JPH03265206A - Chip piezoelectric component and its manufacture - Google Patents
Chip piezoelectric component and its manufactureInfo
- Publication number
- JPH03265206A JPH03265206A JP6376290A JP6376290A JPH03265206A JP H03265206 A JPH03265206 A JP H03265206A JP 6376290 A JP6376290 A JP 6376290A JP 6376290 A JP6376290 A JP 6376290A JP H03265206 A JPH03265206 A JP H03265206A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- resonator element
- electrode
- piezoelectric resonator
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000605 extraction Methods 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は圧電共振子素子を絶縁ケースに収納し封止板に
より封止したチップ形圧電共振子部品とその製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a chip-type piezoelectric resonator component in which a piezoelectric resonator element is housed in an insulating case and sealed with a sealing plate, and a method for manufacturing the same.
（従来の技＃Ｉ） チップ形圧電共振子部品の一例を第６図に示す。(Traditional technique #I) An example of a chip-type piezoelectric resonator component is shown in FIG.
絶縁ケース３２に凹部３６が形成され、凹部３６から凹
部の縁の端面に渡って外部引出し電極３４．３５が形成
され、凹部３６には圧電共振子素子３８が収納されて封
止板４８により封止されている。圧電共振子素子３８は
圧電基板の表裏の両主表面に電極４０．４２をもち、そ
れらの電極４０．４２は圧電基板を挾んで対向する振動
電極部と圧電基板の両端部に延びている引出し電極部と
を備えている。凹部３６に収納された圧電共振子素子３
８の電極４０．４２は導電ペースト４４゜４６によって
それぞれ外部引出し電極３４．３５に接続されている。A recess 36 is formed in the insulating case 32, external lead electrodes 34, 35 are formed extending from the recess 36 to the end face of the edge of the recess, and a piezoelectric resonator element 38 is housed in the recess 36 and sealed by a sealing plate 48. It has been stopped. The piezoelectric resonator element 38 has electrodes 40, 42 on both the front and back main surfaces of the piezoelectric substrate, and these electrodes 40, 42 have a vibrating electrode section facing each other with the piezoelectric substrate in between, and a drawer extending to both ends of the piezoelectric substrate. and an electrode section. Piezoelectric resonator element 3 housed in recess 36
The eight electrodes 40, 42 are connected to external lead electrodes 34, 35 by conductive pastes 44, 46, respectively.
絶縁ケース３２と封止板４８で封止されたチップの端面
には外部引出し電極３４．３５にそれぞれつながる外部
電極５０．５２が形成されている。External electrodes 50 and 52 are formed on the end surfaces of the chip sealed with the insulating case 32 and the sealing plate 48, respectively, and connected to the external lead electrodes 34 and 35, respectively.
（発明が解決しようとする課題）
圧電共振子素子３８の電極４０，４２と外部引出し電１
ｉ３４，３５との接続を確実にするためには、導電ペー
スト４４．４６を十分に供給しておかなければならない
。そのためには、凹部３６の深さに対応する寸法ａを十
分にとっておかなければならない。もし寸法ａが短かけ
れば、導電ペースト４４，４６が外部にはみ出したり、
不要な部分へ流れ出したりして作業性が悪くなる。寸法
ａを大きくしなければならないという制約から、このよ
うなチップ形圧電部品を小型化することが困難になって
いる。(Problem to be Solved by the Invention) Electrodes 40 and 42 of the piezoelectric resonator element 38 and the external extraction voltage 1
In order to ensure connection with i34, 35, a sufficient amount of conductive paste 44, 46 must be supplied. For this purpose, a sufficient dimension a corresponding to the depth of the recess 36 must be provided. If the dimension a is short, the conductive pastes 44 and 46 may protrude outside,
It may flow into unnecessary areas, resulting in poor workability. Due to the constraint that dimension a must be increased, it is difficult to miniaturize such chip-type piezoelectric components.
本発明は、絶縁ケースに圧電共振子素子を収納したチッ
プ形圧電部品において、圧電共振子素子を収納する＃！
縁ケースの凹部の深さを浅くできるように小型化するこ
とを目的とするものである６本発明はまた。小型化した
チップ形圧電部品を製造する方法を提供することを目的
とするものである。The present invention is a chip-type piezoelectric component in which a piezoelectric resonator element is housed in an insulating case.
