JPH11186094A - Manufacture of stacked ceramic electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of a stacked ceramic electronic part, capable of thinning and high integration of an electric body. SOLUTION: The process of transcribing a ceramic raw sheet onto a ceramic raw stack by heating and pressure-bonding an electrode embedded ceramic sheet, which is made by transcribing the ceramic raw sheet made on a second base film and a ceramic stripe pattern 16, at the same time onto plural electrode patterns 17 gravure-printed on a first base film 18, onto other ceramic stack from the base face of the ceramic raw sheet 15 after positioning without exfoliating it from the base film 14, thereby sticking the ceramic raw sheet 15 and the ceramic raw stuck fast to each other, and then exfoliating only the base film 14 is repeated several times.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component used for various electronic devices.

[0002]

2. Description of the Related Art Conventionally, multilayer ceramic capacitors have been required to be further reduced in size, increased in capacity, and reduced in cost with the miniaturization and high performance of various electronic devices. For this reason, it is desired to change the internal electrode from the conventional palladium to nickel, and to further reduce the thickness of the dielectric (less than 2 μm after firing) and increase the number of layers (more than 300 layers). High cost due to lowness has been a problem.

Conventionally, Japanese Patent Publication No. 5-25381 proposes an electrode transfer method, and Japanese Patent Laid-Open Publication No. Hei 4-7577 proposes a thermal transfer method of a green sheet. These will be described together with reference to FIG. 9 and FIG. FIG.
In (A), a heater 1 has a green sheet 3 fixed to the surface thereof while keeping a table 2 at a constant temperature. An electrode 5 is formed on the surface of the base film 4.
Reference numeral 6 denotes a heater for keeping the hot platen 7 at a constant temperature. Next, as shown in FIG. 9B, the hot platen 7 is moved up and down,
The electrode 5 is thermally transferred onto the green sheet 3. Next, FIG.
As shown in FIG. 9 (C) and FIG.
The ceramic green sheet 8 formed thereon is thermally transferred so as to cover the green sheet 3 and the electrode 5.

Similarly, as shown in FIGS. 10E and 10F, an electrode 5 formed on a base film 4 is thermally transferred thereon. These steps are repeated as many times as necessary to form a laminate as shown in FIG. 10 (G), and then divided along the cutting position 9 so that the electrode 5 as shown in FIG. However, a green sheet density difference is likely to occur between the vertical direction and the horizontal direction of the electrode 5. The individual pieces are fired to form end face electrodes, thereby completing a multilayer ceramic electronic component.

FIG. 11A is a partial cross-sectional view of a multilayer ceramic capacitor which is an example of the multilayer ceramic electronic component thus manufactured. In FIG. 11A, several tens to several hundreds of internal electrodes 10 are embedded in the ceramic layer 11. The end face electrodes 12 are alternately connected to the internal electrodes 10.

However, as shown in FIG. 9C, since the green sheet 8 formed on the base film 4 is formed to be thin and uniform in thickness and uniform in density, FIG.
As shown in FIG. 10 (G), irregularities corresponding to the thickness of the embedded electrode 5 are generated on the surface of the transferred green sheet 8, and at the same time, pinholes or microcracks (fine cracks) are formed on the ceramic green sheet 3. Cracks are easily generated. The pinholes and microcracks generated here cannot be repaired in the next step. Thus, the internal electrode 5
As the number of stacked layers increases, the unevenness increases, and there is a possibility that lamination defects and density unevenness of the green sheet may increase.

FIG. 11B shows an example of a multilayer ceramic capacitor in which a defect has occurred.
3 is a defect called a lateral crack. This side crack 13
Not only poses a problem in appearance but also affects the reliability of the multilayer ceramic electronic component depending on its size (or depth). It is empirically known that the side cracks 13 hardly occur on the upper and lower outer surfaces of the ceramic layer 11 and easily occur on the side surfaces of the ceramic layer.
Further, since the side cracks 13 are likely to occur when the internal electrodes 10 are stacked in 200 layers or more (especially 500 layers or more), it is considered that the phenomenon described with reference to FIGS. Can be

[0008] Then, the inventors disclosed in Japanese Patent Application Laid-Open No. 1-222.
No. 6131 proposes a method of thermally transferring a ceramic green sheet with embedded electrodes, but the green sheet tends to have uneven thickness. Also, Japanese Patent Application Laid-Open No. 8-2503
No. 70 proposes a method of laminating a reverse pattern on a dielectric green sheet while printing it by a gravure printing method. In this case, however, the solvent contained in the electrode ink causes the green sheet to swell. Short circuit.

