JPH1111057A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card for holding an IC module in a card body in a stable state while maintaining adhesive properties of a cover sheet with the module. SOLUTION: In the IC card comprising an IC module having a resin molding part 4a incorporated with an IC chip 4d and contained in a penetrating part of a long rectangular card body 2 in an attitude sandwiched between cover sheets 3, a pressure sensitive adhesive sheet 5 made of thermosetting resin having small elastic modulus such as, for example, epoxy resin is interposed between the module and a laminating material 3. A resin molding part 4a of the module is formed of hard thermoplastic resin, while the body 2 and the material 3 are formed of flexible thermoplastic resin. Thus, even if deflecting amounts of the module and material 3 due to deformation of the body 2 are different, adhesive properties of both are maintained by the sheet 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card in which an IC module incorporating an IC chip is incorporated in a rectangular card body.

[0002]

2. Description of the Related Art Heretofore, some cards have an information storage function. Among them, those which store information by a magnetic stripe and ICs such as a memory chip are included.
There is a so-called IC card provided with a chip. In such an IC card, a thin memory chip is embedded in a long rectangular plastic card, and a memory chip or CPU having an increased storage capacity or an antenna coil is incorporated in the card body. , Non-contact type I with more advanced information processing and communication functions
C cards have also been proposed. In the future, such an IC card is expected to be used as an information carrying tool related to a telephone card and electronic money.

On the other hand, in this type of IC card, I
A card incorporating a so-called IC module in which a C chip is integrated and incorporated by resin molding or the like has also been proposed. In such an IC card, the IC module is loaded into a through portion formed in a part of the card body. Then, the cover sheet is attached to the upper and lower surfaces of the card body integrated with the IC module in such a manner as to sandwich the cover sheet.

Here, the card body and the cover sheet are each formed of a flexible member so that the card body and the cover sheet do not break while enduring a certain degree of deformation, and on the contrary, the IC module is incorporated therein. It is generally considered that the IC chip is formed of a hard member so that a bending moment does not act on the IC chip.

[0005]

However, in the above-mentioned conventional IC card having a built-in IC module, the cover sheet and the IC module are considered to be formed of members having mutually opposite properties. In such a case, since the elasticity is different as a contradictory characteristic between the two, the adhesion at the joint portion of the two is reduced depending on the degree of deformation, and furthermore, the cover sheet and the IC module become non-contact. In addition, the IC module becomes unstable in the card body.

The present invention has been conceived under the above circumstances, and maintains the IC module in a stable state in the card body while maintaining the adhesion between the cover sheet and the IC module. It is an object of the present invention to provide an IC card capable of performing such operations.

[0007]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

[0008] That is, an IC card provided by the first aspect of the present invention is an IC card built in a card main body in a posture in which an IC module is sandwiched between cover sheets, wherein an IC card is provided between the IC module and the cover sheet. And an adhesive member interposed therebetween.

In the IC card according to the first aspect to which the above technical means are applied, the adhesive member interposed between the IC module and the cover sheet makes the bonding state between the IC module and the cover sheet adhesive. It has a strong property and enhances the adhesion between the two. For example, even if deformation occurs at the joint of the two, the adhesive member interposed between them relaxes the bending moment generated at the joint and joins the two together.

[0010] Therefore, according to the IC card of the first aspect, even if the joint between the IC module and the cover sheet is deformed, the adhesive member interposed between them reduces the bending moment at the joint. Since the two are joined to each other while maintaining the same, the adhesion between the cover sheet and the IC module is maintained, and the IC module in the card body can be held in a stable state.

The card body is generally provided separately from the cover sheet. However, the present invention is not particularly limited to such a configuration, and a card body obtained by laminating two cover sheets may be used.

In a preferred embodiment, the adhesive member is made of a thermosetting resin.

According to such an IC card, the adhesive member is made of a thermosetting resin, and the IC body and the like are protected in the IC module. By heat treatment using one type of epoxy resin, it is possible to fuse between the IC module and the cover sheet, and the adhesion can be further improved.

In a further preferred embodiment, the adhesive member is formed in a thin film with a predetermined thickness.

According to such an IC card, since the adhesive member is formed in a thin film with a predetermined thickness,
This adhesive member is in a state of being laminated over the entire joint portion between the IC module and the cover sheet, and is reliably interposed between the IC module and the cover sheet irrespective of some surface roughness or unevenness at the joint portion. Therefore, the adhesion between the two can be further enhanced.

[0016] In a further preferred embodiment, the IC module is made of a hard member incorporating an IC chip, and the cover sheet is made of a flexible member.

