JP2002352207A - Non-contact ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card capable of being inexpensively and easily manufactured even in the case of a planar card, without applying stress on an IC chip and connection between the IC chip and an antenna even when the card is deformed, capable of being used without damaging the IC chip and the connection between the IC chip and the antenna and further coping with use such as pasting to a curved surface while utilizing advantages of a non-contact IC card. SOLUTION: The non-contact IC card is composed of an inlet having the IC chip and the antenna, a card main body having an inlet storage part to store the inlet and a cover capable of sealing the inlet storage part, and formed by sticking the cover to the card main body and movably sealing the inlet into the inlet storage part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card, and more particularly, to an IC chip against deformation of a card body by incorporating an IC chip and an antenna into the card body without bonding and fixing the antenna to the card body. And IC
The present invention relates to a non-contact type IC card in which stress is not applied to a connection portion between a chip and an antenna and the IC chip and a connection portion between the IC chip and the antenna are not damaged by deformation of the card.

[0002]

2. Description of the Related Art An IC card has an IC chip embedded in a card formed of a synthetic resin or the like, and is connected to an external reader / writer by a central processing unit (CPU) or a memory such as a ROM built in the IC chip. Read and write information,
A contact IC for exposing metal terminals on the surface of the card.
Unlike a card, an antenna is connected to an IC chip and built in an IC card to transmit and receive information using electromagnetic waves and to receive power supply.

[0003] Such a non-contact type IC card is a contact type IC card.
Compared to cards, you can place the card on the reader or hold it over the card, it can be used while moving, it is excellent in operability, and since the terminals are not exposed on the card surface, it is durable. Are better. Furthermore, since the terminals are not exposed on the card surface, it has the advantage that printing can be performed on the entire surface of the card, and is used for transportation commuter passes, credit cards, cards for public telephones, tags, etc. I have.

However, in these conventional non-contact type IC cards, an inlet composed of an IC chip and an antenna is fitted and adhered to a flat card body made of synthetic resin or the like, or sandwiched between resin sheets. The IC chip and antenna are tightly adhered, adhered, and fixed to the card body because they are integrated, sealed, and embedded by fusion, etc., and slight deformation of the card body when bending stress acts on the card body As a result, stress is applied to the IC chip and the antenna, and the IC chip may be damaged or the connection between the IC chip and the antenna may be cut off, making the IC card unusable.

In order to prevent the IC card from being damaged or the connection between the IC chip and the antenna being disconnected and the IC card from becoming unusable, a reinforcing seal is attached to the surface of the card to reduce the rigidity of the card. (Japanese Patent Application Laid-Open No. 2000-259804), and a device in which a reinforcing member is provided on the upper surface and / or side surface of the IC chip inside the card (Japanese Patent Application Laid-Open No. 2000-31225,
00-276567 and JP-A-2001-76110).

However, in these conventional examples, the rigidity is enhanced by reinforcing the IC card or the periphery of the IC chip is strengthened by reinforcing the periphery of the IC chip.
The goal is to protect the chip and solve the problem,
The IC chip and the antenna are adhered, fixed and adhered to the card body. That is, it is intended to prevent the card itself or the IC chip from being curved. Therefore, bending stress is applied to the card, and the card itself cannot be used in a curved state.

Also, because of such a structure, the IC
For example, it is impossible to make the card correspond to a curved surface, such as pasting the card on a cylindrical bottle or the like.In order to correspond to the curved surface, it is necessary to curve and mold the card itself in advance. Could not adapt to diversity.

Furthermore, these conventional examples have the disadvantage that a large number of members such as reinforcing members are required, the manufacturing process is complicated, and the cost is increased. Further, when embossing is performed on the surface of an IC card, there is a certain limitation in order to prevent damage to a built-in IC chip and an antenna, and it is not easy to perform the processing.

In order to cope with bending of a thin IC card, the ISO standard (ISO7816) requires that the position of the IC chip be a corner of the card and that the area of the IC chip be limited to 25 square millimeters or less. It was stipulated that the degree of freedom in designing, processing, and selecting usable IC chips for IC cards was greatly restricted.

As another conventional example, there is one in which an IC card is formed in a rod shape in order to increase the resistance of the IC card to bending (Japanese Patent Application Laid-Open No. 2001-76112). However, although this technique is effective for certain usage modes, it is not suitable for sticking to commuter passes, credit cards or other objects, and the usage mode is extremely limited, and versatility is required. Was not appropriate for a given IC card. Further, the conventional example also does not prevent the card itself from being curved. Therefore, a bending stress is applied to the card and the card itself cannot be used in a curved state. For example, pasting on a cylindrical bottle, etc.
It was almost impossible to correspond to a curved surface.