[0009]

In the case of a laminating method in which a ceramic green sheet with embedded electrodes is thermally transferred onto a ceramic green laminate, a thin layer of a dielectric material must be obtained unless the surface of the green ceramic sheet with embedded electrodes is highly planarized. With the increase in the number of layers and the number of layers, the unevenness of the overlapping part of the internal electrodes increases,
There is a problem that side cracks are likely to occur in the completed multilayer ceramic electronic component. In order to reduce the unevenness of the embedded electrode, a reverse pattern was printed with dielectric ink between the electrodes (gap between the electrode patterns), but the green sheet swelled and could be short-circuited. There is.

The present invention has been made to solve the above-mentioned conventional problems. By improving the thermal transfer method of a ceramic green sheet with an embedded electrode, it is possible to increase productivity and reduce the thickness and the number of layers of an electric body. It is another object of the present invention to provide a method of manufacturing a dielectric ceramic electronic component that can cope with the above.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method of forming an electrode ink in order to eliminate the unevenness of the internal electrodes, which has been a problem when laminating a conventional ceramic sheet with embedded electrodes. A ceramic stripe pattern is formed in between, and a ceramic raw sheet created on another base film is transferred onto the ceramic raw sheet, and the required number of ceramic embedded sheets made by embedding electrodes are laminated.
Thereby, even if the thickness of the dielectric layer is as thin as 10 μm or less,
A multilayer ceramic electronic component having a high lamination of 300 or more layers can be manufactured with a high yield without generating irregularities or lamination cracks.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is characterized in that a ceramic raw sheet having a thickness of 10 .mu.m or less and a ceramic having an equal pitch are formed on a gravure-printed electrode pattern on a first base film. The stripe-embedded raw ceramic sheet is formed by transferring the stripe pattern, and the raw ceramic sheet with the embedded electrodes is positioned on another ceramic green laminate, and then heat-pressed from the base surface of the raw ceramic sheet with embedded electrodes. Thus, after the ceramic green sheet and the ceramic green laminate are brought into close contact with each other, the ceramic raw sheet and the ceramic green laminate are brought into close contact with each other by heating and pressing from the base surface of the electrode embedded ceramic green sheet, After repeating a series of steps of peeling only the film several times, This is a method of manufacturing a multilayer ceramic electronic component that cuts a MIC raw laminate into a predetermined shape, fires it, and forms an end face electrode, and prevents printing misalignment that has been a problem with the conventional screen printing method by gravure printing the electrode pattern Then, by transferring a ceramic raw sheet having a uniform thickness while reducing unevenness of the electrode pattern by the ceramic stripe pattern, it is possible to further improve the production cost and yield when the multilayer ceramic electronic component is thinned and highly laminated. Has an action.

According to a second aspect of the present invention, the ceramic pattern and the ceramic pattern are formed on a first base film on which a ceramic stripe pattern having an equal pitch and an electrode pattern gravure printed with the ceramic pattern interposed therebetween. A ceramic raw sheet with embedded electrodes formed by transferring a ceramic raw sheet of 10 μm or less formed on the second base film so as to cover the electrode pattern and then peeling the second base film is laminated with another ceramic raw laminate After positioning on the body, from the base surface of the electrode-embedded ceramic raw sheet, the ceramic raw sheet and the ceramic green laminate are brought into close contact with each other by heating and pressing,
A series of steps of peeling only the base film, after repeating a plurality of times, cutting the finished ceramic green laminate into a predetermined shape, firing, relates to a method of manufacturing a multilayer ceramic electronic component to form an end face electrode, The gravure printing of the electrode pattern prevents print misalignment that has been a problem with conventional screen printing methods, reduces the unevenness of the electrode pattern with a ceramic stripe pattern, and transfers a ceramic raw sheet of uniform thickness onto this. By that
This has the effect of improving the production cost and yield when the multilayer ceramic electronic component is made thinner and more highly laminated.

