JPH11150298A - Gallium nitride semiconductor light-emitting element and light-receiving element - Google Patents
Gallium nitride semiconductor light-emitting element and light-receiving elementInfo
- Publication number
- JPH11150298A JPH11150298A JP33101297A JP33101297A JPH11150298A JP H11150298 A JPH11150298 A JP H11150298A JP 33101297 A JP33101297 A JP 33101297A JP 33101297 A JP33101297 A JP 33101297A JP H11150298 A JPH11150298 A JP H11150298A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- light
- side electrode
- electrode
- gallium nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ｎ型及びｐ型窒化
物半導体層を備えた窒化物半導体素子に関する。The present invention relates to a nitride semiconductor device having n-type and p-type nitride semiconductor layers.
【０００２】[0002]
【従来の技術】近年、窒化物化合物半導体を用いた発光
素子が、青色系の発光が可能な発光素子として注目され
ている。この窒化物化合物半導体を用いた従来の発光素
子は、例えば、図７に示すように、サファイヤ基板１１
上にｎ型窒化物半導体層１２を成長させ、そのｎ型窒化
物半導体層１２上に発光層１０を介してｐ型窒化物半導
体層１３を成長させた層構造を有する。この従来の窒化
物半導体発光素子において、図７，８に示すように、ｐ
型窒化物半導体層上には、ｐ型窒化物半導体層とオーミ
ック接触可能な金属膜からなるｐ側の正電極１１５が形
成され、ｎ側の負電極１１４は、所定の位置で、ｐ型窒
化窒化物半導体層と発光層をエッチングにより除去して
ｎ型窒化物半導体層の上面を露出させて、露出させた上
面上に形成されている。このように、従来例の窒化物半
導体発光素子では、同一面側に形成された正負の電極間
の短絡を防止するためと、素子の保護のために正負の電
極の取り出し部分（開口部１１８，１１９）を除いて絶
縁膜１１７が形成されている。尚、図７，８の窒化物半
導体発光素子においては、正電極１１５上の負電極１１
４から比較的離れた位置に取り出し電極１１６が形成さ
れている。以上のように構成された従来例の窒化物半導
体発光素子は、比較的高い強度の青色系の発光が可能で
ある。2. Description of the Related Art In recent years, a light emitting device using a nitride compound semiconductor has attracted attention as a light emitting device capable of emitting blue light. A conventional light emitting device using the nitride compound semiconductor is, for example, as shown in FIG.
It has a layer structure in which an n-type nitride semiconductor layer 12 is grown thereon, and a p-type nitride semiconductor layer 13 is grown on the n-type nitride semiconductor layer 12 via the light emitting layer 10. In this conventional nitride semiconductor light emitting device, as shown in FIGS.
On the p-type nitride semiconductor layer, a p-side positive electrode 115 made of a metal film capable of making ohmic contact with the p-type nitride semiconductor layer is formed. The nitride semiconductor layer and the light emitting layer are removed by etching to expose the upper surface of the n-type nitride semiconductor layer, and are formed on the exposed upper surface. As described above, in the conventional nitride semiconductor light emitting device, the portions where the positive and negative electrodes are taken out (opening portions 118 and 118) for preventing the short circuit between the positive and negative electrodes formed on the same surface side and for protecting the device. Except for 119), an insulating film 117 is formed. Incidentally, in the nitride semiconductor light emitting device of FIGS.
An extraction electrode 116 is formed at a position relatively distant from 4. The conventional nitride semiconductor light emitting device configured as described above can emit blue light with relatively high intensity.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
窒化物半導体発光素子では、基板１１を介して光りを出
力するいわゆるフェースダウン構造としたときに、半導
体層側から光りが漏れ、発光した光りを効率よく出力す
ることができないという問題点があった。また、半導体
層側から光りが漏れるために、出力される光りの強度が
面内で不均一になるという問題点があった。以上、窒化
物半導体発光素子の例について説明したが、発光層１０
に代えて受光層を形成することにより窒化物半導体を用
いた窒化物半導体受光素子を構成しようとする場合にお
いても同様の問題点を有していた。すなわち、受光素子
では、基板側から入力された光りが半導体層を介して漏
れるので、光電変換効率が劣化し、受光層の光電変換効
率が受光面内で均一にすることができず、これによって
も光電変換効率を劣化させていた。However, in the conventional nitride semiconductor light emitting device, when a so-called face-down structure in which light is output through the substrate 11 is used, light leaks from the semiconductor layer side, and the emitted light is reduced. There was a problem that it was not possible to output efficiently. In addition, since light leaks from the semiconductor layer side, there is a problem that the intensity of output light becomes non-uniform in the plane. The example of the nitride semiconductor light emitting device has been described above.
