JPH11165418A - Method for positioning a plurality of members, and method and apparatus for assembling ink jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To align a plurality of members with high accuracy without being affected by disturbance such as vibration of the whole of an apparatus, minute deformation or the like of an object and the member for holding the object. SOLUTION: In an ink jet head assembling apparatus for bonding a top plate 1 having ink flow paths corresponding to a plurality of energy generating elements and nozzles formed therein to a substrate 2 having the energy generating elements, the top plate 1 is held by a top plate holding apparatus 3 to be moved by a position adjusting apparatus 4 and the substrate 2 is held by a substrate moving apparatus 5 to be moved and the image taken by an image input device 7 is analyzed in an image processor 8 in such a state that the substrate 2 and the top plate 1 are brought into contact with each other and the relative positional relation of the top plate 1 and the substrate 2 is measured to align the top plate 1 and the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for positioning a plurality of members, and more particularly to a method for assembling an ink jet head comprising a combination of a substrate having energy generating elements and a top plate having nozzles for ejecting ink.

[0002]

2. Description of the Related Art Conventionally, as a method of assembling an ink jet head in which a substrate having an energy generating element and a top plate having nozzles are combined, the position of the substrate and the top plate are manually adjusted with sufficient accuracy. It was difficult to assemble.

On the other hand, the present applicant has filed Japanese Patent Application No. 3-154.
384 has proposed a method of aligning an energy generation element formed on a substrate with an ink flow path and an ejection hole formed on a top plate. In this method, the position of the energy generating element on the substrate is measured by means such as image processing, a top plate having a nozzle is placed thereon, and the position of the nozzle or ink ejection hole is measured by means such as image processing. This is a method for aligning an energy generating element and a nozzle, which is described in Japanese Patent Application Laid-Open No. 5-4130 and is widely used.

[0004]

However, in the above-mentioned proposed technique, the position of the substrate having the energy generating element and the position of the top plate having the nozzle are measured by separate image pickup means. If there is, there is a case where the relative positional relationship between the respective image pickup means is lost and an error occurs in the correction amount.

[0005] A substrate having an energy generating element;
Since the position of the top plate with nozzles is measured before it comes into contact with the top plate, slight displacement that occurs when the substrate and the top plate come into contact, and slight deformation of the members holding the substrate and the top plate It is difficult to perform positioning in consideration of the influence of the above.

[0006] Therefore, the emergence of an assembling method and apparatus capable of assembling an inkjet head with higher precision has been awaited.

SUMMARY OF THE INVENTION It is an object of the present invention to align a plurality of members with high precision without being affected by disturbances such as vibration of the entire apparatus and minute deformation of an object and members holding the object. It is an object of the present invention to provide a method for aligning a plurality of members, a method for assembling an inkjet head to which the method is applied, and an apparatus for assembling an inkjet head using the method.

[0008]

In order to achieve the above object, according to the present invention, an ink flow path and a nozzle corresponding to each energy generating element are formed on a substrate having a plurality of energy generating elements. In the method of assembling the inkjet head, the top plate is joined, in a state where the substrate and the top plate are in contact with each other, from the image captured by the imaging unit, the relative position of the substrate and the top plate is measured, The positioning of the substrate and the top plate is performed.

Here, the substrate and the top plate are irradiated with light by an illumination light source provided on the opposite side of the imaging means with the substrate and the top plate interposed therebetween, and the transmitted light is imaged. It is preferable that the position of the energy generating element on the substrate and the position of the ink flow path on the top plate are measured.

[0010] It is also preferable that the top plate is formed of a transparent member.

It is also preferable that the position of the energy generating element of the substrate and the position of the ink flow path of the top plate are measured from the brightness of the image picked up by the image pickup means, and the positions thereof are aligned. is there.

[0012] On the other hand, in order to achieve the above object, according to the present invention, a substrate having a plurality of energy generating elements is provided.
An imaging unit for imaging the substrate and the top plate in contact with each other in an inkjet head assembling apparatus for joining a top plate on which an ink flow path and a nozzle corresponding to each of the energy generating elements are formed; From the image
Image processing means for analyzing the position of the energy generating element on the substrate and the position of the ink flow path on the top plate; and a top for adjusting the relative position between the top plate and the substrate based on the processing results of the image processing means. Plate and / or substrate moving means.

Here, an illumination light source is provided on the opposite side of the imaging means with the substrate and the top plate interposed therebetween, and the illumination light source irradiates light to the substrate and the top plate to capture transmitted light. By doing so, it is preferable to measure the position of the energy generating element on the substrate and the position of the ink flow path on the top plate.

It is also preferable that the position of the energy generating element of the substrate and the position of the ink flow path of the top plate are measured from the brightness of the image picked up by the image pickup means, and the positions thereof are aligned. is there.

On the other hand, in order to achieve the above object, according to the present invention, the first surface and the second surface are provided on a substrate having a first surface and a second surface intersecting the first surface. In the method of positioning a plurality of members for positioning and mounting a component to be mounted having a third surface and a fourth surface respectively contacting with the component, the component to be mounted is mounted on the third surface of the first surface of the substrate. A first step of placing the component on the substrate so as to contact a surface, and a second step of moving the component to be attached such that the third surface slides along the first surface; A third step of stopping the movement of the attached component in the second step when the fourth surface comes into contact with the second surface, and a step of stopping the movement of the first surface and the second surface. The relative position between the board and the attached component with respect to the extending direction of the intersection line, A fourth step of judging from the image input by the image means, and, based on a relative position between the substrate and the part to be mounted, determined in the fourth step, the part to be mounted is placed on the first surface. And a fifth step of moving in the direction of extension of the intersection of the second surface.

[0016]

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However,
The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to them unless otherwise specified.

In FIGS. 1 to 18 which illustrate an apparatus for assembling an ink jet head according to an embodiment of the present invention, light is irradiated from above with a top plate having nozzles placed on a substrate having energy generating elements. The light and the shadow transmitted through the substrate and the top plate are simultaneously imaged by one imaging means, and image processing is performed to measure the positional relationship between the two members and perform positioning.

(1. Structure of Inkjet Head) First, an inkjet head 100 assembled according to the present invention will be described with reference to FIGS.

FIG. 2 shows an ink jet cartridge 200 in which an ink jet head 100 assembled according to the present invention is generally mounted.

The ink jet cartridge 200 includes an ink tank 202 and a head ink jet head 1.
It is schematically configured from 00. The ink jet head 100 is roughly composed of a top plate 1 and a substrate 2, and an ink ejection port 103 is provided on the inner top plate 1 side. From this discharge port 103, the ink tank 20
Printing is performed by moving the entire ink jet cartridge 200 in directions a and b in FIG.

FIG. 3 is an enlarged configuration diagram of the ink jet head 100.

The substrate 2 is constituted by a base plate 120 and a heater board (not shown) disposed thereon, and a top plate member 10 having an ink receiving port 107 for supplying ink from an ink tank 202 to an ink jet head.
And an orifice plate 10 integrally attached to the front surface of the top plate member 101 and having a plurality of discharge ports 103.
The top plate 1 is composed of the top plate 2.

FIG. 4 is a schematic view of the back side of the orifice plate when the ink jet head 100 is viewed from the side A in FIG.

When viewed from the side A in FIG. 3, the back side of the orifice plate 102 is configured as shown by a dotted line, and a heater board 110 having a heater 112 for heating ink is positioned on a base plate 120. Has been arranged.

The top plate member 101 is provided with the heater board 110.
And a common liquid chamber (not shown) for distributing ink to each of the ink flow paths 105 and a partition 104 for dividing the plurality of ink flow paths 105, respectively, and for supplying ink to this common liquid chamber. Ink receiving port 107 and the like.

The top plate member 101 is formed so as not to be in contact with the side surface of the heater board 110, but to have a gap 106.

The orifice plate 102 is integrally attached to the front surface of the top plate member 101, and has a plurality of discharge ports 103 corresponding to the respective ink flow paths 105.

In the heater board 110, as shown in FIG. 5, the heaters 112a-1
12f are arranged corresponding to the plurality of flow paths 105, respectively. 113a to 113f are wiring patterns for supplying a current to the heater 112, and 114 is a reference mark which is a position reference of the heater board 110.

The ink flow path 105 and the discharge port 103 are arranged at positions corresponding to the heaters 102 formed on the heater board 110, and each ink flow path 105 is separated from the adjacent flow path by a partition wall 104. ing.

At this time, the heater 102 and the ink flow path 10
5 must be accurately aligned, and if this positional relationship is lost (for example, the
Has a significant effect on the ink ejection performance, and in the worst case, the ink cannot be ejected.

In this embodiment, the positioning accuracy between the heater 102 and the ink flow path 105 is ± 10 μm.
Degree.

(2. Schematic Configuration of Apparatus) An inkjet head assembling apparatus 10 will be described as an embodiment to which the present invention is applied. FIG. 1 is a diagram showing a schematic configuration thereof.

In the figure, 1 is a top plate having a nozzle,
2 is a substrate having an energy generating element, 3 is a top plate holding device for holding the top plate 1, 4 is a position adjustment device for moving the top plate holding device 3 to align the position of the top plate 1 and the substrate 2, 5 is a substrate moving device that holds and moves the substrate 2 to a predetermined position, 6 is a control device that controls the entire device, 7 is a front plate 1 that is disposed in front of the substrate 2 and is in contact with the substrate 2 Input device for inputting an image of the board and the substrate 2, 8
Is an image processing device for analyzing the image of the image input device and measuring the relative positional relationship between the top plate 1 and the substrate 2.

(3. Structure of the Assembling Apparatus) Next, the structure of the inkjet head assembling apparatus 10 will be described in more detail with reference to FIGS.

FIG. 6 is a plan view of the apparatus for assembling the ink jet head as viewed from above, and FIG. 7 is a front view of the apparatus as viewed from the side. Here, the notation of the direction is the direction of the arrow in the figure as the positive (+) direction of each axis.

In these figures, 304 is a top finger for holding the top 1. Top plate finger 3
04 is a fixed arm 342 and a movable arm 34
1 and a finger driving device 343. The top finger driving device 343 includes the movable arm 341
Is driven and the top plate 1 is held between the fixed arm 342 and the movable arm 341.

Reference numeral 303 denotes X for moving the top 1 in the X-axis direction.
Reference numeral 330 denotes an X-axis motor for driving the X-stage 303; 302, a Y-stage for moving the top 1 in the Y-axis direction; and 320, a Y-axis motor for driving the Y-stage 302.

Reference numeral 301 denotes a Z for moving the top 1 in the Z-axis direction.
A stage 310 is a Z-axis motor for driving the Z stage 301.

Here, the top plate finger 304 is
It is coupled to the X stage 303 via 0, and is pulled in the positive Y direction (right side in the drawing). Thus, after driving the Y stage 302 to bring the top plate 1 and the substrate 2 into contact in the Y direction, when the Y stage is further moved, the spring 340 works to bring the top plate 1 and the substrate 2 into close contact. Also, the top plate 1 and the substrate 2
With respect to the close contact in the Z direction,
The two arms (the fixed arm 342 and the movable arm 341) are brought into close contact by utilizing the elasticity.

On the other hand, reference numeral 306 denotes a substrate stage that receives the substrate 2 from a substrate transfer device (not shown) and moves the substrate 2 to an assembling position. Reference numeral 360 denotes a substrate stage motor that drives the substrate stage 306.

Reference numeral 305 denotes a substrate chuck for holding the substrate 2, which is fixed to the substrate stage 306.

Reference numeral 352 denotes a CCD camera for measuring the relative position between the top plate 1 and the substrate 2, 350 denotes an objective lens for enlarging the images of the top plate 1 and the substrate 2, and 351 denotes an image of the objective lens 350. This is a lens barrel for forming an image on the CCD camera 352.

The lens barrel 351 is connected to a focusing stage (not shown) so that the focus can be adjusted.

(4. Arrangement of Optical System) FIG. 8 is a view for explaining an arrangement of an optical system for measuring a relative position between the top plate 1 and the substrate 2.

In the same figure, reference numeral 355 denotes an illuminating device, and 356 schematically represents a light beam projected from the illuminating device 355. The illuminating device 355 illuminates the top plate member 101 obliquely from above and behind.

The objective lens 350 is disposed in front of the orifice plate 102.

FIG. 9 shows a light beam 35 emitted from the illumination device 355.
6 is a diagram for explaining a state of FIG. In the figure, 356a
Represents the heater board 110 and the base plate 12 of the light beam 356.
This is a light beam that has passed through the orifice plate 102 without being equal to zero. Since the top 1 is translucent, the top 1
01 scattered and attenuated. 356b is the top plate member 101
This is a light beam that has entered the ink flow path 105 through the optical path.

The light beam 356 b is reflected by the heater board 110 and passes through the front of the orifice plate 102. Ray 3
56b is also attenuated in the top plate member 101, but is not attenuated in the ink flow path 105, so that it is brighter than the light ray 356a. The light beam 356c is located beside the heater board 110 (1 in FIG. 4).
06), and is reflected by the base plate 120 with the light beam that has passed. The base plate 120 is made of aluminum or the like.
The brightness becomes about the same as b.

FIG. 10 is a view for explaining an image viewed from the front of the orifice plate 102 (image picked up by the CCD camera 352 in FIG. 7). In the figure, the portion of the heater board 110 looks dark because no light ray 356 is transmitted therethrough. Light rays 356 are attenuated due to internal scattering in portions other than the grooves of the top plate member 101, but appear bright. Since the ink flow path 105 and the gap 106 have a space, the top plate member 1
01 has the least internal scattering and looks brightest.

(5. Image Processing Method) The shadow captured by the image input device 7 as shown in FIG. 10 is analyzed by the image processing device 8 as follows, and the relative position between the heater board 110 and the top plate member 101 is determined. Measured.

First, a method for measuring the position of the heater board 110 will be described with reference to FIGS.

FIG. 11A is a diagram schematically showing an image viewed from the front of the orifice plate 102 in a state where the top plate 1 and the substrate 2 are in contact with each other. Here, the image photoelectrically converted by the image input device 7 is converted into a digital value corresponding to light and dark (for example, dark: 0-255: light) by the image processing device 8 and stored as a multi-valued digital image. This multi-valued digital image is stored in a one-dimensional array inside the image processing device 8, but is represented here as a two-dimensional image for convenience of explanation.

In FIG. 11A, the coordinate system of the image is I in the horizontal direction and J in the vertical direction. Also, coordinate values (I, J)
= Let the luminance value at (i, j) be G (i, j).

As described above, the brightness of each part in the image shown in FIG. 5 is the brightest in the ink flow path 105 and the gap 106, and the brightest in the top plate member 101 next.
The portion of the heater board 110 is the darkest.

First, the luminance values of the digital image G (I, J) are added in the vertical direction to create projection data Pj (I) shown in FIG. 11B.

The projection data Pj (I) is given by Pj (i) = G (i, Js) + G (i, Js + 1) + ++ G (i, Je-1) +
Defined by G (i, Je).

Next, in order to extract a change point, FIG.
The difference data Dj (i) shown in FIG. The difference data Dj (I) is defined by Dj (i) = Pj (i) -Pj (I-1). The difference data Dj (I) takes a positive value when the image changes from dark to light, and a negative value when the image changes from light to dark. In FIG. 11A, the heater board 11
Since the light beam 356 does not pass through at all in the portion of 0, the change in brightness from the portion of the gap 106 is considerably larger than that of the other portions, and is much larger than the change in brightness between the ink flow path 105 and the top plate member 101. Therefore, in the difference data graph of FIG. 11C, the abscissa I where the difference data takes the minimum value
= Hi is the measured value of the end position of the heater board 110.

Similarly, FIG. 11D shows a graph in which the image of FIG. 11A is added in the horizontal direction to obtain projection data Pi (J) in the horizontal direction. In the figure, the portion including the ink flow path 105 is the brightest, and then the top plate member 1
01 is bright, and the portion including the heater board 110 is the darkest.

FIG. 11D shows horizontal projection data Pi.
It is a graph of the difference data Di (J) of (J). In the graph of FIG. 1, the portion of the upper surface of the heater board 110 that contacts the ink flow path 105 and the top plate member 101 has the largest change from light to dark, and the ordinate J = where the difference data Di (J) takes the minimum value. Hj is a measured value of the upper surface position of the heater board 110.

That is, the position of the heater board 110 is determined by these methods.

Next, a method of obtaining the position of the ink flow path 105, which is a reference of the position of the top plate 1, will be described with reference to FIGS.

FIG. 12 is a view for explaining a measurement screen of the ink flow path 105. The image itself is the same image as the position measurement screen of the heater board 110. That is, the ink flow path 10
The measurement of 5 uses the image used for the measurement of the heater board 110.

In FIG. 12, the measurement of the ink flow path 105 does not use the data of the entire screen because there are a plurality of ink flow paths 105, and the measurement positions (Hi, Hj) of the heater board 110 are measured.
Is processed to obtain the partial image. Ink channel 1
The range of Ims <i <Ime and Jms <j <Jme is used for the measurement of 05.

FIG. 12B is a cross-sectional view of the luminance at I = k in FIG. 12A. The luminance of the ink passage 105 is the highest (= bright), and the top plate member 101 is the brightest. Next, the brightness of the portion of the heater board 110 is the lowest (dark).

Accordingly, assuming that the threshold value is Th, B (i, j) = 1 when G (i, j)> th, and B (i, j) = 0 when G (i, j) <th Assuming that the binarization processing is performed, when the threshold value Th = Th1 in FIG. 12B, a binary image as shown in FIG. 13A is obtained. That is, the heater board 110
Is a value of “0”, the other portions are all values of “1”,
It is not possible to measure only the ink flow path 105 separately.

Here, when the threshold value Th = Th2, a binary image as shown in FIG.
The portion of 0 and the portion of the top plate member 101 are “0”, the portion of the ink flow path 105 and the gap 106 have a value of “1”, and the ink flow path 105 is separated from the periphery and can be measured.

Next, the ink flow path 105 is obtained from the binary image as shown in FIG.
The method of obtaining the above will be described. The case of FIG. 13A will be described later.

First, in the binary image shown in FIG. 13B, a labeling process for assigning the same label (number) to an area where "1" is connected results in an image as shown in FIG.

In the embodiment of the present invention, “1” is assigned to the ink channel on the left side of the drawing, “2” is assigned to the ink channel on the right side,
6 is labeled "3".

In the label image of FIG. 14, the area is obtained from the number Sn of pixels having the label n, and the width in the horizontal direction is determined from the maximum value (Inmax) and the minimum value (Inmin) of the I coordinate among the pixels of the label n. The width Wjn in the horizontal direction is obtained from the maximum value (Jnmax) and the minimum value (Jnmin) of the Win and J coordinates (see FIG. 15). Here, the area of the standard ink flow path 105 is S, the horizontal width is Wi, and the vertical width is W.
j, and respective allowable values are dS, dWi, and dWj. S-dS <Sn <S + dS Condition 1 Wi-dWi <Win <Wi + dWi ... Condition 2 Wj-dWj <Wjn <Wj + dWj When an area that satisfies the condition 3 is found, the ink flow path 105 can be detected. Further, when Min = ／ i / Sn and Mjn = Σj / Sn are obtained for all the pixels having the label value n, Min and Mjn are obtained as the center of gravity of the area of the label value n, and this may be used as the position of the ink flow path 105. it can. When there are a plurality of ink flow paths 105 in the processing range, the one having the smallest i coordinate is the final measurement result.

Next, as shown in FIG.
A process performed when 05 cannot be separated from its surroundings will be described. At this point (immediately after the binarization process), it is impossible to determine whether the image is the image of FIG. 13A or the image of FIG. After calculating the area and the like, the area Smax of the region having the largest area Sn is compared with the standard area S. When the threshold value Th is low (Th << Th2): Th = T
Since the situation is h1, a large area is formed by connecting the ink flow path 105 and the periphery. That is, Smax> S.

When the threshold value Th is high (Th >> Th2): the reverse of the case where the threshold value Th is low is obtained. However, a part of the ink flow path 105 is missing and becomes a small area, and Smax <S.

Accordingly, if the current threshold value is Tho, if Smax> S: Thn = Tho + dTh If Smax <S: Thn = Th−dTh, the threshold value is changed to a new threshold value Thn and 2 The processing is repeated from the value conversion processing to gradually approach Th2. Finally, the image of FIG. 13B is obtained.

Next, referring to FIG. 16 and FIG.
A description will be given of the alignment of the substrate 2 with the substrate 2.

FIG. 16 is a diagram showing the relationship between the heater 112 serving as a reference and the end of the heater board 110. The heater 112 serving as a reference for positioning is the outermost heater 112a. The distance Lhh to the end of the board 110 is made with a predetermined accuracy.

FIG. 17 is a diagram for explaining a method of aligning the top plate 1 and the substrate 2. In the figure, the position of the end of the heater board 110 is Hi, the position of the reference ink flow path is Mi, and the distance therebetween is Lhm, and the distance from the position of the end of the heater board 110 to the reference heater. Let Lhm <Lhh: the top 1 is on the left (on the screen).

Lhm> Lhh: The top 1 is on the right (on the screen).

That is, assuming that the allowable value of the displacement is dL, the top plate 1 only needs to be moved so that −dL <Lhm−Lhh <dL.

(6. Operation Sequence) Here, the operation of assembling the top plate 1 and the substrate 2 will be described with reference to FIG.

FIG. 18 is a diagram for explaining a flow of assembling the top plate 1 and the substrate 2.

<STEP 1: Supply of Top 1 and Substrate 2> The control device 6 drives the finger driving device 343 to move the movable arm 341 to the open position in order to receive the top 1 from a top plate supply device (not shown). To move the top finger 304 to the top receiving position by driving the X stage motor 330, the Y stage motor 320, and the Z stage motor 310 to move the top finger 304 to the top receiving position. To move the movable arm 3
The top plate 1 is held by the top finger 304 by moving 41 to the holding position.

Next, the substrate stage motor 360 is driven to move the substrate chuck 305 to the substrate supply / discharge position in order to receive the substrate 2 from the substrate transfer device (not shown). Substrate 2 with chuck 305
Hold.

<STEP 2: Move to Assembling Position> The control device 6 drives the substrate stage motor 360 to move the substrate chuck 305 and position the substrate 2 at the assembling position.

Next, the X-stage motor 330, the Y-stage motor 320, and the Z-stage motor 310 are driven to move the top plate 1 above the substrate 2 and the orifice plate 102.
Moves to the assembly initial position, which is a position in front of the tip of the heater board 110.

<STEP 3: Placing the Top 1 on the Substrate 2>
The control device 6 drives the Z stage motor 310 to lower the Z stage 301, and places the top plate 1 on the substrate 2. At this time, the lowering target position of the Z stage 301 is set to the substrate 2
The Z stage 301 is lowered even after the top plate 1 comes into contact with the substrate 2 and the elasticity of the movable arm 341 and the fixed arm 342 of the top plate finger 304 is set. The plate 1 and the substrate 2 are in close contact.

Next, the Y stage motor 320 is driven to move the Y stage 302 backward so that the orifice plate 102
To the tip of the heater board 110. At this time, the retreat target position of the Y stage 302 is the orifice plate 102.
Is set behind the position where the orifice plate 102 hits the tip of the heater board 110, so that the Y stage 302 retreats after the orifice plate 102 hits the tip of the heater board 110 and the orifice plate 102 is Adhere to

<STEP 4: Measurement of Relative Position of Top 1 and Substrate 2> The control device 6 sends a measurement start command to the image processing device 8. Upon receiving the measurement start command, the image processing device 8 captures the image of the top plate 1 and the substrate 2 that are in contact with each other from the image input device 7 and, by the above-described method, connects the end of the heater board 110 and the reference ink flow path The interval Lhm of 105 is measured and sent back to the control device 6. The control device 6 having received the interval Lhm compares the position with the preset reference interval Lhh, and if the difference between Lhm and Lhh is smaller than the preset allowable value dL, completes the alignment and proceeds to STEP.
Proceed to 6.

On the other hand, the difference between Lhm and Lhh is the allowable value dL.
If larger, the top plate 1 and the substrate 2 in STEP5
Is performed.

<STEP 5: Move top plate 1> Control device 6
Calculates the amount of movement of the X stage 303 from the difference between Lhh and Lhm, drives the X stage motor 330 to move the X stage 303, and adjusts the position of the top 1 to the substrate 2.

After the movement of the top 1 is completed, the top 1 and the substrate 2 are again
Return to STEP 4 to measure the relative position of.

<STEP 6: Fixing the Top 1 and the Substrate 2> After the positioning of the top 1 and the substrate 2 is completed, the control device 6
A positioning completion signal is transmitted to a fixing means (not shown) (for example, an adhesive coating device) so that the top plate 1 is fixed to the substrate 2 so that the positional relationship between the top plate 1 and the substrate 2 does not collapse.

At this time, it is not necessary to completely fix the top plate 1 to the substrate 2 and, after removing it from the assembling apparatus, temporarily fix it so that the positional relationship between the top plate 1 and the substrate 2 does not collapse.

When the fixing process is completed, the fixing means (not shown) transmits a fixing completion signal to the control device 6. The control device 6 that has received the fixing completion signal proceeds to the ejection process of the head unit in which the top plate 1 is assembled to the substrate 2 in STEP 7.

<STEP 7: Head Unit Ejection> The control device 6 drives the finger driving device 343 to move the movable arm 341 to the open position, and the top plate finger 304
Then, the Z stage motor 310 is driven to raise the Z stage, and the top plate finger 304 is retracted above the head unit.

Next, the substrate stage motor 360 is driven to move the substrate stage 306 to move the head unit to the discharge position, and then the substrate chuck 305 is opened to release the holding of the head unit to release a substrate transfer unit (not shown). An assembling completion signal is transmitted to the mounting device.

The substrate transfer device (not shown) that has received the assembly completion signal receives the head unit from the substrate chuck 305 and transfers the head unit to a box for a finished product, thus completing a series of cycles.

[0097] In the above configuration, the state in which the top plate having the nozzle is placed on the substrate having the energy generating element is set to 1
The two imaging units simultaneously capture an image of the substrate having the energy generating element and the image of the top plate having the nozzles, and measure the position. Since the substrate and the top plate move in parallel by the same amount, the relative position between the substrate and the top plate can be measured without change.

Further, since the measurement is performed with the top plate placed on the substrate, the position is not affected by the displacement due to the contact between the substrate and the top plate and the displacement due to the minute deformation of the member holding the substrate and the top plate. Accurate positioning becomes possible.

Further, the measurement location of the substrate is an edge of the substrate, and the measurement location of the top plate is a groove, a groove wall, or an ejection port for discharging ink, which forms a nozzle. Enables simultaneous measurement of plate position.

(Other Embodiments) An object of the present invention is to provide a storage medium storing program codes of software for realizing the functions of the above-described embodiments to a system or an apparatus, and to provide a computer (or a computer) of the system or apparatus. It is needless to say that the present invention is also achieved when the CPU or the MPU reads and executes the program code stored in the storage medium.

In this case, the program code itself read from the storage medium implements the functions of the above-described embodiment, and the storage medium storing the program code constitutes the present invention.

Examples of a storage medium for supplying the program code include a floppy disk, hard disk, optical disk, magneto-optical disk, CD-ROM, and CD.
-R, a magnetic tape, a nonvolatile memory card, a ROM, or the like can be used.

When the computer executes the readout program code, not only the functions of the above-described embodiment are realized, but also the OS (Operating System) running on the computer based on the instruction of the program code. ) May perform some or all of the actual processing, and the processing may realize the functions of the above-described embodiments.

Further, after the program code read from the storage medium is written in a memory provided in a function expansion board inserted into the computer or a function expansion unit connected to the computer, based on the instruction of the program code, It goes without saying that the CPU included in the function expansion board or the function expansion unit performs part or all of the actual processing, and the processing realizes the functions of the above-described embodiments.

The technical idea according to the present invention can be applied not only to the assembly of the ink jet head as described in the above embodiment, but also to the assembly of other structures requiring high-precision positioning. It can be applied.

[0106]

As described above, according to the present invention,
A plurality of members can be positioned with high accuracy without being affected by disturbances such as vibration of the entire apparatus and minute deformation of the object and members holding the object.

[0107]

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an inkjet head assembling apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an inkjet cartridge in which an inkjet head assembled according to the present invention is generally mounted.

FIG. 3 is an enlarged configuration diagram of an inkjet head assembled according to the present invention.

4 is a schematic view of the back side of an orifice plate when the inkjet head assembled according to the present invention is viewed from the side A in FIG. 3;

FIG. 5 is a diagram showing a heater board of an ink jet head assembled according to the present invention.

FIG. 6 is a plan view of the apparatus for assembling the inkjet head according to the embodiment of the present invention as viewed from above.

FIG. 7 is a front view of the apparatus for assembling the inkjet head according to the embodiment of the present invention, as viewed from the side.

FIG. 8 is a diagram illustrating an arrangement of an optical system for measuring a relative position between a top plate and a substrate.