According to a third aspect of the present invention, there is provided a ceramic base sheet having a thickness of 10 μm or less on a second base film so as to cover a gravure-printed electrode pattern on the first base film; After transferring the ceramic stripe pattern on the film, the second base film is peeled off to form an embedded ceramic raw sheet, which is formed, and the electrode embedded ceramic raw sheet is positioned on another ceramic raw laminate. From a base surface of the electrode-embedded ceramic raw sheet, the ceramic green sheet and the ceramic green laminate were brought into close contact with each other by heating and pressure bonding, and a series of steps of peeling off only the base film were repeated a plurality of times, and thus completed. The ceramic laminate is cut into a predetermined shape, fired, and laminated ceramic electrodes are formed to form end electrodes. This is a method of manufacturing parts, and gravure printing of the electrode pattern prevents printing misregistration that has been a problem with conventional screen printing, reduces the unevenness of the electrode pattern with a ceramic stripe pattern, and has a uniform thickness on this By transferring the ceramic green sheet, the production cost and yield can be improved when the multilayer ceramic electronic component is made thinner and more highly laminated.

According to a fourth aspect of the present invention, when a ceramic green sheet or a ceramic stripe pattern is transferred onto a gravure printed electrode pattern on a first base film, a multilayer ceramic electronic device using a roll transfer device is used. This is a method for manufacturing a component, and has the effect of using a roll transfer device to continuously manufacture an electrode-embedded ceramic raw sheet, thereby improving production cost and yield.

According to a fifth aspect of the present invention, the electrode pattern includes at least a resin, a solvent, and metal powder having a diameter of 1 μm or less, from which aggregates having a size of 15 μm or more have been removed.
The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the electrode ink having a viscosity equal to or less than a poise is gravure-printed. 15μ which was impossible with conventional screen printing by using electrode ink of
It is also possible to remove aggregates having a size of m or more, and further minimize the deformation of the printed pattern by performing gravure printing, thereby improving the production cost and yield when the multilayer ceramic electronic component is thinned and highly laminated. It has the action of:

According to a sixth aspect of the present invention, the ceramic stripe pattern is formed by gravure printing a ceramic ink having a viscosity of 20 poise or less containing at least a resin, a solvent and a ceramic powder, from which aggregates having a size of 15 μm or more have been removed. The method for producing a multilayer ceramic electronic component according to any one of claims 1 to 3, which uses a low-viscosity ceramic ink which has a viscosity that is too low in conventional screen printing and cannot be printed. Aggregates with a size of 15 microns or more, which were impossible with conventional screen printing, can be removed. By gravure printing, a ceramic stripe pattern can be formed by printing with the same high precision as the electrode pattern. This has the effect of improving the production cost and yield during layering and high lamination.

According to a seventh aspect of the present invention, the pitch of the ceramic stripe pattern and the pitch of the electrode pattern match, and the difference between the thickness of the ceramic stripe pattern and the thickness of the electrode pattern is 5 μm or less.
Wherein the thickness difference between the electrode pattern and the ceramic pattern is reduced, the occurrence of irregularities due to the electrode thickness during lamination can be reduced, and the thickness of the multilayer ceramic electronic component can be reduced. This has the effect of improving the production cost and yield during layering and high lamination.

According to a preferred embodiment of the present invention, the ceramic stripe pattern is a ceramic ink having a viscosity of 20 poise or less containing at least a resin, a solvent, a plasticizer, and ceramic powder, from which aggregates having a size of 15 μm or more have been removed. Is a method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the ceramic stripe pattern is also gravure-printed. By preventing printing misalignment, reducing the unevenness of the electrode pattern with a ceramic stripe pattern, and embedding it in a ceramic raw sheet, it is possible to improve the production cost and yield when thinning and high lamination of multilayer ceramic electronic components. Has an action.

According to a ninth aspect of the present invention, in the ceramic stripe pattern, a ceramic ink containing at least a resin, a solvent, a plasticizer, and ceramic powder from which an agglomerate having a size of 15 μm or more has been removed is gravure on a transfer film. 4. The method for producing a multilayer ceramic electronic component according to claim 1, wherein the ceramic stripe pattern is transferred from the transfer film onto a base film or a ceramic green sheet after being printed. By doing so, it is possible to minimize the influence of the ink solvent, which becomes a problem when printing ceramic ink directly, and to improve the production cost and yield when thinning and high stacking of multilayer ceramic electronic components. Has an action. By reducing the variation in tension between the left and right sides of the base film during gravure printing, the printing accuracy of the electrode pattern and the ceramic pattern can be improved, and the printing productivity can be improved. This has the effect of improving the production cost and yield during high integration and high lamination.

