JPH11163414A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
JPH11163414A
JPH11163414A JP9324019A JP32401997A JPH11163414A JP H11163414 A JPH11163414 A JP H11163414A JP 9324019 A JP9324019 A JP 9324019A JP 32401997 A JP32401997 A JP 32401997A JP H11163414 A JPH11163414 A JP H11163414A
Authority
JP
Japan
Prior art keywords
light
led chips
emitting device
light emitting
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9324019A
Other languages
Japanese (ja)
Inventor
Takayuki Ishihara
孝幸 石原
Masao Saito
匡男 済藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP9324019A priority Critical patent/JPH11163414A/en
Publication of JPH11163414A publication Critical patent/JPH11163414A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To improve color mixture ratio of light by providing a plurality of LED chips in a region, with a slightly widened square of a prism, comprising a bottom surface of such shape which is divided with one or more straight lines containing vertical or diagonal straight line to a short side. SOLUTION: At an upper end part of a central lead terminal 15, a recessed part 15a having a tilted side wall 15c is formed, and to a bottom surface 15b of the recessed part 15a, LED chips 11 and 12 in which an anode and a cathode are formed on an upper surface and a lower surface, respectively are fixed with a conductive paste. The LED chips 11 and 12 are rectangular parallelopiped of the same size, with their bottom surfaces being square wherein a long side is 2 times or longer than a short side. In short, the bottom surfaces of the LED chips 11 and 12 are of such prisms as the square is bisected vertical to its short side. Thus, the color-mixture ratio of light emitted from the LEDs 11 and 12 is improved, while changes in ignition point position are suppressed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、異なる色の光を発
する複数の発光ダイオードチップより成り混色光を放出
する発光装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device comprising a plurality of light emitting diode chips emitting light of different colors and emitting mixed color light.

【0002】[0002]

【従来の技術】異なる色の光を発する複数の発光ダイオ
ード(LED)を備えて、各LEDが発する色の光のほ
かに、それらの混色光を発するようにした発光装置があ
る。このような発光装置の例を図8に模式的に示す。こ
の発光装置は、赤色光を発するLEDチップ31と緑色
光を発するLEDチップ32より成る。
2. Description of the Related Art There is a light-emitting device that includes a plurality of light-emitting diodes (LEDs) that emit light of different colors, and emits mixed-color light in addition to light of the color emitted by each LED. FIG. 8 schematically illustrates an example of such a light emitting device. This light emitting device includes an LED chip 31 that emits red light and an LED chip 32 that emits green light.

【0003】LEDチップ31のみを動作させることで
赤色光が得られ、LEDチップ32のみを動作させるこ
とで緑色光が得られる。また、LEDチップ31、32
は接近して配置されており、両者を同時に動作させるこ
とで、それぞれが発した赤色光と緑色光が混じり合っ
て、橙色光が得られる。このように光の混色を利用する
ことで、得られる光の色の数はLEDチップの数よりも
多くなる。
By operating only the LED chip 31, red light is obtained, and by operating only the LED chip 32, green light is obtained. LED chips 31, 32
Are arranged close to each other, and by operating both at the same time, the red light and the green light emitted from each are mixed to obtain orange light. By utilizing the color mixture of light in this way, the number of light colors obtained is larger than the number of LED chips.

【0004】このような発光装置は、簡素な構成であり
ながら、情報量の多い発光装置として、インジケータや
表示装置をはじめ様々な用途に利用されている。機器の
動作状態を示すインジケータとして用いられるときは、
単独でも多段階の状態を示すことが可能であり、多数を
配列してドットマトリクス型の表示装置として用いると
きは、情報の一部を他と異なる色で表して強調すること
ができる。
[0004] Such a light-emitting device has a simple structure and is used as a light-emitting device having a large amount of information for various uses including an indicator and a display device. When used as an indicator that indicates the operating status of the device,
It is possible to show a multi-stage state by itself, and when many are arranged and used as a dot matrix type display device, a part of the information can be emphasized by expressing it in a different color from the others.

【0005】[0005]

【発明が解決しようとする課題】一般に、LEDチップ
はその上面に対して垂直な方向を中心として光を放出す
る指向性を有している。このため、図8に示したよう
に、2つのLEDチップ31、32を並べて配置する構
成では、赤色光と緑色光が略均等に混じり合って橙色光
となる放出範囲Oの両側に、緑色光を僅かしか含まない
赤色光中心の放出範囲Rと、赤色光を僅かしか含まない
緑色光中心の放出範囲Gが生じる。したがって、2つの
LEDチップを同時に動作させたときでも、発光装置に
対して斜めの方向からは、橙色光ではなく赤色光または
緑色光が観察されることになる。
Generally, an LED chip has a directivity of emitting light about a direction perpendicular to the upper surface thereof. For this reason, as shown in FIG. 8, in the configuration in which the two LED chips 31 and 32 are arranged side by side, green light is emitted on both sides of the emission range O in which red light and green light are almost uniformly mixed to produce orange light. And a green light center emission range G containing only a small amount of red light. Therefore, even when the two LED chips are operated at the same time, red light or green light instead of orange light is observed from a direction oblique to the light emitting device.

