JP2001267022A - Electronic controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make mounting process of electronic components on a circuit board more effective while preventing a device from getting larger as well as restraining heat conduction to controlling treatment elements. SOLUTION: A drive circuit board 20 and a control circuit board 10 are electrically connected with a flexible board 4, which has a connector 2 inserted and mounted as well as a chip component 13 mounted as an electronic component for noise absorption. Therefore, no further measures against noise is necessary for each of circuit boards 10, 20, enabling designing, based on original functions of circuit boards irrespective of loading or usage conditions of the electronic control device 1, hence, standardization of the circuit boards 10, 20 is possible. As a result, mounting process can also be simplified, and manufacturing cost can be controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic control device for driving and controlling an external control object.

[0002]

2. Description of the Related Art Conventionally, an external control object (for example, various actuators such as an electromagnetic solenoid) is supplied with electric power to be driven, and an electronic control device (for example, an engine control or a speed changer) for controlling the operation is provided. An in-vehicle electronic control device that performs control is known.

[0003] This type of electronic control device is, for example, shown in FIG.
As shown in (a), a substrate 6 on which a control processing element 3 such as a microcomputer and a driving element 5 such as a power transistor or a power IC are mounted is housed in a case, and the substrate 6 is connected to an external device (external device). It is configured by providing a connector for electrical connection. The connector has a plurality of connector pins penetrating through holes formed in the board 6, and the connector pins relay electric signals between the board 6 (that is, inside the electronic control device) and outside the electronic control device. Is done.

In these electronic control devices, in recent years,
With the advancement of control and multifunctionality, the influence of heat generated inside the device cannot be ignored. That is, inside the apparatus, the control processing element 3 generates a control signal by performing arithmetic processing or the like based on an externally input signal, drives the driving element 5 with the control signal, and controls the external control target. Control power supply. However, since the number of driving elements 5 and the power handled by the driving elements 5 are increasing with the advancement of control and multifunctionality, the heat flow generated by the driving elements 5 and flowing into the control processing element 3 is increased. I have. Therefore, the temperature of the control processing element 3 becomes high, and the operation thereof may become unstable.

In this case, it is conceivable that the substrate 6 on which the control processing element 3 and the driving element 5 are mounted is widened, and the thermal influence on the control processing element 3 is suppressed by separating the two elements 3 and 5. However, if the area of the substrate 6 is to be increased, the production yield of the substrate 6 may be reduced, or the number of design steps may be increased due to the complexity of the wiring pattern, which may increase the production cost of the electronic control device. .

[0006]

Therefore, the present inventors have
In order to suppress the influence of heat on the control processing element 3 while suppressing an increase in manufacturing cost, an electronic control device having a structure as shown in FIG. That is, as shown in FIG. 7B, the control processing element 3 and the driving element 5 are mounted on separate substrates 10 and 20, respectively, and these two substrates 10 and 20 are opposed to each other via a space. To place. In this way, the size of the substrate is suppressed and the manufacturing cost is suppressed,
Heat transfer from the driving element 5 to the control processing element 3 can be suppressed.

The inventors intend to adopt the following configuration in order to further reduce the manufacturing cost. That is, the substrate 10 on which the control processing element 3 is mounted (hereinafter, referred to as “control circuit board”) and the substrate 20 on which the drive element 5 is mounted (hereinafter, referred to as “drive circuit board”) are connected to each other by the flexible printed wiring board 4. Connecting. The connector 2 for relaying signals between the outside and the inside of the device is a portion of the flexible printed wiring board 4 between the joint on the control circuit board 10 side and the joint on the drive circuit board 20 side. Is mounted on the flexible printed wiring board 4 by inserting the connector pin 2a into the connector (insert mounting)
You do it.

In the conventional electronic control device (see FIG. 7 (a)), since the connector is directly mounted on the board 6, the layout (dimensions, wiring patterns, etc.) of the board 6 is changed for each type of connector. Must be implemented, which has been an obstacle to cost reduction. In contrast, FIG.
In the electronic control device shown in FIG. 2B, the connector 2 is connected to both the boards 10 and 20 via the flexible printed wiring board 4, so that the control circuit board 10 and the drive circuit board 20 are connected.
Is not affected by the type of the connector 2. This is because, by changing the shape and the wiring pattern of the flexible printed wiring board 4, it is possible to cope with the difference between the various connectors 2.