FIG. 9 is a diagram illustrating a state of a light beam emitted from a lighting device.

FIG. 10 is a diagram illustrating an image of the combined top plate and substrate viewed from the front of the orifice plate.

FIG. 11 is a diagram illustrating measurement of a substrate position using an image viewed from the front of an orifice plate.

FIG. 12 is a diagram illustrating measurement of a top plate position using an image viewed from the front of an orifice plate.

FIG. 13 is a diagram in which an image viewed from the front of an orifice plate is binarized using a threshold value.

FIG. 14 is a diagram showing an image obtained by performing a labeling process for giving the same label (number) to each region with respect to the binary image of FIG. 13;

FIG. 15 is a diagram illustrating detection of an ink flow path using FIG.

FIG. 16 is a diagram showing a relationship between a reference heater and an end of a heater board.

FIG. 17 is a diagram illustrating a method of aligning a top plate and a substrate.

FIG. 18 is a flowchart illustrating an assembling sequence of a top plate and a substrate.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 top plate 2 substrate 3 top plate holding device 4 position adjusting mechanism 5 substrate moving device 6 control device 7 image input device 8 image processing device 10 inkjet head assembling device 101 top plate member 102 orifice plate 103 discharge port 104 partition 105 ink flow Path 107 Ink supply port 110 Heater board 120 Base plate 112 Heater

Claims (8)

[Claims] 1. A method for assembling an ink jet head, comprising joining a top plate having an ink flow path and a nozzle corresponding to each energy generating element to a substrate having a plurality of energy generating elements. An ink jet head for measuring a relative position between the substrate and the top plate from an image captured by an imaging unit in a state where the plate is in contact with the plate, and performing alignment between the substrate and the top plate. How to assemble. 2. An illumination light source provided on the opposite side of the imaging means with respect to the substrate and the top plate, irradiating the substrate and the top plate with light, and imaging transmitted light, The method according to claim 1, wherein the position of the energy generating element on the substrate and the position of the ink flow path on the top plate are measured. 3. The method according to claim 1, wherein the top plate is formed of a transparent member. 4. The method according to claim 1, wherein a position of the energy generating element of the substrate and a position of the ink flow path of the top plate are measured from the brightness of the image picked up by the image pickup means, and these positions are aligned. The method for assembling an ink jet head according to claim 1, 2 or 3. 5. An ink jet head assembling apparatus for joining a top plate having ink flow paths and nozzles corresponding to each energy generating element to a substrate having a plurality of energy generating elements, wherein Imaging means for imaging the substrate and the top plate; image processing means for analyzing a position of an energy generating element of the substrate and a position of an ink flow path of the top plate from the captured image; A top plate and / or substrate moving unit that adjusts a relative position between the top plate and the substrate based on a processing result of the processing unit. 6. An illumination light source is provided on the opposite side of the imaging means with the substrate and the top plate interposed therebetween, and the illumination light source irradiates light to the substrate and the top plate to image transmitted light. 6. The apparatus according to claim 5, wherein the position of the energy generating element on the substrate and the position of the ink flow path on the top plate are measured. 7. The method according to claim 1, wherein a position of the energy generating element of the substrate and a position of the ink flow path of the top plate are measured from the brightness of the image picked up by the image pickup means, and these positions are aligned. The inkjet head assembling apparatus according to claim 5 or 6, wherein 8. A substrate having a first surface and a second surface intersecting with the first surface is provided with a third surface and a fourth surface that are in contact with the first surface and the second surface, respectively. A method for positioning a plurality of members for positioning and mounting a component to be mounted, comprising: mounting the component to be mounted on the substrate such that a third surface of the component is in contact with the first surface of the substrate. 1
And a second step of moving the component to be attached so that the third surface slides along the first surface, and the fourth surface abuts on the second surface. At the time the second
A third step of stopping the movement of the attached part in the step of
And the relative position between the substrate and the component to be mounted in the direction in which the intersection of the first surface and the second surface extends.
A fourth step of judging from an image input by the imaging means; and a step of determining the component to be mounted on the first surface based on a relative position between the substrate and the component to be mounted determined in the fourth step. And a fifth step of moving in a direction in which the line of intersection of the second surface extends, and a method of positioning a plurality of members.