[0011]

Accordingly, the present invention makes use of the advantages of the non-contact type IC card, and can be manufactured at low cost and easily, even if the card is flat, even if the card is deformed. No stress is applied to the connection between the IC chip and the IC chip and the antenna, and the IC card can be used without breaking the connection between the IC chip and the IC chip and the antenna. It is an object of the present invention to provide an IC card that can handle the above. Further, it is an object of the present invention to easily emboss the surface of the IC card and to increase the degree of freedom of the processing. It is another object of the present invention to freely determine an installation position of an IC chip, and to increase a degree of freedom in designing and processing an IC card and selecting a usable IC chip.

[0012]

Means for Solving the Problems In order to solve the above problems, the present invention firstly seals an inlet having an IC chip and an antenna, a card body having an inlet housing for housing the inlet, and an inlet housing. A non-contact type IC card comprising a cover capable of being stopped,
The cover is adhered to the card body, and the inlet is sealed in the inlet accommodating portion.

Second, there is provided a non-contact type IC card comprising an inlet having an IC chip and an antenna, a card body having an inlet housing for housing the inlet, and a cover capable of sealing the inlet housing. The cover is adhered to the card body, and the inlet is movably sealed in the inlet storage portion.

[0014] Third, an inlet having an IC chip and an antenna, an inlet housing for housing the inlet, a card body having a cover mounting portion formed on the upper part of the inlet housing, and the inlet housing can be sealed. A non-contact type IC card comprising a cover, wherein the cover is mounted on a cover mounting portion, the cover is adhered to the card body, and the inlet is movably sealed in the inlet storage portion. .

Fourthly, the inlet accommodating portion has a height equal to or greater than the thickness of the inlet, and is formed in such a shape that the side surface of the inlet accommodating portion and the side surface of the inlet can be separated when the inlet is installed. It is characterized by having.

Fifth, the inlet is formed by mounting an IC chip on a substrate on which an antenna is formed, and the inlet storage portion is formed by recessing a second storage portion from the first storage portion and the first storage portion. It is characterized by being formed by.

Sixth, the distance from the outer end of the first storage section to the outer end of the second storage section is formed to be less than the length of the end of the IC chip to the end of the substrate.

A seventh feature is that the IC chip is sealed with a synthetic resin, and at least the side surface of the IC chip does not contact the inlet accommodating portion.

Eighthly, the present invention is characterized in that a suitable number of projections are formed on the cover installation surface of the card body so as to surround the outer periphery of the upper end of the inlet accommodating portion, and the projections and the cover are bonded.

Ninth, as a ninth method of manufacturing a non-contact type IC card, an inlet accommodating portion having a size equal to or larger than an inlet is formed in the card body, and the IC accommodating portion is formed in the inlet accommodating portion.
An inlet having a chip and an antenna is provided, a cover is adhered to the card body, and the inlet is sealed in the inlet storage portion.

The term "adhesion" refers not only to the use of an adhesive, a pressure-sensitive adhesive tape, a heat-sealing material, etc., but also to the heat-sealing that adheres tightly by heating, or the heat-sealing using ultrasonic waves. This refers to tightly joining members by various methods. In addition, enclosing refers to hermetically sealed without bonding and fixing, that is,
This means that the inlet, the card body and the cover are not fixed and adhered, and the inlet is hermetically stored.

[0022]

Embodiments of the present invention will be described below with reference to the drawings. The non-contact type IC card 1 includes a card body 2 having an inlet storage section 3 and a cover mounting section 4, a cover 5, an IC chip 61, an inlet 6 including an antenna 62 and a substrate 63.

The card body 2 is made of ABS resin, polyphenylene ether, polystyrene, polyethylene, polypropylene, polyethylene terephthalate, vinyl chloride resin,
It is formed by injection molding or the like using a synthetic resin having thermoplasticity such as polycarbonate, or a material to which a reinforcing material such as rubber such as polybutadiene having elasticity is added to impart elasticity thereto.

The shape of the card body 2 is not particularly limited as long as the inlet 6 can be sealed therein. According to the ISO international standard, the card body 2 is a substantially rectangular flat card having a width of 54 mm, a length of 85.6 mm and a thickness of 0.76 mm. When used for general credit cards and commuter passes, it is recommended to be formed in that size, but it is not limited to this shape, other shapes such as rectangles,
Needless to say, the shape may be a flat plate shape such as a square or a circle, or the thickness may be further increased or decreased.

