JPH11115354A - Ic module and composite ic card using the module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a connection of a contact type IC module to a non-contact type coil by resin molding a lead frame for projecting an IC-chip, wirings and a rear end piece in a frame laminated on a rear surface of a module board having through holes on the frame, flattening a lowermost surface, and then forming a bottom of the end piece as a connecting terminal. SOLUTION: Through holes 25 in which conductive plating is executed are provided at both ends of an external terminal 22 on a module board 23 made of an insulating synthetic resin. And, frames 23a having the same size and material are adhered on rear surfaces of the board 23 via adhesive layers 26. An IC chip 24 is provided at a center of the recess, and further a lead frame 30 having a front end piece 30a and a rear end piece 30b are bent is provided. The piece 30b is projected on a bottom of the frame 23a. The chip 24 is connected to the holes 25 and the piece 30a. Then, the chip is embedded in the frame 23 by resin molding. A lowermost surface is flattened to a block shape. And, the bottom of the piece 30b is exposed as a connecting terminal 21 on the bottom of the frame 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module capable of easily connecting a contact type IC module and a non-contact type antenna coil, and a contact type and a non-contact type using the IC module. The present invention relates to a composite IC card that shares one IC chip information with both types.

[0002]

2. Description of the Related Art Conventionally, in the fields of credit cards, ID cards, cash cards, and the like, as a card replacing a magnetic card, an IC module including a semiconductor memory such as a microprocessor, RAM, and ROM is mounted on a card material. A so-called IC card has been developed because of its extremely large information recording capacity and high security. These IC cards are roughly classified into a type that performs reading by a contact type and a type that performs reading by a non-contact type. The contact type performs power supply and information communication by directly contacting and connecting a reader-side terminal to an external terminal exposed on the surface of the card. Most current IC card types fall into this category. In the reading of this contact-type card, the error rate for a good card is extremely low, but if the external terminals are dirty or damaged by abrasion, electrical conductivity may be lost and reading may not be possible. . Further, in a dry environment, the surface of the card is easily charged with static electricity, which causes a reading error.

Therefore, in recent years, an IC card using a non-contact type IC module composed of a memory IC chip and a coil having a function as a power supply and communication antenna has been developed. The non-contact type IC module used for this card does not need to expose the communication terminal to the card surface when making the card because the communication is performed in a non-contact manner. Don't worry.

Further, at present, there has been proposed a composite IC card in which the above-mentioned non-contact type IC card and contact type IC card are combined to realize a non-contact function and a contact function with one chip. In other words, by combining the ease of use of contactless type with the security of contact type, it is suitable for, for example, fee payment operation and billing in bank ticket systems, bank transactions, various identity confirmation operations, etc., and realizes convenient applications This is a composite IC card manufactured for the purpose of

[0005] The method of manufacturing the composite IC card varies depending on the form of the module. A card body in which an antenna coil is embedded and a recess in which the IC module is embedded by counterboring is formed, and the module is inserted into the recess later. A method for embedding is conventionally known.

However, when manufacturing a composite IC card having a multilayered structure such as an overprint card, it is difficult to manufacture the card because the printing process is complicated.
Therefore, in advance, using the conventional overprint manufacturing technology, an overprint card base material and an antenna coil card base material in which the antenna coil is sealed with molten resin by injection are manufactured, and the base materials are bonded together. Form the card body. Such a two-layer structure makes it easy to manufacture a card having a multilayer structure, but it is difficult to apply the above-described manufacturing method to a conventional convex IC module as shown in FIG.

[0007]

That is, there are three reasons why the above-mentioned manufacturing method is not applied. The first reason is that when a conventional module is used, since the shape is convex, the IC card is attached to the card body to which the card base materials are adhered.
Processing the connection between the module and the antenna coil becomes complicated. The second reason is that it is difficult to produce an overprint card substrate with the same thickness as a conventional module. Third, in the conventional module shape, it is difficult to connect the module and the terminals of the antenna coil. Therefore, when manufacturing a composite IC card having a multilayer structure, a module shape and a connection terminal structure suitable for it are required.

Accordingly, the present invention provides an IC module for a composite IC card having a shape and connection terminal structure suitable for manufacturing a composite IC card having a multilayer structure, and a composite IC card using this module. To provide.

[0009]

In order to achieve the above object, according to the present invention, first, an external terminal for a reader / writer is provided on an IC module substrate, and both ends of the external terminal surface are provided. Is provided with a through hole for connection penetrating the external terminal and the module substrate, and a frame having the same size as the module substrate is attached to the back surface of the module substrate, and an IC chip, a tip piece and a rear end piece are provided in the frame. Is bent right and left, and a lead frame with a rear end piece protruding above the frame body is provided, and the IC chip is connected to the through hole and the lead frame tip piece by wires, and the IC chip, wire, and lead in the frame body are provided. A block-shaped IC module in which a lowermost surface is flattened by resin-molding a frame, wherein a bottom surface of the protruding rear end piece of the leadframe is used as a connection terminal. An IC module for the IC card.

According to a second aspect of the present invention, a pattern layer and a magnetic stripe and an antenna coil are buried on the back side of a card base made of insulating synthetic resin and the antenna coil connection terminal is exposed on the front side. The antenna coil card base material and a resin sheet provided with a magnetic stripe on a card base material made of insulating synthetic resin are attached, and an anchor coat layer, a concealing layer, a picture layer, and a protective layer are applied thereon. ,
A composite IC comprising a member structure of an overprint card base material provided with a through hole for storing a module at a predetermined position and an IC module provided with lead frame connection terminals at both side ends of the lowermost surface according to claim 1. Card
After fixing the IC module on the antenna coil base via an adhesive and connecting the antenna coil connection terminal and the connection terminal of the IC module, the antenna coil card base and the overprint card base are bonded together. Wherein the IC module external terminal surface and the overprint base material surface are flush (same height).
Card.

[0011]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC module suitable for a composite IC card and a composite IC using this module for a multi-layered card base material such as an overprint card.
I got the card. First, an IC module according to the present invention is provided with external terminals for contacting a reader / writer on a module substrate, and at both ends of the external terminal surface, terminals for external contact and through holes for connection penetrating the module substrate. A wiring board is provided below the through hole and a through-hole. A frame of the same size as the module board is attached to the back of the module board with an adhesive, and an IC chip and a lead frame are provided in the frame. The hole and the lead frame are connected by wire bonding, the IC chip, the wire, and the lead frame are resin-molded, and the lowermost surface is flattened. Is an IC module having a connection terminal.

Also, in the composite card using the IC module, an antenna coil is embedded on the surface side of the base material, and the antenna coil card base material having the antenna coil connection terminals exposed on the surface is stored in a predetermined position. A composite IC card comprising a member of an overprint card base material having a through hole formed therein and an IC module having connection terminals formed by lead frames on both side ends of the lowermost surface, wherein the IC module is formed of an antenna coil base material. After the antenna coil connection terminal and the IC module terminals were connected to each other, the antenna coil card base material and the overprint card base material were adhered to obtain a composite IC card.

An embodiment will be described in detail with reference to the drawings.
FIG. 1 is a sectional view showing an IC module according to an embodiment of the present invention, and FIG. 2 is a bottom view of the IC module. As shown in FIG. 1, an IC module according to the present invention comprises an external terminal 22 which contacts a reader / writer on a module substrate 23 made of an insulating synthetic resin such as polyvinyl chloride resin.
And through holes 25, 25 penetrating through the external terminals and the module substrate 23 at both ends of the external terminals 22.
A wiring board (not shown) is provided below the through-hole and conductive plating is applied to the inside of the through-hole to connect to an external terminal. Also, the module substrate 2 is provided on the back surface of the module substrate 22 via an adhesive layer 26.
2. A frame 23a of the same size as that of the frame 2 and made of the same material is stuck, and an IC
A tip 24 is provided, and a tip piece 30a is further provided inside the frame.
And a lead frame 30 in which the rear end piece 30b is bent at right and left right angles.

Further, as shown in FIG. 2, the rear end pieces 30b, 30b of the lead frame 30 are projected above the bottom surface of the frame 23a. After connecting the IC chip 24 with the through holes 25, 25 and the lead frame tip piece 30a by wire bonding 27, the IC chip 24, the wires 27, and the lead frames 30, 30 inside the frame are resin-molded 28 to form the frame. At the same time as being implanted in the body, the lowermost surface of the module 20 is flattened to the same height as the frame 23a to obtain a square block-shaped IC module 20. By setting the bottom surfaces of the lead frame rear end pieces 30b protruding above the bottom surface of the frame body as the connection terminals 21 and 21, an IC module having the connection terminals exposed on the lowermost surface of the IC module was obtained.

As described above, since the frame 23a attached to the back surface of the module substrate has a concave shape corresponding to the shape of the lead frame, the connection terminals of the module can be exposed on the lowermost surface. Further, the lead frame can be easily processed with respect to the shape of the frame, and the connection terminals can be pulled out to the lowermost surface, which is a great advantage.

FIG. 3 is a sectional view showing a composite IC card using the IC module of the present invention. As shown in FIG. 3, in the composite IC card, the antenna coil 15 is embedded on the surface side of the base material, and the antenna coil connection terminals 16 and 1 are provided.
Antenna coil card base material 5 exposing 6 on its surface
0 and a through hole k for storing the module 20 in a predetermined position
A composite IC card composed of an overprint card base material 50 provided with the above, and an IC module 20 provided with the lead frame connection terminals 21 and 21 at both side ends of the lowermost surface of the module described above. After the antenna coil connection terminals 16 and 16 and the connection terminals 21 and 21 of the IC module are connected at the same time, the antenna coil card substrate 50 and the overprint card substrate 10 are attached. By combining them, a composite IC card is obtained.

FIG. 4 is an explanatory diagram showing components of the composite IC card of the present invention. Composite IC using this component
As shown in FIG. 4 (C), the card is manufactured by first providing a pattern layer 6 and a magnetic stripe 8 on the back side of a card base 1a made of vinyl chloride resin or the like, and connecting an antenna coil to the front side of the base 1a. The antenna coil card base material 50 in which the terminals 16 are exposed on the surface and the antenna coil 15 is embedded by injection or the like is manufactured. The pattern layer 6 is printed directly on the back side of the antenna coil card base material 50, and a transparent resin sheet provided with a magnetic stripe 8 is laminated thereon, or a pattern layer and a magnetic stripe are provided on the resin sheet. May be attached, and there is no limitation.

As shown in FIG. 4A, a resin sheet 3 provided with a magnetic stripe 8 is adhered to a card base 1 made of a vinyl chloride resin or the like via an adhesive 2. , An anchor coat layer 4, a concealing layer 5, a picture layer 6, and a protective layer 7, and a multi-layered overprint card substrate 10 having a through hole k for storing the module 20 at a predetermined position, as described above. IC module 2 having connection terminals 21 and 21 formed by lead frames on both side edges of the lowermost surface
No. 0 is a composite IC card including the constituent members.

This card is formed by fixing the IC module 20 on the antenna coil base material 50 with an adhesive interposed therebetween, and at the same time, connecting the antenna coil connection terminals 16 and 16 exposed on the antenna coil base material surface to the IC module. After connecting the connection terminals 21 and 21 exposed on the lowermost surface, the module 20 and the through-hole k of the overprint card base material 10 are bonded on the antenna coil card base material 50 so as to be aligned. At this time, the IC module is bonded so that the surface of the external terminal 22 and the surface of the overprint base material 10 are flush (same height). In the present embodiment, the IC module 20 is connected first, and the overprint card base material 10 is bonded through the through-hole k from above. However, the IC module 20 is bonded to the antenna coil base material 50 first, and the IC The module 20 can be inserted into the through hole k and connected to the antenna coil connection terminal because the connection terminal of the IC module is provided on the lowermost surface.

The thickness of the IC module 20 of the present invention is the same as the thickness of the overprint card substrate 10, but is adjusted when the overprint substrate 10 and the antenna coil substrate 50 are bonded to each other. The thickness can be the same as the module surface.

[0021]

As described above, the present invention has the following effects. That is, by using a rectangular block shape and an IC module in which connection terminals are exposed on the lowermost surface, a composite IC card having a multilayer structure such as overprint specification can be easily obtained. Further, since the connection between the contact type IC module and the non-contact type coil can be easily performed, the manufacture of a complex IC card which has conventionally been complicated becomes easy. In addition, the appearance can be the same as a general card conforming to the JIS standard, such as external dimensions and thickness. Furthermore, when inserting the module, it is not necessary to perform processing such as counterboring on the antenna coil base material,
Since the module can be easily fitted, a highly accurate composite IC card can be obtained.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a structure of an IC module according to an embodiment of the present invention.

FIG. 2 is a bottom view showing the lowermost surface of the IC module.

FIG. 3 is a side sectional view showing a composite IC card using a module for a composite IC card according to an embodiment of the present invention.

4A and 4B are explanatory diagrams showing constituent members of the composite IC card of the present invention, wherein FIG. 4A shows an overprint base material, and FIG.
Indicates an IC module, and (C) indicates an antenna coil base material.

FIG. 5 is a side sectional view showing a conventional IC module.

[Explanation of symbols]

 1, 1a Card base material 2 Adhesive layer 3 Oversheet 4 Anchor coat layer 5 Concealing layer 6 Picture layer 7 Protective layer 8 Magnetic stripe 10 Overpunt Card base material 15 Antenna coil 16 Antenna coil connection terminal 20 IC module 21 Module connection terminal 22 External terminal for reader / writer 23 Module substrate 23a Frame (module substrate) Reference numeral 24: IC chip (DIE) 25: Through hole 26: Adhesive layer 27: Wire 28: Resin mold 30: Lead frame 30a: Lead frame tip 30b: Lead frame rear edge

Claims (2)

[Claims] An external terminal for a reader / writer is provided on an IC module substrate, and through-holes for connecting the external terminal and the module substrate are provided at both ends of the external terminal surface, and a module is provided on a back surface of the module substrate. A frame having the same size as the substrate is attached, and an IC chip, a tip piece and a rear end piece are bent right and left at right angles in the frame, and a lead frame is provided in which the rear end piece is projected onto the frame body. Connect the IC chip to the through hole and the lead frame tip with a wire,
A block-shaped IC module in which the lowermost surface is flattened by resin-molding an IC chip, a wire, and a lead frame in a frame, wherein a bottom surface of the protruding rear end piece is used as a connection terminal. IC module for a complex IC card. 2. An antenna coil card in which a picture layer and a magnetic stripe and an antenna coil are buried on the front side of a base material of a card base material made of an insulating synthetic resin resin, and the antenna coil connection terminals are exposed on the front surface. A substrate and a resin sheet provided with a magnetic stripe on a card substrate made of an insulating synthetic resin resin are adhered, and an anchor coat layer, a concealing layer, a picture layer, and a protective layer are formed thereon, and A composite IC card comprising a member configuration of an overprint card base material provided with a through hole for storing a module therein, and an IC module having lead frame connection terminals on both side ends of the lowermost surface according to claim 1. And fixing the IC module on the antenna coil base material via an adhesive,
And after connecting the antenna coil connection terminal and the connection terminal of the IC module, the antenna coil card base material and the overprint card base material are adhered to each other, and the IC module external terminal surface and the overprint base material surface are flush with each other. A composite IC card characterized in that: