JPH11159767A - High frequency heater - Google Patents

High frequency heater

Info

Publication number
JPH11159767A
JPH11159767A JP32740897A JP32740897A JPH11159767A JP H11159767 A JPH11159767 A JP H11159767A JP 32740897 A JP32740897 A JP 32740897A JP 32740897 A JP32740897 A JP 32740897A JP H11159767 A JPH11159767 A JP H11159767A
Authority
JP
Japan
Prior art keywords
lead wire
noise filter
main fuse
high frequency
metal terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32740897A
Other languages
Japanese (ja)
Inventor
Fumihiko Migaki
文彦 三垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP32740897A priority Critical patent/JPH11159767A/en
Publication of JPH11159767A publication Critical patent/JPH11159767A/en
Pending legal-status Critical Current

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  • Electric Ovens (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce cost by mounting a main fuse on a noise filter board and soldering the main fuse directly to the board as an integral structure thereby decreasing the labor required for assembling work and the number of parts. SOLUTION: A main fuse 2 is soldered directly onto a noise filter board 1 performing power supply noise control of a high frequency food heater and a power cord connection part 4 is connected with the noise filter board 1 through a lead wire 3. Since a metal terminal for main fuse and the lead wire 3 are not required to be caulked nor a resin cover is required, the labor required for assembling work can be reduced. Further, a water resistant vibration-proof cushion rubber can be eliminated by disposing at the upper part of the back plate of the body of high frequency food heater. Since no countermeasure against temperature is required at the metal terminal part of the lead wire 3, a lead wire 3 having smaller cross-section can be employed and the cost can be reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、食品を加熱する高
周波加熱装置に関するもので、特にノイズフィルター基
板部の構成に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency heating device for heating food, and more particularly to a structure of a noise filter substrate.

【0002】[0002]

【従来の技術】従来、この種の高周波加熱装置は、図4
に示されているように、高周波加熱装置の本体後上部に
設けたノイズフィルター基板1と本体後下部に設けたメ
インヒューズ2とが別々に配置され、ノイズフィルター
基板1に電力を供給する電源コード接続部4がリード線
3を介して接続され、リード線3の中間にメインヒュー
ズ2が取り付けられ、電源コード接続部4の近傍に配置
された構成となっていた。メインヒューズ2は固定、及
び絶縁の為、リード線3に金属端子2−aをカシメ、樹
脂のカバー2−bで覆っていた。また、本体裏板の近傍
を通すメインヒューズ2と接続されるリード線3には振
動及び耐水対策のために、その上部近傍にクッションゴ
ム5を貼り付けていた。その他、リード線3はその金属
端子2−aとヒューズ口金部との接触抵抗による温度対
策のために、断面積の大きなものを使用し、その位置も
配慮が必要とされていた。図5は従来のノイズフィルタ
ー基板の外観図である。
2. Description of the Related Art Conventionally, a high-frequency heating apparatus of this type is shown in FIG.
As shown in FIG. 1, a noise filter substrate 1 provided at the upper rear part of the main body of the high-frequency heating device and a main fuse 2 provided at the lower rear part of the main body are separately arranged, and a power cord for supplying power to the noise filter substrate 1 is provided. The connecting portion 4 is connected via the lead wire 3, the main fuse 2 is attached in the middle of the lead wire 3, and is arranged near the power cord connecting portion 4. For fixing and insulating the main fuse 2, the metal terminal 2-a is covered with a cover 2-b made of caulking or resin on the lead wire 3. Further, a cushion rubber 5 is attached near the upper portion of the lead wire 3 connected to the main fuse 2 passing through the vicinity of the back plate of the main body in order to prevent vibration and water resistance. In addition, the lead wire 3 has a large cross-sectional area in order to take measures against temperature by contact resistance between the metal terminal 2-a and the fuse base, and it is necessary to consider the position thereof. FIG. 5 is an external view of a conventional noise filter substrate.

【0003】[0003]

【発明が解決しようとする課題】従来の高周波加熱装置
では、メインヒューズは固定、及び絶縁の為に、リード
線に金属端子をカシメ、樹脂のカバーで覆わなければな
らなかった。また、リード線には、本体裏板の近傍を通
るために振動及耐水対策のために、その上部近傍にクッ
ションゴムを貼り付けなければならなかった。更に、メ
インヒューズはリード線の金属端子とヒューズ口金部と
の接触抵抗による温度対策の為に、その位置を配慮しな
ければならず、性能,コストの両面から実際の設計に関
する課題が多くあった。
In the conventional high-frequency heating device, the main fuse had to be covered with a caulking or resin cover on the lead wire for fixing and insulation. In addition, cushion rubber had to be attached to the lead wire near its upper part for measures against vibration and water to pass near the back plate of the main body. Furthermore, the position of the main fuse must be considered in order to take measures against temperature due to the contact resistance between the metal terminal of the lead wire and the fuse base, and there are many issues related to the actual design in terms of both performance and cost. .

【0004】[0004]

【課題を解決するための手段】本発明は上記課題を解決
するために、ノイズフィルター基板にメインヒューズを
一体化して設けることでノイズフィルター基板を一元化
したもので、かつ、メインヒューズをノイズフィルター
基板に直接半田付けしたものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention unifies a noise filter substrate by integrally providing a main fuse on a noise filter substrate. Directly soldered to

【0005】上記発明によれば、メインヒューズ用金属
端子をリード線にカシメる必要もなく、また、樹脂のカ
バーを使用する必要もなくなり、かつ、電源コードから
ノイズフィルターに接続するリード線の線径も細くで
き、メインヒューズの機能を満足しながら、組立工数や
部品点数を減らすことができ、コストも削減できる。
According to the above invention, it is not necessary to caulk the metal terminal for the main fuse to the lead wire, it is not necessary to use a resin cover, and the lead wire connecting the power cord to the noise filter. The diameter can be reduced, and while the function of the main fuse is satisfied, the number of assembly steps and the number of parts can be reduced, and the cost can be reduced.

【0006】[0006]

【発明の実施の形態】本発明は、ノイズフィルター基板
にメインヒューズを一体化し、かつ、高周波加熱装置本
体の後部上方に配置したものであり、メインヒューズは
直接ノイズフィルター基板に半田付けする構成としたも
のである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention has a structure in which a main fuse is integrated with a noise filter substrate and is disposed above a rear portion of a high-frequency heating device main body. The main fuse is directly soldered to the noise filter substrate. It was done.

【0007】そして組立工数,部品点数を減らしコスト
削減が可能となる。
[0007] Then, the number of assembly steps and the number of parts can be reduced, and the cost can be reduced.

【0008】[0008]

【実施例】以下、本発明の実施例について図面を用いて
説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0009】(実施例)図2は本発明の実施例の高周波
加熱装置のノイズフィルターの部品の基板外観図であ
る。図1は高周波加熱装置のノイズフィルター基板、及
びメインヒューズ部周辺の斜視図である。図3は高周波
加熱装置のノイズフィルター回路図を示す。
(Embodiment) FIG. 2 is an external view of a substrate of a noise filter component of a high-frequency heating device according to an embodiment of the present invention. FIG. 1 is a perspective view of a noise filter substrate of a high-frequency heating device and a periphery of a main fuse portion. FIG. 3 shows a noise filter circuit diagram of the high-frequency heating device.

【0010】図1において、1はノイズフィルター基板
で、高周波加熱装置の電源雑音の制御を行なうものであ
る。2はノイズフィルター基板1上に直接半田付けされ
たメインヒューズである。3は電源コード接続部4から
ノイズフィルター基板1に接続するリード線3で、4は
電源コード接続部4である。
In FIG. 1, reference numeral 1 denotes a noise filter substrate for controlling power supply noise of a high-frequency heating device. 2 is a main fuse directly soldered on the noise filter substrate 1. Reference numeral 3 denotes a lead wire 3 connected from the power cord connection part 4 to the noise filter substrate 1, and reference numeral 4 denotes a power cord connection part 4.

【0011】[0011]

【発明の効果】以上のように本発明によれば、メインヒ
ューズ用金属端子をリード線にカシメる必要もなく、且
つ、樹脂のカバーで覆う必要もなくなる。また、高周波
加熱装置本体の裏板上部に位置させることで、振動及耐
水対策のクッションゴムを貼り付ける必要もなくなり、
作業性も改善される。更に、リード線についても、金属
端子部の温度対策が不要となり、より断面の小さいリー
ド線を使用することができ、組立工数や部品点数を削減
することが可能となり、コストダウンにつながる。
As described above, according to the present invention, it is not necessary to caulk the metal terminal for the main fuse to the lead wire, and it is not necessary to cover the metal terminal with the resin cover. In addition, by placing it on the top of the back plate of the main body of the high-frequency heating device, there is no need to attach cushion rubber for vibration and water resistance.
Workability is also improved. Further, for the lead wire, it is not necessary to take measures against the temperature of the metal terminal portion, a lead wire having a smaller cross section can be used, and the number of assembly steps and the number of parts can be reduced, leading to a cost reduction.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例の高周波加熱装置のノイズフィ
ルター部、及びメインヒューズ部周辺の外観斜視図
FIG. 1 is an external perspective view of the vicinity of a noise filter portion and a main fuse portion of a high-frequency heating device according to an embodiment of the present invention.

【図2】同ノイズフィルター基板の外観図FIG. 2 is an external view of the noise filter substrate.

【図3】同ノイズフィルターの回路図FIG. 3 is a circuit diagram of the noise filter.

【図4】従来の高周波加熱装置のノイズフィルター部、
及びメインヒューズ部周辺の外観図
FIG. 4 shows a noise filter section of a conventional high-frequency heating device;
And external view around the main fuse section

【図5】同ノイズフィルター基板の外観図FIG. 5 is an external view of the noise filter substrate.

【符号の説明】[Explanation of symbols]

1 ノイズフィルター基板 2 メインヒューズ 3 リード線 4 電源コード接続部 1 noise filter board 2 main fuse 3 lead wire 4 power cord connection

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】ノイズフィルター基板にメインヒューズを
搭載しメインヒューズを直接基板に半田付けして一体構
成としたノイズフィルター基板部を有する高周波加熱装
置。
1. A high-frequency heating device having a noise filter substrate unit having a noise filter substrate unit mounted integrally with a main fuse mounted on a noise filter substrate and soldered directly to the substrate.
JP32740897A 1997-11-28 1997-11-28 High frequency heater Pending JPH11159767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32740897A JPH11159767A (en) 1997-11-28 1997-11-28 High frequency heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32740897A JPH11159767A (en) 1997-11-28 1997-11-28 High frequency heater

Publications (1)

Publication Number Publication Date
JPH11159767A true JPH11159767A (en) 1999-06-15

Family

ID=18198830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32740897A Pending JPH11159767A (en) 1997-11-28 1997-11-28 High frequency heater

Country Status (1)

Country Link
JP (1) JPH11159767A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436267B1 (en) * 2002-05-13 2004-06-16 삼성전자주식회사 Microwave oven & manufacturing method the same
JP2009283272A (en) * 2008-05-22 2009-12-03 Panasonic Corp High frequency heating device
WO2011102127A1 (en) 2010-02-16 2011-08-25 パナソニック株式会社 High-frequency heating device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436267B1 (en) * 2002-05-13 2004-06-16 삼성전자주식회사 Microwave oven & manufacturing method the same
JP2009283272A (en) * 2008-05-22 2009-12-03 Panasonic Corp High frequency heating device
WO2011102127A1 (en) 2010-02-16 2011-08-25 パナソニック株式会社 High-frequency heating device

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