Another object of the present invention is to miniaturize the edge case so that the depth of the recess can be reduced. The object of the present invention is to provide a method for manufacturing a miniaturized chip-type piezoelectric component.
（課題を解決するための手段）
本発明のチップ形圧電部品では、圧電基板の表裏の両主
表面に振動電極を有しそれぞれの引出し電極が端面を経
て反対側の主表面に至る圧電共振子素子が絶縁ケースの
凹部に収納されて固定されており、圧電共振子素子の両
端部にはそれぞれ引出し電極上から絶縁ケースの凹部の
縁の端面につながる導電被膜にてなる外部引出し電極が
形成されており、絶縁ケースの凹部が絶縁性封止板で封
止されてチップ状にされ、そのチップの外側には前記外
部引出し電極と接続された外部電極が形成されている。(Means for Solving the Problems) The chip-type piezoelectric component of the present invention has a piezoelectric resonator that has vibrating electrodes on both the front and back main surfaces of a piezoelectric substrate, and each extraction electrode reaches the opposite main surface via an end surface. The element is housed and fixed in the recess of the insulating case, and external lead-out electrodes made of a conductive film are formed at both ends of the piezoelectric resonator element, respectively, from the lead-out electrodes to the end faces of the edges of the recess of the insulating case. The concave portion of the insulating case is sealed with an insulating sealing plate to form a chip, and an external electrode connected to the external lead electrode is formed on the outside of the chip.
本発明の製造方法では、絶縁基板に凹部を形成し、圧電
基板の表裏の両主表面に振動電極を有しそれぞれの引出
し電極が端面を経て反対側の主表面に至る圧電共振子素
子を前記凹部に固定し、圧電共振子素子の両端部の引出
し電極上から前記凹部の縁の端面につながる外部引出し
電極が形成される領域以外の領域を被うマスクを介して
導電被膜を形成して外部引出し電極とする工程を含み、
その後、前記凹部を絶縁性封止板で封止し、外部電極を
形成する。In the manufacturing method of the present invention, a piezoelectric resonator element is manufactured by forming a recess in an insulating substrate, having vibrating electrodes on both the front and back main surfaces of the piezoelectric substrate, and having each extraction electrode reach the opposite main surface via an end surface. The piezoelectric resonator element is fixed in the recess, and a conductive film is formed on the extraction electrodes at both ends of the piezoelectric resonator element through a mask that covers the area other than the area where the external extraction electrodes connected to the end faces of the edges of the recess are formed. Including the process of making it into an extraction electrode,
After that, the recessed portion is sealed with an insulating sealing plate to form an external electrode.
（作用）
本発明の圧電部品では、絶縁ケースに収納された圧電共
振子素子の電極と絶縁ケース及び封止板の外部に形成さ
れる外部電極とを接続する外部引出し電極は、導電被膜
によって外部引出し電極の形成とともに圧電共振子素子
の電極との接続がなされたものである。そのため、圧電
共振子素子の上面と絶縁ケースの凹部の縁の端面との段
差ｂ（第１図参照）は単に圧電共振子素子の振動が抑制
されない程度の最小の段差であればすみ、それだけ圧電
部品の厚さを薄くすることができ、小型化することがで
きる。(Function) In the piezoelectric component of the present invention, the external lead electrode that connects the electrode of the piezoelectric resonator element housed in the insulating case and the external electrode formed on the outside of the insulating case and the sealing plate is externally connected by the conductive coating. At the same time as the extraction electrode is formed, connection with the electrode of the piezoelectric resonator element is made. Therefore, the level difference b (see Figure 1) between the top surface of the piezoelectric resonator element and the end face of the edge of the recessed part of the insulating case is simply the minimum level difference that does not suppress the vibration of the piezoelectric resonator element, and the piezoelectric The thickness of the component can be reduced and the size can be reduced.
