrate transfer unit 110 and stores it in the cassette. is there. The process control station 230 is a computer that controls all processes in the semiconductor substrate processing apparatus 10. The processing control station 230 will be described later.

In this specification, the term "processing unit" particularly refers to a unit that performs processing for processing a substrate. Since the substrate transport unit 110 and the indexer arm 220 are units for transporting substrates, they do not correspond to “processing units” in the present embodiment. Therefore, among the units shown in FIG. 1, those which can be called “processing units” are the process modules 10.
There are eight units of two spin coaters SC1, SC2, three hot plates HP1, HP2, HP3, and three cooling plates CP1, CP2, CP3 in 0.

FIG. 2 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG. The semiconductor substrate processing apparatus 10 includes a processing control station 230, a transfer control unit 240, and a processing control unit 250. The transfer control unit 240 has a function of controlling transfer in the substrate transfer unit 110 and the indexer arm 220 in FIG. The processing control unit 250 controls each processing unit (SC1, SC2, HP1, HP2, HP3, CP1,
CP2, CP3). The transport control unit 240 and the processing control unit 250 control each unit based on a command from the control unit 232.

The processing control station 230 includes the control unit 2
32, an external magnetic storage unit 234, an operation unit 236 such as a keyboard, a mouse, and a control panel, and a display unit 238 such as a liquid crystal display. The control unit 232 further includes a CPU (not shown).
And a main memory, and controls processes of the transport control unit 240 and the process control unit 250 by executing a computer program stored in the main memory. The external magnetic storage unit 234 stores flow processing conditions for performing single-wafer processing, unit processing conditions, and the like.
Each of these processing conditions will be described later.

A computer program for realizing the function of each unit shown in FIG.
-Provided in a form recorded on a computer-readable recording medium such as a ROM. Each computer reads the computer program from the recording medium and transfers it to an internal storage device or an external storage device. Alternatively, a computer program may be supplied to a computer via a communication path. When realizing each function of the computer program, the computer program stored in the internal storage device is executed by the microprocessor of the computer. Further, a computer may read a computer program recorded on a recording medium and directly execute the computer program.

In this specification, a computer is
The concept includes a hardware device and an operation system, and means a hardware device that operates under the control of the operation system. In the case where an operation system is unnecessary and a hardware device is operated by an application program alone, the hardware device itself corresponds to a computer. The hardware device includes at least a microprocessor such as a CPU and means for reading a computer program recorded on a recording medium. The computer program includes a program code that causes such a computer to realize the functions of the above-described units. Some of the functions described above may be realized by an operation system instead of the application program.

The "recording medium" in the present invention includes a flexible disk, a CD-ROM, a magneto-optical disk, an IC card, a ROM cartridge, a punched card, a printed matter on which a code such as a bar code is printed, and an internal storage of a computer. Device (RAM, ROM, etc.)
And various computer-readable media such as an external storage device.

B. FIG. 3 is a flowchart showing the overall procedure of the processing in this embodiment. In step S1, the cassette stage 21 of FIG.
0 (or 212, 214, 216) is detected in the substrate storage cassette provided in the substrate storage cassette.

FIG. 4 is an explanatory view schematically showing a method for detecting a substrate stored in a slot of the substrate storage cassette. In FIG. 4, a hatched portion indicates that the substrate is stored in the slot of the substrate storage cassette, and a broken line indicates that the substrate is not stored in the slot. The substrate is detected by a substrate detection sensor 260 disposed opposite to the substrate storage cassette. The substrate detection sensor 260 includes a light emitting element 260a and a light receiving element 260b.
It is composed of The light emitting element 260a and the light receiving element 260b are arranged so that their optical axes are inclined with respect to the surface of the substrate, so that light from the light emitting element 260a is blocked by the substrate if the substrate is housed in the slot. The light emitting element 260b is not detected by the light emitting element 260b if the substrate is not stored in the slot.
The presence or absence of the substrate in the slot is determined by detecting the light from a in the light receiving element 260b.
In addition, since the light emitting element 260a and the light receiving element 260b move in a vertical direction along the substrate storage cassette integrally, by controlling the timing of the determination, it is possible to determine the presence or absence of a substrate in all slots of the substrate storage cassette. can do. The method and apparatus for detecting a substrate in a cassette are described in detail, for example, in Japanese Patent Application Laid-Open No. 3-297156, which was disclosed by the present applicant.

This substrate storage cassette has 25 slots, and can store up to 25 substrates. In FIG. 4, 1, 2, 4, 5,
Substrates are stored in the sixth and ninth slots, and no substrates are stored in the other slots. This information is detected by the board detection sensor 260. Note that the detection of the substrate by the substrate detection sensor 260 corresponds to a detection unit in the present invention.