The card body 2 is formed with an inlet storage section 3 and a cover installation section 4. The method for forming the inlet storage section 3 and the cover installation section 4 is not particularly limited. When the card body 2 is formed by injection molding, the inlet storage section 3 and the cover installation section 4 need to be formed by a mold capable of forming the shape. What is necessary is just to shape using it.

The inlet housing 3 is a recess formed in the card body 2 for housing the inlet 6, and comprises a first housing 31 and a second housing 32. The first storage section 31 includes the antenna 62 of the inlet 6 and the substrate 63.
The second storage section 32 stores the IC chip 61 of the inlet 6. The first storage section 31 is recessed at an appropriate position of the card body 2 and has a shape corresponding to the shape of the substrate 63.
All sides of the first storage section 31 and all sides of the substrate 63 have a size and shape that can be separated, and the depth of the first storage section 31 is
The height is equal to or slightly greater than the height of the antenna 62.

The second storage portion 32 is further recessed from the bottom surface of the first storage portion 31, and the second storage portion 32 is positioned at the IC chip 6 of the inlet 6.
1 is formed corresponding to the installation position. The shape of the second storage section 32 corresponds to the shape of the IC chip 61, and
1 is formed so that the side surface or the side surface and the bottom surface of the second storage portion 32 are not in contact with the side surface or the side surface and the bottom surface of the IC chip 61, and the depth is greater than the height of the IC chip 61. And the position of the second storage section 32 is the first storage section 31.
The distance from the outer peripheral end to the outer end of the second storage portion 32 is formed at a position where the distance from the end where the IC chip 61 contacts the substrate 63 to the end of the substrate 63 or less.

Here, the first storage section 31 and the second storage section 32
It is recommended that the boundary be formed in a curved shape, not a square shape. Note that if the IC chip 61 is sealed in the substrate 63 and the inlet 6 is flat, it is not necessary to form the second storage section 32 in the inlet storage section 3.

The inlet housing 3 has not only the above-mentioned shape, but also all the side surfaces and the lower surface of the inlet 6 have the housing portion 3.
It is a matter of course that the shape in contact with the side surface and the bottom surface, that is, the shape of the inlet housing portion 3 may be the same shape and the same size as the shape of the inlet 6. Even in such a case, the card body 2, the cover 5 and the substrate 63 are formed of an elastic and extensible synthetic resin, and the inlet 6 is not bonded to the card body 2 and / or the cover 5. Therefore, all the stress applied to the IC card 1 is not applied to the inlet 6.

The cover installation part 4 is a place where the cover 5 is installed, and is formed to be recessed above the inlet storage part 3 of the card body 2. The cover installation part 4 is formed corresponding to the shape of the cover 5, but the outer periphery is formed at an appropriate position in the direction from the outer peripheral upper end of the inlet housing 3 toward the outer peripheral end of the card body 2, and the outer peripheral upper end of the inlet housing 3 is formed. Is formed so as to surround the periphery of.

The cover installation surface 41 of the cover installation portion 4 is formed horizontally, and the cover 5 surrounding the upper end outer circumference of the inlet storage portion 3 over the cover installation surface 41 over the outer circumference of the upper end of the inlet storage portion 3. It is also possible to form an appropriate number of the projections 42 to be the bonding portions. In this case, the upper surface of the substrate 63 and the lower surface of the cover 5 may be separated from each other by the height of the projection 42. However, the portion of the cover 5 corresponding to the inlet storage section 3 is formed thicker, or Storage section 3
The lower surface of the cover 1 may be formed to have a thickness approximately equal to or slightly less than the length of the lower surface of the cover 5 so that the degree of separation between the upper surface of the substrate 63 and the lower surface of the cover 5 may be adjusted or brought into contact. .

The cover 5 is not formed on the card body 2 but the upper surface of the card body 2 is used as the installation surface of the cover 2 or the cover 5 is bonded to a protrusion similar to the protrusion 42 formed on the upper surface. Of course, it may be good. In this case, the cover 5 is formed on the upper surface of the card main body 2 formed from the upper end of the outer periphery of the inlet housing 3 of the card main body 2 to the outer peripheral end of the card main body 2 or the protrusion 42 formed on the upper surface. The card body 2 is formed to be thinner by about the height of the cover installation section 4 than the case where the cover installation section 4 is formed, and the cover 5 has the same cross-sectional shape as the card body 2. What is necessary is just to form in a shape.