In the case where a nitride semiconductor light receiving device using a nitride semiconductor is formed by forming a light receiving layer instead of the light receiving layer, there is a similar problem. That is, in the light receiving element, light input from the substrate side leaks through the semiconductor layer, so that the photoelectric conversion efficiency is deteriorated, and the photoelectric conversion efficiency of the light receiving layer cannot be made uniform within the light receiving surface. Also deteriorated the photoelectric conversion efficiency.
【０００４】そこで、本発明の第１の目的は、上記問題
点を解決して、基板側から光りを出力するように構成し
た場合に、半導体層側からの光りの漏れを少なくでき、
発光効率がよく、かつ出力される光りの強度を出力面内
で略均一にできる窒化物半導体発光素子を提供すること
にある。Accordingly, a first object of the present invention is to solve the above-mentioned problems and to reduce the leakage of light from the semiconductor layer side when light is output from the substrate side.
It is an object of the present invention to provide a nitride semiconductor light emitting device which has good luminous efficiency and can make the intensity of output light substantially uniform in an output plane.
【０００５】また、本発明の第２の目的は、入力された
光りを効率よく光電変換できる変換効率の高い窒化物半
導体受光素子を提供することにある。A second object of the present invention is to provide a nitride semiconductor light receiving element having high conversion efficiency capable of efficiently performing photoelectric conversion of input light.
【０００６】[0006]
【課題を解決するための手段】本発明は、基板側から光
を出力する窒化物半導体発光素子において、半導体層か
ら光りが漏れるのを防止し、発光効率を向上させるもの
である。すなわち、本発明に係る窒化ガリウム系半導体
発光素子は、基板上に形成されたｎ型窒化ガリウム系半
導体からなる第１半導体層と、該第１半導体層上に発光
層を介して形成されたｐ型窒化ガリウム系半導体からな
る第２半導体層とを備え、上記第２半導体層の中央部に
おいて開口部設けて露出させた第１半導体層の表面にｎ
側電極を形成しかつ上記第２の半導体層の表面に上記ｎ
側電極を取り囲むようにｐ側電極を形成して、上記基板
を介して光りを出力する窒化ガリウム系半導体発光素子
であって、上記開口部における上記第２の半導体層の側
壁と上記ｐ側電極の内周周辺部とに連続した絶縁膜を形
成し、上記ｎ側電極が上記絶縁膜を介して上記ｐ側電極
の内周周辺部と重なるように上記ｎ側電極を延在させ、
上記ｐ側電極と上記ｎ側電極との間から光が漏れること
を防止したことを特徴とする。SUMMARY OF THE INVENTION According to the present invention, in a nitride semiconductor light emitting device that outputs light from the substrate side, it is possible to prevent light from leaking from the semiconductor layer and to improve luminous efficiency. That is, the gallium nitride-based semiconductor light-emitting device according to the present invention includes a first semiconductor layer made of an n-type gallium nitride-based semiconductor formed on a substrate, and a p-type semiconductor formed on the first semiconductor layer via a light-emitting layer. A second semiconductor layer made of a type gallium nitride-based semiconductor, and an opening is provided at the center of the second semiconductor layer and n is formed on the surface of the first semiconductor layer exposed.
Forming a side electrode and forming the n electrode on the surface of the second semiconductor layer.
A gallium nitride-based semiconductor light emitting device that forms a p-side electrode so as to surround a side electrode and outputs light through the substrate, wherein a side wall of the second semiconductor layer in the opening and the p-side electrode Forming an insulating film continuous with the inner peripheral portion of the n-side electrode, extending the n-side electrode so that the n-side electrode overlaps the inner peripheral portion of the p-side electrode via the insulating film,
Light is prevented from leaking from between the p-side electrode and the n-side electrode.
【０００７】また、本発明の窒化ガリウム系半導体発光
素子ではさらに、上記第１半導体層と上記第２半導体層
の外周側面に、絶縁膜を介して上記ｐ側電極と連続する
電極膜又はｎ側電極と連続する電極膜を形成することに
より、上記第１半導体層及び上記第２半導体層の基板と
対向する面を除く表面を、上記ｐ側電極、ｎ側電極又は
上記電極膜いずれかで覆い、該表面から光が漏れること
を防止することが好ましい。Further, in the gallium nitride based semiconductor light emitting device of the present invention, an electrode film continuous with the p-side electrode or an n-side electrode film on the outer peripheral side surfaces of the first semiconductor layer and the second semiconductor layer via an insulating film. By forming an electrode film continuous with the electrode, the surface of the first semiconductor layer and the second semiconductor layer other than the surface facing the substrate is covered with any one of the p-side electrode, the n-side electrode, and the electrode film. It is preferable to prevent light from leaking from the surface.
【０００８】本発明に係る窒化ガリウム系半導体受光素
子は、基板上に形成されたｎ型窒化ガリウム系半導体か
らなる第１半導体層と、該第１半導体層上に光吸収層を
介して形成されたｐ型窒化ガリウム系半導体からなる第
２半導体層とを備え、上記第２半導体層の中央部におい
て開口部設けて露出させた第１半導体層の表面にｎ側電
極を形成しかつ上記第２の半導体層の表面に上記ｎ側電
極を取り囲むようにｐ側電極を形成して、上記基板を介
して入力される光を電気信号に変換する窒化ガリウム系
半導体受光素子であって、上記開口部における上記第２
の半導体層の側壁と上記ｐ側電極の内周周辺部とに連続
した絶縁膜を形成し、上記ｎ側電極を上記絶縁膜を間に
挟んで上記ｐ側電極の内周周辺部上まで延在させ、上記
ｐ側電極と上記ｎ側電極との間から光が漏れることを防
止したことを特徴とする。A gallium nitride based semiconductor light receiving device according to the present invention is formed by forming a first semiconductor layer made of an n-type gallium nitride based semiconductor formed on a substrate, and a light absorbing layer formed on the first semiconductor layer. A second semiconductor layer made of a p-type gallium nitride-based semiconductor, wherein an n-side electrode is formed on the surface of the first semiconductor layer exposed by providing an opening at the center of the second semiconductor layer; A gallium nitride-based semiconductor light receiving element for forming a p-side electrode on the surface of the semiconductor layer to surround the n-side electrode and converting light input through the substrate into an electric signal, The second in
A continuous insulating film is formed on the side wall of the semiconductor layer and the inner peripheral part of the p-side electrode, and the n-side electrode is extended to above the inner peripheral part of the p-side electrode with the insulating film interposed therebetween. To prevent light from leaking from between the p-side electrode and the n-side electrode.
【０００９】また、本発明の窒化ガリウム系半導体発光
素子では、上記第１半導体層と上記第２半導体層の外周
側面に、絶縁膜を介して上記ｐ側電極と連続する電極又
はｎ側電極と連続する電極膜を形成することにより、上
記第１半導体層及び上記第２半導体層の基板と対向する
面を除く表面を上記ｐ側電極、ｎ側電極又は上記電極膜
いずれかで覆い、該表面から光が漏れることを防止する
ことが好ましい。Further, in the gallium nitride based semiconductor light emitting device of the present invention, an electrode continuous with the p-side electrode or an n-side electrode on an outer peripheral side surface of the first semiconductor layer and the second semiconductor layer via an insulating film. By forming a continuous electrode film, the surface of the first semiconductor layer and the second semiconductor layer other than the surface facing the substrate is covered with any one of the p-side electrode, the n-side electrode, and the electrode film. It is preferable to prevent light from leaking out of the device.
【００１０】[0010]
【発明の実施の形態】以下、図面を参照して本発明に係
る実施の形態について説明する。 実施形態１．本発明に係る実施形態１の窒化物半導体発
光素子は、図１に示すように、例えばサファイヤ等から
なる基板１１上に、例えば、ＳｉがドープされたＡｌＩ
ｎＧａＮからなるｎ型窒化物半導体層１２、例えば、Ｉ
ｎＧａＮからなる発光層１０及び例えば、Ｍｇがドープ
されたＡｌＩｎＧａＮからなるｐ型窒化物半導体層１３
が順に積層された半導体層構造を有し、以下のように構
成される。 １）実施形態１の窒化物半導体発光素子において、ｐ型
窒化物半導体層は、その中央部において円形に除去さ
れ、開口部３１が形成される。これによって、開口部３
１を介してｎ型窒化物半導体層１２の表面が露出され
る。 ２）ｐ側の正電極１９は、図２に示すように、ｐ型窒化
物半導体層１３上に、開口部３１の近傍及び外周の近傍
とを除いて形成される。 ３）ｐ側の取り出し電極１６は、正電極１９上の開口部
３１と一側面との間に略矩形形状に形成される。 ４）絶縁層１７ａは、ｐ側の正電極１９、ｐ型窒化物半
導体層１３及びｎ型窒化物半導体層１２の側面を覆い基
板１１に達するように形成される。 尚、絶縁層１７ａにおいて、開口部３１の内側に開口部
３１と同心円の開口部３２が形成され、取り出し電極１
９上に開口部３３が形成される。 ５）ｎ側の負電極１４は、開口部３２を形成することに
よって露出されたｎ型窒化物半導体層１２の表面１８に
接続されるように形成される。ここで、負電極１４は、
図２に示すように、ｐ側の取り出し電極１６の側におい
て、いずれの位置においても保護膜１７ａを介して正電
極１９と重なるように取り出し電極１６に近接する位置
まで延在し、かつ反対側においては、絶縁膜１７ａを介
して正電極１９を実質的に覆うように形成される。６）
さらに絶縁膜１７ｂは、取り出し電極１６上に開口部３
３と重なる開口部３５を有しかつ開口部３５の反対側の
負電極１４上に開口部３４を有し、各電極及び半導体層
を覆うように形成される。Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIG. As shown in FIG. 1, a nitride semiconductor light emitting device according to a first embodiment of the present invention includes, for example, a Si-doped AlI on a substrate 11 made of sapphire or the like.
An n-type nitride semiconductor layer 12 made of nGaN, for example, I
A light emitting layer 10 made of nGaN and a p-type nitride semiconductor layer 13 made of, for example, AlInGaN doped with Mg
Have a semiconductor layer structure laminated in order, and are configured as follows. 1) In the nitride semiconductor light emitting device of the first embodiment, the p-type nitride semiconductor layer is removed in a circular shape at the center, and an opening 31 is formed. Thereby, the opening 3
1 exposes the surface of n-type nitride semiconductor layer 12. 2) The p-side positive electrode 19 is formed on the p-type nitride semiconductor layer 13 except for the vicinity of the opening 31 and the vicinity of the outer periphery, as shown in FIG. 3) The extraction electrode 16 on the p-side is formed in a substantially rectangular shape between the opening 31 on the positive electrode 19 and one side surface. 4) The insulating layer 17a is formed to cover the side surfaces of the p-side positive electrode 19, the p-type nitride semiconductor layer 13, and the n-type nitride semiconductor layer 12, and reach the substrate 11. In addition, in the insulating layer 17a, an opening 32 concentric with the opening 31 is formed inside the opening 31, and the extraction electrode 1 is formed.
An opening 33 is formed on 9. 5) The n-side negative electrode 14 is formed so as to be connected to the surface 18 of the n-type nitride semiconductor layer 12 exposed by forming the opening 32. Here, the negative electrode 14
As shown in FIG. 2, on the p-side extraction electrode 16 side, at any position, it extends to a position close to the extraction electrode 16 via the protective film 17a so as to overlap with the positive electrode 19, and on the opposite side. Is formed so as to substantially cover the positive electrode 19 via the insulating film 17a. 6)
Further, the insulating film 17b is provided on the lead-out electrode 16 with the opening 3
3 and an opening 34 on the negative electrode 14 on the opposite side of the opening 35 to cover each electrode and the semiconductor layer.
【００１１】以上のように構成された実施形態１の窒化
物半導体発光素子において、ｎ型窒化物半導体層１２及
びｐ型窒化物半導体層１３の上方は、正電極１９及び負
電極１４のいずれかの電極で覆われているので、活性層
１０において発生した光りが上方から漏れるのを防止で
き、基板１１側から効率よく出力できる。In the nitride semiconductor light emitting device of the first embodiment configured as described above, one of the positive electrode 19 and the negative electrode 14 is located above the n-type nitride semiconductor layer 12 and the p-type nitride semiconductor layer 13. , The light generated in the active layer 10 can be prevented from leaking from above, and the light can be efficiently output from the substrate 11 side.
【００１２】また、実施形態１の窒化物半導体発光素子
において、ｎ側の負電極１４をｎ型窒化物半導体層１２
の中央部で接続し、該接続部分の全てを取り囲むよう
に、正電極１９を形成しているので、負電極１４から正
電極１９に向かって放射状に電子を注入することがで
き、周りを取り囲む正電極１９からｎ電極に均一に電流
を流すことができる。これによって、均一の発光が可能
になり、電流集中に起因した発光素子の劣化を防止でき
る。In the nitride semiconductor light emitting device of the first embodiment, the n-side negative electrode 14 is replaced with the n-type nitride semiconductor layer 12.
And the positive electrode 19 is formed so as to surround all of the connecting portions, so that electrons can be radially injected from the negative electrode 14 toward the positive electrode 19 and surround the periphery. A current can flow uniformly from the positive electrode 19 to the n electrode. As a result, uniform light emission becomes possible, and deterioration of the light emitting element due to current concentration can be prevented.
【００１３】実施形態２．図３は、実施形態２の窒化物
半導体素子の構成を示す模式断面図である。実施形態２
の窒化物半導体素子では、実施形態１の負電極１４を、
外周部において絶縁膜１７ａと絶縁膜１７ｂとの間に延
在させ、ｐ型窒化物半導体層１３及びｎ型窒化物半導体
層１４の各外側面を覆うように形成（図４参照）した以
外は、実施形態１と同様に形成する。尚、図４は、図３
に示す窒化物半導体素子から絶縁膜１７ｂを取り除い
て、ｎ側の負電極１４ａの形状が分かるように示した斜
視図である。ここで、図３，４においては、ｎ側の負電
極は、実施形態１の負電極１４と区別するために１４ａ
の符号を付して示し、実施形態１と同様のものには同様
の符号を付して示している。Embodiment 2 FIG. FIG. 3 is a schematic cross-sectional view illustrating a configuration of the nitride semiconductor device of the second embodiment. Embodiment 2
In the nitride semiconductor device of the first embodiment, the negative electrode 14 of the first embodiment is
Except that it is formed between the insulating film 17a and the insulating film 17b in the outer peripheral portion to cover each outer surface of the p-type nitride semiconductor layer 13 and the n-type nitride semiconductor layer 14 (see FIG. 4). , Formed in the same manner as in the first embodiment. FIG. 4 is similar to FIG.
FIG. 14 is a perspective view showing the nitride semiconductor element shown in FIG. 1 with the insulating film 17b removed, so that the shape of the n-side negative electrode 14a can be seen. Here, in FIGS. 3 and 4, the n-side negative electrode is denoted by 14 a to distinguish it from the negative electrode 14 of the first embodiment.
The same reference numerals are given to the same components as those in the first embodiment.
【００１４】以上のように構成された実施形態２の窒化
物半導体素子は、実施形態１の窒化物半導体素子に比較
してさらに、ｐ型窒化物半導体層１３及びｎ型窒化物半
導体層１２の各外周側面が、絶縁膜１７ａ，１７ｂの間
に延長して形成された負電極１４ａによって覆われてい
る。これによって、実施形態１の窒化物半導体素子と同
様の効果を有するとともに、さらに、ｐ型窒化物半導体
層１３及びｎ型窒化物半導体層１２の各外周側面から光
りが漏れるのを、防止することができる。The nitride semiconductor device according to the second embodiment configured as described above further includes a p-type nitride semiconductor layer 13 and an n-type nitride semiconductor layer 12 as compared with the nitride semiconductor device according to the first embodiment. Each outer peripheral side surface is covered by a negative electrode 14a formed to extend between the insulating films 17a and 17b. This has the same effect as the nitride semiconductor device of the first embodiment, and further prevents light from leaking from the outer peripheral side surfaces of the p-type nitride semiconductor layer 13 and the n-type nitride semiconductor layer 12. Can be.
【００１５】実施形態３．本発明に係る実施形態３の窒
化物半導体発光素子が、実施形態１の窒化物半導体素子
と異なる点は、図５及び図６に示すように、ｐ型窒化物
半導体層とｎ型窒化物半導体層の各側面を、絶縁膜１７
ｄを介して正電極１９で覆っている点であり、それ以外
は実施形態１と同様に形成される。すなわち、実施形態
３の窒化物半導体素子では、ｐ型窒化物半導体層を中央
部において円形に除去して、開口部３１を形成した後、
ｐ型窒化物半導体層１３上面の外周周辺部からｐ型窒化
物半導体層１３及びｎ型窒化物半導体層１３の各外周側
面に連続した絶縁膜１７ｄを形成し、正電極１９をｐ型
窒化物半導体層１３上面のほぼ全面及び絶縁膜１７ｄ上
に形成する。ここで、正電極１９は、開口部３１の近傍
のｐ型窒化物半導体層１３上面を除いて形成される。
尚、図６は、実施形態３の窒化物半導体発光素子におい
て、取り出し電極１６、絶縁膜１７ｆ，１７ｅを取り除
いて、正電極１９の形状が分かるように示した斜視図で
ある。また、図５及び図６において、実施形態１と同様
のものには同様の符号を付している。Embodiment 3 The nitride semiconductor light emitting device according to the third embodiment of the present invention is different from the nitride semiconductor device according to the first embodiment in that a p-type nitride semiconductor layer and an n-type nitride semiconductor as shown in FIGS. Each side of the layer is covered with an insulating film 17
The second embodiment is the same as the first embodiment except that it is covered with the positive electrode 19 via d. That is, in the nitride semiconductor device according to the third embodiment, after the p-type nitride semiconductor layer is removed in a circular shape at the center and the opening 31 is formed,
A continuous insulating film 17d is formed on each of the outer peripheral side surfaces of the p-type nitride semiconductor layer 13 and the n-type nitride semiconductor layer 13 from the outer peripheral peripheral portion of the upper surface of the p-type nitride semiconductor layer 13, and the positive electrode 19 is made It is formed on almost the entire upper surface of the semiconductor layer 13 and on the insulating film 17d. Here, the positive electrode 19 is formed except for the upper surface of the p-type nitride semiconductor layer 13 near the opening 31.
FIG. 6 is a perspective view of the nitride semiconductor light emitting device according to the third embodiment, in which the extraction electrode 16 and the insulating films 17f and 17e are removed so that the shape of the positive electrode 19 can be seen. 5 and 6, the same components as those in the first embodiment are denoted by the same reference numerals.
【００１６】以上のように構成された実施形態３の窒化
物半導体発光素子においては、ｐ型窒化物半導体層１３
及びｎ型窒化物半導体層１２の各外周側面が、絶縁膜１
７ｄを介して負電極１９で覆われているので、実施形態
２と同様、ｐ型窒化物半導体層１３及びｎ型窒化物半導
体層１２の各外周側面から光りが漏れるのを、防止する
ことができる。また、半導体層との接触面積が大きいｐ
側の正電極１９の表面積を大きくできるので、実施形態
２に比較して放熱特性を良好にできる。In the nitride semiconductor light emitting device of the third embodiment configured as described above, the p-type nitride semiconductor layer 13
And the outer peripheral side surfaces of the n-type nitride semiconductor layer 12
Since it is covered with the negative electrode 19 via 7d, it is possible to prevent light from leaking from the outer peripheral side surfaces of the p-type nitride semiconductor layer 13 and the n-type nitride semiconductor layer 12, as in the second embodiment. it can. Further, p having a large contact area with the semiconductor layer
Since the surface area of the positive electrode 19 on the side can be increased, heat radiation characteristics can be improved as compared with the second embodiment.
【００１７】以上の実施形態１〜３においては、本発明
を窒化物半導体発光素子に適用した形態について説明し
たが、本発明はこれに限らず、受光素子に適用してもよ
い。受光素子に適用する場合、半導体層構造は、例え
ば、サファイヤ基板上に、例えばＳｉがドープされたＧ
ａＮからなるｎ型窒化物半導体層（例えば、５μｍ）
と、ＭｇがドープされたＧａＮからなるｐ-型窒化物半
導体層（例えば、３００オングストローム）と、ｐ-型
窒化物半導体層より高濃度にＭｇがドープされたＧａＮ
からなるｐ型窒化物半導体層（例えば、１５００オング
ストローム）とが積層された半導体層構造を有し、電極
構造等は、実施形態１〜３と同様に構成される。In the first to third embodiments, the embodiments in which the present invention is applied to a nitride semiconductor light emitting device have been described. However, the present invention is not limited to this, and may be applied to a light receiving device. When applied to a light receiving element, the semiconductor layer structure is formed, for example, on a sapphire substrate by, for example, Si-doped G
n-type nitride semiconductor layer made of aN (for example, 5 μm)
A p - type nitride semiconductor layer made of GaN doped with Mg (for example, 300 angstroms); and a GaN doped with Mg at a higher concentration than the p - type nitride semiconductor layer.
And a p-type nitride semiconductor layer (e.g., 1500 angstroms) made of a laminated semiconductor layer. The electrode structure and the like are configured in the same manner as in the first to third embodiments.
【００１８】以上のように構成された本発明に係る窒化
物半導体受光素子は、基板側から入力された光りを半導
体側から漏らすことなく、ｐｎ接合面において光電変換
することができるので、変換効率をよくできる。The nitride semiconductor light receiving device according to the present invention having the above-described structure can perform photoelectric conversion on the pn junction surface without leaking light input from the substrate side from the semiconductor side, and therefore, the conversion efficiency. Can be better.
【００１９】[0019]
【発明の効果】以上説明したように、本発明は、上記基
板を介して光りを出力する窒化ガリウム系半導体発光素
子であって、上記ｎ側電極を上記絶縁膜を間に挟んで上
記ｐ側電極の内周周辺部上まで延在させ、実質的に上記
半導体層を電極で覆うようにしているので、半導体側か
ら光が漏れることを防止することができる。これによっ
て、発光効率をよくでき、光りが半導体側から部分的に
もれることを防止できるので、出力される光りの強度を
出力面内で略均一にできる。As described above, the present invention relates to a gallium nitride based semiconductor light emitting device which outputs light through the above-mentioned substrate, wherein the above-mentioned n-side electrode is interposed between the above-mentioned p-side and the above-mentioned insulating film. Since the semiconductor layer extends over the inner peripheral portion of the electrode and substantially covers the semiconductor layer, it is possible to prevent light from leaking from the semiconductor side. As a result, the light emission efficiency can be improved, and light can be prevented from partially leaking from the semiconductor side, so that the intensity of the output light can be made substantially uniform in the output plane.
【００２０】また、本発明の窒化ガリウム系半導体発光
素子ではさらに、上記第１半導体層と上記第２半導体層
の外周側面に、絶縁膜を介して上記ｐ側電極と連続する
電極膜又はｎ側電極と連続する電極膜を形成することに
より、発光効率をさらに向上させることができる。Further, in the gallium nitride based semiconductor light emitting device of the present invention, an electrode film or an n-side electrode film continuous with the p-side electrode via an insulating film is provided on the outer peripheral side surfaces of the first semiconductor layer and the second semiconductor layer. By forming the electrode film continuous with the electrode, the luminous efficiency can be further improved.
【００２１】本発明に係る窒化ガリウム系半導体受光素
子は、上記基板を介して入力される光を電気信号に変換
する窒化ガリウム系半導体受光素子であって、上記開口
部における上記第２の半導体層の側壁と上記ｐ側電極の
内周周辺部とに連続した絶縁膜を形成し、上記ｎ側電極
を上記絶縁膜を間に挟んで上記ｐ側電極の内周周辺部上
まで延在させ、上記ｎ型及びｐ型窒化物半導体層を、上
記ｐ側電極及び上記ｎ側電極のいずれかでおおっている
ので、半導体側から光が漏れることをでき、発光効率を
よくできる。The gallium nitride based semiconductor light receiving device according to the present invention is a gallium nitride based semiconductor light receiving device for converting light input through the substrate into an electric signal, wherein the second semiconductor layer in the opening is provided. Forming a continuous insulating film on the side wall of the p-side electrode and the inner peripheral portion of the p-side electrode, extending the n-side electrode over the inner peripheral portion of the p-side electrode with the insulating film interposed therebetween; Since the n-type and p-type nitride semiconductor layers are covered with either the p-side electrode or the n-side electrode, light can leak from the semiconductor side and light emission efficiency can be improved.
【００２２】また、本発明の窒化ガリウム系半導体発光
素子ではさらに、上記第１半導体層と上記第２半導体層
の外周側面を、絶縁膜を介して上記ｐ側電極と連続する
電極又はｎ側電極と連続する電極膜を形成することによ
り、さらに光電変換効率よくできる。Further, in the gallium nitride based semiconductor light emitting device of the present invention, the outer peripheral side surfaces of the first semiconductor layer and the second semiconductor layer may be connected to the p-side electrode or the n-side electrode via an insulating film. By forming an electrode film continuous with the above, the photoelectric conversion efficiency can be further improved.
【図面の簡単な説明】[Brief description of the drawings]
【図１】 本発明に係る実施形態１の窒化物半導体発光
素子の構成を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically illustrating a configuration of a nitride semiconductor light emitting device according to a first embodiment of the present invention.
【図２】 図１の窒化物半導体発光素子の電極形状を示
す平面図である。FIG. 2 is a plan view showing an electrode shape of the nitride semiconductor light emitting device of FIG.
【図３】 本発明に係る実施形態２の窒化物半導体発光
素子の構成を模式的に示す断面図である。FIG. 3 is a cross-sectional view schematically illustrating a configuration of a nitride semiconductor light emitting device according to a second embodiment of the present invention.
【図４】 図３の実施形態２の窒化物半導体発光素子に
おける負電極１４の形状を示すための斜視図である。FIG. 4 is a perspective view showing a shape of a negative electrode 14 in the nitride semiconductor light emitting device according to the second embodiment of FIG.
【図５】 本発明に係る実施形態３の窒化物半導体発光
素子の構成を模式的に示す断面図である。FIG. 5 is a cross-sectional view schematically illustrating a configuration of a nitride semiconductor light emitting device according to a third embodiment of the present invention.
【図６】 図５の実施形態３の窒化物半導体発光素子に
おける正電極１９の形状を示す斜視図である。6 is a perspective view showing a shape of a positive electrode 19 in the nitride semiconductor light emitting device of Embodiment 3 in FIG.
【図７】 従来例の窒化物半導体発光素子の構成を示す
模式断面図である。FIG. 7 is a schematic sectional view showing a configuration of a conventional nitride semiconductor light emitting device.
【図８】 従来例の窒化物半導体発光素子の電極構成を
示す平面図である。FIG. 8 is a plan view showing an electrode configuration of a conventional nitride semiconductor light emitting device.
１０…発光層、 １１…基板、 １２…ｎ型窒化物半導体層、 １３…ｐ型窒化物半導体層、 １４…負電極、 １６…取り出し電極、 １７ａ，１７ｂ，１７ｃ，１７ｄ，１７ｅ，１７ｆ…絶
縁膜、 １９…正電極。DESCRIPTION OF SYMBOLS 10 ... Light emitting layer, 11 ... Substrate, 12 ... N-type nitride semiconductor layer, 13 ... P-type nitride semiconductor layer, 14 ... Negative electrode, 16 ... Extraction electrode, 17a, 17b, 17c, 17d, 17e, 17f ... Insulation Membrane, 19 ... Positive electrode.
Claims (4)
半導体からなる第１半導体層と、該第１半導体層上に発
光層を介して形成されたｐ型窒化ガリウム系半導体から
なる第２半導体層とを備え、上記第２半導体層の中央部
において開口部設けて露出させた第１半導体層の表面に
ｎ側電極を形成しかつ上記第２の半導体層の表面に上記
ｎ側電極を取り囲むようにｐ側電極を形成して、上記基
板を介して光りを出力する窒化ガリウム系半導体発光素
子であって、 上記開口部における上記第２の半導体層の側壁と上記ｐ
側電極の内周周辺部とに連続した絶縁膜を形成し、上記
ｎ側電極が上記絶縁膜を介して上記ｐ側電極の内周周辺
部と重なるように上記ｎ側電極を延在させ、上記ｐ側電
極と上記ｎ側電極との間から光が漏れることを防止した
ことを特徴とする窒化ガリウム系半導体発光素子。A first semiconductor layer formed of an n-type gallium nitride-based semiconductor formed on a substrate; and a second semiconductor layer formed of a p-type gallium nitride-based semiconductor formed on the first semiconductor layer via a light-emitting layer. A semiconductor layer, an n-side electrode is formed on the surface of the first semiconductor layer exposed by providing an opening at the center of the second semiconductor layer, and the n-side electrode is formed on the surface of the second semiconductor layer. A gallium nitride-based semiconductor light emitting device that forms a p-side electrode so as to surround and outputs light through the substrate, wherein a side wall of the second semiconductor layer in the opening and the p-side electrode are formed.
Forming an insulating film continuous with the inner peripheral portion of the side electrode, extending the n-side electrode such that the n-side electrode overlaps the inner peripheral portion of the p-side electrode via the insulating film, A gallium nitride based semiconductor light emitting device, wherein light is prevented from leaking from between the p-side electrode and the n-side electrode.
外周側面に、絶縁膜を介して上記ｐ側電極と連続する電
極膜又はｎ側電極と連続する電極膜を形成することによ
り、上記第１半導体層及び上記第２半導体層の基板と対
向する面を除く表面を、上記ｐ側電極、ｎ側電極又は上
記電極膜いずれかで覆い、該表面から光が漏れることを
防止した請求項１記載の窒化ガリウム系半導体発光素
子。2. An electrode film continuous with the p-side electrode or an electrode film continuous with the n-side electrode with an insulating film interposed therebetween on the outer peripheral side surfaces of the first semiconductor layer and the second semiconductor layer, Claims wherein surfaces of the first semiconductor layer and the second semiconductor layer other than the surface facing the substrate are covered with any one of the p-side electrode, the n-side electrode, and the electrode film to prevent light from leaking from the surfaces. Item 3. A gallium nitride based semiconductor light emitting device according to item 1.
半導体からなる第１半導体層と、該第１半導体層上に光
吸収層を介して形成されたｐ型窒化ガリウム系半導体か
らなる第２半導体層とを備え、上記第２半導体層の中央
部において開口部設けて露出させた第１半導体層の表面
にｎ側電極を形成しかつ上記第２の半導体層の表面に上
記ｎ側電極を取り囲むようにｐ側電極を形成して、上記
基板を介して入力される光を電気信号に変換する窒化ガ
リウム系半導体受光素子であって、 上記開口部における上記第２の半導体層の側壁と上記ｐ
側電極の内周周辺部とに連続した絶縁膜を形成し、上記
ｎ側電極を上記絶縁膜を間に挟んで上記ｐ側電極の内周
周辺部上まで延在させ、上記ｐ側電極と上記ｎ側電極と
の間から光が漏れることを防止したことを特徴とする窒
化ガリウム系半導体受光素子。3. A first semiconductor layer formed of an n-type gallium nitride-based semiconductor formed on a substrate, and a first semiconductor layer formed of a p-type gallium nitride-based semiconductor formed on the first semiconductor layer via a light absorbing layer. An n-side electrode is formed on the surface of the first semiconductor layer exposed by providing an opening at the center of the second semiconductor layer, and the n-side electrode is formed on the surface of the second semiconductor layer. A gallium nitride-based semiconductor light receiving element that forms a p-side electrode so as to surround the substrate and converts light input through the substrate into an electric signal, the side wall of the second semiconductor layer in the opening, The above p
Forming an insulating film continuous with the inner peripheral portion of the side electrode; extending the n-side electrode over the inner peripheral portion of the p-side electrode with the insulating film interposed therebetween; A gallium nitride-based semiconductor light receiving device, wherein light is prevented from leaking from between the n-side electrode and the n-side electrode.
外周側面に、絶縁膜を介して上記ｐ側電極と連続する電
極又はｎ側電極と連続する電極膜を形成することによ
り、上記第１半導体層及び上記第２半導体層の基板と対
向する面を除く表面を上記ｐ側電極、ｎ側電極又は上記
電極膜いずれかで覆い、該表面から光が漏れることを防
止した請求項１記載の窒化ガリウム系半導体受光素子。4. An electrode film continuous with the p-side electrode or an electrode film continuous with the n-side electrode with an insulating film interposed between outer peripheral side surfaces of the first semiconductor layer and the second semiconductor layer. 2. A surface of the first semiconductor layer and the second semiconductor layer other than the surface facing the substrate is covered with any one of the p-side electrode, the n-side electrode, and the electrode film to prevent light from leaking from the surfaces. The gallium nitride based semiconductor light receiving device according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33101297A JP3322300B2 (en) | 1997-11-14 | 1997-11-14 | Gallium nitride based semiconductor light emitting device and light receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33101297A JP3322300B2 (en) | 1997-11-14 | 1997-11-14 | Gallium nitride based semiconductor light emitting device and light receiving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11150298A true JPH11150298A (en) | 1999-06-02 |
| JP3322300B2 JP3322300B2 (en) | 2002-09-09 |
Family
ID=18238846
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|---|---|---|---|
| JP33101297A Expired - Lifetime JP3322300B2 (en) | 1997-11-14 | 1997-11-14 | Gallium nitride based semiconductor light emitting device and light receiving device |
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| Country | Link |
|---|---|
| JP (1) | JP3322300B2 (en) |
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