In step S2 of FIG. 3, the flow processing conditions are set for each slot for which the presence of the substrate has been confirmed in step S1, and a single-wafer processing recipe is created. FIG. 5 is an explanatory diagram showing the relationship between the flow processing conditions and the unit processing conditions in the semiconductor substrate processing apparatus 10. FIG. 5A shows the flow processing data 300, and FIG. 5B shows the unit processing data 310, 320, 330 of each processing unit. The flow processing data 300 includes 99 flow processing conditions, and the unit processing data 310 and 32 of each processing unit.
Each of 0 and 330 also includes 99 unit processing conditions.

Here, the "flow processing condition" is data indicating a series of processing contents obtained by arbitrarily combining unit processing conditions indicating processing contents in each processing unit. Each flow processing condition is, as shown in FIG.
It includes a transfer order, processing unit identification information, and a unit processing condition number. The transfer order indicates the order of transfer of the substrates in the substrate processing apparatus. The processing unit identification information includes the unit number of the processing unit to which the substrate is transported, and the processing category of the processing unit.
In the column of the processing category, “ID” indicates an indexer module, “SC” indicates a spin coater, “HP” indicates a hot plate, and “CP” indicates a cooling plate. Further, the unit processing condition number indicates one unit processing condition in the unit processing data 310, 320, 330. "SC" in the unit processing condition number column
“1” indicates the first unit processing condition included in the unit processing data 310 for the spin coater, and the unit processing condition in the spin coater is thereby determined.

The transfer order and the processing unit identification information correspond to transfer order information indicating the order in which the substrates are sequentially transferred to the processing unit. Further, the unit processing condition number and the unit processing data 310, 320, 330 correspond to unit processing information indicating processing conditions in each processing unit.

The "unit processing condition" is data indicating the processing content in each processing unit. For example, the unit processing conditions of the spin coater include the timing of applying the photoresist to the substrate, the number of rotations of the spinner with respect to the elapsed time from the start of the processing, and the like. The hot plate unit processing conditions include the set temperature of the heating plate. Further, the unit processing condition of the cooling plate also includes the set temperature of the cooling plate.

The substrate processing conditions defined by the flow processing conditions and the unit processing conditions are called "processing recipes". The single-wafer processing recipe is a processing recipe in which a plurality of different processing conditions are set for the substrates stored in the cassette. In the single-wafer processing recipe, it is possible to set different flow processing conditions for each slot of the cassette. Examples of the single-wafer processing recipe will be further described later.

When processing is performed in accordance with the flow processing condition "No. 1" shown at the top of the flow processing data 300 in FIG. 5A, the substrate includes an indexer ID, a spin coater SC, a hot plate HP, and a cooling plate. C
It is transported and processed in the order of P. Third transport order (3
The unit number of the (#th destination unit) is "#
7 ", which means the hot plate HP3 (FIG. 1). The unit number in the fourth transport order is “# 8”, which is the cooling plate CP.
3 (FIG. 1).

As described above, since the processing unit identification information defines the transfer order of the substrates by the unit number unique to each processing unit, the transfer order of the substrates to the plurality of processing units is set to an arbitrary order. It is possible. In addition,
Since the processing unit identification information only needs to be able to identify each processing unit, it is sufficient that the processing unit identification information includes at least the unit number and does not need to include the processing category.

FIG. 6 is an explanatory diagram showing a single-wafer processing recipe for the substrate storage cassette of FIG. In the prior art, flow processing conditions have to be set for all slots even when substrates are not stored in all slots of the substrate storage cassette. Therefore, even if the substrates are stored only in some of the slots of the substrate storage cassette as shown in FIG. 4, the flow processing conditions are applied to all the slots as shown in the single-wafer processing recipe 400 in FIG. Had to be set. In this example, regarding the slot in which the board is stored, the first slot has the flow processing condition “No. 3”, the second slot has the flow processing condition “No. 5”, and the fourth slot has the flow processing condition “No. Is the flow processing condition “No. 26”, the fifth slot is the flow processing condition “No. 99”, the sixth slot is the flow processing condition “No.
The flow processing condition “No. 3” is set in the third slot. In addition, the flow processing condition “No. 99” is set for other slots in which no substrates are stored.

FIG. 6B shows a single-wafer processing recipe of the embodiment, in which the flow processing conditions are set only for the slots for which the presence of the substrate has been confirmed in step S1 of FIG. For the fifth slot that does not need to be processed, no processing (no processing) can be set. The setting of the flow processing conditions for each slot (each substrate) is executed by using the operation unit 236 of the processing control station 230 according to a setting processing program. The function of the processing recipe setting unit according to the present invention is realized by the control unit 232 and the operation unit 236 that execute this program.