According to such an IC card, the IC module is made of a rigid member having an IC chip incorporated therein,
On the other hand, since the cover sheet is formed of a flexible member, even if deformation occurs at a joint between the two members having different elastic moduli as contradictory characteristics, the degree of deformation is buffered by the adhesive member. As a result, the bending moment at the joint portion is reduced, and the bending moment acting on the IC module itself is also reduced, so that breakage of the IC chip incorporated in the IC module can be prevented.

IC chips are mainly memory chips and CPUs.
It can be used as a chip, but a chip having various other functions may be used. Further, the number of IC chips is not limited to one or more.

In a further preferred embodiment, the IC module has a built-in antenna for transmitting and receiving a radio signal between the IC chip and the outside of the card.

According to such an IC card, the IC chip and the antenna are conductively connected in the IC module. However, since the bending moment acting on the IC module itself is reduced by the adhesive member, the conductive property is reduced. The IC chip and the antenna can be integrated in the IC module while preventing disconnection that is likely to occur at the connection point.

The antenna may be in the form of a winding or a single wire, but is not particularly limited thereto, and may have any shape.

The form of connection between the IC chip and the antenna is a so-called flip chip method or wireless bonding based on a TAB method, whereby the effect of preventing disconnection is further enhanced. However, the connection form is not particularly limited.
Bonding or soldering may be used.

In a further preferred embodiment, the IC module is sandwiched from both sides by the cover sheet in a state where the IC module is loaded in the penetrating portion of the card body.

According to such an IC card, since the IC module is inserted from both sides by the cover sheet in a state of being loaded in the penetrating portion of the card body, it is bent into the IC module following the bending deformation of the card body. Even if a moment is applied, the IC module is held in the card body by the penetrating portion and is brought into close contact with the cover sheets on both sides by the adhesive member. It can be held in a more stable state.

[0025] In a further preferred embodiment, the IC module is sandwiched by the cover sheet while being fitted into a concave portion of the card body.

According to such an IC card, since the IC module is sandwiched by the cover sheet while being fitted into the concave portion of the card body, a bending moment acts on the IC module following the bending deformation of the card body. However, since the IC module is held in the card body by the recess and is in close contact with the cover sheet by the adhesive member, the IC module in the card body is held in a more stable state. can do.

[0027] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is an external perspective view showing an embodiment of an IC card according to the present invention, FIG. 2 is an exploded sectional view showing an IC card in a longitudinal direction, and FIG. 1
FIG. 4 is an enlarged sectional view of a main part showing a section taken along line XX in FIG.

As shown in these figures, the IC card 1
Has a rectangular appearance in plan view and is formed with a thickness of, for example, about 0.76 mm, and has a rectangular main body 2 and two cover sheets 3 adhered to the upper and lower surfaces of the card main body 2 in a sandwiched state. , IC built in card body 2
It has a module 4 and an adhesive sheet 5 interposed between the IC module 4 and the cover sheet 3.

The card body 2 has a thickness of, for example, about 0.45 mm, and is made of a flexible heat-resistant material such as polyethylene terephthalate resin (hereinafter abbreviated as PET) or vinyl chloride (hereinafter abbreviated as PVC). It is made of a plastic resin, and a part thereof has a penetrating portion 2a penetrating over the upper and lower surfaces, and is formed in a circular shape for loading an IC module 4 described later.

The two cover sheets 3 are formed so as to conform to the planar shape of the card body 2, for example, 0.1
It has a thickness of about 5 mm and is formed of a thermoplastic resin having flexibility such as PET or PVC. One surface of each cover sheet 3 is attached by thermocompression bonding over the entire upper and lower surfaces of the card body 2. I have.

FIG. 4 is an exploded perspective view showing the IC module 4 and the adhesive sheet 5 in an exploded manner. Referring to FIG. 4 and FIG. 2 and FIG. The sheet 5 will be described.

The IC module 4 has an extremely thin cylindrical shape as a whole, and has a thickness substantially equal to that of the card body 2.
Molded with a hard thermoplastic resin such as acrylonitrile-butadiene-styrene resin (hereinafter abbreviated as ABS) having a higher elastic modulus than T or PVC. A flexible substrate 4b, an antenna coil 4c, and an IC chip 4d are incorporated in a resin molded portion 4a that occupies most of the IC module 4.
This IC module 4 is used as a primary molded product,
Two adhesive sheets 5 are stacked in a posture facing the upper and lower surfaces.

The flexible substrate 4b is formed of a flexible insulating film such as a polyimide film, and has an antenna coil 4c formed on its surface by printed wiring processing.

FIG. 5 is a plan view showing the flexible board 4b from the top. The antenna coil 4c has both terminals connected to lands 4e and 4f formed at the center of the flexible board 4b. , One land 4e
In order to prevent short-circuiting of the continuous wiring from the first land part 4f to the other land part 4f, wiring processing is performed in a posture of winding around the central part of the flexible substrate 4b so as to bypass both the land parts 4e and 4f. This antenna coil 4c is
It has the function of transmitting and receiving wireless signals between the outside of the C card 1 and the IC chip 4d,
It also has a function as a coil for supplying the driving power of the chip 4d, and when exerting the coil function, generates an induced electromotive force by an electromagnetic induction effect to supply secondary power to the IC chip 4d.

The IC chip 4d is connected to the land portion 4 by wireless bonding according to, for example, a TAB method.
e, 4f, and is mainly used as a memory having an information storage function, and is driven by electric power supplied from outside the IC card 1 via the antenna coil 4c.

The adhesive sheet 5 is formed so as to conform to the planar circular shape of the IC module 4, is formed into a thin film having a predetermined thickness, and is formed by thermosetting, for example, an epoxy resin having a smaller elastic modulus than the PET or PVC. It is formed of a conductive resin. This adhesive sheet 5 is used for the IC module 4
Cover sheets 3 on the upper and lower surfaces of the card body 2 integrated with the
Is laminated over the entire upper and lower surfaces of the IC module 4 before being adhered, and is fused when the cover sheet 3 is adhered, so that the space between the cover sheet 3 and the upper and lower surfaces of the IC module 4 is formed. In the state intervening.

Next, the IC card 1 according to this embodiment
Will be described with reference to FIG.

FIG. 6 is an enlarged sectional view of a main part showing a deformed state in a section taken along line XX of FIG. 1. As shown in FIG. When bending deformation is applied to the vicinity, the cover sheet 3 and I
The C module 4 is deformed with a different amount of bending. That is, the cover sheet 3 is largely bent integrally with the card body 2 due to the difference in the elastic modulus as a contradictory characteristic between the two, but the IC module 4 has a constant shape with almost no bending. Is kept.

Then, the adhesive sheet 5 interposed between the cover sheet 3 and the IC module 4 changes from the uniform distribution state as shown in FIG. 3 to a deformed filling state to fill the gap between them. The degree of deformation is buffered, and the pressure-sensitive adhesive sheet 5 strengthens the bonding state between the IC module 4 and the cover sheet 3 and lowers the adhesion at the bonding portion between the two before the deformation. To be maintained.

Due to the buffering function of the adhesive sheet 5, the bending moment generated at the joint between the IC module 4 and the cover sheet 3 is reduced, and the bending moment applied to the IC module 4 itself is also reduced. Therefore, the I built in the IC module 4
Thus, the IC card 1 is provided, in which the breakage of the C chip 4d is prevented and the durability against bending deformation is high.

When using such an IC card 1, I
For the IC chip 4d incorporated in the C module 4,
Power is supplied from outside the IC card 1 via the antenna coil 4c, and information stored in the IC chip 4d is wirelessly transmitted to a receiving device outside the IC card 1 via the antenna coil 4c. .

Therefore, according to the IC card 1 of this embodiment, even if bending deformation occurs in the vicinity of the joint between the IC module 4 and the cover sheet 3, the adhesive sheet 5 interposed between them covers the joint. Since the two are joined together while relaxing the bending moment, the adhesion between the cover sheet 3 and the IC module 4 is maintained, and the IC module 4 in the card body 2 can be held in a stable state.

Further, another embodiment will be described with reference to FIG. The description of the members having the same structure and operation as those of the above embodiment will be omitted as appropriate.

FIG. 7 is an exploded cross-sectional view of another embodiment of the IC card according to the present invention, in which the cross section in the long side direction is exploded. The IC card 11 has a long rectangular card body 12 and a card body. It has a cover sheet 13 attached to the upper surface of the IC card 12, an IC module 14 built in the card body 12, and two adhesive sheets 15 laminated on the upper and lower surfaces of the IC module 14.

In a part of the card body 12, a concave portion 12a formed halfway in the upper and lower surfaces thereof has an IC module 14a.
Is formed in a planar circular shape in order to be fitted.

The cover sheet 13 is attached only to the upper surface of the card body 12.

The IC module 14 has an extremely thin cylindrical shape as a whole, and has a thickness such that it can be fitted into the concave portion 12a.
It has a flexible substrate 14b, an antenna coil 14c, and an IC chip 14d. This IC module 14
The two adhesive sheets 15 are stacked so as to face the upper and lower surfaces of the adhesive sheet.

