JPH11150154A - Circuit board holding device and manufacture of semiconductor device using the same - Google Patents
Circuit board holding device and manufacture of semiconductor device using the sameInfo
- Publication number
- JPH11150154A JPH11150154A JP31722097A JP31722097A JPH11150154A JP H11150154 A JPH11150154 A JP H11150154A JP 31722097 A JP31722097 A JP 31722097A JP 31722097 A JP31722097 A JP 31722097A JP H11150154 A JPH11150154 A JP H11150154A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor element
- board
- thin circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、薄型回路基板の保
持装置に関し、特にフリップチップ実装技術に用いる回
路基板の保持装置および該保持装置を用いた半導体装置
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for holding a thin circuit board, and more particularly to a device for holding a circuit board used in flip-chip mounting technology and a method for manufacturing a semiconductor device using the device.
【０００２】[0002]
【従来の技術】近年、半導体素子の高集積化に伴い、半
導体装置の小型化および接続端子の狭ピッチ化が進み、
半導体素子をバンプを介して回路基板に実装するフリッ
プチップ実装技術が多く用いられる。図４は、フリップ
チップ実装技術を用いて作製した半導体装置の断面図で
ある。半導体素子１０１の下面にはアルミ電極端子１０
２が形成され、アルミ電極端子１０２以外の部分はＳｉ
酸化膜あるいは窒化膜等からなる絶縁膜１０３で覆われ
ている。アルミ電極端子１０２上には、Ａｕ、Ｃｕ等の
導電性金属材料からなるバンプ（突起電極）１０４が形
成されている。一方、回路基板１０５上には、回路パタ
ーン１０６および電極端子１０７が形成されている。半
導体素子１０１のバンプ１０４と回路基板１０５の電極
端子１０７とは、Ａｇ、Ｃｕ、Ｎｉ等の導電性金属材料
の粉体を樹脂中に含んだ導電性接着剤１０８により電気
的に接続され、回路基板１０５上に半導体素子１０１が
フェイスダウンでフリップチップ実装されている。ま
た、半導体素子１０１と回路基板１０５との間の隙間部
には、絶縁性の封止樹脂１０９が充填されている。封止
樹脂１０９は硬化することにより収縮応力が発生し、半
導体素子１０１と回路基板１０５とを引っ張った状態で
固定する。2. Description of the Related Art In recent years, as semiconductor elements have become more highly integrated, the size of semiconductor devices and the pitch of connection terminals have been reduced.
2. Description of the Related Art Flip chip mounting technology for mounting a semiconductor element on a circuit board via bumps is often used. FIG. 4 is a cross-sectional view of a semiconductor device manufactured by using the flip chip mounting technique. An aluminum electrode terminal 10 is provided on the lower surface of the semiconductor element 101.
2 are formed, and portions other than the aluminum electrode terminals 102 are Si
It is covered with an insulating film 103 made of an oxide film or a nitride film. A bump (projection electrode) 104 made of a conductive metal material such as Au or Cu is formed on the aluminum electrode terminal 102. On the other hand, the circuit pattern 106 and the electrode terminals 107 are formed on the circuit board 105. The bumps 104 of the semiconductor element 101 and the electrode terminals 107 of the circuit board 105 are electrically connected to each other by a conductive adhesive 108 containing a powder of a conductive metal material such as Ag, Cu, or Ni in a resin. The semiconductor element 101 is flip-chip mounted face down on the substrate 105. The gap between the semiconductor element 101 and the circuit board 105 is filled with an insulating sealing resin 109. When the sealing resin 109 is cured, contraction stress is generated, and the semiconductor element 101 and the circuit board 105 are fixed in a stretched state.
【０００３】[0003]
【発明が解決しようとする課題】半導体装置の小型化、
低コスト化等の要請により、回路基板１０５には、薄型
の樹脂基板や板厚が０．４ｍｍ以下の薄型セラミック基
板等が用いられる。かかる回路基板１０５は剛性が低
く、容易に変形するため、例えば回路パターン１０６等
のような非対称な配線パターンを有する場合には、回路
基板１０５の作製工程における熱応力による変形が生
じ、回路基板１０５が局所的な反りやうねりを有するこ
ととなる。かかる回路基板１０５の局所的な反りやうね
りは、図５に示すような回路基板１０５の電極端子１０
７の高さのばらつきを生じ、半導体素子１０１を実装す
る場合に、回路基板１０５の反り等の凹部の電極端子１
０７に導電性接着剤１０８が届かず、電気的に接続不良
となるという問題点を有していた。特に、半導体装置の
小型化に伴い、回路基板１０５には極めて高い平坦性
（電極端子１０７の高さばらつきが、１０μｍ以内）が
要求されることとなった。また、上記回路基板１０５の
局所的な反りやうねりの発生は、回路基板作製工程中だ
けでなく、フリップチップ実装工程中における導電性接
着剤１０８や封止樹脂１０９の加熱工程においても発生
するため、一旦、良好に接続された導電性接着剤１０８
が、かかる局所的な反りやうねりの発生により接続不良
となるという問題点も有している。SUMMARY OF THE INVENTION The miniaturization of semiconductor devices,
Due to demands for cost reduction and the like, a thin resin substrate or a thin ceramic substrate having a thickness of 0.4 mm or less is used for the circuit board 105. The circuit board 105 has low rigidity and easily deforms. For example, when the circuit board 105 has an asymmetrical wiring pattern such as the circuit pattern 106, the circuit board 105 is deformed by thermal stress in a manufacturing process of the circuit board 105. Have local warpage and undulation. Such local warpage or undulation of the circuit board 105 is caused by the electrode terminals 10 of the circuit board 105 as shown in FIG.
When the semiconductor element 101 is mounted, the height of the electrode terminal 1 in the concave portion of the circuit board 105 is reduced.
07 did not reach the conductive adhesive 108, and the connection was electrically poor. In particular, as the size of the semiconductor device is reduced, the circuit board 105 is required to have extremely high flatness (a height variation of the electrode terminal 107 is within 10 μm). The local warpage and undulation of the circuit board 105 occur not only during the circuit board manufacturing process but also during the heating process of the conductive adhesive 108 and the sealing resin 109 during the flip chip mounting process. , Once well connected conductive adhesive 108
However, there is a problem that a connection failure occurs due to the occurrence of such local warpage or undulation.
【０００４】そこで発明者らは、かかる問題点を解決す
るために、図６に示す回路基板保持装置を用いて半導体
素子の実装を行う方法を試みた。図６（ａ）は回路基板
保持装置の上面図であり、図６（ｂ）は、Ａ−Ａ’にお
ける断面図である。かかる回路基板保持装置では、基板
支持台２ａに設けられた、底面が平坦な凹部２ｅに樹脂
基板等の薄型回路基板１がはめ込まれ、その上に基板固
定蓋２ｂが載置され、ネジ２ｃを締め込むことによっ
て、基板支持台２ａ上に基板固定蓋２ｂが固定される。
ここで、凹部２ｅの深さは、回路基板１の板厚より浅く
なるように設計されているため、ネジ２ｃを締めること
により、回路基板１は平坦な凹部２ｅの底面に基板固定
蓋２ｂにより押し付けられ、かかる押圧により反りやう
ねりを有する薄型回路基板１は、平坦に保持されること
となる。しかし、一方で、薄膜回路基板１はわずかな応
力によっても変形するため、ネジ２ｃを締め込む力によ
って、回路基板１の平坦性が損なわれるという問題が発
生した。かかる問題を回避するためには、ネジ２ｃの締
め込みは、ある程度の熟練者がトルクドライバーなどを
用いて慎重に行うことが必要であり、半導体装置の大量
生産に対応することができなかった。また、凹部２ｅの
深さは回路基板１の厚みに応じて変更する必要があるた
め、膜厚の異なった回路基板１に対応するためには、複
数の基板支持台２ａを準備することが必要となり、製造
設備のコストの増大を招くこととなっていた。そこで、
本発明は、基板支持台に薄型回路基板を固定する際に発
生する薄型回路基板の反り等を防止し、膜厚の異なる薄
型回路基板を固定可能な回路基板保持装置および該保持
装置を用いた半導体装置の製造方法を提供することを目
的とする。[0004] In order to solve such a problem, the inventors have tried a method of mounting a semiconductor element using a circuit board holding device shown in FIG. FIG. 6A is a top view of the circuit board holding device, and FIG. 6B is a cross-sectional view along AA ′. In such a circuit board holding device, a thin circuit board 1 such as a resin board is fitted into a recess 2e having a flat bottom provided on a board support 2a, a board fixing lid 2b is placed thereon, and a screw 2c is mounted. By tightening, the substrate fixing lid 2b is fixed on the substrate support 2a.
Here, since the depth of the recess 2e is designed to be shallower than the thickness of the circuit board 1, the circuit board 1 is fixed to the bottom of the flat recess 2e by the board fixing lid 2b by tightening the screw 2c. The thin circuit board 1 which is pressed and warps or undulates due to the pressing is held flat. However, on the other hand, since the thin film circuit board 1 is deformed even by a slight stress, there is a problem that the flatness of the circuit board 1 is impaired by the force for tightening the screw 2c. In order to avoid such a problem, it is necessary for an expert to carefully tighten the screw 2c using a torque driver or the like, and it has not been possible to cope with mass production of semiconductor devices. Also, since the depth of the recess 2e needs to be changed according to the thickness of the circuit board 1, it is necessary to prepare a plurality of substrate supports 2a in order to correspond to the circuit boards 1 having different thicknesses. As a result, the cost of manufacturing equipment is increased. Therefore,
The present invention uses a circuit board holding device capable of fixing a thin circuit board having a different thickness, preventing warpage of the thin circuit board, which is generated when the thin circuit board is fixed to the substrate support, and using the holding device. It is an object to provide a method for manufacturing a semiconductor device.
【０００５】[0005]
【課題を解決するための手段】そこで、発明者らは鋭意
研究の結果、基板支持台と基板固定蓋とからなる回路基
板保持装置において、基板支持台の凹部内に、平坦な表
面を備えた基板搭載板を弾性体を介して設け、かかる基
板搭載板により薄型回路基板を基板固定蓋に押し付ける
ようにして固定することにより、回路基板固定時の反り
等の発生を防止でき、半導体素子の実装工程における接
続不良の発生を防止できることを見出し、本発明を完成
した。Therefore, as a result of intensive studies, the inventors have found that a circuit board holding device including a substrate support and a substrate fixing lid has a flat surface in a recess of the substrate support. By mounting the board mounting plate via an elastic body and fixing the thin circuit board by pressing the board mounting lid on the board mounting lid, it is possible to prevent the occurrence of warpage and the like when fixing the circuit board, and to mount the semiconductor element. The present inventors have found that the occurrence of connection failure in the process can be prevented, and completed the present invention.
【０００６】即ち、本発明は、薄型回路基板がはめ込ま
れる凹部を設けた基板支持台と、該基板支持台上に上記
薄型回路基板を覆うように固定され、上記薄型回路基板
の半導体素子実装領域上に開口部が設けられた基板固定
蓋と、からなる回路基板保持装置が、上記基板支持台の
上記凹部の底面上に、弾性体を介して設けられた平坦な
上面を有する基板搭載板を備え、上記基板搭載板上に搭
載された上記薄型回路基板が、上記弾性体によって上記
基板固定蓋に押し付けられて平坦に固定され、上記半導
体素子実装領域を該半導体素子実装領域に実装される半
導体素子の電極形成面に対して略平行にしたことを特徴
とする回路基板保持装置である。このように、基板支持
台の凹部底面に設けた平坦な表面を備えた基板搭載板に
より、薄型回路基板を基板固定蓋に押し付けて固定する
ことにより、従来行われていた基板支持台と基板固定蓋
との間に薄型回路基板を挟み込んで固定する場合のよう
な薄型回路基板に働く締め付け応力の発生を防止するこ
とができる。従って、薄型回路基板に反り等を発生させ
ることなく、容易に薄型回路基板を平坦に固定すること
が可能となる。また、基板搭載板は、基板支持台の凹部
底面上に弾性体を介して設けられているため、膜厚が多
少異なる薄型回路基板でも同一の保持装置を用いて固定
することが可能となり、従来のように薄型回路基板の膜
厚に対応した深さの凹部を備えた複数の基板支持台を準
備することが不要となる。That is, the present invention provides a substrate support having a concave portion into which a thin circuit board is fitted, and a semiconductor device mounting area fixed on the substrate support to cover the thin circuit board. A circuit board holding device comprising a substrate fixing lid having an opening provided thereon, and a substrate mounting plate having a flat upper surface provided via an elastic body on a bottom surface of the concave portion of the substrate support base. A semiconductor, wherein the thin circuit board mounted on the board mounting plate is pressed flat against the board fixing lid by the elastic body and fixed flat, and the semiconductor element mounting area is mounted on the semiconductor element mounting area. A circuit board holding device which is substantially parallel to an electrode forming surface of an element. In this way, the substrate mounting plate having the flat surface provided on the bottom surface of the concave portion of the substrate supporting base presses the thin circuit board against the substrate fixing lid and fixes the circuit board. It is possible to prevent the occurrence of tightening stress acting on the thin circuit board as in the case where the thin circuit board is sandwiched and fixed between the cover and the lid. Therefore, it is possible to easily fix the thin circuit board flat without causing warpage or the like in the thin circuit board. In addition, since the substrate mounting plate is provided on the bottom surface of the concave portion of the substrate support via an elastic body, it is possible to fix even a thin circuit board having a slightly different film thickness using the same holding device. As described above, it is not necessary to prepare a plurality of substrate supports having concave portions having a depth corresponding to the thickness of the thin circuit board.
【０００７】上記弾性体は、バネであることが好まし
い。比較的に簡単な構造で基板搭載板を基板固定蓋に押
し付けて固定することが可能だからである。Preferably, the elastic body is a spring. This is because the substrate mounting plate can be pressed against the substrate fixing lid and fixed with a relatively simple structure.
【０００８】上記基板固定蓋は、ネジを用いて上記基板
支持台に固定されることが好ましい。ネジを用いること
により基板支持台と基板固定蓋とを固定するのが、最も
容易かつ確実であるが、従来構造の回路基板保持装置で
は、ネジの使用が困難であった。これに対して、本発明
では、ネジを用いた固定が容易に行え、作業性の向上を
図ることが可能となる。It is preferable that the substrate fixing lid is fixed to the substrate support using screws. It is easiest and most reliable to fix the substrate support base and the substrate fixing lid by using screws, but it has been difficult to use screws in the conventional circuit board holding device. On the other hand, in the present invention, fixation using screws can be easily performed, and workability can be improved.
【０００９】少なくとも上記薄型回路基板と接触する部
分が、絶縁材料または表面が絶縁処理された金属材料か
らなることが好ましい。かかる回路基板保持装置を用い
ることにより、回路基板保持装置に固定したままで、薄
型回路基板の導通検査が可能となるからである。It is preferable that at least a portion in contact with the thin circuit board is made of an insulating material or a metal material whose surface is insulated. By using such a circuit board holding device, a continuity test of a thin circuit board can be performed while being fixed to the circuit board holding device.
【００１０】また、本発明は、基板支持台に設けた凹部
に薄型回路基板をはめ込み、該薄型回路基板の半導体素
子実装領域上に開口部を設けた基板固定蓋を上記薄型回
路基板を覆うように上記基板支持台上に載置し、上記半
導体素子実装領域に半導体素子をフリップチップ実装す
る半導体装置の製造方法であって、上記基板支持台の凹
部底面上に弾性体を介して設けられ、平坦な上面を備え
た基板搭載板上に上記薄型回路基板を搭載し、上記弾性
体により上記薄型回路基板を上記基板固定蓋に、押し付
けながら上記基板支持台上に上記基板固定蓋を固定する
ことにより、上記半導体素子実装領域と該半導体素子実
装領域に実装される半導体素子の電極形成面とが略平行
になるように上記薄型回路基板を平坦に固定し、上記半
導体素子実装領域に上記半導体素子を実装することを特
徴とする半導体装置の製造方法でもある。かかる方法を
用いることにより、薄型回路基板を反り等のない状態で
固定することができ、半導体素子のフリップチップ実装
工程における接続不良の発生を低減することが可能とな
る。Further, according to the present invention, a thin circuit board is fitted into a concave portion provided on a substrate support base, and a substrate fixing lid provided with an opening on a semiconductor element mounting region of the thin circuit board covers the thin circuit board. A method of manufacturing a semiconductor device in which the semiconductor device is flip-chip mounted on the semiconductor element mounting area, the semiconductor element being mounted on the substrate support, provided on the bottom surface of the concave portion of the substrate support via an elastic body, Mounting the thin circuit board on a board mounting plate having a flat upper surface, and fixing the substrate fixing lid on the substrate support while pressing the thin circuit board against the substrate fixing lid by the elastic body; Thus, the thin circuit board is fixed flat so that the semiconductor element mounting area and the electrode forming surface of the semiconductor element mounted on the semiconductor element mounting area are substantially parallel to each other. It is also a method of manufacturing a semiconductor device characterized by mounting the semiconductor element. By using such a method, the thin circuit board can be fixed without warping or the like, and the occurrence of connection failure in the flip chip mounting step of the semiconductor element can be reduced.
【００１１】また、本発明は、上記半導体素子を実装し
た後に、上記薄型回路基板と上記半導体装置との間に封
止樹脂を充填することを特徴とする半導体装置の製造方
法でもある。特に、かかる樹脂封止工程を備えることに
より、半導体素子実装後に発生する接続不良を低減する
ことが可能となる。Further, the present invention is also a method of manufacturing a semiconductor device, characterized by filling a sealing resin between the thin circuit board and the semiconductor device after mounting the semiconductor element. In particular, by providing such a resin sealing step, it is possible to reduce connection failures that occur after mounting the semiconductor element.
【００１２】[0012]
【発明の実施の形態】本発明の実施の形態に関して、図
１〜３を参照しながら説明する。図１は、本発明の実施
の形態にかかる回路基板保持装置２の断面図であり、か
かる回路基板保持装置２の上面図は、図６（ａ）と同じ
形態となる。本発明の実施の形態にかかる回路基板保持
装置２は、薄型回路基板１がはめ込まれる凹部２ｅを設
けた基板支持台２ａと、基板支持台上２ａに固定され、
薄型回路基板１の半導体素子実装領域上に開口部２ｇを
設けた基板固定蓋２ｂとからなる。基板支持台２ａと基
板固定蓋２ｂとは、ネジ２ｃにより固定される。基板支
持台２ａの凹部の底面上に、平坦な上面を備えた基板搭
載板２ｆが、複数のバネ２ｄを介して設けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of a circuit board holding device 2 according to an embodiment of the present invention, and a top view of the circuit board holding device 2 has the same form as FIG. 6A. A circuit board holding device 2 according to an embodiment of the present invention is fixed to a board support 2a provided with a concave portion 2e into which the thin circuit board 1 is fitted, and a board support 2a,
A substrate fixing lid 2b provided with an opening 2g on the semiconductor element mounting region of the thin circuit board 1; The substrate support 2a and the substrate fixing lid 2b are fixed by screws 2c. On the bottom surface of the concave portion of the substrate support 2a, a substrate mounting plate 2f having a flat upper surface is provided via a plurality of springs 2d.
【００１３】本実施の形態にかかる回路基板保持装置２
は、以下のようにして用いられる。まず、薄型回路基板
１は、基板支持台２ａの凹部２ｅにバネ２ｄを介して設
けられた基板搭載板２ｆ上に、半導体素子実装領域１ａ
を上向きにして配置する。次に、その上から、基板固定
蓋２ｂに設けた開口部２ｇが、薄型回路基板１の実装領
域１ａ上に位置するように基板固定蓋２ｂを載置する。
次に、基板支持台２ａ、基板固定蓋２ｂの外周部に設け
たネジ穴にネジ２ｃを差し込み、ネジ２ｃを締め込むこ
とによって、基板支持台２ａと基板固定蓋２ｂとを固定
する。ここで、凹部２ｅの深さは、バネ２ｄ上の基板搭
載板２ｆに薄型回路基板１を搭載した高さよりやや浅く
形成されているため、基板支持台２ａ上に基板固定蓋２
ｂを固定した場合、薄型回路基板１は、バネ２ｄにより
基板固定蓋２ｂに押し付けられ、反り等がない平坦な状
態で回路基板保持装置２に固定されることとなる。特
に、本実施の形態にかかる回路基板保持装置２では、ネ
ジ２ｃを締め込んでも、従来の装置（図６）のように薄
型回路基板１にはネジ２ｃからの回転応力はかからず、
かかる応力により薄型回路基板１が反ることなく、平坦
な状態で固定される。Circuit board holding device 2 according to the present embodiment
Is used as follows. First, the thin circuit board 1 is provided with a semiconductor element mounting area 1a on a board mounting plate 2f provided in a recess 2e of a board support 2a via a spring 2d.
Is placed face up. Next, the substrate fixing lid 2b is placed from above so that the opening 2g provided in the substrate fixing lid 2b is positioned on the mounting area 1a of the thin circuit board 1.
Next, screws 2c are inserted into screw holes provided in the outer peripheral portions of the substrate support 2a and the substrate fixing lid 2b, and the screws 2c are tightened to fix the substrate support 2a and the substrate fixing lid 2b. Here, the depth of the concave portion 2e is formed to be slightly shallower than the height at which the thin circuit board 1 is mounted on the substrate mounting plate 2f on the spring 2d.
When b is fixed, the thin circuit board 1 is pressed against the board fixing lid 2b by the spring 2d, and is fixed to the circuit board holding device 2 in a flat state without warpage or the like. In particular, in the circuit board holding device 2 according to the present embodiment, even when the screw 2c is tightened, the thin circuit board 1 is not subjected to the rotational stress from the screw 2c unlike the conventional device (FIG. 6).
The thin circuit board 1 is fixed in a flat state without warping due to such stress.
【００１４】図２は、本実施の形態にかかる回路基板保
持装置２に薄型回路基板１を固定した場合の基板の反り
量の変化を示す。図２（ａ）は固定前における反り量の
分布、図２（ｂ）は固定後における反り量の分布であ
り、横軸に薄型回路基板１の反り量（μｍ）、縦軸にそ
の分布（％）を表す。また、薄型回路基板１には、厚さ
０．６５ｍｍのガラスエポキシ基板を用い、反り量は、
薄型回路基板１の半導体素子実装領域１ａ内において測
定した。図２から明らかなように、回路基板保持装置２
を用いて薄型回路基板１を固定することにより、固定前
は１０〜２０μｍを中心に分布していた反りの分布が、
１０μｍ以下を中心に分布するようになり、薄型回路基
板１の半導体素子実装領域１ａ内における反り量を低減
することが可能となる。また、上記結果は、基板支持台
と基板固定蓋とのネジの締め付けによる固定を、特にト
ルクドライバー等により慎重に行うことなく得られたも
のであり、かかる固定手段が量産工程に応用できること
がわかる。FIG. 2 shows a change in the amount of warpage of the board when the thin circuit board 1 is fixed to the circuit board holding device 2 according to the present embodiment. 2A shows the distribution of the amount of warpage before fixing, and FIG. 2B shows the distribution of the amount of warpage after fixing. The horizontal axis indicates the amount of warpage (μm) of the thin circuit board 1 and the vertical axis indicates the distribution ( %). A 0.65 mm thick glass epoxy substrate is used for the thin circuit board 1, and the amount of warpage is
The measurement was performed in the semiconductor element mounting area 1a of the thin circuit board 1. As is clear from FIG. 2, the circuit board holding device 2
By fixing the thin circuit board 1 by using, the distribution of the warp that was distributed around 10 to 20 μm before fixing is
The distribution is centered on 10 μm or less, and the amount of warpage in the semiconductor element mounting region 1a of the thin circuit board 1 can be reduced. In addition, the above results were obtained without carefully tightening the screws between the substrate support base and the substrate fixing lid, especially with a torque driver or the like, and it can be seen that such fixing means can be applied to the mass production process. .
【００１５】このように、薄型回路基板１が平坦となる
ように、回路基板保持装置２を用いて薄型回路基板１を
固定した後、薄型回路基板１の半導体実装領域１ａに、
導電性接着剤を塗布した半導体素子３をフェイスダウン
でフリップチップ実装する。その後、１３０℃のオーブ
ンに入れて導電性接着剤を硬化させ、半導体素子３を固
定する。図３（ａ）は、回路基板保持装置２に平坦な状
態に固定された薄型回路基板１の半導体素子実装領域１
ａに、半導体素子３をフリップチップ実装した状態にお
ける断面図である。また、図３（ｂ）は、図３（ａ）に
おける薄型回路基板１と半導体素子３との接続部分の拡
大図である。半導体素子３上に設けられたアルミ電極端
子３ａ上に、バンプ（突起電極）４が形成され、かかる
バンプ４と薄型回路基板１上に形成された入出力電極端
子１ｂが、導電性接着剤５により接合される。ここで、
従来の保持装置（図６）で薄型回路基板１を固定した場
合は、薄型回路基板１の半導体素子実装領域１ａの表面
の平坦性が良くないために、半導体素子３の実装時に、
導電性接着剤５が回路基板１上の入出力電極端子１ｂに
届かない箇所が発生したり、導電性接着剤５の硬化時に
薄型回路基板１の熱変形によって接合部分が離れたりす
ることにより、接続不良が発生していた。これに対し
て、本実施の形態にかかる回路基板保持装置２を用いる
ことにより、かかる接合不良のない半導体素子３の実装
が可能となる。After the thin circuit board 1 is fixed by using the circuit board holding device 2 so that the thin circuit board 1 becomes flat, the semiconductor mounting area 1a of the thin circuit board 1 is
The semiconductor element 3 coated with the conductive adhesive is flip-chip mounted face down. After that, the semiconductor device 3 is fixed by placing it in an oven at 130 ° C. to cure the conductive adhesive. FIG. 3A shows a semiconductor element mounting area 1 of a thin circuit board 1 fixed to a circuit board holding device 2 in a flat state.
4A is a cross-sectional view in a state where the semiconductor element 3 is flip-chip mounted. FIG. 3B is an enlarged view of a connection portion between the thin circuit board 1 and the semiconductor element 3 in FIG. A bump (projection electrode) 4 is formed on an aluminum electrode terminal 3 a provided on the semiconductor element 3, and the bump 4 and the input / output electrode terminal 1 b formed on the thin circuit board 1 are connected to a conductive adhesive 5. Are joined. here,
When the thin circuit board 1 is fixed by the conventional holding device (FIG. 6), the flatness of the surface of the semiconductor element mounting region 1a of the thin circuit board 1 is not good, so that when the semiconductor element 3 is mounted,
A portion where the conductive adhesive 5 does not reach the input / output electrode terminals 1b on the circuit board 1 is generated, or a joint portion is separated due to thermal deformation of the thin circuit board 1 when the conductive adhesive 5 is cured. A connection failure has occurred. On the other hand, by using the circuit board holding device 2 according to the present embodiment, it is possible to mount the semiconductor element 3 without such a bonding failure.
【００１６】導電性接着剤５が硬化した後、図３（ｂ）
に示す半導体素子３と薄型回路基板１の表面との間に封
止材料を注入し（図示せず）、１３０℃のオーブンで加
熱して硬化させる。かかる封止材料を塗布、硬化させる
ことにより、半導体素子３と薄型回路基板１との接着力
が高くなり、回路基板保持装置２から薄型回路基板１を
外しても薄型回路基板１の反り等による接合箇所のはず
れが発生しなくなる。かかる封止樹脂としては、シリカ
（ＳｉＯ2）やアルミナ（Ａｌ2Ｏ3）などの無機物フィ
ラを含有したエポキシ系の封止樹脂を用いることが好ま
しい。尚、本実施の形態では、基板支持台２ａと基板搭
載板２ｆとの間にバネ２ｄを設けたが、基板固定蓋２ｂ
と基板搭載板２ｆとの間にバネ２ｄを設けても良い。ま
た、回路基板保持装置２の材質にはステンレス鋼ＳＵＳ
−３０４を用いたが、銅、アルミニウムなどの他の金属
材料を用いても良く、また、アルミナなどのセラミック
材料を用いても良い。特に、少なくとも上記薄型回路基
板と接触する部分を、絶縁材料または表面が絶縁処理さ
れた金属材料から形成することにより、回路基板保持装
置２に固定したままで薄型回路基板１の導通検査を行う
ことができ、生産性を向上させることが可能となる。ま
た、本実施の形態にかかる固定手段は、樹脂基板、樹脂
およびガラスから構成される基板、セラミック基板等の
薄型回路基板１に適用可能である。After the conductive adhesive 5 has hardened, FIG.
A sealing material is injected (not shown) between the semiconductor element 3 and the surface of the thin circuit board 1 shown in FIG. By applying and curing such a sealing material, the adhesive force between the semiconductor element 3 and the thin circuit board 1 is increased, and even if the thin circuit board 1 is detached from the circuit board holding device 2, the thin circuit board 1 may be warped. The joint portion does not come off. As such a sealing resin, it is preferable to use an epoxy-based sealing resin containing an inorganic filler such as silica (SiO 2 ) or alumina (Al 2 O 3 ). In the present embodiment, the spring 2d is provided between the substrate support 2a and the substrate mounting plate 2f.
A spring 2d may be provided between and the substrate mounting plate 2f. The material of the circuit board holding device 2 is stainless steel SUS.
Although −304 is used, other metal materials such as copper and aluminum may be used, and a ceramic material such as alumina may be used. In particular, by conducting a continuity test of the thin circuit board 1 while being fixed to the circuit board holding device 2 by forming at least a portion in contact with the thin circuit board from an insulating material or a metal material whose surface is insulated. And productivity can be improved. Further, the fixing means according to the present embodiment is applicable to a thin circuit board 1 such as a resin substrate, a substrate made of resin and glass, and a ceramic substrate.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
にかかる回路基板保持装置を用いることにより、基板支
持台と基板固定蓋との間に薄型回路基板を挟み込んで固
定する場合のような、固定時に薄型回路基板に働く応力
の発生を防止することができ、薄型回路基板に反り等を
発生させることなく、平坦な状態で、薄型回路基板を固
定することが可能となる。従って、大量生産工程におい
ても、かかる回路基板保持装置を用いることによって容
易に平坦な状態で薄型回路基板を固定でき、高品質の半
導体装置の量産が可能となる。As is apparent from the above description, by using the circuit board holding device according to the present invention, it is possible to fix the thin circuit board between the board support and the board fixing lid. In addition, the generation of stress acting on the thin circuit board during fixing can be prevented, and the thin circuit board can be fixed in a flat state without causing warpage or the like in the thin circuit board. Therefore, even in a mass production process, by using such a circuit board holding device, a thin circuit board can be easily fixed in a flat state, and mass production of a high-quality semiconductor device becomes possible.
【００１８】また、基板搭載板は、基板支持台の凹部底
面上に弾性体を介して設けられているため、膜厚が多少
異なる薄型回路基板でも同一の保持装置を用いて固定す
ることが可能となり、従来のように薄型回路基板の膜厚
に対応した深さの凹部を備えた複数の基板支持台を準備
することが不要となる。従って、一の基板支持台で、複
数の種類の薄型回路基板に対応することが可能となり、
半導体装置の製造コストの低減が可能となる。Further, since the substrate mounting plate is provided on the bottom surface of the concave portion of the substrate support via an elastic body, it is possible to fix even a thin circuit board having a slightly different film thickness using the same holding device. As a result, it is not necessary to prepare a plurality of substrate supports having concave portions having a depth corresponding to the thickness of the thin circuit board as in the related art. Therefore, it is possible to support a plurality of types of thin circuit boards with one board support,
The manufacturing cost of the semiconductor device can be reduced.
【図１】 本発明の実施の形態にかかる回路基板保持装
置の断面図である。FIG. 1 is a sectional view of a circuit board holding device according to an embodiment of the present invention.
【図２】 （ａ） 固定前における薄型回路基板の反り
量の分布である。（ｂ） 固定後における薄型回路基板
の反り量の分布である。FIG. 2 (a) is a distribution of the amount of warpage of a thin circuit board before fixing. (B) Distribution of the amount of warpage of the thin circuit board after fixing.
【図３】 （ａ） 本発明の実施の形態にかかる回路基
板保持装置の断面図である。（ｂ） 接続部の拡大図で
ある。FIG. 3A is a cross-sectional view of a circuit board holding device according to an embodiment of the present invention. (B) It is an enlarged view of a connection part.
【図４】 薄型回路基板と半導体素子の接続部の断面図
である。FIG. 4 is a cross-sectional view of a connection portion between a thin circuit board and a semiconductor element.
【図５】 従来の回路基板保持装置を用いた場合の問題
点を示す図である。FIG. 5 is a diagram showing a problem when a conventional circuit board holding device is used.
【図６】 （ａ） 従来の回路基板保持装置の上面図で
ある。（ｂ） Ａ−Ａ’における断面図である。FIG. 6A is a top view of a conventional circuit board holding device. (B) It is sectional drawing in AA '.
１ 薄型回路基板、１ａ 半導体素子実装領域、１ｂ
入出力端子電極、２回路基板保持装置、２ａ 基板支持
台、２ｂ 基板固定蓋、２ｃ ネジ、２ｄバネ、２ｅ
凹部、２ｆ 基板搭載板、２ｇ 開口部、３ 半導体素
子、３ａアルミ電極端子、４ バンプ（突起電極）、５
導電性接着剤。1 Thin circuit board, 1a Semiconductor element mounting area, 1b
I / O terminal electrode, 2 circuit board holding device, 2a board support, 2b board fixing cover, 2c screw, 2d spring, 2e
Recess, 2f substrate mounting plate, 2g opening, 3 semiconductor element, 3a aluminum electrode terminal, 4 bump (projection electrode), 5
Conductive adhesive.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 嘉文 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 小野 正浩 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 別所 芳宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshifumi Nakamura 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Yoshihiro Bessho 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (6)
た基板支持台と、該基板支持台上に上記薄型回路基板を
覆うように固定され、上記薄型回路基板の半導体素子実
装領域上に開口部が設けられた基板固定蓋と、からなる
回路基板保持装置が、 上記基板支持台の上記凹部の底面上に、弾性体を介して
設けられた平坦な上面を有する基板搭載板を備え、 上記基板搭載板上に搭載された上記薄型回路基板が、上
記弾性体によって上記基板固定蓋に押し付けられて平坦
に固定され、上記半導体素子実装領域を該半導体素子実
装領域に実装される半導体素子の電極形成面に対して略
平行にしたことを特徴とする回路基板保持装置。A substrate support provided with a recess into which the thin circuit board is fitted; and a fixing portion fixed on the substrate support to cover the thin circuit board, and an opening formed on a semiconductor element mounting area of the thin circuit board. A circuit board holding device comprising: a substrate fixing cover provided with a substrate mounting plate having a flat upper surface provided via an elastic body on a bottom surface of the concave portion of the substrate support base; The thin circuit board mounted on the mounting plate is pressed flat against the substrate fixing lid by the elastic body and is fixed flat, and the semiconductor element mounting area is formed on the semiconductor element mounting area. A circuit board holding device characterized by being substantially parallel to a surface.
する請求項１に記載の回路基板保持装置。2. The circuit board holding device according to claim 1, wherein the elastic body is a spring.
板支持台に固定されることを特徴とする請求項１に記載
の回路基板保持装置。3. The circuit board holding device according to claim 1, wherein the board fixing lid is fixed to the board support using a screw.
部分が、絶縁材料または表面が絶縁処理された金属材料
からなることを特徴とする請求項１に記載の回路基板保
持装置。4. The circuit board holding device according to claim 1, wherein at least a portion in contact with the thin circuit board is made of an insulating material or a metal material whose surface is insulated.
をはめ込み、該薄型回路基板の半導体素子実装領域上に
開口部を設けた基板固定蓋を上記薄型回路基板を覆うよ
うに上記基板支持台上に載置し、上記半導体素子実装領
域に半導体素子をフリップチップ実装する半導体装置の
製造方法であって、 上記基板支持台の凹部底面上に弾性体を介して設けら
れ、平坦な上面を備えた基板搭載板上に上記薄型回路基
板を搭載し、上記弾性体により上記薄型回路基板を上記
基板固定蓋に、押し付けながら上記基板支持台上に上記
基板固定蓋を固定することにより、上記半導体素子実装
領域と該半導体素子実装領域に実装される半導体素子の
電極形成面とが略平行になるように上記薄型回路基板を
平坦に固定し、上記半導体素子実装領域に上記半導体素
子を実装することを特徴とする半導体装置の製造方法。5. A thin circuit board is fitted into a concave portion provided on a substrate support base, and a substrate fixing cover provided with an opening on a semiconductor element mounting region of the thin circuit board is provided on the substrate support so as to cover the thin circuit board. A method of manufacturing a semiconductor device in which a semiconductor device is mounted on a base and flip-chip mounted with a semiconductor element in the semiconductor element mounting area, wherein the flat surface is provided on a bottom surface of a concave portion of the substrate support base via an elastic body. By mounting the thin circuit board on a substrate mounting plate provided, and fixing the substrate fixing lid on the substrate support base while pressing the thin circuit board against the substrate fixing lid with the elastic body, the semiconductor The thin circuit board is fixed flat so that an element mounting area and an electrode forming surface of a semiconductor element mounted on the semiconductor element mounting area are substantially parallel to each other, and the semiconductor element is mounted on the semiconductor element mounting area. The method of manufacturing a semiconductor device characterized by implementing.
型回路基板と上記半導体装置との間に封止樹脂を充填す
ることを特徴とする請求項５に記載の半導体装置の製造
方法。6. The method according to claim 5, wherein a sealing resin is filled between the thin circuit board and the semiconductor device after mounting the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31722097A JPH11150154A (en) | 1997-11-18 | 1997-11-18 | Circuit board holding device and manufacture of semiconductor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31722097A JPH11150154A (en) | 1997-11-18 | 1997-11-18 | Circuit board holding device and manufacture of semiconductor device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11150154A true JPH11150154A (en) | 1999-06-02 |
Family
ID=18085826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31722097A Withdrawn JPH11150154A (en) | 1997-11-18 | 1997-11-18 | Circuit board holding device and manufacture of semiconductor device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11150154A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100789542B1 (en) | 2006-10-16 | 2008-01-21 | 삼성전기주식회사 | Support device of table for substrate printing |
| WO2008106620A1 (en) * | 2007-02-28 | 2008-09-04 | Finisar Corporation | Printed circuit board positioning mechanism |
| US8129630B2 (en) | 2007-02-28 | 2012-03-06 | Finisar Corporation | Angular seam for an electronic module |
| WO2016199219A1 (en) * | 2015-06-09 | 2016-12-15 | 日産自動車株式会社 | Mechanically and electrically integrated rotating electric machine device |
-
1997
- 1997-11-18 JP JP31722097A patent/JPH11150154A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100789542B1 (en) | 2006-10-16 | 2008-01-21 | 삼성전기주식회사 | Support device of table for substrate printing |
| WO2008106620A1 (en) * | 2007-02-28 | 2008-09-04 | Finisar Corporation | Printed circuit board positioning mechanism |
| US7507034B2 (en) | 2007-02-28 | 2009-03-24 | Finisar Corporation | Printed circuit board positioning mechanism |
| US8129630B2 (en) | 2007-02-28 | 2012-03-06 | Finisar Corporation | Angular seam for an electronic module |
| US8356728B2 (en) | 2007-02-28 | 2013-01-22 | Finisar Corporation | Rotatable top shell |
| TWI387411B (en) * | 2007-02-28 | 2013-02-21 | Finisar Corp | Printed circuit board positioning mechanism |
| WO2016199219A1 (en) * | 2015-06-09 | 2016-12-15 | 日産自動車株式会社 | Mechanically and electrically integrated rotating electric machine device |
| JPWO2016199219A1 (en) * | 2015-06-09 | 2018-03-15 | 日産自動車株式会社 | Mechanical and electric integrated rotating electrical machine |
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