That is, according to the electronic control device considered by the inventors, the control circuit board 10 and the drive circuit board 20 can be standardized, so that the design period can be shortened and the mounting process can be reduced. Can be simplified, and reduction in the manufacturing cost of the electronic control device can be promoted.

Meanwhile, in the electronic control device, noise is absorbed or absorbed through the connector 2 (connector pin 2a) so that noise does not enter from the outside or noise generated inside the device leaks to the outside. It is necessary to provide an electronic component 13 (herein, referred to as a “noise absorbing electronic component”) for reduction. When the boards are divided as shown in FIG. 7 (b), it is necessary to provide electronic components for noise absorption on each board, and such noise countermeasures differ depending on the use environment of the electronic control device. Standardization of the substrates 10 and 20 is limited, and the simplification and cost reduction of the mounting process on the circuit boards 10 and 20 and, consequently, reduction of the manufacturing cost are limited.

Further, in order to suppress the enlargement of the substrate and increase the degree of integration of the circuit, it is preferable to mount the electronic components on both sides of the substrate. However, the electronic components are mounted with the lead wires 14a inserted into the through holes. Type electronic component 14 (so-called lead component. In this specification, this is also referred to as “insertion mounting electronic component”).
In this case, the lead wire penetrates the circuit board, and the mounting area of the other electronic component on the opposite surface is narrowed. Therefore, it is not advantageous in comparison with the surface mount component (SMD). In the case where surface-mounted components and electronic components for insertion and mounting are mixed on one circuit board, mounting of these electronic components requires both a reflow soldering process and a flow soldering process. In that case, there is a possibility that the mounting process may become an obstacle in simplifying and reducing the cost.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem. In an electronic control device, heat conduction to a control processing element is suppressed while suppressing increase in size of the device, and electronic components are transferred to a circuit board. An object of the present invention is to make the mounting process more efficient.

[0013]

In order to achieve the above object, in the electronic control device according to the first aspect of the present invention, the drive element and the control processing element are mounted on separate boards, and the drive circuit board is mounted. The control circuit board is disposed so as to face the space therebetween. Therefore, heat conduction from the driving element to the control processing element can be suppressed while maintaining a small device configuration.

A connecting member for electrically connecting the drive circuit board and the connector and the control circuit board and the connector to each other are constituted by a mounting portion and a wire portion. In this mounting part, a connector is inserted and an electronic component is mounted, and an electrical connection between the mounting part and the drive circuit board and an electrical connection between the mounting part and the control circuit board are provided by a flexible wire part. It is decided to plan.

Since the wire portion is flexible, even if vibration is applied due to an influence from the outside of the electronic control unit, the vibration can be absorbed. Therefore, the electrical connection between the control circuit board, the drive circuit board, and the connector is made. Can be kept. In particular, in the electronic control device according to the first aspect, since the electronic components are mounted on the connection members, the efficiency of the mounting process on both circuit boards can be improved, and the manufacturing cost can be reduced. Can be.

For example, when the electronic component for noise absorption is provided in the mounting portion as described in claim 2, it is not necessary to take noise countermeasures on both circuit boards, irrespective of the mounting environment and use environment of the electronic control device. Since the circuit board can be designed based on the original function of the circuit board, the circuit board can be standardized. Then, it is not necessary to change the mounting process on the circuit board one by one according to the layout change of the circuit board. As a result, the efficiency of the mounting process can be increased, and the production cost can be reduced.

In addition, when the electronic component for insertion mounting is provided in the mounting portion as in claim 3, the flow soldering step can be omitted in the mounting step on the circuit board.
The efficiency of the mounting process can be increased. Since the connector is inserted and mounted in the mounting portion of the connection member, even if an electronic component for insertion and mounting is further provided, it is not a large burden.