【0006】ところが、従来の発光装置では、個々のL
EDチップとして底面が正方形またはそれに近い形状の
ものを使用しているため、LEDチップを配置している
領域が両チップを結ぶ方向に長い矩形となる。LEDチ
ップは接近して配置されているものの、各LEDチップ
の中心間距離は長くなり、このため、一方の光しか含ま
れない放出範囲が大きくなって、略均等な混色光を観察
し得る方向範囲が狭くなっている。
However, in the conventional light emitting device, each L
Since the bottom surface of the ED chip has a square shape or a shape close thereto, the area where the LED chips are arranged is a rectangle long in the direction connecting the two chips. Although the LED chips are arranged close to each other, the center-to-center distance of each LED chip becomes longer, so that the emission range including only one light becomes larger, and a direction in which substantially uniform mixed color light can be observed. The range is narrow.

【0007】この不都合への対策として、LEDチップ
を覆う透光性の樹脂モールドにガラス粉末を加えたり、
光放出方向の前方にスリガラス等を配設したりして、光
を拡散させることが行われている。このようにすると、
光は拡散されてより広い範囲で混じり合い、一方の光し
か含まれない放出範囲は減少する。しかしながら、拡散
によって多くの光が失われるため、光量が低下してしま
うことになる。
As a measure against this inconvenience, glass powder is added to a translucent resin mold covering the LED chip,
Light is diffused by disposing a ground glass or the like in the front of the light emission direction. This way,
Light is diffused and mixed over a larger area, and the emission range containing only one light is reduced. However, since much light is lost due to diffusion, the amount of light will be reduced.

【0008】また、従来の発光装置では、LEDチップ
の中心間距離が長いため、一方のLEDチップが発光し
ているときと他方のLEDチップが発光しているときと
で、発光点の位置が大きく異なる。このため、発光装置
を正面から観察するときでも、色が変わるごとに発光点
が移動するように見えて、不自然な印象を受けることが
ある。
In the conventional light emitting device, the distance between the centers of the LED chips is long, so that the position of the light emitting point is different between when one LED chip emits light and when the other LED chip emits light. to differ greatly. For this reason, even when observing the light emitting device from the front, the light emitting point may appear to move every time the color changes, giving an unnatural impression.

【0009】本発明は、上記問題点に鑑みてなされたも
のであり、複数のLEDチップが発する光の混色の割合
を高めるとともに、発光点の位置の変化を抑えた発光装
置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device in which the rate of color mixture of light emitted from a plurality of LED chips is increased and the change in the position of a light emitting point is suppressed. Aim.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
に本発明では、相互に接近して配置され異なる色の光を
発する複数のLEDチップより成り、複数のLEDチッ
プが発する光を混色して放出する発光装置において、複
数のLEDチップを、矩形をその短辺に対して垂直方向
または斜め方向の直線を含む1以上の直線で分割した形
状の底面を有する角柱とし、前記矩形を僅かに広げた大
きさの領域に配置する。
In order to achieve the above object, the present invention comprises a plurality of LED chips which are arranged close to each other and emit light of different colors, and mixes the light emitted by the plurality of LED chips. In a light-emitting device that emits light, a plurality of LED chips are formed into a prism having a bottom surface in a shape obtained by dividing a rectangle by at least one straight line including a straight line perpendicular or oblique to a short side thereof, and Place it in the area of the expanded size.

【0011】この発光装置は2以上の角柱状のLEDチ
ップより成り、全てのLEDチップを側面で接触させた
状態での底面の形状は矩形となる。ここでいう矩形は、
正方形を除く長方形と正方形の両方を含む形である。L
EDチップは側面を接触させた状態ではなく、その接触
状態から相互に僅かに離間して配置され、全LEDチッ
プが配置される領域は、接触状態の底面よりも僅かに大
きい略矩形の形状となる。
This light emitting device is composed of two or more prismatic LED chips, and the shape of the bottom surface in a state where all the LED chips are in contact with the side surface is a rectangle. The rectangle here is
It is a shape that includes both rectangles and squares excluding squares. L
The ED chips are not in a state where the side surfaces are in contact with each other, but are arranged slightly apart from the contact state, and the area where all the LED chips are arranged has a substantially rectangular shape slightly larger than the bottom surface in the contact state. Become.

【0012】接触状態の矩形の底面を分割する線には、
その短辺に対して垂直または斜めの線、すなわち短辺に
平行でない線が少なくとも1つ含まれる。したがって、
少なくとも1組の隣合うLEDチップが向かい合う面に
は、全LEDチップが配置される略矩形の領域の短辺に
対して非平行な面が含まれることになる。
Lines dividing the bottom surface of the contacting rectangular shape include:
At least one line perpendicular or oblique to the short side, that is, a line not parallel to the short side is included. Therefore,
The surface on which at least one set of adjacent LED chips faces includes a surface that is non-parallel to the short side of the substantially rectangular area where all the LED chips are arranged.

【0013】隣合うLEDチップが発する光が混じり合
う割合は、両チップの中心間距離が短いほど大きくな
る。略矩形の領域の短辺に対して非平行な面で向かい合
う部位では、2つのLEDチップの中心間距離は、最長
でもその領域の短辺の長さの1/2程度となる。このた
め、これら2つのLEDチップが発する光が混じり合う
割合は高くなる。また、発光するLEDチップを切り換
えるときでも、発光点の位置の移動は僅かになる。
The rate at which the light emitted by adjacent LED chips mixes increases as the distance between the centers of the two chips decreases. In a portion facing the non-parallel surface to the short side of the substantially rectangular area, the distance between the centers of the two LED chips is at most about 1/2 of the length of the short side of the area. For this reason, the ratio at which the light emitted from these two LED chips is mixed increases. In addition, even when the LED chip that emits light is switched, the position of the light emitting point moves slightly.

【0014】2つのLEDチップの向かい合う面が略矩
形の領域の短辺に対して垂直に近くなるほど、光の混色
の割合は増し、略矩形の領域の長辺方向に沿う混色の割
合の分布も均一になる。例えば、2つのLEDチップを
幅の狭い直方体として幅方向に並べて配置すると、両チ
ップの発する光は殆ど全て混じり合い、しかも、混色の
割合は、チップの長さに関わらず長辺方向全体にわたっ
て均一になる。
[0014] As the opposing surfaces of the two LED chips become closer to being perpendicular to the short side of the substantially rectangular area, the ratio of light color mixing increases, and the distribution of the color mixing ratio along the long side direction of the substantially rectangular area also increases. Become uniform. For example, if two LED chips are arranged side by side in the width direction as a narrow rectangular parallelepiped, almost all of the light emitted from both chips will be mixed, and the ratio of color mixture will be uniform over the entire long side direction regardless of the chip length. become.

【0015】個々のLEDチップの底面は、凸多角形で
も凹多角形でもよい。また、全てのLEDチップを同一
形状としてもよく、異なる大きさや異なる形状としても
構わない。
The bottom surface of each LED chip may be a convex polygon or a concave polygon. In addition, all the LED chips may have the same shape, or may have different sizes or different shapes.

【0016】[0016]

【発明の実施の形態】以下、本発明の発光装置の実施形
態について図面を参照して説明する。第1の実施形態の
発光装置1の平面図および正面図を、図1および図2に
それぞれ示す。発光装置1は、赤色光を発するLEDチ
ップ11、緑色光を発するLEDチップ12、3本のリ
ード端子13、14、15、2本のワイヤ16、17お
よび樹脂モールド18より成る。
Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show a plan view and a front view of the light emitting device 1 of the first embodiment, respectively. The light emitting device 1 includes an LED chip 11 that emits red light, an LED chip 12 that emits green light, three lead terminals 13, 14, 15, two wires 16 and 17, and a resin mold 18.

【0017】中央のリード端子15の上端部には、傾斜
した側壁15cを有する凹部15aが形成されている。
LEDチップ11およびLEDチップ12はそれぞれ、
上面に陽極、下面に陰極を形成されており、リード端子
15の凹部15aの底面15bに導電性のペーストで固
着されている。LEDチップ11および12の陽極はそ
れぞれ、金製のワイヤ16および17でリード端子13
および14の上端に接続されている。
At the upper end of the center lead terminal 15, a recess 15a having an inclined side wall 15c is formed.
The LED chip 11 and the LED chip 12 are respectively
An anode is formed on the upper surface, and a cathode is formed on the lower surface. The anode is fixed to the bottom surface 15b of the recess 15a of the lead terminal 15 with a conductive paste. The anodes of the LED chips 11 and 12 are connected to lead terminals 13 by gold wires 16 and 17, respectively.
And 14 are connected to the upper ends.

【0018】リード端子13および14はそれぞれLE
Dチップ11および12の個別の陽極端子となり、リー
ド端子15はLEDチップ11および12に共通の陰極
端子となる。LEDチップ11およびLEDチップ12
への電圧印加は個別に制御され、発光装置1は、赤色光
のみを発する状態と、緑色光のみを発する状態と、赤色
光と緑色光の両方を発する状態の3種類の発光状態をと
る。赤色光と緑色光の両方を発しているとき、両光は混
じり合って橙色光となる。
The lead terminals 13 and 14 are LE
The lead terminals 15 serve as individual anode terminals of the D chips 11 and 12, and the lead terminal 15 serves as a cathode terminal common to the LED chips 11 and 12. LED chip 11 and LED chip 12
The voltage application to the light-emitting device 1 is individually controlled, and the light-emitting device 1 has three kinds of light-emitting states, a state of emitting only red light, a state of emitting only green light, and a state of emitting both red light and green light. When both red light and green light are emitted, the two lights mix and become orange light.

【0019】樹脂モールド18はエポキシ樹脂を固化し
て成る透明なもので、LEDチップ11、12とワイヤ
16、17の全体とリード端子13、14、15の上部
とを覆う。樹脂モールド18の下部は円柱状であり、そ
の下端面からはリード端子13、14、15が突出して
いる。樹脂モールド18の上部は半球状とされており、
LEDチップ11、12が発した光を集光させるレンズ
として機能する。
The resin mold 18 is a transparent one formed by solidifying epoxy resin, and covers the entire LED chips 11 and 12, the wires 16 and 17, and the upper portions of the lead terminals 13, 14 and 15. The lower portion of the resin mold 18 has a cylindrical shape, and lead terminals 13, 14, and 15 protrude from the lower end surface. The upper part of the resin mold 18 has a hemispherical shape,
It functions as a lens that condenses the light emitted by the LED chips 11 and 12.

【0020】リード端子15の凹部15aの側壁15c
の内面は、LEDチップ11、12が発した光のうち側
方に進む少量の光を上方に向けて反射する。これと樹脂
モールド18の集光作用とにより、発光装置1は、上方
に向かって広がる頂角90゜程度の円錐状の範囲内に大
部分の光を放出することになる。
Side wall 15c of recess 15a of lead terminal 15
Of the light emitted by the LED chips 11 and 12 reflects upward a small amount of light traveling to the side. Due to this and the light-condensing action of the resin mold 18, the light-emitting device 1 emits most of the light within a conical area having a vertex angle of about 90 ° that spreads upward.

【0021】2つのLEDチップ11、12は同一の大
きさの直方体であり、それらの底面は長辺が短辺の2倍
を超える矩形である。すなわち、LEDチップ11、1
2の底面は、矩形をその短辺に対して垂直に2等分した
形状である。LEDチップ11、12は相互に僅かに離
間して平行に配置されており、それらが配置されている
領域(以下、配置領域という)全体の形状も矩形であ
る。
The two LED chips 11 and 12 are rectangular parallelepipeds having the same size, and their bottom surfaces are rectangles whose long sides exceed twice the short sides. That is, the LED chips 11, 1
The bottom surface of 2 has a shape obtained by bisecting a rectangle perpendicular to its short side. The LED chips 11 and 12 are arranged slightly parallel to each other with a slight distance from each other, and the entire area in which they are arranged (hereinafter, referred to as an arrangement area) is also rectangular.

【0022】LEDチップ11の中心とLEDチップ1
2の中心との距離は、配置領域の短辺S(図1)と両チ
ップの離間距離Dの和の半分(S+D)/2であり、こ
の距離がLEDチップ11、12の位置のずれとなる。
このずれは、配置領域の長辺Lすなわち両チップの長さ
と比べて1/2以下の大きさであり、小さい。
The center of the LED chip 11 and the LED chip 1
2 is half (S + D) / 2 of the sum of the short side S of the arrangement area (FIG. 1) and the distance D between the two chips, and this distance is the difference between the position of the LED chips 11 and 12 Become.
This shift is smaller than the long side L of the arrangement area, that is, half of the length of both chips, and is small.

【0023】したがって、LEDチップ11が発する赤
色光とLEDチップ12が発する緑色光は殆ど全て混じ
り合うことになる。このため、図8に示した赤色光中心
の放出範囲Rと緑色光中心の放出範囲Gはごく僅かであ
る。しかも、発光装置1からの光の放出方向は前述の円
錐状の範囲に限定されており、LEDチップ11、12
を共に発光させたときに発光装置1から放出される光は
殆どが橙色光となる。
Therefore, the red light emitted from the LED chip 11 and the green light emitted from the LED chip 12 are almost all mixed. For this reason, the emission range R of the red light center and the emission range G of the green light center shown in FIG. 8 are very small. In addition, the direction in which light is emitted from the light emitting device 1 is limited to the above-described conical range, and the LED chips 11 and 12 emit light.
When light is emitted together, most of the light emitted from the light emitting device 1 is orange light.

【0024】また、LEDチップ11、12の位置のず
れは上述のように小さいから、発光状態を前述の3種類
の間で切り換えたときでも、発光点の位置の変化は僅か
である。すなわち、赤色光、緑色光、橙色光のいずれ
も、略同一点から発せられたように観察される。
Further, since the displacement of the LED chips 11 and 12 is small as described above, even when the light emitting state is switched between the above three types, the change of the position of the light emitting point is slight. That is, it is observed that all of the red light, green light, and orange light are emitted from substantially the same point.

【0025】第2の実施形態の発光装置2の平面図およ
び正面図を、図3および図4にそれぞれ示す。この発光
装置2は、上記のLEDチップ11および12を表面に
3つの配線パターン23、24、25が形成された基板
20に載置して、樹脂28でモールドしたものである。
FIGS. 3 and 4 are a plan view and a front view, respectively, of the light emitting device 2 of the second embodiment. The light emitting device 2 is one in which the LED chips 11 and 12 are mounted on a substrate 20 having three wiring patterns 23, 24 and 25 formed on a surface thereof, and molded with a resin 28.

【0026】中央の配線パターン25は基板20の上面
中央から側面を経て下面にまで設けられており、LED
チップ11および12は、基板20の上面の配線パター
ン25に導電性のペーストで固着されている。配線パタ
ーン23および24はそれぞれ、基板20の上面のLE
Dチップ11および12の近傍から側面を経て下面にま
で設けられている。LEDチップ11および12の陽極
はそれぞれ、金製のワイヤ26および27で配線パター
ン23および24に接続されている。
The central wiring pattern 25 is provided from the center of the upper surface of the substrate 20 to the lower surface via the side surfaces.
The chips 11 and 12 are fixed to the wiring pattern 25 on the upper surface of the substrate 20 with a conductive paste. The wiring patterns 23 and 24 are respectively provided on the LE of the upper surface of the substrate 20.
It is provided from the vicinity of the D chips 11 and 12 to the lower surface via the side surface. The anodes of the LED chips 11 and 12 are connected to wiring patterns 23 and 24 by gold wires 26 and 27, respectively.

【0027】配線パターン23および24はそれぞれ、
LEDチップ11および12の個別の陽極配線となり、
配線パターン25はLEDチップ11および12に共通
の陰極配線となる。この発光装置2は表面実装型であ
り、回路基板の表面に半田等で固定されると同時にその
回路配線に接続される。
The wiring patterns 23 and 24 are respectively
It becomes the individual anode wiring of the LED chips 11 and 12,
The wiring pattern 25 is a common cathode wiring for the LED chips 11 and 12. The light emitting device 2 is of a surface mounting type, and is fixed to the surface of a circuit board by soldering or the like and is connected to the circuit wiring.

【0028】樹脂モールド28はエポキシ樹脂を固化し
て成る透明なもので、LEDチップ11、12とワイヤ
26、27の全体と配線パターン23、24、25の端
部とを覆う。樹脂モールド28は上面を平坦に形成され
ており、発光装置2はLEDチップ11および12が発
する光を特に集光させることなく、広い範囲に放出す
る。
The resin mold 28 is a transparent one formed by solidifying epoxy resin, and covers the entire LED chips 11 and 12, the wires 26 and 27, and the ends of the wiring patterns 23, 24 and 25. The resin mold 28 has an upper surface formed to be flat, and the light emitting device 2 emits light emitted from the LED chips 11 and 12 to a wide range without particularly condensing the light.

【0029】LEDチップ11および12の形状や配置
は前述の発光装置1と同様である。したがって、LED
チップ11とLEDチップ12の位置のずれは小さく、
それらが発する赤色光と緑色光は殆ど全て混じり合って
橙色光となる。LEDチップ11、12を共に発光させ
たときに赤色光または緑色光が放出されるのは、基板2
0に対して平行に近い斜め方向に限られる。通常の使用
ではこのような方向から発光装置2を観察することはな
く、発光装置2は実用上、均一な橙色光を放出するもの
となる。
The shapes and arrangement of the LED chips 11 and 12 are the same as those of the light emitting device 1 described above. Therefore, LED
The displacement between the chip 11 and the LED chip 12 is small,
Almost all of the red light and green light emitted by them are mixed to produce orange light. When the LED chips 11 and 12 emit light together, red light or green light is emitted from the substrate 2.
It is limited to an oblique direction that is nearly parallel to 0. In normal use, the light-emitting device 2 is not observed from such a direction, and the light-emitting device 2 emits uniform orange light in practical use.

【0030】第1および第2の実施形態の発光装置1お
よび2は、例えばインジケータとして、単独で使用する
こともできるし、多数を2次元に配列してドットマトリ
クス型の表示装置とし、文字や図形の表示に使用するこ
ともできる。いずれの使用形態においても、赤色光、緑
色光および橙色光を使い分けることで、提供される情報
量は多くなる。しかも、橙色光が赤色光や緑色光として
観察されることがないため、発光装置1、2が色によっ
て表す情報を観察者が誤認する恐れがない。
The light-emitting devices 1 and 2 of the first and second embodiments can be used alone, for example, as indicators, or can be arranged in a two-dimensional array to form a dot-matrix display device. It can also be used to display graphics. In any of the usage modes, the amount of information provided is increased by properly using red light, green light, and orange light. In addition, since the orange light is not observed as red light or green light, there is no possibility that the observer may mistakenly recognize the information represented by the colors of the light emitting devices 1 and 2.

【0031】また、赤色光、緑色光および橙色光のいず
れを放出するときでも、その発光点の位置に大きなずれ
がないから、放出する色を切り換えたときに発光点が移
動するという不自然な印象を観察者に与えることもな
い。
Also, when emitting any of red light, green light and orange light, there is no large shift in the position of the light emitting point, so that the light emitting point moves when the emitted color is switched. No impression is given to the observer.

【0032】なお、上記の実施形態では、赤色光を発す
るLEDチップと緑色光を発するLEDチップを備える
例を示したが、発光装置の用途に応じて、任意の色の光
を発するLEDチップを組み合わせるとよい。
In the above embodiment, an example is shown in which an LED chip that emits red light and an LED chip that emits green light are provided. However, an LED chip that emits light of any color may be used according to the application of the light emitting device. Good to combine.

【0033】また、個々のLEDチップの底面の形状
は、上記の実施形態で示した矩形に限られるものではな
い。LEDチップの底面は、矩形を分割した形状であっ
て、その分割する線に短辺に対して垂直または斜めの直
線を1以上含むものであればよい。また、LEDチップ
の数も2に限られず、3以上であってもよい。各LED
チップは、側面を接し合わせて全ての底面が矩形を成し
ている状態から相互に離間させて、配置領域が元の矩形
よりも僅かに大きな略矩形となるように配置する。
The shape of the bottom surface of each LED chip is not limited to the rectangle shown in the above embodiment. The bottom surface of the LED chip may be a shape obtained by dividing a rectangle, and the dividing line may include at least one straight line perpendicular or oblique to the short side. Further, the number of LED chips is not limited to two, and may be three or more. Each LED
The chips are arranged so that the side surfaces thereof are in contact with each other and are separated from each other from a state in which all the bottom surfaces form a rectangle, so that the arrangement region becomes a substantially rectangular shape slightly larger than the original rectangle.

【0034】本発明の発光装置に用いるLEDチップの
底面の形状と配置の他の例を図5〜図7に示す。これら
の図において、横方向が配置領域の短辺Sに、縦方向が
長辺Lに対応する。
FIGS. 5 to 7 show other examples of the shape and arrangement of the bottom surface of the LED chip used in the light emitting device of the present invention. In these figures, the horizontal direction corresponds to the short side S of the arrangement area, and the vertical direction corresponds to the long side L.

【0035】図5は2つのLEDチップを組み合わせた
例である。LEDチップの底面は(a)では三角形、
(b)では台形、(c)では凹六角形であり、同一形状
である。いずれも配置領域の中心に関して点対称に配置
されている。(c)では、どちらのLEDチップも3つ
の側面で他方のLEDチップに面することになる。
FIG. 5 shows an example in which two LED chips are combined. The bottom of the LED chip is triangular in (a),
(B) is a trapezoid, (c) is a concave hexagon, and has the same shape. All are arranged point-symmetrically with respect to the center of the arrangement area. In (c), both LED chips face the other LED chip on three sides.

【0036】図6は3つのLEDチップを組み合わせた
例である。3つのLEDチップとしてすべて異なる色の
光を発するものを用いれば、7色の光を発する発光装置
となる。赤色光、緑色光および青色光を発するLEDチ
ップの組では、全てを同時に発光させることにより、白
色光を得ることができる。(a)を除き、3つのLED
チップのうちの1つは、他の2つと異なる底面形状であ
る。
FIG. 6 shows an example in which three LED chips are combined. If all of the three LED chips emit light of different colors, a light emitting device that emits light of seven colors is obtained. In a set of LED chips that emit red light, green light and blue light, white light can be obtained by causing all to emit light simultaneously. 3 LEDs except (a)
One of the chips has a different bottom shape than the other two.

【0037】図7は4つのLEDチップを組み合わせた
例である。赤色光を発するLEDチップと緑色光を発す
るLEDチップをそれぞれ2つ用いて、それらを交互に
この図のように配置すれば、第1の実施形態や第2の実
施形態の発光装置1、2よりも、さらに均一に混じり合
った光を発する発光装置となる。
FIG. 7 shows an example in which four LED chips are combined. By using two LED chips that emit red light and two LED chips that emit green light and arranging them alternately as shown in this figure, the light emitting devices 1 and 2 of the first embodiment and the second embodiment can be used. The light emitting device emits light that is more uniformly mixed than the light emitting device.

【0038】なお、図5(c)、図6(b)、(c)お
よび(d)では、配置領域の形状は輪郭に凹凸があり厳
密には矩形ではない。しかしながら、個々のLEDチッ
プは同一のチップを切断して製造するものではないか
ら、いずれか1つまたは複数の形状を調整して、配置領
域を矩形とすることも容易である。たとえば、図5
(c)の場合、両LEDチップの縦方向の離間間隔だけ
各LEDチップの縦方向の長さを増せば、配置領域は矩
形となる。
In FIGS. 5 (c), 6 (b), 6 (c) and 5 (d), the shape of the arrangement area has irregularities in the outline and is not strictly rectangular. However, since the individual LED chips are not manufactured by cutting the same chip, it is easy to adjust one or a plurality of shapes to make the arrangement area rectangular. For example, FIG.
In the case of (c), if the length of each LED chip in the vertical direction is increased by the vertical spacing between the two LED chips, the arrangement area becomes rectangular.

【0039】配置領域の長辺Lと短辺Sの長さの比は任
意である。長辺Lと短辺Sを等しくして正方形としても
よい。また、長辺Lが短辺Sよりもはるかに長い場合で
も、底面を分割する直線を短辺に対して垂直にすること
により、長辺方向の全体にわたって光は均一に混じり合
う。
The ratio of the length of the long side L to the length of the short side S is arbitrary. The long side L and the short side S may be equal to form a square. Even when the long side L is much longer than the short side S, light is uniformly mixed over the whole of the long side direction by making the straight line dividing the bottom surface perpendicular to the short side.

【0040】LEDチップの形状は、製造の難易や強度
も考慮して選択するとよい。第1、第2の実施形態や図
6(a)、図7に示したような底面が矩形のものが、光
の混じり合いの均一性、製造の容易さ、取扱い易さ、お
よび強度の面で好ましい。ワイヤボンディングの容易さ
の点では、図5(c)や図6(c)のように、幅の広い
ものが優れているといえる。
The shape of the LED chip may be selected in consideration of the difficulty in manufacturing and the strength. A rectangular bottom surface as shown in the first and second embodiments and FIGS. 6A and 7 is used for uniformity of light mixing, ease of manufacture, ease of handling, and strength. Is preferred. In terms of ease of wire bonding, it can be said that a wide one as shown in FIG. 5C or FIG. 6C is superior.

【0041】[0041]

【発明の効果】本発明の発光装置によるときは、異なる
色の光を発するLEDチップの位置のずれが小さいた
め、それらの光が混じり合う範囲が広くなって、混色光
の色分離が防止される。このため、光の色によって情報
を表す場合でも、正しく情報を伝えることができる。ま
た、放出する光の色を切り換えるときでも、発光点は殆
ど移動しないから、観察者が不自然な印象を受けること
がない。
According to the light emitting device of the present invention, since the displacement of the LED chips emitting light of different colors is small, the range in which the light is mixed is widened, and color separation of mixed light is prevented. You. For this reason, even when information is represented by the color of light, information can be transmitted correctly. Further, even when the color of the emitted light is switched, the light emitting point hardly moves, so that the observer does not receive an unnatural impression.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 第1の実施形態の発光装置の平面図。FIG. 1 is a plan view of a light emitting device according to a first embodiment.

【図2】 第1の実施形態の発光装置の正面図。FIG. 2 is a front view of the light emitting device according to the first embodiment.

【図3】 第2の実施形態の発光装置の平面図。FIG. 3 is a plan view of a light emitting device according to a second embodiment.

【図4】 第2の実施形態の発光装置の正面図。FIG. 4 is a front view of a light emitting device according to a second embodiment.

【図5】 2つのLEDチップから成る発光装置のLE
Dチップの底面形状と配置を模式的に示す図。
FIG. 5: LE of a light emitting device comprising two LED chips
The figure which shows typically the bottom shape and arrangement | positioning of a D chip.

【図6】 3つのLEDチップから成る発光装置のLE
Dチップの底面形状と配置を模式的に示す図。
FIG. 6: LE of a light emitting device comprising three LED chips
The figure which shows typically the bottom shape and arrangement | positioning of a D chip.

【図7】 4つのLEDチップから成る発光装置のLE
Dチップの底面形状と配置を模式的に示す図。
FIG. 7: LE of a light emitting device comprising four LED chips
The figure which shows typically the bottom shape and arrangement | positioning of a D chip.

【図8】 従来の発光装置の構成と光の混色の様子を示
す図。
FIG. 8 is a diagram showing a configuration of a conventional light emitting device and a state of color mixing of light.

【符号の説明】[Explanation of symbols]

1、2 発光装置 11 LEDチップ(赤色) 12 LEDチップ(緑色) 13、14 陽極リード端子 15 陰極リード端子 15a 陰極リード端子凹部 16、17 ワイヤ 18 樹脂モールド 20 基板 23、24 陽極配線パターン 25 陰極配線パターン 26、27 ワイヤ 28 樹脂モールド DESCRIPTION OF SYMBOLS 1, 2 Light emitting device 11 LED chip (red) 12 LED chip (green) 13, 14 Anode lead terminal 15 Cathode lead terminal 15a Cathode lead terminal concave part 16, 17 Wire 18 Resin mold 20 Substrate 23, 24 Anode wiring pattern 25 Cathode wiring Pattern 26, 27 Wire 28 Resin mold

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 相互に接近して配置され異なる色の光を
発する複数の発光ダイオードチップより成り、前記複数
の発光ダイオードチップが発する光を混色して放出する
発光装置において、 前記複数の発光ダイオードチップは、矩形をその短辺に
対して垂直方向または斜め方向の直線を含む1以上の直
線で分割した形状の底面を有する角柱であるとともに、
前記矩形を僅かに広げた大きさの領域に配置されている
ことを特徴とする発光装置。
1. A light emitting device comprising a plurality of light emitting diode chips arranged close to each other and emitting light of different colors, wherein the light emitted from the plurality of light emitting diode chips is mixed and emitted. The chip is a prism having a bottom surface in a shape obtained by dividing a rectangle by one or more straight lines including a straight line in a vertical direction or an oblique direction with respect to a short side thereof,
A light-emitting device, wherein the light-emitting device is arranged in an area having a size obtained by slightly expanding the rectangle.
JP9324019A 1997-11-26 1997-11-26 Light-emitting device Pending JPH11163414A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9324019A JPH11163414A (en) 1997-11-26 1997-11-26 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9324019A JPH11163414A (en) 1997-11-26 1997-11-26 Light-emitting device

Publications (1)

Publication Number Publication Date
JPH11163414A true JPH11163414A (en) 1999-06-18

Family

ID=18161244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9324019A Pending JPH11163414A (en) 1997-11-26 1997-11-26 Light-emitting device

Country Status (1)

Country Link
JP (1) JPH11163414A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332765A (en) * 2000-05-22 2001-11-30 Iwasaki Electric Co Ltd Led display lamp
JP2013000090A (en) * 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc Growth state evaluating device
JP2014060277A (en) * 2012-09-18 2014-04-03 Stanley Electric Co Ltd Led array
WO2015093314A1 (en) * 2013-12-16 2015-06-25 ソニー株式会社 Image analysis device, image analysis method, program, and illumination device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332765A (en) * 2000-05-22 2001-11-30 Iwasaki Electric Co Ltd Led display lamp
JP2013000090A (en) * 2011-06-21 2013-01-07 Konica Minolta Advanced Layers Inc Growth state evaluating device
JP2014060277A (en) * 2012-09-18 2014-04-03 Stanley Electric Co Ltd Led array
WO2015093314A1 (en) * 2013-12-16 2015-06-25 ソニー株式会社 Image analysis device, image analysis method, program, and illumination device
JP2015135659A (en) * 2013-12-16 2015-07-27 ソニー株式会社 Image analysis device, image analysis method, program, and illumination device
CN105979852A (en) * 2013-12-16 2016-09-28 索尼公司 Image analysis device, image analysis method, program, and illumination device
TWI666000B (en) * 2013-12-16 2019-07-21 新力股份有限公司 Image analysis device, image analysis method, program and lighting device
US10939823B2 (en) 2013-12-16 2021-03-09 Sony Corporation Image analysis device, image analysis method, and illumination device

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