JP2009283272A - High frequency heating device - Google Patents

High frequency heating device Download PDF

Info

Publication number
JP2009283272A
JP2009283272A JP2008133852A JP2008133852A JP2009283272A JP 2009283272 A JP2009283272 A JP 2009283272A JP 2008133852 A JP2008133852 A JP 2008133852A JP 2008133852 A JP2008133852 A JP 2008133852A JP 2009283272 A JP2009283272 A JP 2009283272A
Authority
JP
Japan
Prior art keywords
fuse
current fuse
lead
service
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008133852A
Other languages
Japanese (ja)
Other versions
JP5343397B2 (en
Inventor
Hisashi Morikawa
久 森川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2008133852A priority Critical patent/JP5343397B2/en
Publication of JP2009283272A publication Critical patent/JP2009283272A/en
Application granted granted Critical
Publication of JP5343397B2 publication Critical patent/JP5343397B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electric Ovens (AREA)
  • Fuses (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem of a costly replacing service of the whole printed board when replacing a current fuse in use of a current fuse with lead, and a problem of restriction in performance and cost increasing involved in cooling of the fuse due to limitation on temperature rising at a contact part of a fuse holder with the fuse pursuant to Electrical Appliance and Material Safety Law in use of a cartridge current fuse. <P>SOLUTION: The temperature limitation pursuant to Electric Appliance and Material Safety Law is eliminated and the restriction in performance and cost increasing involved in cooling of the fuse are also eliminated by mounting the current fuse with lead on the printed board and providing electrically connected connection terminals on both ends of the current fuse with lead. Replacement of only the fuse is made possible when replacing the current fuse in the service by attaching fuses for service use to the connection terminals electrically connected to both ends of the current fuse with lead, replacement of the whole printed board becomes unnecessary and hence the cost involved in service is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、高周波加熱装置の電流ヒューズ部の構成に関するものである。   The present invention relates to a configuration of a current fuse portion of a high-frequency heating device.

従来の高周波加熱装置の一例を図４に示す（例えば、特許文献１参照）。図４は、特許文献１に記載された従来の高周波加熱装置のノイズフィルター基板の正面図である。図４に示すように、プリント基板１にリード付き電流ヒューズ２がハンダ付けされている。   An example of a conventional high-frequency heating device is shown in FIG. 4 (see, for example, Patent Document 1). FIG. 4 is a front view of a noise filter substrate of a conventional high-frequency heating device described in Patent Document 1. As shown in FIG. 4, a current fuse 2 with leads is soldered to the printed circuit board 1.

もう一例を図５に示す（例えば、特許文献２参照）。図５は、特許文献２に記載された従来の高周波加熱装置のノイズフィルター基板の外観図である。図５に示すように、プリント基板１にヒューズホルダ６がハンダ付けされており、ヒューズホルダ６には管形電流ヒューズ７がはめ込まれている。
特開平１１−１５９７６７号公報 特開平６−２９０８４号公報 Another example is shown in FIG. 5 (see, for example, Patent Document 2). FIG. 5 is an external view of a noise filter substrate of a conventional high-frequency heating device described in Patent Document 2. As shown in FIG. 5, a fuse holder 6 is soldered to the printed circuit board 1, and a tubular current fuse 7 is fitted in the fuse holder 6.
Japanese Patent Laid-Open No. 11-159767 JP-A-6-29084

上記従来の高周波加熱装置は、電流ヒューズにリード付き電流ヒューズを使用した場合、プリント基板にハンダ付けされているので、市場でヒューズが溶断し交換サービスする時に、最近はハンダ付けの信頼性などの観点からリード付き電流ヒューズのみを交換する事はほとんどなく、プリント基板ごとの交換が通例であり、サービス費用が高くなるという課題を有していた。   The above conventional high-frequency heating device is soldered to a printed circuit board when a current fuse with a lead is used as a current fuse, so when a fuse is blown and replaced in the market, the reliability of soldering has recently been increased. From the point of view, only the leaded current fuse is rarely replaced, and replacement of each printed circuit board is common, and there is a problem that service costs are increased.

なお、上記従来例はノイズフィルター基板にリード付きヒューズがハンダ付けされているが、高周波加熱装置の制御基板にリード付きヒューズがハンダ付けされている場合も多々あり、その場合は、制御基板の方がノイズフィルター基板より高価なので、サービス費用がさらに高くなるという課題を有していた。   In the above conventional example, the fuse with lead is soldered to the noise filter substrate, but there are many cases where the fuse with lead is soldered to the control substrate of the high-frequency heating device. However, since it is more expensive than the noise filter substrate, there is a problem that the service cost is further increased.

一方、電流ヒューズに管形電流ヒューズを使用した場合は、ヒューズホルダが必要だが、電気用品安全法によって、ヒューズホルダとヒューズの接触部の温度上昇には温度限度が設けられているので、ヒューズを冷却するために、冷却ファンによる冷却をしたり、冷却するための部品を追加するなど、性能面での制約やコスト高になるという課題を有していた。   On the other hand, when a tubular current fuse is used as the current fuse, a fuse holder is required. However, due to the Electrical Appliance and Material Safety Law, there is a temperature limit for the temperature rise at the contact point between the fuse holder and the fuse. In order to cool, there are problems such as cooling by a cooling fan or adding parts for cooling, resulting in restrictions on performance and high costs.

本発明は、リード付きヒューズを使用することにより、電気用品安全法による温度限度はないので、ヒューズを冷却するための性能面での制約やコスト高になる事がなく、かつ市場でヒューズが溶断し、交換サービスする時でもプリント基板ごとの交換が不要で、ヒューズのみを交換する事が出来るので、サービス費用も安価ですむ高周波加熱装置を提供することを目的とする。   Since the present invention uses a leaded fuse, there is no temperature limit according to the Electrical Appliance and Material Safety Law, so there is no performance limitation or cost increase for cooling the fuse, and the fuse is blown in the market. However, it is an object of the present invention to provide a high-frequency heating apparatus that does not require replacement for each printed circuit board even when performing replacement service, and can replace only the fuse, so that the service cost is low.

上記従来の課題を解決するために、本発明の高周波加熱装置は、プリント基板上にリード付き電流ヒューズを設けると共に、前記リード付き電流ヒューズの両端に電気的に接続された接続端子を各々設ける事により、電気用品安全法による温度限度はないので、ヒューズを冷却するための性能面での制約やコスト高になる事がない。   In order to solve the above-described conventional problems, the high-frequency heating device of the present invention is provided with a current fuse with leads on a printed circuit board, and with connection terminals electrically connected to both ends of the current fuse with leads. Therefore, there is no temperature limit according to the Electrical Appliance and Material Safety Law, so there is no restriction on performance and cost for cooling the fuse.

また、市場でヒューズが溶断し、交換サービスする時はリード付き電流ヒューズの両端
に電気的に接続された接続端子にサービス専用ヒューズを取り付ける事により、ヒューズのみの交換が可能となり、プリント基板ごとの交換は不要になるので、サービス費用も安価ですむものである。 In addition, when a fuse blows in the market and is serviced for replacement, it is possible to replace only the fuse by attaching a dedicated service fuse to the connection terminals that are electrically connected to both ends of the leaded current fuse. Since no replacement is required, service costs are low.

本発明の高周波加熱装置によれば、電気用品安全法による温度限度はないので、ヒューズを冷却するための性能面での制約やコスト高になる事がない。   According to the high-frequency heating device of the present invention, since there is no temperature limit by the Electrical Appliance and Material Safety Law, there is no limitation in performance and cost for cooling the fuse.

また市場でヒューズが溶断し交換サービスする時は、リード付き電流ヒューズの両端に電気的に接続された端子部にサービス専用ヒューズを取り付ける事により、ヒューズのみの交換が可能となり、プリント基板ごとの交換は不要になるので、サービス費用も安価ですむ。   In addition, when a fuse is blown in the market for replacement service, it is possible to replace only the fuse by attaching a dedicated service fuse to the terminal part that is electrically connected to both ends of the current fuse with leads. Is no longer required, so service costs are low.

本発明は、プリント基板上にリード付き電流ヒューズを設けると共に、前記リード付き電流ヒューズの両端に電気的に接続された接続端子を各々設ける事により、電気用品安全法による温度限度はないので、ヒューズを冷却するための性能面での制約やコスト高になる事はない。   The present invention provides a current fuse with a lead on a printed circuit board and also provides connection terminals electrically connected to both ends of the current fuse with a lead so that there is no temperature limit according to the Electrical Appliance and Material Safety Law. There is no restriction on performance and cost for cooling the battery.

また市場でヒューズが溶断し、交換サービスする時は、リード付き電流ヒューズの両端に電気的に接続された接続端子にサービス専用ヒューズを取り付ける事により、ヒューズのみの交換が可能となり、プリント基板ごとの交換は不要になるので、サービス費用も安価ですむものである。   In addition, when fuses are blown in the market and replacement service is performed, it is possible to replace only the fuse by attaching a dedicated service fuse to the connection terminals that are electrically connected to both ends of the current fuse with leads. Since no replacement is required, the service cost is low.

以下、本発明の実施の形態について、図面を参照しながら説明する。なお、この実施の形態によって本発明が限定されるものではない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited by this embodiment.

（実施の形態）
図１は、本発明の実施の形態における高周波加熱装置のプリント基板の斜視図、図２は、本発明の実施の形態における高周波加熱装置のプリント基板の回路図、図３は本発明の実施の形態における高周波加熱装置のサービス専用ヒューズの正面図を示すものである。 (Embodiment)
FIG. 1 is a perspective view of a printed circuit board of a high-frequency heating device according to an embodiment of the present invention, FIG. 2 is a circuit diagram of the printed circuit board of the high-frequency heating device according to the embodiment of the present invention, and FIG. The front view of the service exclusive fuse of the high frequency heating apparatus in a form is shown.

図１、図２及び図３において、ノイズを防止するためのノイズフィルターのプリント基板１と、プリント基板１にハンダ付けされ、定格電流以上の電流が流れた時溶断し、安全を保つためのリード付き電流ヒューズ２と、リード付き電流ヒューズ２の両端と電気的に接続された接続端子３と、サービス専用リード付き電流ヒューズ４と、サービス専用リード付き電流ヒューズ４の両端にカシメなどで固定されており、プリント基板１上の接続端子３と電気的かつ機械的に接続可能な接続端子５から構成されている。   1, 2, and 3, a noise filter printed circuit board 1 for preventing noise, and a lead that is soldered to the printed circuit board 1 and melts when a current exceeding the rated current flows to maintain safety. The current fuse 2 with lead, the connection terminal 3 electrically connected to both ends of the current fuse 2 with lead, the current fuse 4 with service dedicated lead, and the current fuse 4 with service dedicated lead 4 are fixed to both ends by caulking or the like. The connecting terminal 3 on the printed circuit board 1 is connected to the connecting terminal 5 that can be electrically and mechanically connected.

以上のように構成された高周波加熱装置について、以下説明する。   The high-frequency heating device configured as described above will be described below.

高周波加熱装置に内蔵されているノイズフィルターのプリント基板１には、リード付き電流ヒューズ２がハンダ付けされているので、電気用品安全法による温度限度はない。市場でリード付き電流ヒューズ２が溶断し、ヒューズを交換サービスする場合は、プリント基板１上の二箇所の接続端子３に、サービス専用リード付き電流ヒューズ４の両端の接続端子５を接続すれば、ヒューズ交換が完了する。   The printed circuit board 1 of the noise filter built in the high-frequency heating device is soldered with a current fuse 2 with leads, so there is no temperature limit according to the Electrical Appliance and Material Safety Law. If the lead current fuse 2 is melted in the market and the fuse is exchanged, the connection terminals 5 on both ends of the service dedicated lead current fuse 4 are connected to the two connection terminals 3 on the printed circuit board 1. Fuse replacement is complete.

なお、前記構成では、リード付き電流ヒューズ２と接続端子３をノイズフィルターのプリント基板１に設けているが、高周波加熱装置の制御用のプリント基板などに設けても同様な効果を得ることが出来る。   In the above configuration, the lead current fuse 2 and the connection terminal 3 are provided on the printed circuit board 1 of the noise filter. However, the same effect can be obtained by providing the current fuse 2 on the printed circuit board 1 for controlling the high frequency heating device. .

以上のように、本発明にかかる高周波加熱装置は、高周波加熱装置に限らず、電流ヒューズが必要な他の機器にも使用でき、幅広く応用が可能である。   As described above, the high-frequency heating device according to the present invention can be used not only for a high-frequency heating device but also for other devices that require a current fuse, and can be widely applied.