It is preferable that the invention of claim 2 and the invention of claim 3 are combined to mount an electronic component for noise absorption and an electronic component for insertion mounting as electronic components. Further, other electronic components may be further provided in the mounting section. That is, in the electronic control device according to the first aspect, as the electronic components to be mounted on the mounting portion of the connection member, not only the electronic components for noise absorption and the electronic components for insertion mounting but also various electronic components can be considered. For example, if not only the electronic components for insertion mounting but also large electronic components that are difficult to automatically mount on the circuit board are provided in the mounting portion, the mounting rate of the electronic components on the circuit board can be improved, so that the mounting process can be improved. Simplification and cost reduction are possible. Not only electronic components for noise absorption, but also electronic components that are selectively used according to the control target and the use environment, etc., can be provided in the mounting portion of the connection member to standardize the circuit board. You can proceed.

Next, the wire portion may be constituted by a cable constituted individually one by one, but in this case, the connection from the mounting portion to the drive circuit board and the control circuit board is performed.
It is necessary to perform one by one, which is troublesome, and the production cost may increase due to an increase in the number of parts.

Therefore, it is preferable that the wire portion is constituted by a flexible printed wiring board, so that the electronic control device can be further downsized.
The number of parts can be reduced. Further, connectors and electronic components can be mounted on the flexible printed wiring board. Therefore, as described in claim 5, not only the wire part but also the mounting part is constituted by a flexible printed wiring board,
Preferably, the wire section and the mounting section are integrally formed. According to this structure, the same effect as that of the fourth aspect can be obtained, and the connection work between the mounting portion and the wire portion can be omitted, and the manufacturing process can be simplified. In addition, there is an effect that an increase in the number of parts can be suppressed.

However, since the flexible printed wiring board has a relatively high elasticity, when electronic components are provided on the flexible printed wiring board as in the electronic control device according to the fifth aspect, vibration transmitted from outside the electronic control device is provided. Therefore, the electronic component (especially, the electronic component for insertion mounting) may swing. As a result, the possibility that the electrical connection between the mounting part and the electronic component becomes defective cannot be denied.

Therefore, it is preferable that the wire portion is formed of a flexible printed wiring board and the mounting portion is formed of a printed wiring board harder than the flexible printed wiring board. According to the electronic control device configured as described above, the same effect as that of the fourth aspect can be obtained, and the possibility that the electrical connection between the electronic component and the mounting portion is impaired by external vibration is reduced. be able to.

Further, in order to protect the electrical connection between the mounting portion and the electronic component from vibration, a holding portion for holding the electronic component may be provided in the connector. That is, if the vibration of the electronic component is suppressed by holding the electronic component mounted on the mounting portion, the electrical connection with the mounting portion can be kept good.

Since the connector is connected to the mounting portion via a plurality of connector pins inserted into the through holes of the mounting portion, electronic components cannot be arranged at positions where the connector pins pass. The location of the electronic component on the mounting portion may be any position where the connector pin does not pass. For example, if the space where the electronic component can be arranged is between the connector pins, the electronic component is utilized by using the space. May be provided in the mounting part. By doing so, the space can be effectively used, which contributes to downsizing of the device.

Further, the electronic component may be arranged outside the connection area of the connector pin in the mounting portion, so that the connector or the electronic component can be mounted on the mounting portion. Implementation is easy. That is, if an electronic component is arranged between the connector pins, it becomes difficult to mount the electronic component after mounting the connector, so that there is a restriction that the electronic component must be mounted first. On the other hand, according to the configuration of claim 8,
Either the connector or the electronic component is preferably mounted first, since no difficulty is caused and the degree of freedom of the mounting process is increased.

[0026]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a configuration of an electronic control unit 1 according to a first embodiment. Among these, FIG. 1 (b)
FIG. 1A is a diagram showing an internal configuration of the electronic control device 1 from the connector 2 side in FIG. FIG. 2 is a diagram showing an assembling procedure of the electronic control device 1 of the first embodiment.