According to a tenth aspect of the present invention, in the ceramic stripe pattern, a ceramic slurry containing at least a resin, a solvent, a plasticizer, and a ceramic powder, from which aggregates having a size of 15 μm or more have been removed, is used as an electrode pattern or 2. The method of claim 1, wherein the ceramic stripe pattern is applied and dried at least once.
3. The method for manufacturing a multilayer ceramic electronic component according to any one of items 1 to 3, wherein the ceramic stripe pattern is printed and formed a plurality of times to minimize the thickness accuracy and the occurrence of pinholes. This has the effect of improving the production cost and yield during layering and high lamination.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a member for producing a raw ceramic sheet with embedded electrodes according to the first embodiment of the present invention, and FIG. 2 shows a configuration of the raw ceramic sheet with embedded electrodes manufactured in the same embodiment. 3 and 4 are views for explaining the state of lamination of the ceramic raw sheets with embedded electrodes. FIG. 5 is a diagram for explaining a less expensive method for producing a green ceramic sheet with embedded electrodes according to the second embodiment of the present invention, and FIG. 6 is a method for producing a green ceramic sheet with embedded electrodes according to the third embodiment of the present invention. FIG. 7 is a view for explaining a method of individually transferring and forming the constituent members of the ceramic green sheet with embedded electrodes according to the fourth embodiment of the present invention, and FIG. 8 is a view for explaining a seventh embodiment of the present invention. FIG. 3 is a diagram showing a state in which a ceramic stripe pattern and an electrode pattern are flattened using a smoother according to the embodiment.

In the above description, a multilayer ceramic capacitor has been described as an example of a multilayer ceramic electronic component, but other multilayer ceramic electronic components can be similarly implemented.

(Embodiment 1) In FIGS. 1 and 2,
Reference numeral 14 denotes a second base film, on which a ceramic green sheet 15 and a ceramic stripe pattern 16 having a thickness of 10 μm or less are formed on the second base film at an equal pitch. Reference numeral 17 denotes an electrode pattern, a plurality of which are formed on the first base film 18 by gravure printing. Note that FIG. 1C corresponds to FIG.
3 shows the state viewed from the direction of the arrow of FIG. 1 (A) and FIG.
As shown in (B), the ceramic raw sheet 15 and the ceramic stripe pattern 16 formed on the second base film 14 face the electrode pattern 17 formed on the first base film 18.

Then, as shown in FIG. 2 (B), pressure is applied to bring them into close contact with each other and integrate them. Then, after the integration, only the second base film 14 is peeled off, whereby a ceramic sheet with embedded electrodes as shown in FIG. 2C is completed. FIG. 2C is a diagram of FIG. 2A viewed from the direction of the arrow. 2A and FIG.
As shown in (C), on the first base film 18, the electrode embedded ceramic raw sheet including the electrode pattern 17, the ceramic stripe pattern 16 and the ceramic raw sheet 15 is completed.

FIGS. 3 and 4 illustrate the state of lamination of the ceramic green sheets with embedded electrodes. Note that the lamination of the electrode-embedded ceramic raw sheets is disclosed in
A method for manufacturing a multilayer ceramic electronic component by thermal transfer proposed in, for example, Japanese Unexamined Patent Publication No. 226133/1996 can be used. In FIG. 3 (A), a heater 1 has a green sheet 3 fixed on the surface thereof while keeping the table 2 at a constant temperature. The electrode pattern 1 is formed on the surface of the first base film 18.
7, a ceramic stripe pattern 16, and a ceramic raw sheet 15 formed so as to cover them. Reference numeral 6 denotes a heater for keeping the hot platen 7 at a constant temperature.

Next, as shown in FIG. 3B, the hot platen 7 is moved up and down so that the electrode pattern 1 is placed on the green sheet 3.
7, the ceramic stripe pattern 16 and the ceramic raw sheet 15 are simultaneously thermally transferred. Next, as shown in FIGS. 3C and 4D, such a lamination process is repeated a predetermined number of times. By repeating these steps as many times as necessary, FIG.
After forming the laminated body as shown in (E), by dividing along the cutting position 9, individual pieces in which the electrode patterns 17 are embedded in the ceramic raw sheet 15 as shown in FIG. As shown in FIGS. 3 and 4, in the case of the present invention, by forming the ceramic stripe pattern 16, it is possible to prevent the occurrence of unevenness due to the electrode pattern 17, thereby increasing the yield of the lamination process. Furthermore, since the density difference does not occur in the laminated body produced in this way, defects such as side cracks do not occur in the finished laminated ceramic electronic component.

The method for manufacturing a multilayer ceramic capacitor will be described in more detail by way of example. As a monolithic ceramic capacitor, a prototype having a nickel thickness of 2 μm and an internal electrode of 600 layers after firing was manufactured. First, the first base film 18 shown in FIG.
A commercially available polyester film having a thickness of 0 μm and a width of 300 mm was used, and the electrode ink was directly gravure printed thereon.
The internally developed gravure printing nickel ink was used. The gravure printing machine used was a commercially available one for food packaging, and the gravure plate used was a gravure plate having a diameter of 10 cm. For printing, an area of about 300 mm square, the pattern of the internal electrodes of the multilayer ceramic capacitor is formed on the circumference of the surface,
Further, nickel plating was performed to extend the life. Thus, a device equivalent to FIG. 1B was prepared.

Further, the second base film 1 subjected to the release treatment
A ceramic green sheet 15 having a thickness of 10 μm or less is formed on
6 was formed. FIG. 1A and FIG.
(C) The equivalent sample is cut into sheets (sheets) of about 300 mm square, and further set so that the coating surfaces face each other as shown in FIG. 2 (B). After being integrated using the same, the second base film 14 was peeled off, and an electrode-embedded ceramic raw sheet corresponding to FIG. 2C was prepared.

Next, through a laminating process as shown in FIGS. 3 and 4, 600 electrode patterns 17 were laminated, cut into a predetermined shape, fired, and end face electrodes were formed, thereby producing a prototype multilayer ceramic capacitor. Although the completed sample was observed, there was no side crack 13 as shown in FIG.
Good products were obtained in reliability evaluation. In this way, good products could be produced with a high yield.

As a conventional example, when the lamination was attempted using the sample shown in FIG. 7 with the slight irregularities remaining, the irregularities on the surface increased as the number of laminated layers increased, and it was difficult to laminate 200 or more layers. . Therefore, lamination was stopped with the number of laminations kept at 200, cut into a predetermined shape, fired, and end face electrodes were formed, thereby producing a prototype multilayer ceramic capacitor. However, the completed sample had side cracks as shown in FIG. 11 (B), and a problem remained in terms of reliability. 9 and 10, since the electrodes and the ceramic green sheets are separately laminated, the lamination time and the lamination cost are twice as large as those of the present invention.

The thickness of the single green sheet is 10 μm.
The following (especially, 5 μm or less) is desirable. When a green sheet having a thickness of 12 μm or more is used, the thickness of the fired ceramic layer 11 increases, and the capacitance characteristics of the product decrease. Further, a green sheet having a thickness of 12 μm or more has appropriate elasticity (or compressibility), so that the thickness of the electrode pattern is easily absorbed. However, a very thin ceramic sheet having a thickness of several μm as described in the present embodiment can no longer absorb the electrode thickness. Therefore, by introducing a ceramic stripe pattern in such a very thin ceramic raw sheet, the thickness of the electrode can be easily absorbed.

(Embodiment 2) In FIG. 5, reference numeral 19 denotes a winding core. On the core 19a, a second base film 14, and a ceramic raw sheet 15 formed thereon,
The ceramic stripe pattern 16 is wound over a long length. On the core 19b, a first base film 18 and an electrode pattern 17 formed thereon are wound over a long length. Reference numeral 20 denotes a roll press, which presses and adheres each other while contacting the first base film 18 and the second base film 14.

In this way, the ceramic stripe pattern 16 and the ceramic raw sheet 15 are transferred onto the electrode pattern 17, and the core 19d together with the first base film 18 is transferred.
It is wound up. The unnecessary second base film 14 is collected by the core 19c and reused. In FIG. 5, arrows indicate the state of application of pressure by the roll press 20 and the direction in which the core 19 rotates.

By using the roll press 20 in this way, the productivity can be improved, and the reuse of the base film can be facilitated, which is effective in cost reduction and waste reduction.

(Embodiment 3) In FIG. 6A, only a ceramic green sheet 15 is formed on a second base film 14. On one first base film 18, the electrode pattern 17 and the ceramic stripe pattern 16 are formed so as not to overlap with each other. In the third embodiment, as shown in FIG. 6A, the ceramic raw sheet 15, the electrode pattern 17 and the ceramic stripe pattern 16 are set facing each other, and are adhered and integrated with each other. After that, as shown in FIG.
By peeling off only 4, an electrode-embedded ceramic raw sheet can be prepared.

The ceramic stripe pattern 16 can be printed by using a gravure printing machine on which the electrode pattern 17 is printed. In this case, it is preferable to first print the ceramic stripe pattern 16 on the first base film using a gravure printing machine, and then print the electrode pattern 17. By doing so, the electrode pattern 1
7 can be minimized.

(Embodiment 4) In FIG. 7A, only a ceramic green sheet 15 is formed on a second base film 14. This ceramic raw sheet 1
5 and the electrode pattern 17 formed on the first base film 18 are set so as to face each other.
As shown in (B), they are brought into close contact with each other and integrated. After that, only the second base film 14 is peeled off. Furthermore,
As shown in FIG. 7 (C), only the ceramic stripe pattern 16 is formed on the second base film 14, and this is adhered to the surface of the ceramic raw sheet 15 as shown in FIG. 7 (D). After the integration, only the second base film 14 is peeled off.

As shown in the present embodiment, by transferring the ceramic stripe pattern 16 last (in total, two transfer steps are performed), the adhesion between the electrode pattern 17 and the ceramic raw sheet 15 is obtained. Even if pinholes or microcracks (microcracks) occur in the ceramic raw sheet while raising the temperature, these can be repaired by re-transferring. In addition, when transferring only the ceramic raw sheet 15, no alignment is required, so that the equipment cost is low, high-speed transfer can be performed, and the cost does not increase.

When any one of the electrode pattern 17 and the ceramic stripe pattern 16 was formed on a trial basis using a screen printing method, the mutual displacement was large.
The target was not obtained. In particular, when the screen printing method is used, the precision required for the screen plate to gradually elongate or deform cannot be obtained due to an increase in the number of times of printing.

On the other hand, in the case of gravure printing, since the plate itself is a rigid body, high accuracy can be maintained regardless of the number of printings. As described above, by performing both the ceramic stripe pattern and the electrode pattern by gravure printing, the intended effect can be obtained for the first time.

(Embodiment 5) The electrode pattern and the electrode gravure ink used in the present invention will be described in more detail. The electrode ink used for gravure printing is composed of at least a resin, a solvent, and metal powder having a diameter of 1 μm or less, and desirably has a viscosity of 10 poise or less (particularly 5 poise or less). Aggregates having a size of 15 μm or more (preferably 10 μm or more) need to be removed. By using such an electrode ink, a predetermined multilayer ceramic electronic component can be manufactured with a high yield even when the dielectric is made thinner and more highly laminated.

The means for removing the aggregates can be dealt with by selecting an appropriate solvent-resistant material from commercially available filter media and performing pressure filtration. If the viscosity of the electrode ink exceeds 20 poise, the required printing accuracy and film thickness cannot be obtained.
One of the causes is that when gravure printing is performed directly on the green sheet, the ink penetrates the green sheet,
This is considered to be a phenomenon that occurs because the electrode ink does not penetrate into the base film.

(Embodiment 6) A ceramic stripe pattern and a ceramic gravure ink used in the present invention will be described. The ceramic ink used for forming the ceramic stripe pattern has a viscosity of at least 20 μm including at least a resin, a solvent, a plasticizer, and ceramic powder from which aggregates having a size of 15 μm or more (preferably 10 μm or more) have been removed.
It is desirable that the ceramic ink of a poise or less be gravure printed. Since the ceramic stripe pattern is a continuous pattern in the printing direction, there is no particular problem even if the ceramic stripe pattern is shifted (slipped) in the printing direction.
Therefore, the printing conditions for gravure printing have a margin, and it is possible to use a material having a higher viscosity than the electrode ink for gravure printing. The lamination stability can be improved by changing the resin material used for (1).

(Embodiment 7) The relationship between the ceramic stripe pattern and the electrode pattern will be described with reference to FIG. FIG. 8 shows a state where the ceramic stripe pattern and the electrode pattern are flattened using a smoother.
For example, the width of the ceramic stripe pattern 16 is made narrower than the interval between the electrode patterns 17 and the ceramic stripe pattern 16 is made thicker than the electrode pattern 17.
By running the first base film 18 in the direction of the arrow, the smoothers 21 can flatten each other. In particular, by smoothing the ceramic ink in an undried state, the gap between the ceramic ink and the electrode pattern can be easily and accurately filled.

In addition to the smoothing, a roll press or a calender may be used. In such an apparatus, after the ceramic stripe is completed, even if the thickness of the ceramic stripe pattern is thicker than the electrode pattern, the thickness is automatically adjusted to the thickness of the electrode pattern.

(Embodiment 8) The width of a base film on which an electrode pattern and a ceramic pattern are printed (or stripe-coated with a predetermined coater) is desirably 100 mm or more. When the width of the base film is 70 mm,
In particular, when the thickness of the base film is less than 30 μm, it is difficult to adjust the right and left tension in the width direction of the film, and it takes time to align the electrode pattern and the ceramic pattern. Film width 100mm or more, preferably 1
It is desirable to be 50 mm or more. It is easy to make film tension uniform during gravure printing. Therefore, in addition to the gravure printing in the circumferential direction, the gravure printing plate can be obtained in the width direction of the film. Thus, one print pattern (corresponding to one lamination area of the embedded ceramic green sheet) is 2
Even if it is 00mm square, base film width is 450mm
By doing so, two chamfers can be formed in the width direction of the base film, and the productivity can be increased. Also, the maximum width of the base film is desirably up to about 1000 mm. If the maximum width of the base film exceeds 2 m, if the base film is not divided by a slitter or the like, the weight of the single body becomes considerable and handling becomes difficult.

The printing speed for gravure printing of the electrode pattern and the ceramic stripe pattern is 10 m.
/ Min or more is desirable. By setting the speed to 10 m / min or more, the base film can be tightened with a certain tension or more, and the electrode pattern and the ceramic stripe pattern can be aligned with high precision. When the speed is 7 m / min or less, the base film is easily loosened in a printing machine or a drier, and the base film can be displaced.

The ceramic raw sheet used here is formed by applying a ceramic slurry containing at least a resin, a solvent, a plasticizer, and a ceramic powder and having a size of 15 μm or more from which agglomerates have been removed onto a transfer film at least once.
The ceramic raw sheet may be dried to be transferred from the transfer film onto the electrode pattern 17 shown in FIG. Alternatively, this may be transferred from the transfer film onto the electrode pattern 17 and the ceramic stripe pattern 16 shown in FIG. In this way, an electrode-embedded ceramic raw sheet with minimal surface irregularities can be produced. By transferring the ceramic raw sheet instead of applying the ceramic slurry in this manner, productivity can be improved.

Particularly, in the present invention, since the ceramic green sheet can be formed alone on the base film, its density, thickness, mechanical strength, etc. can be controlled with high precision. Further, since the base film can be cleaned immediately before coating, occurrence of defects such as pinholes can be prevented. When both the electrode pattern and the ceramic stripe pattern are formed by gravure printing, not only the gravure ink production specifications (solvent, resin, equipment) but also the printing apparatus can be shared. Therefore, the accuracy, thickness, coating density, and the like of the gravure printing pattern can be easily adjusted.

[0051]

As described above, according to the present invention, by using a homogeneous ceramic green sheet, a buried ceramic green sheet can be produced with high accuracy, and even when high lamination is performed, the occurrence of side cracks can be prevented. The effect of reducing the thickness of the ceramic layer or the dielectric layer to 2 μm or less and the ultra-high lamination of 500 or more layers can be obtained at a high yield and can be realized at low cost.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a member for manufacturing a ceramic raw sheet with embedded electrodes according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a raw ceramic sheet with embedded electrodes manufactured in the same embodiment.

FIG. 3 is a process diagram for explaining a state of lamination of the ceramic raw sheet with embedded electrodes.

[Fig. 4]

FIG. 5 is a diagram showing a less expensive method of manufacturing a ceramic green sheet with embedded electrodes according to the second embodiment of the present invention.

FIG. 6 is a diagram for explaining a method for producing a ceramic raw sheet with embedded electrodes according to a third embodiment of the present invention.

FIG. 7 is a view for explaining a method of individually transferring and forming constituent members of a ceramic raw sheet with embedded electrodes according to a fourth embodiment of the present invention.

FIG. 8 is a diagram showing a state in which a ceramic stripe pattern and an electrode pattern are flattened using a smoother according to a seventh embodiment of the present invention.

FIG. 9 is a process chart for explaining a state of laminating a ceramic raw sheet according to a conventional method.

FIG. 10

FIG. 11 is a partially cutaway perspective view of a multilayer ceramic capacitor manufactured by a conventional method.

[Explanation of symbols]

 Reference Signs List 1 heater 2 units 3 green sheet 4 base film 5 electrode 6 heater 7 hot platen 9 cutting position 14 second base film 15 ceramic raw sheet 16 ceramic stripe pattern 17 electrode pattern 18 first base film 19 core 20 roll press 21 Smoother

Claims (10)

[Claims] 1. A ceramic raw sheet having a thickness of 10 μm or less and a ceramic stripe pattern having an equal pitch from a second base film are transferred onto a gravure-printed electrode pattern on a first base film and embedded with electrodes. After the ceramic green sheet with embedded electrodes is positioned on another ceramic green laminate, the ceramic green sheet and the ceramic green sheet are heat-pressed from the base surface of the ceramic green sheets with embedded electrodes. After the laminated body is brought into close contact, from the base surface of the electrode-embedded ceramic raw sheet, the ceramic raw sheet and the ceramic green laminated body are brought into close contact with each other by heating and pressure bonding, and a series of steps of peeling only the base film are performed. After repetition, cut the finished ceramic green laminate into the desired shape , Baking, manufacturing method of a multilayer ceramic electronic component forming the end face electrodes. 2. A first base film on which a ceramic stripe pattern having an equal pitch and an electrode pattern formed by gravure printing with the ceramic pattern interposed is formed so as to cover the ceramic pattern and the electrode pattern. 10 formed on the base film of 2
After the ceramic raw sheet having a thickness of μm or less has been transferred and the second base film has been peeled off, the electrode-embedded ceramic raw sheet formed by peeling off the second base film is positioned on another ceramic raw laminate, and then the base of the electrode-embedded ceramic raw sheet is formed. A series of steps of heat-pressing the ceramic green sheet and the ceramic green laminate to adhere the ceramic green laminate to each other and peeling only the base film from the surface are repeated a plurality of times, and then the completed ceramic green laminate is cut into a predetermined shape. And firing,
A method for manufacturing a multilayer ceramic electronic component for forming an end face electrode. 3. A ceramic green sheet having a thickness of 10 μm or less on a second base film so as to cover a gravure-printed electrode pattern on the first base film.
After transferring the ceramic stripe pattern on the base film, the second base film is peeled off to produce an embedded ceramic raw sheet, and this electrode embedded ceramic raw sheet is positioned on another ceramic raw laminate. After that, from the base surface of the electrode-embedded ceramic raw sheet, the ceramic green sheet and the ceramic green laminate are brought into close contact with each other by heating and pressing, and a series of steps of peeling only the base film is repeated a plurality of times. A method of manufacturing a multilayer ceramic electronic component in which a completed ceramic green laminate is cut into a predetermined shape, fired, and an end face electrode is formed. 4. The method according to claim 1, wherein a roll transfer device is used to transfer the ceramic raw sheet or the ceramic stripe pattern onto the gravure printed electrode pattern on the first base film. 3. The method for producing a multilayer ceramic electronic component according to item 1. 5. The electrode pattern according to claim 1, wherein at least a resin, a solvent, a diameter of 1 μm and a size of 15 μm or more are removed.
An electrode ink having a viscosity of 10 poise or less containing a metal powder of not more than μm is gravure printed.
The method for producing a multilayer ceramic electronic component according to any one of the above. 6. A ceramic stripe pattern comprising:
4. A ceramic ink having a viscosity of 20 poise or less containing at least a resin, a solvent, a plasticizer, and ceramic powder, from which an aggregate having a size of not less than μm has been removed, is subjected to stripe printing or stripe coating. Any one
5. A method for manufacturing a multilayer ceramic electronic component according to any one of the above. 7. The pitch of the ceramic stripe pattern is equal to the pitch of the electrode pattern, and the thickness difference between the ceramic stripe pattern and the electrode pattern is 5
The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the thickness is not more than μm. 8. A ceramic stripe pattern comprising:
After the agglomerates having a size of at least μm have been removed, at least a ceramic ink containing a resin, a solvent, a plasticizer, and ceramic powder is gravure-printed on a transfer film. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component is transferred to a multilayer ceramic electronic component. 9. An electrode pattern or a ceramic stripe pattern is gravure printed at a speed of 10 m / min or more, and at least the thickness of the electrode pattern after drying is 3 μm.
The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein: 10. The ceramic stripe pattern is 1
A ceramic slurry containing at least a resin, a solvent, a plasticizer, and ceramic powder from which aggregates having a size of 5 microns or more have been removed is applied and dried at least once on an electrode pattern or a ceramic stripe pattern. The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein: