JPH11129373A - Conductive heat shrinkable laminate film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat shrinkable film obtained by laminating a novel antistatic composition. SOLUTION: A conductive layer containing 100 pts.wt. of a sulfonated polyaniline including an alkoxy group substituted aminobenzenesulfonic acid as a main component, 10 to 2000 pts.wt. of a water soluble or water dispersible copolymerized polyester bonded with a sulfonic acid group and/or its alkali metal salt, and 0.001 to 1000 pts.wt. of a nonionic surfactant is laminated at least on one side surface of a heat shrinkable film having a heat shrinkage factor larger by 30% in one direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive heat-shrinkable laminated film, and more particularly to a heat-shrinkable polyester film having excellent antistatic properties and conductivity even under low humidity, especially a heat-shrinkable polyester film. , Specifically, industrial films and tubes such as shielding materials, printing materials, etc .; building material coating materials, mounted circuit boards, ICs
-Packaging films such as LSI packages, shrink labels, and shrink packaging films.

[0002]

2. Description of the Related Art Conventionally, shrinkable films using polyester, nylon, polyethylene, polypropylene, polyvinyl chloride, polystyrene, etc. have been used for packaging films,
It is used in large quantities and in a wide range as industrial films. Synthetic resins used in these films are generally hydrophobic, and static electricity is likely to be generated on the surface of the structure formed of the synthetic resin, and sticking to the same structure or other articles may occur. , Dust and the like easily adhere to the surface, causing various troubles. Generally, a surfactant is used as an antistatic agent for films, packaging materials, and the like. However, a surfactant has a sufficient surface resistance (10 ¹⁰ Ω / □ or less) to suppress the adhesion of dust, dust, and the like.
Not only is not obtained, but also the antistatic ability is liable to change under the influence of surrounding moisture and moisture. In particular, there is a disadvantage that the surface resistance of the film, which has been reduced by the surfactant, is significantly increased under low humidity, and the desired antistatic ability cannot be obtained. As a result, dust adheres to the film and the surface of the packaging material, causing various troubles. Diversified today's technology, even under low humidity environment are becoming sought no film of static disorders, that in order under low humidity 10 ¹²
The appearance of an antistatic agent giving a surface resistance value of Ω / □ or less is desired. As a material giving such a low surface resistance value, conductive polymers such as polyaniline and polypyrrole are known. Both are soluble in a specific organic solvent, but are insoluble or indispensable in water or a mixed solvent of water / alcohol, so that a method of bonding a sulfonic acid group to an aromatic ring has been performed, and Therefore, a method of mixing a water-soluble or water-dispersible resin has been used since sufficient film characteristics cannot be obtained. However, when a resin having good compatibility with sulfonated polyaniline is used, a predetermined surface resistance value is not obtained. On the contrary, when a predetermined surface resistance value is obtained, the surface becomes cloudy and the original transparency of the film is impaired. The problem had arisen.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of intensive studies focusing on the above-mentioned problems, and an object thereof is to provide an antistatic device which has sufficient antistatic properties even under low humidity. It is an object of the present invention to provide an inexpensive thermoplastic film having the ability to simultaneously have heat shrinkability and not completely losing transparency.

[0004]

According to the present invention, 100 parts by weight of a polyaniline and / or a sulfonated polyaniline containing an alkoxy-substituted aminobenzenesulfonic acid as a main component, at least one side of a heat-shrinkable film, Alternatively, a conductive layer comprising 10 to 2000 parts by weight of a water-soluble or water-dispersible copolymerized polyester bonded with the alkali metal base and 0.001 to 1000 parts by weight of a surfactant is laminated. The present invention relates to a conductive heat-shrinkable laminated film.

[0005] The heat shrinkable film in the present invention includes:
What is heat-shrinkable in uniaxial or biaxial direction, polyester, nylon, polyvinyl chloride, polypropylene, polyethylene, a single polymer such as polystyrene, or a mixture thereof, having a copolymer component, They may be stacked. Further, a void-containing heat-shrinkable film obtained by at least uniaxially stretching a sheet obtained by mixing the thermoplastic resin incompatible with the heat-shrinkable film material may be used.

[0006] As the sulfonated polyaniline in the present invention, a sulfonated aniline copolymer containing an alkoxy group-substituted aminobenzenesulfonic acid as a main component is suitable as a basic material of the conductive composition of the present invention. Sulfonic acid is preferred. Further, from the viewpoint of improving the coatability, spreadability, and hardness of the coated body of the conductive composition of the present invention, the co-use of the copolymerized polyester containing 5-sulfoisophthalic acid unit in an amount of 4 mol% to 10 mol% is further preferred. It is suitable. Here, specific examples of aminoanisolesulfonic acids include 2-aminoanisole-3-sulfonic acid, 2-aminoanisole-4-sulfonic acid, 2-aminoanisole-5-sulfonic acid, and 2-aminoanisole-6-. Sulfonic acid, 3-aminoanisole-2-sulfonic acid, 3-aminoanisole-4-sulfonic acid, 3-aminoanisole-5-sulfonic acid, 3-aminoanisole-6-sulfonic acid, 4-aminoanisole-2- Sulfonic acid, 4-aminoanisole-3-sulfonic acid and the like can be mentioned. It is also possible to use a compound in which the methoxy group of anisole is substituted by an alkoxy group such as an ethoxy group or an iso-propoxy group. However, 2-aminoanisole-3-sulfonic acid 2-aminoanisole-
4-sulfonic acid, 2-aminoanisole-5-sulfonic acid, 2-aminoanisole-6-sulfonic acid, 3-aminoanisole-2-sulfonic acid, 3-aminoanisole-4-sulfonic acid, 3-aminoanisole- 6-sulfonic acid is preferably used. A sulfonated polyaniline copolymer containing aminoanisolesulfonic acid as a main component is used as one component of the laminated film of the present invention. As described above, in the sulfonated polyaniline copolymer used in the present invention, the sulfonic acid group accounts for 70% or more, preferably 80% or more, more preferably 100%, based on the aromatic ring. In addition, there is no problem for the purpose of the present invention, even if aromatic rings containing a sulfonic acid group and aromatic rings not containing a sulfonic acid group are mixed or alternately arranged. If the sulfonic acid group content of the sulfonated polyaniline copolymer is less than 70%, the solubility or dispersibility of the copolymer in water, alcohol or a mixed solvent system thereof becomes insufficient, and as a result, The applicability and spreadability to the substrate deteriorate, and the conductivity of the resulting applied film tends to be significantly reduced. The number average molecular weight of the sulfonated polyaniline copolymer used in the present invention is 300 to 50.
0000 and 1,000 or more are preferable in view of solubility in the solvent and strength of the coating film. The use ratio of the sulfonated polyaniline copolymer is 0.01 to 100 parts by weight of the solvent.
-10 parts by weight, preferably 0.1-2 parts by weight. When the use ratio of the sulfonated polyaniline copolymer is less than 0.01 part by weight, the long-term storage property of the solution is deteriorated, pinholes are easily generated on the surface coat layer, and the conductivity of the coated surface is significantly deteriorated. On the other hand, if the use ratio exceeds 10 parts by weight, the solubility and dispersibility of the copolymer in water or a water / organic solvent system and the coatability of the coat layer tend to deteriorate, which is not preferable. As the solvent, any organic solvent can be used as long as it does not dissolve or swell a substrate such as a polyester film, but it is preferable to use a mixed solvent with water or an organic solvent such as water / alcohol in terms of use environment. In addition, the coatability to the support and the conductivity may be improved. Organic solvents include alcohols such as methanol, ethanol, propanol and isopropyl alcohol; ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone; cellosolves such as methyl cellosolve and ethyl cellosolve; propylene glycols such as methyl propylene glycol and ethyl propylene glycol. And amides such as dimethylformamide and dimethylacetamide, and pyrrolidones such as N-methylpyrrolidone and N-ethylpyrrolidone are preferably used. These are used by being mixed with water at an arbitrary ratio. As examples of this, specifically, water / methanol, water /
Ethanol, water / propanol, water / isopropanol, water / methylpropylene glycol, water / ethylpropylene glycol and the like can be mentioned. The ratio used is preferably water / organic solvent = 1/10 to 10/1.

The copolyester (hereinafter referred to as a sulfonic acid group-containing copolyester) to which at least one group selected from the group consisting of a sulfonic acid group and an alkali metal base thereof is used in the present invention is a dicarboxylic acid. A polyester in which at least one group selected from the group consisting of a sulfonic acid group and an alkali metal base thereof is bonded to a part of an acid component and / or a glycol component. An aromatic dicarboxylic acid component containing at least one group selected from the group,
Copolymerized polyester prepared and used at a ratio of 0 mol% is preferable in that the conductive heat-shrinkable laminated film of the present invention has a high surface hardness. As an example of such a dicarboxylic acid, 5-sodium sulfoisophthalic acid is preferred.

Other dicarboxylic acid components include terephthalic acid, isophthalic acid, phthalic acid, p-β-oxyethoxybenzoic acid, 2,6-naphthalenedicarboxylic acid,
4'-dicarboxydiphenyl, 4,4'-dicarboxybenzophenone, bis (4-carboxyphenyl) ethane, adipic acid, sebacic acid, cyclohexane-1,
4-dicarboxylic acid and the like. From the viewpoint of improving the surface hardness of the conductive heat-shrinkable laminated film of the present invention, terephthalic acid and isophthalic acid are preferred.

As the glycol component for preparing the copolymerized polyester, ethylene glycol is mainly used. In addition, propylene glycol, butanediol, neopentyl glycol, diethylene glycol, cyclohexanedimethanol, and ethylene oxide adduct of bisphenol A are also used. , Polyethylene glycol,
Polypropylene glycol, polytetramethylene glycol and the like can be used. Among them, the use of ethylene glycol, propylene glycol, butanediol, neopentyl glycol, ethylene glycol, cyclohexane dimethanol, or the like as a copolymer component is preferred in that compatibility with the sulfonated polyaniline is improved.

In addition, the copolymer component may contain a small amount of a dicarboxylic acid component or a glycol component containing an amide bond, a urethane bond, an ether bond, a carbonate bond or the like. Further to improve the surface hardness of the coating film obtained by applying the obtained conductive layer of the present invention to the substrate, trimellitic acid, trimesic acid, pyromellitic acid, trimellitic anhydride, such as pyromellitic anhydride It is also possible to use a polycarboxy group-containing monomer in a proportion of 5 mol% or less as a copolymer component of the polyester. If it exceeds 5 mol%, the resulting sulfonic acid group-containing copolymerized polyester becomes thermally unstable and easily gelates,
It is not preferable as a component of the conductive layer of the present invention.

The above-mentioned sulfonic acid group-containing copolymerized polyester is subjected to a transesterification reaction, a polycondensation reaction, or the like, using, for example, the above-mentioned dicarboxylic acid component, the above-mentioned glycol component, and if necessary, the above-mentioned polycarboxylic acid-containing monomer. It is obtained by performing a reaction or the like. The obtained sulfonic acid group-containing copolymerized polyester is heated and stirred with a solvent such as n-tyl cellosolve, and can be used as an aqueous solution or a water solution by gradually adding water while stirring.

The content of the sulfonic acid group-containing copolymerized polyester is preferably 50 to 2 parts per 100 parts by weight of polyaniline and / or sulfonated polyaniline, based on the conductivity and mechanical properties of the resulting conductive heat-shrinkable laminated film.
000 parts by weight, more preferably 100 to 1
500 parts by weight, most preferably 200 to 1000 parts by weight.

The conductive layer of the present invention is usually dissolved or dispersed in a solvent and applied to a desired substrate surface. As the solvent used here, any organic solvent can be used as long as it does not dissolve or swell the substrate (eg, a polyester film or the like). The use of water or a mixed solvent of water and an organic solvent is not only preferable in terms of use environment, but also sometimes improves the antistatic property of the obtained conductive heat-shrinkable laminated film of the present invention.

Examples of the organic solvent include alcohols such as methanol, ethanol, propanol and isopropanol, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, cellosolves such as methyl cellosolve and ethyl cellosolve, methyl propylene glycol and ethyl propylene. Propylene glycols such as glycol; amides such as dimethylformamide and dimethylacetamide; N-methylpyrrolidone;
Pyrrolidones such as ethylpyrrolidone are preferably used. These organic solvents can be used by being mixed with water at an arbitrary ratio. Examples of mixing include water / methanol, water / ethanol, water / propanol, water / isopropanol, water / methyl propylene glycol, water / ethyl propylene glycol, and the like. The mixing ratio is preferably water / organic solvent = 1/10 to 10/1.

The proportion of the solvent to be used is not particularly limited, but is usually polyaniline and / or sulfonated polyaniline.
It is 1000 to 20,000 parts by weight with respect to 0 parts by weight. When the amount of the solvent used is extremely large, the applicability of the obtained conductive heat-shrinkable laminated film of the present invention may be deteriorated. Accordingly, pinholes are likely to be generated in the conductive layer, and the conductivity of the conductive heat-shrinkable laminated film may be significantly reduced, that is, the antistatic property may be reduced. When the amount of the solvent used is extremely small, the solubility or dispersibility of the polyaniline and / or the sulfonated polyaniline in the above solvent may be insufficient, and the surface of the obtained conductive layer may be difficult to be flat.

The conductive layer of the present invention is excellent in coating properties and spreadability by using only the above-mentioned components, and has a good surface hardness of the obtained conductive layer. By further using a polymer compound, it becomes possible to apply the composition to a heat-shrinkable film having poor wettability.

Examples of the above surfactant include nonionic surfactants such as polyoxyethylene octyl phenyl ether, polyoxyethylene alkyl ether, and polyoxyethylene sorbitan fatty acid ester, and fluoroalkyl carboxylic acids, perfluoroalkyl carboxylic acids, and the like. Fluorinated surfactants such as perfluoroalkylbenzenesulfonic acid, perfluoroalkylquaternary ammonium, and perfluoroalkylpolyoxyethyleneethanol are used.

The amount of the surfactant used in the present invention is 0.001 to 1000 parts by weight based on 100 parts by weight of polyaniline and / or sulfonated polyaniline.

When the amount of the surfactant exceeds 1000 parts by weight, the surfactant in the coating layer is set off on the uncoated surface,
Problems occur in secondary processing and the like.

Examples of the polymer compound that can be contained in the conductive layer of the conductive heat-shrinkable laminated film of the present invention include water-soluble resins such as polyacrylamide and polyvinylpyrrolidone, and water-soluble resins containing a hydroxyl group or a carboxylic acid group. Or water-dispersible copolymerized polyester, polyacrylic acid, acrylic resin such as polymethacrylic acid, acrylate resin such as polyacrylate polymethacrylate, polyethylene terephthalate, ester resin such as polybutylene terephthalate, polystyrene, Styrene resins such as poly-α-methylstyrene, polychloromethylstyrene, polystyrene sulfonic acid, and polyvinyl phenol; vinyl ether resins such as polyvinyl methyl ether and polyvinyl ethyl ether; polyvinyl alcohol; Ruhorumaru, polyvinyl alcohols such as polyvinyl butyral, a novolak, a phenol resin such as a resol may be used. Among them, water-soluble or water-dispersible copolymerized polyesters containing a hydroxyl group or a carboxylic acid group and polyvinyl alcohols are preferred from the viewpoint of compatibility with the above-mentioned sulfonated polyaniline, and from the viewpoint of adhesion to a substrate made of polyester or the like. .

The amount of the high molecular compound is preferably 0 to 1000 parts by weight, more preferably 100 parts by weight of polyaniline and / or sulfonated boraniline.
0 to 500 parts by weight. The amount of the polymer compound is 1000
When the amount is more than the weight part, the conductivity of the polyaniline and / or the sulfonated polyaniline does not appear, and the original antistatic function is not exhibited.

The conductive layer of the conductive heat-shrinkable laminated film of the present invention may contain various additives in addition to the above. Such additives include TiO ₂ , SiO ₂ , kaolin, CaCO ₃ , Al ₂ , O ₃ , BaSO ₄ , ZnO,
Inorganic particles such as talc, mica, and composite particles; and organic particles composed of polystyrene, polyacrylate, or a crosslinked product thereof. Powders of SnO ₂ , (tin oxide), ZnO (zinc oxide), and inorganic particles (TiO ₂ ,
It is also possible to add a carbon-based conductive filler such as BaSO ₄ ), carbon black, graphite, and carbon fiber. The content of the above-mentioned additive is preferably 4000 parts by weight or less based on 100 parts by weight of polyaniline and / or sulfonated polyaniline.
If it exceeds 4,000, the viscosity of the conductive layer may increase, which may cause uneven coating.

As a method for laminating a conductive layer on the surface of the heat-shrinkable film, there are a gravure roll coating method, a reverse roll coating method, a knife coater method, a dip coating method, a spin coating method and the like. The coating method is not particularly limited. There are an in-line coating method in which application to the film is performed simultaneously in the film-forming process and a fly-coat method in which coating is independently performed after the production of the film-forming roll. However, a preferred method can be selected according to the application, and there is no particular limitation. However, in the case where the off-line coating is applied after the production of the heat-shrinkable film, in the drying step, the substrate must be dried at a temperature lower than the heat-shrinkage starting temperature so as not to cause the heat-shrinkage.

[0024]

When the conductive heat-shrinkable laminated film of the present invention is used as an industrial or packaging film, antistatic properties can be imparted even under low humidity, so that it is excellent in handling properties and other articles. When the shrinking device is used, the above-described specific conductive performance can be imparted to the article.

Examples Next, examples and comparative examples of the present invention will be described, but the present invention is not limited to these examples. The evaluation method used in the present invention is shown below.

1) Surface resistance value A surface resistance measuring device manufactured by Mitsubishi Yuka Co., Ltd.
It measured on conditions of ° C and 15% RH. 2) Measurement of heat shrinkage ratio 1 cm ×
Cut out a 10 cm strip-shaped sample. This one
After heating for 10 seconds in a hot air open at 00 ° C., take out from the oven and measure the length of the long side with a caliper.
If the length at that time is Lcm,

[0027]

(Equation 1) The heat shrinkage is represented by the following equation. 3) Measurement of surface resistance value after heat shrinking A sample having a length of 10 cm and a width of 5 cm is cut out with the long side being the shrinking direction of the heat shrinkable film and excluding gripping margins at both ends. This sample is held in a frame having a length of 6 cm in the sample holding portion, with the grips at both ends of the long side of the sample held, and the sample is slackened by 4 cm. The sample is heated in a hot air oven at 100 ° C. for 10 seconds and then taken out of the oven. The sample is measured by the method of 1) in which the long side direction is set as the voltage application direction.

(Synthesis Example 1) Preparation of Sulfonic Acid Group-Containing Polyester and Aqueous Dispersion First, a sulfonic acid group-containing polyester was synthesized by the following method, and the dispersion was further prepared. Dimethyl terephthalate 46 mol%, dimethyl isophthalate 47 mol% and sodium 5-sulfoisophthalate 7 mol% are used as dicarboxylic acid components, and ethylene glycol 50 mol% and neopentyl glycol 5 are used as glycol components.
Using 0 mol%, a transesterification reaction and a polycondensation reaction were carried out by a conventional method. The glass transition temperature of the obtained sulfonic acid group-containing polyester was 69 ° C. The sulfonic acid group-containing polyester (300 parts) and n-butyl cellosolve (150 parts) were heated and stirred to form a viscous solution, and 550 parts of water was gradually added with further stirring to obtain a uniform light brown color having a solid content of 30% by weight. Was obtained. This dispersion was further added to a mixture of equal amounts of water and isopropanol to prepare an aqueous dispersion of a sulfonic acid group-containing polyester having a solid content of 8% by weight.

(Synthesis Example 2) Preparation of sulfonic acid group-containing polyaniline coating solution 2-aminoanisole-4-sulfonic acid 100 mmol
Is dissolved in a 4 mol / l aqueous ammonia solution at 23 ° C. with stirring, and 100 mmol of ammonium peroxadisulfate is dissolved.
Was added dropwise. After the dropwise addition, the mixture was further stirred at 23 ° C. for 10 hours, and the reaction product was separated by filtration, washed, and dried to obtain 13 g of a powdery copolymer. The volume resistivity of this copolymer was 12.3 Ωcm. 3 parts by weight of the above polymer was stirred and dissolved at room temperature in 100 parts by weight of a 0.3 mol / l sulfuric acid aqueous solution to prepare a conductive composition. At this time, the content of the sulfonic acid group in the sulfonated polyaniline was 100%. 2.0 parts by weight of the sulfonated polyaniline is
It was dissolved in 50 parts by weight of water and 50 parts by weight of isopropane. A liquid obtained by mixing this liquid with the dispersion shown in Synthesis Example 1
It was applied to one side of a thermoplastic film. This coating solution was dark yellow and no insoluble matter was observed in appearance.

(Preparation of unstretched sheet) Average particle size 0.5 μm
m of calcium carbonate fine particles are dispersed at 4000 ppm, and polyethylene terephthalate obtained by copolymerizing a neopentyl glycol component with 20 mol% of the total glycol component is 2
It was melt-extruded at 90 ° C. and cooled by a cooling roll at 30 ° C. to obtain an unstretched film having a thickness of about 180 μm.

(Preparation of Laminated Film) A coating solution having a solid content of 4% was applied to a thickness of about 13 μm on the obtained unstretched sheet, and dried at 160 ° C. with hot air. Next, it was preheated at 110 ° C. by a tenter, stretched 4.5 times in the transverse direction at 70 ° C., and heat-fixed at 80 ° C. to produce a conductive heat-shrinkable laminated film of the present invention.

Example 1 A coating solution was prepared by mixing a sulfonated polyaniline and a sulfonic acid group-containing polyester with a solid content ratio of 30.
/ 70, and a surfactant Emulgen 810 (manufactured by Kao) was added so that the ratio with the sulfonated polyaniline became 8/100. (Example 2) A coating solution was prepared in the same manner as in Example 1, and was applied on a commercially available heat-shrinkable polyester film, S5630 (manufactured by Toyobo Co., Ltd.) at a thickness of about 3 µm off-line, at 65 ° C.
And dried with hot air. Comparative Example 1 In Example 1, the solid content of the sulfonated polyanine was entirely replaced by sodium dodecylbenzenesulfonate. Comparative Example 2 In Example 2, the base film used was replaced with a non-shrinkable polyester film, E5100 (manufactured by Toyobo Co., Ltd.).

Table 1 shows the evaluation results of the above examples. Thus, the films of the examples exhibit low surface resistance even under low humidity, have heat shrinkability, and maintain low resistance even after shrinkage.

[0034]

[Table 1]

[0035]

As is clear from the above description, the conductive heat-shrinkable laminated film of the present invention exhibits excellent antistatic properties even under low humidity. Therefore, the dust in the air is less likely to be adsorbed during the production of the film to reduce its cleanliness, the sticking between the films or between the film and the process apparatus is reduced, and the handling property is improved. Also, there is little danger due to spark discharge. Furthermore, since it has its unique antistatic property even after heat shrinkage, it is possible to newly impart antistatic properties by coating articles and building materials that do not originally have antistatic properties. Especially when applied to a shrink label, the label tube opens easily into a cylindrical shape without sticking. Even when this is put on a bolt, it can be put on a predetermined position accurately because there is no sticking to the bolt. Even when heat shrinks due to a dry heat tunnel that follows, the entrapment of floating dust can be reduced. Then, the antistatic effect is also imparted to the bottle after mounting. As described above, the conductive heat-shrinkable laminated film of the present invention exhibits various advantages when used in various industrial and packaging films.

Continued on the front page (51) Int.Cl. ⁶ Identification code FI C08K 5/16 C08K 5/16 C08L 67/02 C08L 67/02 // C08J 7/04 CFD C08J 7/04 CFDD B29K 67:00 105: 02 B29L 7:00 9:00

Claims (5)

[Claims] 1. A heat shrinkage rate of at least 30% in at least one direction.
100 parts by weight of polyaniline and / or sulfonated polyaniline, water-soluble or water-dispersible copolymerized polyester having a sulfonic acid group and / or an alkali metal base thereof bonded to one or both sides of the larger heat shrinkable film.
0 to 2000 parts by weight, 0.001 to 100 surfactant
A conductive heat-shrinkable laminated film, wherein a conductive layer comprising 0 parts by weight is laminated directly or via any other number of layers. 2. A conductive heat-shrinkable laminated film, wherein the main raw material of the sulfonated polyaniline according to claim 1 is an alkoxy-substituted aminobenzenesulfonic acid, especially an aminoanisolesulfonic acid. 3. The water-soluble or water-dispersed copolyester according to claim 1, wherein the 5-sulfoisophthalic acid unit is 2-1.
A conductive heat-shrinkable laminated film containing 0 mol%. 4. The conductive heat-shrinkable laminated film according to claim 1, wherein the surfactant is a fluorine-based surfactant. 5. The surface resistance of the conductive layer before and after shrink mounting on an article using the heat shrinkable laminated film is 25.
A conductive heat-shrinkable laminated film having a temperature of 10 ¹² Ω / □ or less at 15 ° C. and 15% RH.