本発明の実施の形態における高周波加熱装置のプリント基板の正面図The front view of the printed circuit board of the high frequency heating apparatus in embodiment of this invention 本発明の実施の形態における高周波加熱装置のプリント基板の回路図The circuit diagram of the printed circuit board of the high frequency heating device in an embodiment of the present invention 本発明の実施の形態における高周波加熱装置のサービス専用ヒューズの正面図The front view of the service-only fuse of the high-frequency heating device in the embodiment of the present invention 従来の高周波加熱装置の一形態であるプリント基板の正面図Front view of printed circuit board which is one form of conventional high-frequency heating device 従来の高周波加熱装置の別形態であるプリント基板の外観図External view of printed circuit board, which is another form of conventional high-frequency heating device

符号の説明Explanation of symbols

１ プリント基板
２ リード付き電流ヒューズ
３ 接続端子
４ サービス専用のリード付き電流ヒューズ
５ 接続端子 1 Printed Circuit Board 2 Current Fuse with Lead 3 Connection Terminal 4 Current Fuse with Lead for Service 5 Connection Terminal

Claims (1)

リント基板上にリード付き電流ヒューズを設けると共に、前記リード付き電流ヒューズの両端に電気的に接続された接続端子を各々設けた事を特徴とした高周波加熱装置。 A high-frequency heating apparatus, wherein a lead current fuse is provided on a lint substrate, and connection terminals electrically connected to both ends of the lead current fuse are provided.
JP2008133852A 2008-05-22 2008-05-22 Current fuse part of high-frequency heating device Active JP5343397B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008133852A JP5343397B2 (en) 2008-05-22 2008-05-22 Current fuse part of high-frequency heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008133852A JP5343397B2 (en) 2008-05-22 2008-05-22 Current fuse part of high-frequency heating device

Publications (2)

Publication Number Publication Date
JP2009283272A true JP2009283272A (en) 2009-12-03
JP5343397B2 JP5343397B2 (en) 2013-11-13

Family

ID=41453526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008133852A Active JP5343397B2 (en) 2008-05-22 2008-05-22 Current fuse part of high-frequency heating device

Country Status (1)

Country Link
JP (1) JP5343397B2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289753U (en) * 1980-10-30 1990-07-17
JPH0629084A (en) * 1992-07-09 1994-02-04 Matsushita Electric Ind Co Ltd High frequency heating device
JPH10261850A (en) * 1997-03-19 1998-09-29 Oki Inf Syst Printed circuit board and formation of printed circuit board with fuse
JPH11159767A (en) * 1997-11-28 1999-06-15 Matsushita Electric Ind Co Ltd High frequency heater
JP2003217436A (en) * 2002-01-18 2003-07-31 Yazaki Corp Safety device for current circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289753U (en) * 1980-10-30 1990-07-17
JPH0629084A (en) * 1992-07-09 1994-02-04 Matsushita Electric Ind Co Ltd High frequency heating device
JPH10261850A (en) * 1997-03-19 1998-09-29 Oki Inf Syst Printed circuit board and formation of printed circuit board with fuse
JPH11159767A (en) * 1997-11-28 1999-06-15 Matsushita Electric Ind Co Ltd High frequency heater
JP2003217436A (en) * 2002-01-18 2003-07-31 Yazaki Corp Safety device for current circuit

Also Published As

Publication number Publication date
JP5343397B2 (en) 2013-11-13

Similar Documents

Publication Publication Date Title
JP2007123644A (en) Power semiconductor device
JP6036408B2 (en) Electronic component and electronic control device
JP2014165165A (en) Electronic component and electronic control device
KR102481793B1 (en) Thermal Fuse and Printed Circuit Board with Thermal Fuse
JP2015185702A (en) Resin sealed semiconductor device
JP2009052898A (en) Current detection substrate
KR20160054655A (en) Surface mounted thermal fuse for electronic device
CN107995785B (en) Printed circuit board assembly
JP4389573B2 (en) Power supply
JP5343397B2 (en) Current fuse part of high-frequency heating device
JP2000003662A (en) Electric circuit board
JP2017174654A (en) Protection element
JP5590966B2 (en) Fuse device and circuit board
JP2007109994A (en) Device having built-in circuit board and method of mounting circuit board
JP2011065916A (en) High-frequency heating apparatus
KR100453299B1 (en) Blower resistor
JP5495895B2 (en) Fuse device
JP2011023556A (en) Battery unit
JP2007299874A (en) Thermally conductive substrate, and electrically conductive substrate
JP2006286465A (en) Switching unit
JP2017054868A (en) Varistor
JP2009099509A (en) Resistor with built-in temperature fuse
KR20170132581A (en) Thermal fuse and printed circuit board thereof
JP3158495U (en) Constant temperature power failure resistance device and circuit board using constant temperature power failure resistance device
JP2006310557A (en) Switching unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110218

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20110314

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120731

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120926

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20121213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130402

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130716

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130729

R151 Written notification of patent or utility model registration

Ref document number: 5343397

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151