JPH1116758A - Manufacture of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which the wear of a cutting blade can be suppressed and the stagnation of a treating liquid on a substrate in an electrode patterning process, etc., can be prevented, and then, such electronic component that can obtain fine linear (pattern) can be manufactured. SOLUTION: A gap G having a prescribed width Wg is formed between in an electrode (connection electrode) 2a, arranged on a cutting line A drawn on the surface of a unit substrate 1 and connection electrodes 2a and 2a are exposed in two cut end faces faced oppositely to each other by cutting the gap section of the substrate 1 together with parts of a pair of electrode patterns 2 faced each other with the gap G in between with a cutting blade. In addition, the width Wg of the gap G is adjusted to meet a relation, Wg<=Wb-2α (where, Wb and α respectively represent the thickness of the cutting blade and the deviated amount of the cutting position in the thickness direction of the cutting blade).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more particularly, to a method for cutting a unit substrate (parent substrate) having electrodes disposed on its surface along a predetermined cutting line. The present invention relates to a method for manufacturing an electronic component including a step of obtaining an element having an electrode exposed at a cut end face.

[0002]

2. Description of the Related Art A chip-type coil component having an electrode pattern (thin-film coil pattern) provided on a substrate surface is, for example, as shown in FIG.
A unit substrate 5 on which a plurality of electrode patterns 52 are provided and whose surface is covered with an insulating / protective film 53
1 is cut along predetermined cutting lines A and B to cut out individual elements 54.

The insulating / protective film 53 is preferably made of a resin material such as polyimide or glass from the viewpoints of surface smoothness, insulating properties, heat resistance, and suitability for fine processing accompanying miniaturization of chips. System materials and the like are used.

In chip-type electronic components required to be miniaturized, particularly in chip-type coil components in which an electrode pattern (thin-film coil pattern) is provided on a substrate surface, it is necessary to maintain and improve the performance. It is important how large an area in which an electrode pattern can be formed can be ensured.

Therefore, as a method of cutting the unit substrate 51 at a predetermined position and cutting out the individual elements 54, a dicing method of cutting using a dicing blade is widely used. This dicing method is not only excellent in processing accuracy, but also can cut the insulating / protective film 53 at the same time, and does not need to form a cutting margin as in the scribe-break method, etc. There is an advantage that the pattern 52 can be formed, and the area that can be used for forming the electrode pattern can be widened.

FIG. 6 is a cross-sectional view showing a state in which an external electrode 55 that is electrically connected to the connection electrode 52 exposed on the cut end face 51b is formed on the element 54 cut out from the unit substrate 51 shown in FIG.

By the way, in cutting out each element 54, if the connection electrode 52a is to be exposed on the end face of the substrate 51a by using the dicing method, in the case of the electrode pattern shown in FIG. It is necessary to cut the (metal) 52a. In general, since the connection electrode (metal) 52a has a higher cutting resistance than the unit substrate 51, the dicing blade is greatly worn, causing a decrease in the cutting force due to clogging of the dicing blade. However, there is a problem that chipping occurs.

In the case of an electrode pattern as shown in FIG. 5, since the electrode patterns of each row R1, R2, R3... When performing spin etching or the like, the processing liquid is applied to each row R1, R2 by centrifugal force.
... There is a problem that stagnation occurs, and a fine linear pattern (pattern) cannot be obtained, or an etching residue occurs. In FIG. 7, a hatched portion D is a portion where the processing liquid easily accumulates.

The present invention has been made to solve the above problems, and has a unit substrate (parent substrate) having electrodes disposed on the surface.
In the manufacture of an electronic component having a structure in which electrodes are exposed at the cut end surface, the cutting blade has a small amount of wear, and it is possible to suppress the occurrence of chipping of the substrate. It is an object of the present invention to provide a method for manufacturing an electronic component capable of obtaining a fine linear shape (pattern) without a liquid stagnation.