The adhesive sheet 15 is used for the IC module 14
Before it is fitted into the recess 12a of the card body 12,
The C module 14 is stacked over the entire upper and lower surfaces, and the IC module 14 is fitted into the concave portion 12a and the cover sheet 13 is adhered.
4, the other adhesive sheet 15 is provided with the concave portion 1
2A and the lower surface of the IC module 14.

In the IC card 11 having such a configuration, when bending deformation is applied to the vicinity of the concave portion 12a in which the IC module 14 of the card body 12 is built, the cover sheet 1
Adhesive sheet 1 interposed between the IC module 14 and the IC module 14 or between the recess 12a and the IC module 14
As in the previous embodiment, 5 becomes a deformed and filled state in which the gap between the two is filled from the evenly distributed state to buffer the degree of deformation.
Bonding state of the IC module 14 and the cover sheet 13;
In addition, the bonding state between the IC module 14 and the concave portion 12a is strengthened, and the adhesion at the bonding portion between the two is maintained without lowering than before the deformation.

Therefore, the same effects as those of the above-described embodiment can be achieved by the IC card 11 according to such another embodiment.

It should be noted that the I described in both of the above embodiments is used.
The shape and structure of the C modules 4 and 14 are not limited to such shapes and structures. For example, as other forms, those in which a reinforcing member is interposed between the resin molded portions 4a and 14a, the flexible substrates 4b and 14b may be a ceramic substrate, and the flexible substrate 14b may be directly formed in the concave portion 12a without using the resin molded portion 14a.
Alternatively, the IC chip 14d may be integrated and fitted.

The antenna coils 4c and 14c are formed on the flexible substrates 4b and 14b by printed wiring, but are not limited to this, and may be in a state where they are directly embedded in the resin molded portions 4a and 14a. Alternatively, the shape may be a single line without being a coil. In this case, it is considered that the driving power supplied to the IC chips 4d and 14d is supplied from outside the IC cards 1 and 11 by high frequency.

Further, the adhesive sheets 5 and 15 may be interposed between the card bodies 2 and 12 and the cover sheets 3 and 13 over the entire surface. In this case, the adhesive sheet 5,
15 improves the adhesion between the IC modules 4 and 14 and also improves the adhesion between the cover sheets 3 and 13 and the card bodies 2 and 12. 3, 13 are obtained.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing one embodiment of an IC card according to the present invention.

FIG. 2 is an exploded cross-sectional view showing an exploded cross-section of a long side direction of the IC card.

FIG. 3 is an enlarged sectional view of a main part showing a section taken along line XX in FIG. 1;

FIG. 4 is an exploded perspective view showing an exploded IC module and an adhesive sheet.

FIG. 5 is a plan view showing the flexible substrate from above.

FIG. 6 is an enlarged sectional view of a main part showing a deformed state in a section taken along line XX of FIG. 1;

FIG. 7 is an exploded cross-sectional view showing another embodiment of the IC card according to the present invention by exploding a cross section in a long side direction.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2 Card main body 2a Penetration part 3 Cover sheet 4 IC module 4a Resin molding part 4b Flexible board 4c Antenna coil 4d IC chip 5 Adhesive sheet 11 IC card 12 Card main body 12a Depression 13 Cover sheet 14 IC module 14a Resin molding part 14b Flexible board 14c Antenna coil 14d IC chip 15 Adhesive sheet

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomoharu Horio 21 Ryozaki-cho, Saiin, Ukyo-ku, Kyoto City Inside ROHM Co., Ltd.

Claims (7)

[Claims] 1. An IC card which is incorporated in a card body in a posture in which an IC module is sandwiched between cover sheets, wherein an adhesive member is interposed between the IC module and the cover sheet. card. 2. The IC card according to claim 1, wherein the adhesive member is made of a thermosetting resin. 3. The IC card according to claim 1, wherein the adhesive member is formed in a thin film with a predetermined thickness. 4. The IC card according to claim 1, wherein said IC module is made of a hard member incorporating an IC chip, and said cover sheet is made of a flexible member. 5. The IC according to claim 1, wherein said IC module has a built-in antenna for transmitting and receiving a radio signal between an IC chip and an outside of a card.
C card. 6. The IC card according to claim 1, wherein the IC module is sandwiched from both sides by the cover sheet in a state where the IC module is loaded in a penetrating portion of the card body. 7. The IC card according to claim 1, wherein said IC module is sandwiched by said cover sheet while being fitted into a concave portion of said card body.