In the single-wafer processing recipe 410 shown in FIG. 6B, it is possible to further set the presence or absence of the additional processing. Here, “incidental processing” is processing corresponding to lot change. At the time of a normal lot change, the cassette is replaced, and various additional processes are executed before the next lot is processed. By performing the supplementary processing in the middle of the single-wafer processing, the processing of the substrate to be performed using different cassettes can be performed using the same cassette. In the present semiconductor substrate processing apparatus 10 (FIG. 1), for example,
Pre-dispensing of the spin coater SC1 (or SC2) is performed as ancillary processing. This pre-dispensing is a process for preventing the film from being uniformly applied on the substrate due to deterioration of the photoresist, and a process for discarding a small amount of the photoresist accumulated at the nozzle tip portion of the photoresist application portion. . In addition, as other additional processing, for example, replacement of a reticle (a mask in which a pattern is enlarged) in an exposure step of a pattern,
There is a pre-dispensing of a developer in a developing process of the exposure pattern. The setting of the presence / absence of ancillary processing for each slot is also performed by the operation unit 2
The processing is executed in accordance with the setting processing program using the program 36. The function of the auxiliary processing setting unit according to the present invention is realized by the control unit 232 and the operation unit 236 that execute this program.

In step S2 of FIG.
When a single-wafer processing recipe is set for one substrate storage cassette, flow processing conditions are sequentially set for each slot in which substrates are stored.

FIG. 7 is a flowchart showing details of the processing in step S2 in FIG. In step S2a, a slot number to be displayed on the control panel of the operation unit 236 (FIG. 2) is prepared based on the slot information in step S1 (FIG. 3).

FIG. 8 is an explanatory diagram showing an example of a control panel for selecting and executing flow processing conditions for each slot. The control panel shown in FIG. 8 includes a slot number display field 500, a flow processing condition display field 510, and a flow processing condition selection button 520.
, Ancillary processing selection button 525, and start button 53
0, stop button 540, cancel button 55
0, a decision button 560, and a pause button 570. The slot number display field 500 is a field for displaying the slot number of the slot in which the board is stored and the presence or absence of additional processing. The flow processing condition selection button 520 is displayed in the slot number display field 5
00 is a button for selecting a flow processing condition for the target slot displayed at 00, and a code indicating the selected flow processing condition is indicated by a flow processing condition display field 51.
Displayed as 0. The additional processing selection button 525 is a button for selecting whether or not there is an additional processing for the target slot. The start button 530 is a button for executing processing according to the set single-wafer processing recipe. The stop button 540 is a button for forcibly stopping the currently executed single-wafer processing. Cancel button 550
Is a button for canceling the processing setting for the target slot. The decision button 560 is a button for deciding a process for the target slot. The pause button 570 is a button for temporarily interrupting the currently executed single-wafer processing.

In step S2b in FIG. 7, step S2
The slot numbers prepared in a are sequentially displayed on the control panel. In the embodiment shown in FIG. 8, "slot 1", that is, the first slot is displayed as the target slot in the slot number display field 500.

Next, in step S2c (FIG. 7), a flow processing condition is selected for the target slot displayed in the slot number display field 500 (FIG. 8) in step S2b. The flow processing condition is selected by operating the flow processing condition selection button 520, and is displayed in the flow processing condition display field 510. In the embodiment shown in FIG. 8, “03”, that is, the flow processing condition “No.
"3" is selected.

In step S2d, the presence or absence of additional processing for the target slot is selected. The setting of the presence or absence of the additional processing is selected by operating the additional processing selection button 525, and is displayed in the slot number display field 500. In the embodiment shown in FIG. 8, "Yes" is selected.

In step S2e, the slot number display field 500 and the flow processing condition display field 5
It is determined whether to select the flow processing condition for the target slot displayed in 10 and to select whether or not to perform the additional processing. By pressing the enter button 560, the processing of the substrate in the target slot is set, and subsequently, the slot number display field 500 displays the slot number of the next slot in which the substrate is stored. When the cancel button 550 is pressed, the setting of the process for the target slot is canceled and can be set again.

As described above, the slot numbers are sequentially displayed in the slot number display field 500 only for the slots for which the presence of the board has been confirmed in step S1 (FIG. 3). Can be set quickly when the is stored.