As shown in FIG. 1, this electronic control unit 1
The engine 100 of the automobile (that is, the “controlled object” in the claims)
Is equivalent to ) Is used to control the engine by driving and controlling various actuators (ignition plugs, electromagnetic solenoids, etc.) provided in the connector 2, the control processing element 3, the drive element 5, and the case (housing). Body 7). The case 7 includes a case lid 7a and a case bottom 7b.

The connector 2 is for the electronic control unit 1 to transmit and receive an electric signal (including an energizing current) to and from the engine 100 via the cable 102. The control processing element 3 according to the present embodiment is a microcomputer configured as a so-called one-chip microcomputer. The control processing element 3 receives input signals from various sensors for detecting the operating state of the engine via the connector 2 and receives the input signals. Or a control signal corresponding to the result of the control process is output to the drive element 5. Also,
The control processing element 3 also communicates with various electronic devices (not shown) mounted on the vehicle via the connector 2.

The control processing element 3 is accommodated in a case 7 constituting the outer shape of the electronic control unit 1, and is mounted on the control circuit board 10 inside the case 7. The control circuit board 10 is a board made of resin (in this embodiment, a glass epoxy board made of glass cloth as a base material and impregnated with epoxy resin), and has a control circuit for controlling an external actuator. This is a substrate to be formed. A plurality of electronic components (for example, lead components 14) are mounted on the control circuit board 10 in addition to the control processing element 3 and constitute a control circuit together with the control processing element 3.

The control circuit board 10 is driven such that one of the board surfaces (the upper surface of the control circuit board 10 in FIG. 1A) faces the board surface of the drive circuit board 20 (described later). 20 are arranged in parallel. The control processing element 3 is provided on a surface of the control circuit board 10 facing the drive circuit board 20. Although not shown, a large number of electronic components are also mounted on the back side of the control circuit board 10 on which the control processing elements 3 are mounted, and constitute a control circuit together with the control processing elements 3 and the like.

On the other hand, the drive element 5 is for supplying electricity to the actuator of the engine 100 and driving it. That is, the driving element 5 is a so-called switching element, and is provided on an energizing path from an on-vehicle battery (not shown) external to the electronic control unit 1 to the actuator, and this energizing path is based on a control signal from the control processing element 3. It is configured to be intermittent.

The drive element 5 is also provided inside the case 7 like the control processing element 3, but is mounted on a board (drive circuit board 20) different from the control circuit board 10 on which the control processing element 3 is mounted. Have been. The drive circuit board 20 on which the drive elements 5 are mounted is a ceramic substrate having excellent heat radiation properties, and is a board for forming a drive circuit that constitutes a part of an energization path for energizing the actuator. .

One (upper surface in FIG. 1A) of the substrate surface of the drive circuit substrate 20 is provided in close contact with the inner wall surface of the case 7 as described later, and the other (FIG. 1 (a)). ), The lower surface is opposed to the control circuit board 10. Various electronic components including the drive element 5 are mounted on the surface facing the control circuit board 10 to form a drive circuit.

The control circuit board 10 on which the control circuit composed of the control processing element 3 is formed and the drive circuit board 20 on which the drive circuit composed of the drive element 5 is formed are connected to the flexible printed wiring board 4 (hereinafter simply referred to as “flexible”). Are electrically connected to each other via a board 4 "). The flexible board 4 is excellent in flexibility and elasticity, is joined to the ends of the control circuit board 10 and the drive circuit board 20 by soldering, and is electrically connected to the wiring patterns of the boards 10 and 20. ing.

The flexible substrate 4 is bent so as to have an appropriate bending between the joint portions with the circuit boards 10 and 20, and a gap is formed between the flexible substrate 4 and the inner wall surface of the case 7. It is arranged so that. Therefore, even if vibration is applied to the flexible substrate 4, the case 7
And the flexible substrate 4 are not rubbed with each other, and the electrical connection between the two substrates 10 and 20 can be reliably established.

The connector 2 is inserted and mounted on the flexible board 4 between the joints with the circuit boards 10 and 20. That is, the connector 2 has connector pins 2a for insertion and mounting on a predetermined circuit board, and the connector pins 2a are soldered to the wiring pattern in a state of being inserted into the through holes of the flexible board 4. Are mounted on the flexible substrate 4.

The flexible board 4 has a connector 2
In addition, a plurality of chip components 13 are mounted. These chip components 13 are for reducing noise passing through the flexible substrate 4, and correspond to “electronic components for noise absorption” in the claims. And the chip component 13
It is arranged outside the connection area A (shown by a two-dot chain line in the figure) of the connector pin 2a on the flexible board 4.

In this embodiment, the "mounting unit" in the claims
The “wire portion” is formed integrally with the flexible substrate 4. A portion of the flexible board 4 on which the connector 2 and the chip component 13 are mounted is referred to as a “mounting unit” in the claims.
The portion that electrically connects the portion corresponding to the “mounting portion” to the control circuit board 10 or the drive circuit board 20 corresponds to the “wire portion” in the claims.

The control circuit boards 1 thus connected to each other
0 and the case 7 housing the drive circuit board 20 and the like,
It is formed by casting a metal (aluminum in this embodiment), and includes a case lid 7a and a case bottom 7b. The case cover 7a is connected to the control circuit board 1
0 is a portion that covers the surface of the substrate surface facing the drive circuit substrate 20 among the 0 substrate surfaces. The upper wall portion 7c is a portion functioning as a heat radiating plate, and a drive circuit board 20 is provided in close contact with the inner wall surface 7d (the lower surface in FIG. 1A) of the upper wall portion 7c. A side wall substantially perpendicular to the upper wall 7c is formed around the upper wall 7c of the case lid 7a. A connector housing opening 7e for housing the connector 2 in the case 7 (in other words, for exposing the housed connector 2 to the outside of the case 7) is formed in a part of the side wall. A flange 2b having a fixing hole 2c is formed in the connector 2, while a screw hole 7f is formed in an edge of the connector housing 7e. This screw hole 7f
And the flange 2b is fastened to the edge of the connector accommodating opening 7e by a screw 9 which passes through the fixing hole 2c of the flange 2b, thereby connecting the connector 2 to the case 7 (more specifically, the case lid 7a). Fixed.

The control circuit board 10 and the drive circuit board 20 are arranged on the connector 2 with an interval corresponding to the size. By providing a space between the circuit boards 10 and 20 in this manner, heat conduction from the driving element 5 to the control processing element 3 is suppressed.

The case bottom 7b is for covering a surface of the control circuit board 10 that is not opposed to the drive circuit board 20, and is located on the opposite side of the control circuit board 10 from the case lid 7a. Be placed. And the case bottom 7b
Is fixed to the case lid 7a by screws 8 with a part of the edge of the control circuit board 10 sandwiched between the control circuit board 10 and the case lid 7a.

Next, an example of an assembling procedure of the electronic control unit 1 will be described with reference to FIG. First, various electronic components including the control processing element 3 are mounted on the control circuit board 10 to form a control circuit. The drive circuit board 20 includes
Electronic components including the driving element 5 are mounted to form a driving circuit. Then, on the back side of the board surface on which the drive circuit is formed, the drive circuit board 20 is placed on the case lid 7 as a heat sink.
a (FIG. 2A). In order to bring the drive circuit board 20 into close contact with the inner wall surface 7d, the two are adhered to each other via an adhesive having excellent thermal conductivity and kept at a high temperature (for example, about 150 ° C.) for a predetermined time (for example, about 30 minutes). By heat-curing the adhesive in this manner, the drive circuit board 20 and the inner wall surface 7d of the case 7 are adhered in close contact with each other, and the thermal resistance between them is reduced.

In a predetermined portion of the flexible substrate 4,
The chip component 13 is surface-mounted, and the connector 2 is inserted and mounted. Next, the control circuit board 10 and the drive circuit board 20
Are connected by a flexible substrate 4 so that both substrates 10 and 2
0 so that the surfaces to be opposed to each other (hereinafter referred to as “opposed surfaces”) face in substantially the same direction (upward in FIG. 2A).
These two boards 10, 20 (that is, the control circuit board 10 and the case lid 7a) are arranged.

Then, the flexible substrate 4 is provided from the facing surface side.
, The flexible substrate 4 is joined to the end of the drive circuit board 20, and the end of the control circuit board 10 is also
The flexible substrate 4 is joined. More specifically, solder is attached to the joint between the two circuit boards 10 and 20, and
The ends of the flexible substrate 4 are pressed almost simultaneously with the heated pressing jig to melt the solder, thereby joining the two substrates 10 and 20 and the flexible substrate 4.

After connecting the two substrates 10 and 20 with the flexible substrate 4 in this manner, as shown in FIG.
Is fixed to the case lid 7 a with the screw 9. Then, the drive circuit board 20 (or the control circuit board 10 or both the boards 10 and 20) is rotated around the vicinity of the flexible board 4 so that the two circuit boards 10 and 20 are opposed to each other. Thereafter, the control circuit board 10 is moved to the case lid 7a.
As shown in FIG. 1, the electronic control unit 1 is housed in the case 7 so as to be sandwiched between the electronic control unit 1 and the case bottom 7 b and is fixed by screws 8 penetrating through holes 10 a of the control circuit board 10. Is configured.

As described above, according to the electronic control unit 1 of the present embodiment, the following effects (1) to (6) can be obtained. (1) The drive element 5 and the control processing element 3 are mounted on separate boards (that is, the drive circuit board 20 and the control circuit board 10), and are controlled so as to face the drive circuit board 20 via a predetermined space. The circuit board 10 is arranged. for that reason,
The heat conduction from the driving element 5 to the control processing element 3 can be suppressed while maintaining the device configuration small.

(2) Between the drive circuit board 20 and the connector 2 and between the control circuit board 10 and the connector 2
The portions of the flexible substrate 4 corresponding to the “wire portion” are electrically connected to each other. Therefore, downsizing of the electronic control device 1 can be further promoted, and the number of parts can be reduced.

(3) The connector 2 is inserted and mounted in the portion corresponding to the “mounting portion”, and the chip component 13 as the “electronic component for noise absorption” is mounted. Therefore,
This makes it possible to simplify the mounting process on the circuit boards 10 and 20, and to reduce the manufacturing cost. Specifically, there is no need to take noise countermeasures on each of the circuit boards 10 and 20, and a board design based on the original function of the circuit board can be performed regardless of the mounting environment and use environment of the electronic control unit 1. Therefore, the circuit boards 10 and 2
0 can be standardized. As a result, the efficiency of the mounting process can be increased, and the production cost can be reduced.

(4) Since the flexible substrate 4 corresponding to the “wire portion” is flexible, even if vibration is applied due to an influence from the outside of the electronic control unit 1, the vibration is absorbed and the control circuit substrate is absorbed. 10, electrical connection between the drive circuit board 20 and the connector 2 can be maintained.

(5) Since the "mounting portion" and the "wire portion" are integrally formed by the flexible substrate 4, the manufacturing process can be simplified, and the increase in the number of parts can be suppressed. Also play. (6) Since the chip component 13 is arranged outside the connection area A of the connector pin 2a, the degree of freedom of the mounting process for the flexible substrate 4 as the "mounting portion" is further increased, and the efficiency is improved. Can be promoted.

Next, a second embodiment will be described. The electronic control device 1 of the second embodiment is almost the same as that of the first embodiment, except that the lead components 14 are mounted on the flexible substrate 4 instead of the control circuit substrate 10. That is, in the electronic control device 1 of the first embodiment, since the lead component 14 is provided on the control circuit board 10,
It is not possible to perform all mounting of the electronic components on the control circuit board 10 only by the reflow soldering process.

On the other hand, the electronic control unit 1 of the second embodiment
As shown in FIG. 3, only electronic components for surface mounting (including the control processing element 3) are provided on the control circuit board 10, and the lead
Is to be implemented. That is, the lead component 14 is mounted by being soldered to the wiring pattern of the flexible substrate 4 in a state where the lead wire 14a is inserted into the through hole of the flexible substrate 4. The lead component 14 is provided on the same side as the connector 2 with respect to the flexible board 14 as a “mounting unit”.

Incidentally, the constructions other than the above are the same as those of the first embodiment.
The description is omitted because it is similar to the embodiment. According to the electronic control device 1 of the present embodiment having the above configuration, the following effects (7) to (9) can be obtained in addition to the effects (1) to (6).

(7) "Process of mounting on control circuit board 10"
With regard to the above, the flow soldering step can be omitted, and the simplification can be achieved. On the other hand, in the “mounting step on the flexible substrate 4”, the man-hour is increased by the procedure of mounting the lead component 14. However, since the connector 2 is originally inserted and mounted on the flexible substrate 4, the lead component 14 is further provided. Even in this case, there is little change in the “mounting process for the flexible substrate 4”, and therefore, the efficiency of the entire mounting process is improved.

(8) The lead component 14 is configured to be inserted and mounted on the “mounting portion” from the same side as the connector 2. Therefore, the lead component 14 and the connector 2 can be soldered simultaneously by the flow soldering process, and the efficiency of the mounting process can be further improved.

(9) The lead component 14 is inserted and mounted on the "mounting portion" from the same side as the connector 2, and is disposed between the connector pins 2a, so that the space is effectively utilized. This contributes to downsizing of the device.
Next, a third embodiment will be described.

As described above, in the electronic control unit 1 according to the second embodiment, the lead component 14 is mounted on the flexible board 4. However, since the flexible substrate 4 is excellent in elasticity, the lead component 14 may be shaken by vibration transmitted from outside the electronic control device 1. The possibility that the electrical connection between the flexible substrate 4 and the lead component 14 becomes defective cannot be denied.

Therefore, in the electronic control unit 1 of the third embodiment, as shown in FIG. 4, a holding portion 2d for holding the lead component 14 is provided. The holding portion 2d of the present embodiment is provided between the connector pins 2a provided on the connector 2 corresponding to the arrangement position of the lead component 14. This holding part 2d
Is made of the same material (made of resin) as the connector 2 and is formed integrally with the connector 2. The holding portion 2d is formed in a cylindrical shape, and is formed inside the holding portion 2d so as to hold the lead component 14.

Incidentally, for the configuration and the like other than the above,
The description is omitted because it is similar to the embodiment. According to the electronic control device 1 of the present embodiment having the above configuration, the following effects are obtained in addition to the effects (1) to (9).

(10) Since the holding part 2d holds the lead component 14 mounted on the flexible substrate 4, the swing of the lead component 14 can be suppressed, and the electrical connection between the flexible substrate 4 and the lead component 14 is established. Can be kept good. Next, a fourth embodiment will be described.

The electronic control unit 1 of the fourth embodiment is similar to the first embodiment.
The third embodiment is different from the third embodiment in the configuration of the "connection member" for connecting the control circuit board 10 and the drive circuit board 20. That is, in the electronic control device 1 of the first to third embodiments, the “mounting part” and the “wire part” of the “connecting member”
Are formed integrally with the flexible substrate 4.

On the other hand, in the electronic control unit 1 of the fourth embodiment, as shown in FIG. 5, the "mounting portion" is formed by a hard printed wiring board 30 (for example, a glass epoxy board). The “wire portion” is formed by the flexible substrate 34 having higher flexibility than the wiring board 30.

In this embodiment, the printed wiring board 30 is formed in a rectangular shape, and the connector 2 is inserted and mounted, and the connector pins 2 of the connector 2 fixed to the case lid 7a are provided.
a. On the printed wiring board 30, in addition to the connector 2, a chip component 13 and a lead component 14 are mounted, and flexible substrates 34 are joined to both ends thereof. One of the flexible substrates 34 is joined to an end of the control circuit board 10, and the other is joined to an end of the drive circuit board 20. In this manner, the electrical connection between the printed wiring board 30 and the control circuit board 10 and the electrical connection between the printed wiring board 30 and the drive circuit board 20 are achieved by the flexible board 34.

The control circuit board 10 and the drive circuit board 20 are electrically connected to each other via a printed wiring board 30 and flexible boards 34 connected to both ends thereof. The configuration other than the above is the same as that of the first embodiment, and the description is omitted.

According to the electronic control unit 1 of the present embodiment having the above configuration, the above effects (1) to (4) and (6) to (9)
In addition, the following effects can be obtained. (11) Since the electronic components such as the chip component 13 and the lead component 14 are mounted on the printed wiring board 30 which is harder than the flexible substrate 34, the electrical connection of the electronic component to the “mounting portion” is caused by vibration. The possibility of being damaged by the influence can be reduced.

As described above, one embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and can take various aspects. For example, in the above-described second to fourth embodiments, the description has been made assuming that the lead component 14 is arranged between the connector pins 2a and inside the connection area A indicated by the two-dot chain line in FIG. 6, but the present invention is not limited to this. . For example, as shown in FIG. 6, the connection area A of the connector pin 2a
The lead component 15 may be arranged outside the device. By doing so, the degree of freedom in the mounting process for the flexible substrate 4 or the printed wiring board 30 as the “mounting portion” is further increased, and the effect that the efficiency can be promoted can be obtained. Of course, as shown in FIG. 6, it goes without saying that electronic components (chip components 13, lead components 14, 15, etc.) may be provided both inside and outside the region A.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an internal configuration of an electronic control device according to a first embodiment.

FIG. 2 is an explanatory diagram illustrating an assembly procedure of the electronic control device according to the first embodiment.

FIG. 3 is an explanatory diagram illustrating an internal configuration of an electronic control device according to a second embodiment.

FIG. 4 is an explanatory diagram illustrating an internal configuration of an electronic control device according to a third embodiment.

FIG. 5 is an explanatory diagram showing an internal configuration of an electronic control device according to a fourth embodiment.

FIG. 6 is an explanatory diagram showing a modification of the arrangement of electronic components.

FIG. 7 is an explanatory diagram illustrating a configuration of an electronic control device of a comparative example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic control device 2 ... Connector 2a ... Connector pin 2d ... Holding part 3 ... Control processing element 5 ... Drive element 4, 34 ... Flexible printed wiring board 7 ... Case 10 ... Control circuit board 13 ... Chip parts 14, 15 ... Lead Component 14a Lead wire 20 Drive circuit board 30 Printed wiring board A Connector connection area

Claims (8)

[Claims] 1. A connector for relaying transmission and reception of an electric signal to and from the outside, a drive circuit board on which a drive element for energizing an external control target via the connector is mounted, and a drive circuit board from the outside via the connector. A control processing element that performs arithmetic processing based on an input signal and controls the control target by driving the driving element is mounted, and a control circuit board arranged to face the driving circuit board via a space. An electronic control device comprising: a connection member for electrically connecting the drive circuit board to the connector; and a connection member for electrically connecting the control circuit board to the connector, wherein the connection member includes the connector And a mounting part on which electronic components are mounted, an electrical connection between the mounting part and the drive circuit board, and an electrical connection between the mounting part and the control circuit board. An electronic control device, comprising: a flexible wire portion. 2. The electronic control device according to claim 1, wherein a noise absorbing electronic component is mounted on the mounting section as the electronic component. 3. The electronic component according to claim 1, wherein an electronic component for insertion mounting is mounted on said mounting part as said electronic component.
Electronic control device according to the above. 4. The apparatus according to claim 1, wherein said wire portion is formed of a flexible printed wiring board.
The electronic control device according to any one of claims 1 to 4. 5. The electronic control device according to claim 1, wherein said wire portion and said mounting portion are integrally formed by a flexible printed wiring board. 6. The method according to claim 1, wherein the wire portion is formed of a flexible printed wiring board, and the mounting portion is formed of a printed wiring board harder than the flexible printed wiring board. The electronic control device according to claim 1. 7. The electronic control device according to claim 1, wherein the connector includes a holding unit that holds the electronic component. 8. The electronic component according to claim 8, wherein:
The electronic control device according to claim 1, wherein the electronic control device is arranged outside a connection region of a connector pin of the connector.