[0010]

In order to achieve the above object, a method for manufacturing an electronic component according to the present invention is directed to a method of manufacturing a unit substrate (parent substrate) having electrodes disposed on a surface thereof along a predetermined cutting line. In the method of manufacturing an electronic component including a step of obtaining an element having an electrode exposed on the cut end face by cutting
A gap having a predetermined width Wg is formed on an electrode on a cutting line on the surface of the unit substrate, and a cutting blade is used to form the gap.
Cutting a gap portion of the unit substrate along a cutting line while cutting each of the pair of electrodes facing each other with the gap interposed therebetween, thereby exposing the electrodes to two cut end faces facing each other. Features.

A gap having a predetermined width Wg is formed in an electrode on a cutting line on the surface of the unit substrate, and a pair of electrodes facing each other across the gap are cut by a cutting blade while cutting the pair of electrodes. By cutting the gap portion of the unit substrate along, the electrodes can be reliably exposed to the two cut end faces facing each other, and the connection reliability with the external electrodes can be improved. Also, since a gap is formed in the electrode, the cutting blade does not cut the electrode (metal) over its entire width, but only the portion excluding the gap portion. It is possible to suppress the wear of the blade and extend the life. In addition, it is possible to suppress a decrease in cutting force due to clogging of the cutting blade and to suppress occurrence of chipping of the unit substrate resulting therefrom, thereby improving connection reliability between the electrode and the external electrode. In addition, a gap is formed in the electrode, and a processing liquid used for patterning the electrode flows through the gap and does not stagnate on the unit substrate, so that a fine linear pattern can be obtained. Become.

Further, in the method of manufacturing an electronic component according to the present invention, the width Wg of the gap satisfies a requirement of the following formula (1): Wg ≦ Wb-2α (1) Wb: thickness of the cutting blade α: Displacement amount in the thickness direction of the cutting blade is characterized.

By setting the width Wg of the gap to Wg ≦ Wb-2α, the cutting blade can be prevented from cutting the electrode (metal) with the entire width of the cutting blade even when the cutting position is displaced. It is possible to reliably cut a part of the electrode while exposing the electrode to the cut end face of the substrate while suppressing the wear of the substrate, thereby making the present invention more effective.

Further, in the method of manufacturing an electronic component according to the present invention, the electrode exposed on the cut end surface is a connection electrode drawn out for connecting the electrode to an external electrode.

In the form in which the electrode exposed on the cut end face is a drawn-out connection electrode for connection with an external electrode, the connection electrode can be exposed on the cut end face and securely connected to the external electrode. As a result, the connection reliability can be improved, the Q of the electronic component can be increased, and a high-performance electronic component can be efficiently manufactured.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail.

In this embodiment, as shown in FIG. 4, a thin film coil pattern (electrode pattern) 2 including a connection electrode 2a for connection to the outside is provided on a surface of a substrate 1a made of ceramic, and The connection electrode 2 is provided on the end face of the element 4 in which the surface on which the thin film coil pattern 2 is provided is covered with the insulating / protective film (covering material) 3, exposing the connection electrode 2 a.
A case in which a chip-type coil component having a structure in which the external electrode 5 is disposed so as to be electrically connected to a will be described as an example.

First, sputtering, vapor deposition, ion plating, plating,
An electrode film made of a metal such as Ag or Cu is formed by a film forming method such as thick film printing.

Next, the unit substrate 1 having a plurality of thin-film coil patterns (electrode patterns) 2 including connection electrodes 2a formed on the surface thereof as shown in FIG. 1 by etching the electrode film by a known method. Form.

It should be noted that a width Wg ≦ Wb− is provided between the adjacent connection electrodes 2 a of the thin-film coil pattern 2.
2α (Wb is a cutting blade (dicing blade) 6 used for cutting the unit substrate 1 (FIG. 1 (a))
A gap (groove) G is formed with the thickness α of the cutting blade 6 in the thickness direction of the cutting blade 6).

Then, as shown in FIG. 2, an insulating / protective film made of a resin material such as polyimide or an inorganic insulating material such as glass paste is applied so as to cover the surface of the unit substrate 1 on which the thin film coil pattern 2 is formed. Form 3

Next, the unit substrate 1 is cut into a gap (groove) G using a cutting blade 6 having a thickness Wb (FIG. 1A).
Is cut along the cutting line A (primary cut). Thereby, the cut end face of the electrode is exposed to the cut end face. Thereafter, individual elements 4 are cut out by dicing (secondary cutting) along the cutting line B (FIG. 3).

Then, the connection electrode 2a of each element 4
A metal such as Ag, Cu, Cr, Ni or the like is electrically connected to the connection electrode 2a in a portion including the exposed cut end face 1b (FIG. 4) by a sputtering method or a method using a combination of sputtering and plating. Electronic components (chip type coil components) as shown in FIG.
Get.

The external electrode 5 may be formed after each element 4 is cut out. However, after the primary electrode is cut along the cutting line A, it is formed at the stage of a strip-shaped substrate including a plurality of elements. Thereafter, the strip-shaped substrate on which the external electrodes are formed can be cut and divided into individual electronic components (chip-type coil components). In this case, the manufacturing process can be simplified as compared with the case where the individual elements are cut out and the external electrodes are formed.

In the method of the above embodiment, since the gap G is formed between the adjacent connection electrodes 2a of the thin-film coil pattern 2, the connection electrode (metal) 2a is cut by the entire width of the cutting blade. By doing so, the wear of the cutting blade can be reduced. In addition, a reduction in cutting force due to clogging of the cutting blade and occurrence of chipping of the substrate resulting therefrom can be suppressed, and the connection reliability between the connection electrode 2a and the external electrode 5 can be improved.

The width Wg of the gap (groove) G is Wg
≦ Wb−2α (Wb is the thickness of the cutting blade (dicing blade) 6 (FIG. 1A) used for cutting the unit substrate 1, and α is the cutting position shift amount in the thickness direction of the cutting blade 6. ),
As shown in FIG. 1A, the cutting position is shifted from the original position by α.
Even if it is shifted only in the thickness direction of the cutting blade 6, it is possible to surely cut a part of the two adjacent connection electrodes 2a and 2a to expose the cut end surface 1b (FIG. 4), and to make the external electrode 5 can be improved in connection reliability.

In the method of the above embodiment, the connection electrode 2 for connecting the thin film coil pattern 2 to the external electrode 5 is used.
a is exposed on the cut end face 1b (FIG. 4), it is possible to increase the Q of the chip-type coil component, increase the inductance, or reduce the stray capacitance.
The performance can be efficiently improved.

Further, since the gap G is formed, the processing liquid used for patterning the thin film coil pattern 2 flows out from the gap (groove) G to the peripheral portion and stays on the unit substrate 1. Therefore, a fine linear pattern can be obtained.

In the above embodiment, the case where a chip-type coil component is manufactured has been described as an example. However, the present invention is not limited to the chip-type coil component, and a resistance,
The present invention can be applied to various electronic components formed with an element pattern (electrode) such as a capacitor.

In the above embodiment, the case where the electrode pattern is formed only on one surface of the unit substrate has been described. However, the present invention is applicable to the case where the electrode pattern is formed on both surfaces. Is possible.

In the above embodiment, the case where the insulating / protective film is formed on the electrode pattern and then the unit substrate is cut using the cutting blade has been described. However, the insulating / protective film is formed. It is also possible to cut before. Further, the present invention can be applied to a case where an electronic component without an insulating / protective film is manufactured.

The present invention is not limited to the above embodiment in other respects, and various applications and modifications can be made within the scope of the present invention.

[0033]

As described above, according to the method of manufacturing an electronic component of the present invention, the cutting blade is used to cut each of the pair of electrodes facing each other with the gap therebetween, while cutting the unit substrate along the cutting line. By cutting the gap, the electrodes are exposed at the two cut end faces facing each other, so that the electrodes can be reliably exposed at the cut end faces, improving the connection reliability with external electrodes. Can be done. Also, since a gap is formed in the electrode, the cutting blade does not cut the electrode (metal) over its entire width, but only the portion excluding the gap portion. The wear of the blade can be suppressed, and the life of the cutting blade can be extended.

Further, it is possible to suppress a decrease in the cutting force due to clogging of the cutting blade and to suppress the occurrence of chipping of the substrate resulting therefrom, thereby improving the connection reliability between the electrode and the external electrode.

Further, since a gap is formed in the electrode, a processing liquid used for patterning the electrode flows through the gap and does not stagnate on the unit substrate. )
Obtainable.

The width Wg of the gap is defined as Wg ≦ Wb−
By setting 2α (Wb is the thickness of the cutting blade used for cutting the unit substrate, and α is the shift amount of the cutting blade 6 in the thickness direction of the cutting blade 6), even when the cutting position is shifted, To avoid cutting the electrode (metal) with the full width of the cutting blade and to suppress the wear of the cutting blade, it is possible to cut a part of the electrode reliably and expose the electrode to the cut end surface of the substrate. This allows the present invention to be more effective.

In the case where the electrode exposed on the cut end face is a drawn-out connection electrode for connection to an external electrode, the connection electrode is exposed on the cut end face and securely connected to the external electrode. This makes it possible to improve the connection reliability and to efficiently manufacture high-performance electronic components.

[Brief description of the drawings]

FIG. 1 is a view showing a unit substrate having a thin-film coil pattern formed on a surface thereof in one step of a method of manufacturing an electronic component according to an embodiment of the present invention, wherein FIG.
FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 2 is a plan view showing a state in which an insulating / protective film is provided on a surface of a unit substrate on which a thin-film coil pattern is formed in one step of a method of manufacturing an electronic component according to an embodiment of the present invention. .

FIG. 3 is a plan view showing a state in which a unit substrate is cut along a cutting line in one step of a method of manufacturing an electronic component according to an embodiment of the present invention.

FIG. 4 is a perspective view showing an electronic component (chip-type coil component) manufactured by the method for manufacturing an electronic component according to one embodiment of the present invention.

FIG. 5 is a view showing an electrode pattern formed on a conventional unit substrate.

FIG. 6 is a front sectional view showing an electronic component manufactured by a conventional method for manufacturing an electronic component.

FIG. 7 is a view showing a portion of a conventional unit substrate in which a processing liquid easily accumulates.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Unit board 1a Substrate which constitutes each element 1b Cut end face 2 Electrode pattern (thin-film coil pattern) 2a Connection electrode 3 Insulation / protective film 4 Element 5 External electrode 6 Cutting blade (dicing blade) A, B Cutting line G Gap (Groove) Wg Gap width Wb Thickness of cutting blade

Claims (3)

[Claims] 1. A method of manufacturing an electronic component, comprising the steps of: cutting a unit substrate (parent substrate) having electrodes disposed on a surface thereof along a predetermined cutting line to obtain an element having electrodes exposed on a cut end face. In the manufacturing method, a gap having a predetermined width Wg is formed in an electrode on a cutting line on the surface of the unit substrate, and cutting is performed by a cutting blade while each of a pair of electrodes facing each other across the gap is cut. By cutting the gap part of the unit board along the line,
A method of manufacturing an electronic component, comprising a step of exposing an electrode to two cut end surfaces facing each other. 2. The width Wg of the gap satisfies the following formula (1): Wg ≦ Wb-2α (1) Wb: thickness of cutting blade α: thickness of cutting blade in thickness direction The method for manufacturing an electronic component according to claim 1, further comprising: a cutting position shift amount. 3. The method for manufacturing an electronic component according to claim 1, wherein the electrode exposed on the cut end surface is a connection electrode drawn out for connection with an external electrode.