In step S3 of FIG. 3, the processing in the semiconductor substrate processing apparatus 10 is executed according to the single wafer processing recipe 410 of FIG. 6B set as described above in step S2. The single-wafer processing is started by pressing a start button 530 on the control panel of FIG. First, processing is performed on the substrate stored in the first slot in accordance with the flow processing condition “No. 3”. However, for the substrate stored in the first slot, the additional processing “Yes” is set,
The additional processing is also executed. Next, the flow processing conditions “No.
5 ". Since the additional processing “absent” is set for the substrate stored in the second slot, the additional processing is not executed. Since the substrate is not stored in the third slot, after the processing of the substrate stored in the second slot is executed, the flow processing condition “No. 2” is applied to the substrate stored in the fourth slot.
6 ". The board is stored in the fifth slot, but since no processing is set,
That is, since the flow processing condition is not set, after the processing of the substrate stored in the fourth slot is performed,
The processing is performed on the substrate stored in the sixth slot according to the flow processing condition “No. 12”. Since the supplementary process “Yes” is also set for the substrate stored in the sixth slot, the supplementary process is also executed. Since the substrates are not stored in the seventh and eighth slots, after the processing of the substrate stored in the sixth slot is performed, the flow processing condition “No. 3” is applied to the substrate stored in the ninth slot. Is performed in accordance with "." Since the substrates are not stored in the tenth to twenty-fifth slots, after the processing of the substrates stored in the ninth slot is completed, the single-wafer processing for this substrate storage cassette is completed.

As described above, in the above embodiment, 1
With respect to one substrate storage cassette, flow processing conditions including no processing can be set only for the slots in which the substrates are stored. Therefore, a single-wafer processing recipe for processing a small number of substrates can be easily created. As a result, it is possible to quickly set a single-wafer processing recipe and execute processing.

It should be noted that the present invention is not limited to the above examples and embodiments, but can be implemented in various modes without departing from the gist thereof.
For example, the following modifications are possible.

(1) In the above embodiment, part of the configuration realized by hardware may be replaced by software, and conversely, part of the configuration realized by software may be replaced by hardware. You may do so.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a semiconductor substrate processing apparatus as one embodiment of the present invention.

FIG. 2 is a block diagram showing an electrical configuration of the semiconductor substrate processing apparatus 10 of FIG.

FIG. 3 is a flowchart illustrating an overall procedure of a process according to the embodiment.

FIG. 4 is an explanatory view schematically showing a method of detecting a substrate stored in a slot of the substrate storage cassette.

FIG. 5 is an explanatory diagram showing a relationship between flow processing conditions and unit processing conditions in the semiconductor substrate processing apparatus 10.

FIG. 6 is an explanatory view showing a single-wafer processing recipe for the substrate storage cassette of FIG. 4;

FIG. 7 is a flowchart showing details of the processing in step S2 in FIG. 3;

FIG. 8 is an explanatory diagram showing an example of a control panel for selecting and executing a flow processing condition for each slot.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor substrate processing apparatus 100 ... Process module 110 ... Substrate transfer unit 200 ... Indexer module 210, 212, 214, 216 ... Cassette stage 210 ... Cassette stage 220 ... Indexer arm 230 ... Processing control station 232 ... Control part 234 ... External magnetic Storage unit 236 Operation unit 238 Display unit 240 Transfer control unit 250 Processing control unit 260 Substrate detection sensor 260a Light emitting element 260b Light receiving element 300 Flow processing data 310, 320, 330 Unit processing data 400 sheets Leaf processing recipe 410 ... Single wafer processing recipe 500 ... Slot number display field 510 ... Flow processing condition display field 520 ... Flow processing condition selection button 525 ... Auxiliary processing selection button 530 ... Start button 54 ... stop button 550 ... cancel button 560 ... the decision button 570 ... pause button SC1, SC2 ... spin coater HP1, HP2, HP3 ... hot plate CP1, CP2, CP3 ... cooling plate

Claims (3)

[Claims] 1. A substrate processing apparatus for processing a substrate stored in a plurality of slots of a substrate storage cassette, comprising: a plurality of processing units for processing a substrate; Detecting means for detecting whether or not a substrate is stored in the substrate storage cassette; and transport sequence information indicating an order of sequentially transporting the substrates detected in the substrate storage cassette to a plurality of processing units. A processing recipe setting means for setting a single-wafer processing recipe including unit processing information indicating processing conditions in each processing unit; and detecting that the wafer is stored in the substrate storage cassette according to the single-wafer processing recipe. A substrate processing apparatus comprising: a control unit that executes processing of each substrate. 2. The non-processing setting device according to claim 1, wherein the processing recipe setting device sets not to perform a process on an arbitrary substrate stored in the substrate storage cassette. A substrate processing apparatus comprising: 3. The substrate processing apparatus according to claim 1, wherein said processing recipe setting means corresponds to changing a substrate lot for an arbitrary substrate stored in said substrate storage cassette. A substrate processing apparatus comprising an additional processing setting means for setting whether or not to execute processing.