製造方法においては、外部引出し電極と、圧電共振子素
子の電極と外部引出し電極とを接続する領域に開口を有
するマスクを用いて蒸着法やスパッタリング法により導
電被膜を形成すれば、−度の成膜工程で外部引出し電極
の形成と、外部引出しＷ１極と圧電共振子素子の電極と
の接続を同時に果たすことができる。In the manufacturing method, if a conductive film is formed by a vapor deposition method or a sputtering method using a mask having openings in the region connecting the external extraction electrode and the electrode of the piezoelectric resonator element and the external extraction electrode, a -degree of formation can be achieved. In the film process, it is possible to simultaneously form the external lead electrode and connect the external lead W1 pole to the electrode of the piezoelectric resonator element.
（実施例）
第■図は一実施例を示す縦断面図、第２図は第１図から
封止板を取り除いた状態を示す平面図。(Embodiment) Fig. 2 is a longitudinal sectional view showing one embodiment, and Fig. 2 is a plan view showing a state in which the sealing plate is removed from Fig. 1.
第３図は同実施例における圧電共振子素子を表わす斜視
図である。FIG. 3 is a perspective view showing a piezoelectric resonator element in the same embodiment.
２はセラミックや耐熱性樹脂などにてなる絶縁ケースで
あり、圧電共振子素子６を収納する凹部４が形成されて
いる。凹部４に圧電共振子素子６を収納したとき、圧電
共振子素子６の下側には圧電共振子素子の振動を抑制し
ない振動空間が形成され、圧電共振子素子６の上部には
封止板１６で凹部を封止したときに圧電共振子素子の振
動を抑制しない振動空間が形成されるように、絶縁ケー
ス２の凹部４の縁の端面と収納された圧電共振子素子６
との段差すが存在するように凹部４が形成されている。Reference numeral 2 denotes an insulating case made of ceramic, heat-resistant resin, or the like, in which a recess 4 for accommodating the piezoelectric resonator element 6 is formed. When the piezoelectric resonator element 6 is housed in the recess 4, a vibration space that does not suppress the vibration of the piezoelectric resonator element is formed below the piezoelectric resonator element 6, and a sealing plate is provided above the piezoelectric resonator element 6. The end face of the edge of the recess 4 of the insulating case 2 and the housed piezoelectric resonator element 6 are arranged so that when the recess is sealed with the recess 16, a vibration space is formed that does not suppress the vibration of the piezoelectric resonator element.
The recess 4 is formed so that there is a step between the two.
絶縁ケース２の凹部４には圧電共振子素子６が固定され
ている。圧電共振子素子６は第３図に示されるエネルギ
ー閉じ込め形の厚み滑り振動モード又は厚み縦振動モー
ドの圧電共振子素子であり、圧電セラミックなどにてな
る圧電基板８の表裏の主表面に電極１０．１２が形成さ
れたものである６一方の電極１０は振動電極部１０ａと
、一方の端面を経て他方の主表面に延在する引出し電極
部１０ｂとを備えており、他方の電極部２は゛振動電極
部１２ａと、他方の端面を経て一方の主表面に延在する
引出し電極部１２ｂとを備えている。振動電極部１０ａ
と１２ａは圧電基板８を挾んで対向している。電極１０
．１２は蒸着法やスパッタリング法などにより形成され
たものである。A piezoelectric resonator element 6 is fixed in the recess 4 of the insulating case 2. The piezoelectric resonator element 6 is an energy-trap type piezoelectric resonator element of thickness shear vibration mode or thickness longitudinal vibration mode shown in FIG. One electrode 10 includes a vibrating electrode section 10a and an extraction electrode section 10b extending from one end face to the other main surface, and the other electrode section 2 has a vibrating electrode section 10a. It includes a vibrating electrode section 12a and an extraction electrode section 12b extending from the other end surface to one main surface. Vibrating electrode section 10a
and 12a face each other with the piezoelectric substrate 8 in between. Electrode 10
．． 12 is formed by a vapor deposition method, a sputtering method, or the like.
圧電共振子素子６の両端部の電極と外部引出し電極との
接続領域、及び絶縁ケース２の端面で外部引出し電極が
形成される領域には導電被膜１４゜１５が形成されてい
る。導電被膜１４．１５は外部引出し電極であるととも
に、圧電共振子素子６の電極と外部引出し電極とを接続
している。Conductive coatings 14 and 15 are formed in the connection areas between the electrodes at both ends of the piezoelectric resonator element 6 and the external extraction electrodes, and in the area where the external extraction electrodes are formed on the end face of the insulating case 2. The conductive coatings 14 and 15 are external extraction electrodes and connect the electrodes of the piezoelectric resonator element 6 and the external extraction electrodes.
絶縁ケース２の凹部上には絶縁性封止板１６が接着剤１
８により固着されて、圧電共振子素子６を封止している
。An insulating sealing plate 16 is placed on the recess of the insulating case 2 with an adhesive 1
8 to seal the piezoelectric resonator element 6.
絶縁ケース２と封止板１６で圧電共振子素子６が封止さ
れたチップ形圧電部品の外側には、外部引出し電極１４
，１５が引出されている両端面にそれぞれ外部電極２４
．２６が形成されており。On the outside of the chip-type piezoelectric component in which the piezoelectric resonator element 6 is sealed with the insulating case 2 and the sealing plate 16, an external extraction electrode 14 is provided.
, 15 are drawn out, external electrodes 24 are respectively provided on both end faces.
．． 26 is formed.
外部引出し電極１４が外部電極２４に接続され。External extraction electrode 14 is connected to external electrode 24.
外部引出し電極１５が外部電極２６に接続されている。External extraction electrode 15 is connected to external electrode 26 .
第１図において、絶縁ケース１２の凹部４から端面に渡
って第６図に示されるような外部引出し電極３４．３５
が予め形成されていてもよい。その場合には、外部引出
し電極と圧電共振子素子６の電極との接続がより確実と
なる。In FIG. 1, an external lead electrode 34, 35 extending from the recess 4 of the insulating case 12 to the end surface as shown in FIG.
may be formed in advance. In that case, the connection between the external extraction electrode and the electrode of the piezoelectric resonator element 6 becomes more reliable.
また、第１ＷＩにおいて、導電被膜１４．１５上にその
導電被膜を腐食や断線などから保護するための樹脂など
による保護膜を設けておいてもよい。Further, in the first WI, a protective film made of resin or the like may be provided on the conductive film 14.15 to protect the conductive film from corrosion, disconnection, etc.
実施例で用いられる圧電共振子索子６としては。The piezoelectric resonator cord 6 used in the example is as follows.
第４図に示されるように、引出し電極１０ｂ、１２ｂが
形成される圧電基板両端部にＲ面８ａ、８ａを形成した
ものでもよい。Ｒ面があれば、−主表面から他の主表面
に端面を経て形成される引出し電極部１０ｂ、１２ｂの
膜厚を均一にすることが容易になり、電極１０．１２の
信頼性が向上する。As shown in FIG. 4, rounded surfaces 8a, 8a may be formed at both ends of the piezoelectric substrate on which the extraction electrodes 10b, 12b are formed. If there is an R surface, it becomes easy to make uniform the film thickness of the extraction electrode portions 10b and 12b formed from the -main surface to the other main surface via the end surface, and the reliability of the electrode 10.12 is improved. .
第５図を参照して一実施例の製造方法について説明する
。A manufacturing method of one embodiment will be described with reference to FIG.
複数個の圧電部品用のセラミックにてなる大判の絶縁マ
ザー基板２８を用いる。マザー基板２８に各圧電部品用
の凹部４を形成する。A large insulating motherboard 28 made of ceramic is used for a plurality of piezoelectric components. Recesses 4 for each piezoelectric component are formed in the motherboard 28.
凹部４に圧電共振子素子６を嵌合、かしめ、低粘度接着
剤による固定などの方法により固定して収納する。The piezoelectric resonator element 6 is fixed and housed in the recess 4 by fitting, caulking, fixing with a low viscosity adhesive, or the like.
その後、斜線部で示される領域を被う帯状のパターン３
０をもつマスク、すなわち、圧電共振子素子６の両端部
の電極と外部引出し電極との接続領域と、絶縁ケースの
端面で外部引出し電極が形成される領域に開口をもつマ
スクを用い、スパッタリング法や蒸着法により導電被膜
を形成する。After that, a band-shaped pattern 3 covering the area indicated by the diagonal line is formed.
0, that is, a mask with openings in the connection area between the electrodes at both ends of the piezoelectric resonator element 6 and the external extraction electrode, and in the area where the external extraction electrode is formed on the end face of the insulating case, the sputtering method is performed. A conductive film is formed using a vapor deposition method.
その後、凹部４がある側から絶縁マザー基板２８上に接
着剤により大判の封止板を接着し、鎖線で示される位置
で切断して圧電部品用チップを形成する。Thereafter, a large sealing plate is adhered to the insulating motherboard 28 from the side where the recess 4 is located using an adhesive, and is cut at the position shown by the chain line to form a piezoelectric component chip.
その後、外部引出し電極が露出しているチップ端面にス
パッタリング法などにより外部電極を形成する。Thereafter, external electrodes are formed by sputtering or the like on the end face of the chip where the external lead electrodes are exposed.
複数個の圧電部品用のマザー基板２８を用いると、−度
に複数個の圧電部品を製造することができるので、製造
コストを低下させることができる。By using the motherboard 28 for a plurality of piezoelectric components, it is possible to manufacture a plurality of piezoelectric components at one time, thereby reducing manufacturing costs.
（発明の効果）
本発明のチップ形圧電部品では、絶縁ケースの凹部に収
納した圧電共振子素子を導電被膜によって外部引出し電
極と接続するとともに、その導電被膜自体を外部引出し
電極としたので、従来のように導電ペーストや半田によ
って圧電共振子素子と外部引出し電極とを接続したもの
に比べると、導電ペーストや半田がはみ出したり流出し
たりすることがなくなるので１作業性がよくなるだけで
はなく、絶縁ケースの凹部の深さを浅くすることができ
、それだけ部品寸法を小さくすることができ、小型化を
図ることができる。(Effects of the Invention) In the chip-type piezoelectric component of the present invention, the piezoelectric resonator element housed in the recess of the insulating case is connected to the external extraction electrode by the conductive coating, and the conductive coating itself is used as the external extraction electrode. Compared to a method in which the piezoelectric resonator element and external lead electrode are connected using conductive paste or solder, the conductive paste or solder does not protrude or flow out, which not only improves workability but also improves insulation. The depth of the recessed portion of the case can be made shallow, and the dimensions of the parts can be reduced accordingly, allowing for miniaturization.
本発明の製造方法では、導電被膜を形成するだけで外部
引出し電極の形成と、圧電共振子素子と外部引出し電極
との間の接続を同時に行なうことができるので、工程数
が少なくなる。また、導電被膜はマスクスパッタリング
法やマスク蒸着法により形成することができ、導電ペー
ストや半田を用いる従来の方法に比べて作業性がよい。In the manufacturing method of the present invention, the formation of the external extraction electrode and the connection between the piezoelectric resonator element and the external extraction electrode can be performed simultaneously by simply forming a conductive film, thereby reducing the number of steps. Further, the conductive film can be formed by a mask sputtering method or a mask vapor deposition method, which has better workability than conventional methods using conductive paste or solder.
第１図は一実施例を示す縦断面図、第２図は第工図から
封止板を取り除いた状態を示す平面図。
第３図は同実施例における圧電共振子素子を表わす斜視
図、第４図は同実施例で用いる他の圧電共振子素子を示
す斜視図、第５図は製造方法の一実施例で用いられるマ
ザー基板を示す概略平面図である。第６図は従来のチッ
プ形圧電部品を示す縦断面図である。
２・・・・・・絶縁ケース、４・・・・・・凹部、６・
・・・・圧電共振子素子、８・・・・・圧電基板、１０
，１２・・・・・・電極。
１４．１５・・・・・・導電被膜、１６・・・・・・封
止板、↓８・・・・・・接着剤、２４．２６・・・・・
・外部電極、２８・・・・・マサ−基板、３０・・・・
・・マスクのパターン。FIG. 1 is a longitudinal sectional view showing one embodiment, and FIG. 2 is a plan view showing a state in which a sealing plate is removed from the first construction drawing. Fig. 3 is a perspective view showing a piezoelectric resonator element in the same embodiment, Fig. 4 is a perspective view showing another piezoelectric resonator element used in the same embodiment, and Fig. 5 is used in an embodiment of the manufacturing method. FIG. 2 is a schematic plan view showing a motherboard. FIG. 6 is a longitudinal sectional view showing a conventional chip-type piezoelectric component. 2...Insulation case, 4...Recess, 6.
... Piezoelectric resonator element, 8 ... Piezoelectric substrate, 10
, 12... Electrode. 14.15... Conductive film, 16... Sealing plate, ↓8... Adhesive, 24.26...
・External electrode, 28...Mother board, 30...
・Mask pattern.
Claims (2)
ぞれの引出し電極が端面を経て反対側の主表面に至る圧
電共振子素子が絶縁ケースの凹部に収納されて固定され
ており、圧電共振子素子の両端部にはそれぞれ引出し電
極上から絶縁ケースの凹部の縁の端面につながる導電被
膜にてなる外部引出し電極が形成されており、絶縁ケー
スの凹部が絶縁性封止板で封止されて、チップ状にされ
、そのチップの外側には前記外部引出し電極と接続され
た外部電極が形成されているチップ形圧電部品。(1) A piezoelectric resonator element having vibrating electrodes on both the front and back main surfaces of the piezoelectric substrate, with each lead electrode extending through an end face to the opposite main surface, is housed and fixed in a recess of an insulating case, At both ends of the piezoelectric resonator element, external extraction electrodes made of a conductive film are formed that connect from the extraction electrodes to the end faces of the edges of the recess of the insulating case, and the recess of the insulating case is sealed with an insulating sealing plate. A chip-shaped piezoelectric component, which is fixed and formed into a chip, and an external electrode connected to the external lead-out electrode is formed on the outside of the chip.
表面に振動電極を有しそれぞれの引出し電極が端面を経
て反対側の主表面に至る圧電共振子素子を前記凹部に固
定し、圧電共振子素子の両端部の引出し電極上から前記
凹部の縁の端面につながる外部引出し電極が形成される
領域以外の領域を被うマスクを介して導電被膜を形成し
て外部引出し電極とする工程を含み、その後、前記凹部
を絶縁性封止板で封止し、外部電極を形成するチップ形
圧電部品の製造方法。(2) A recess is formed in the insulating substrate, and a piezoelectric resonator element, which has vibrating electrodes on both the front and back main surfaces of the piezoelectric substrate and whose respective extraction electrodes reach the opposite main surface via the end face, is fixed in the recess. , a conductive film is formed on the extraction electrodes at both ends of the piezoelectric resonator element through a mask covering an area other than the area where the external extraction electrodes connected to the end faces of the edges of the recess are formed to form external extraction electrodes. A method for manufacturing a chip-type piezoelectric component, including the step of: sealing the recess with an insulating sealing plate to form an external electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063762A JP2564960B2 (en) | 1990-03-14 | 1990-03-14 | Chip-type piezoelectric component and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2063762A JP2564960B2 (en) | 1990-03-14 | 1990-03-14 | Chip-type piezoelectric component and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03265206A true JPH03265206A (en) | 1991-11-26 |
| JP2564960B2 JP2564960B2 (en) | 1996-12-18 |
Family
ID=13238723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2063762A Expired - Lifetime JP2564960B2 (en) | 1990-03-14 | 1990-03-14 | Chip-type piezoelectric component and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564960B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1717952A1 (en) * | 2005-04-28 | 2006-11-02 | Epson Toyocom Corporation | Piezoelectric resonator and piezoelectric oscillator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6082831U (en) * | 1983-11-10 | 1985-06-08 | 松下電器産業株式会社 | piezoelectric vibrator |
-
1990
- 1990-03-14 JP JP2063762A patent/JP2564960B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6082831U (en) * | 1983-11-10 | 1985-06-08 | 松下電器産業株式会社 | piezoelectric vibrator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1717952A1 (en) * | 2005-04-28 | 2006-11-02 | Epson Toyocom Corporation | Piezoelectric resonator and piezoelectric oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2564960B2 (en) | 1996-12-18 |
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