The cover 5 is a lid for enclosing the inlet 6 in the card body 2, and its shape is not particularly limited as long as the inlet housing 6 can be completely sealed. desirable. Further, the side surface of the cover 5 may be shaped to be in close contact with the side surface of the cover installation surface 41, but is formed in a shape that can be separated from the side surface of the cover installation surface 41 in order to facilitate bending of the non-contact type IC card 1. It may be that.

Here, when the cover 5 is adhered to the card body 2, the antenna 62 and the substrate 63 are simultaneously covered by the cover 5.
May be in contact with the bottom surface of the first storage unit 31 from the bottom surface of the first storage unit 31. The height of the bottom surface of the first storage unit 31 from the lower surface of the cover 5 is equal to or higher than the height of the antenna 62 plus the height of the substrate 63. Thus, the antenna 62 and the substrate 63 may not be simultaneously in contact with the lower surface of the cover 5 and the bottom surface of the first storage portion 31.

The cover 5 is made of ABS resin, polyphenylene ether, polystyrene, polyethylene, polypropylene, polyethylene terephthalate,
Injection molding or the like using a synthetic resin having thermoplasticity such as vinyl chloride resin or polycarbonate, or a material to which a reinforcing material such as rubber such as polybutadiene having elasticity is added in order to impart elasticity thereto. Form. or,
A thin metal sheet may be used.

The inlet 6 comprises an IC chip 61, an antenna 62, and a substrate 63. The IC chip 61 is mounted on a substrate 63 so as to be connected to an antenna 62. The IC chip 61 may be installed by using a bare chip mounting method or the like, and an anisotropic conductive adhesive or the like is used for connection at this time.

The IC chip 61 is made of a thermoplastic resin such as ABS resin, polyphenylene ether, polyimide, acrylic resin, urethane resin, epoxy resin, polystyrene, polyethylene, polypropylene, polyethylene terephthalate, vinyl chloride resin, polycarbonate, glass epoxy, rubber silicon resin, etc. It is recommended to seal with a synthetic resin having the following, or a material to which a reinforcing material such as rubber such as polybutadiene having elasticity is added in order to impart elasticity thereto.

In this case, the depth of the second housing portion 32 is formed so that at least the side surface of the IC chip sealing resin does not contact the side surface of the second housing portion 32 and is higher than the height of the sealing resin. It is necessary to appropriately change the shape and the like of the second storage portion 32. When the bottom surface of the second housing portion 32 comes into contact with the sealing resin, the sealing resin and thus the sealing resin,
It is recommended that the C-tip 61 and the inlet 6 be formed in a hemispherical shape in order to facilitate movement in the storage section 3. As another form, the entire surface of the sealing resin may be in contact with all side surfaces and the bottom surface of the second storage portion 32.

The substrate 63 is made of a thermoplastic synthetic resin such as ABS resin, polyphenylene ether, polystyrene, polyethylene, polypropylene, polyethylene terephthalate, polyimide, vinyl chloride resin, polycarbonate, glass epoxy or the like, or in order to make them elastic. It is formed using a material that can be formed into a film shape such as a material to which a reinforcing material such as rubber such as polybutadiene having elasticity is added. Although the shape is not particularly limited, the shape that can be placed on the first storage portion 31 and the side surface thereof can be separated from the side surface of the first storage portion 31 or the entire side surface thereof is the first storage portion 3.
At least the first storage portion 31
The shape is not particularly limited as long as the shape can be accommodated in the device, but it is recommended to form the film.

The antenna 62 is formed and installed by forming a metal wire into a coil shape and attaching it to the substrate 63 with an adhesive or the like, or attaching a conductive foil such as copper or aluminum to the substrate 63 and etching the same. .

Further, even when one side end of the substrate 63 contacts the side surface of the first storage portion 31, the IC chip 61 does not contact the side surface of the second storage portion 32 so that the substrate 63 It is recommended that the IC chip 61 be placed on the substrate 63 at a position where the length of the 63 end is equal to or greater than the distance from the outer end of the first storage section to the outer end of the second storage section.

It is a matter of course that an extremely thin paper, a thin metal plate or the like may be adhered to the upper surface or the lower surface of the IC card 1. This is particularly effective when the side of the storage unit 3 and the side of the cover 5 are separated from each other and a recess is formed on the upper surface of the card body 2.
The paper or the like can be subjected to processing such as embossing or printing in advance.

In manufacturing the non-contact type IC card 1 of the present invention, first, the card body 2 and the cover 5 are formed by injection molding, and the antenna 62 is formed and installed on the substrate 63. Then, an anisotropic conductive adhesive is inserted between the IC chip 61 and the substrate 63 and thermocompression-bonded to connect the IC chip 61 and the antenna 62 to form the inlet 6. The inlet 6 is installed in the inlet storage section 3 of the card body 2. Specifically, the IC chip 61 is mounted on the second storage section 32 and the substrate 63 is mounted on the first storage section 31.
Set up so that it can be stored in. At this time, the lower surface of the substrate 63 or the antenna 62 contacts the upper surface of the first storage section 31,
The first storage section 3 is simply provided without bonding between the two sides.
Only the substrate 63 is placed on the upper surface of the substrate 1.

Next, the cover 5 is placed on the cover installation surface 41 of the cover installation section 4 and bonded using an adhesive such as a polyester resin or an epoxy resin, an adhesive tape, a heat sealing material, or the like. The cover 5 is adhered to the card body 2 by heat fusion or fusion using ultrasonic waves, and the inlet 6 is sealed. In the case where an appropriate number of protrusions are formed on the cover installation surface 41 so as to surround the outer periphery of the upper end of the inlet housing 3 over the outer periphery of the upper end of the inlet housing 3, the cover 5
And the projection 42 are adhered by the above-described method to encapsulate the inlet 6. The lower surface of the cover 5 and the upper surface of the substrate 63 are not bonded.

When the IC card 1 is subjected to embossing or printing, the embossing or printing is performed on the cover 5 and / or the card body 2 before the cover 5 is bonded to the card body 2. It is desirable to apply the processing.

The non-contact type IC card 1 thus formed
When the non-contact type IC card 1 is deformed or bent, the IC chip 61 has a gap between the IC chip 61 and the second storage portion 32, so that the IC chip 61 may not contact the card body 2. Further, since the inlet 6 is not adhered to the card body 2 and the cover 5, the substrate 63 can be slid back and forth and left and right in the second storage portion 32, and the substrate 63 can be slid in the first storage portion 31. Accordingly, even when a part of the side surface of the substrate 63 contacts the side surface of the first storage portion 31, the IC chip 61 does not contact the card body 2.

Also, a part of the side surface of the substrate 63 is
When the non-contact type IC card 1 is stressed when it is in contact with the side surface of the substrate 63 and the non-contact type IC card 1 is deformed or curved, the non-contact type IC card 1 is moved in the non-contact direction in the first storage portion 31 of the substrate 63. No load is applied to the substrate 63, the IC chip 61, and the connection between the substrate 63 and the IC chip 61 by the slide. Further, even in the case where the inlet 6 is in contact with the storage section 3, the card body 2, the cover 5,
Is formed of a synthetic resin having elasticity and extensibility, and since the inlet 6 is not bonded to the card body 2 and / or the cover 5, the stress applied to the IC card 1
It doesn't take all.

As a mode of use of such a non-contact type IC card, a normal state such as a credit card and a commuter pass can be used as a flat so-called card.
Used for distribution tags that are subject to external stress,
It is used by sticking it on the curved surface such as the bottle side.

[0049]

According to the present invention, stress is not applied to the IC chip and the connection between the IC chip and the antenna even if the card is deformed even if the card is deformed, while taking advantage of the non-contact type IC card. Thus, the IC card and the connection between the IC chip and the antenna can be used without breaking the IC card, and it is possible to cope with the use such as attaching the IC card to a curved surface.

Furthermore, since the card body and the cover can be bonded after the body or the cover is processed, the surface of the IC card can be easily embossed, and the degree of freedom of the processing can be increased.

Further, unlike the prior art, there is no need to attach a reinforcing seal or incorporate a reinforcing body, and the cost is low.
It can be easily manufactured.

The installation position of the IC chip in the IC card can be freely determined, and the degree of freedom in designing, processing, and selecting usable IC chips can be increased.

[Brief description of the drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a sectional view of another embodiment of the present invention.

FIG. 3 is an exploded view of one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Non-contact type IC card 2 Card main body 3 Inlet storage part 31 First storage part 32 Second storage part 4 Cover installation part 41 Cover installation surface 42 Projection 5 Cover 6 Inlet 61 IC chip 62 Antenna 63 Substrate

Claims (9)

[Claims] 1. A non-contact type IC card comprising: an inlet having an IC chip and an antenna; a card body having an inlet housing for housing the inlet; and a cover capable of sealing the inlet housing. A non-contact type IC card, wherein a cover is adhered to a main body and an inlet is sealed in an inlet accommodating portion. 2. A non-contact IC card comprising: an inlet having an IC chip and an antenna; a card body having an inlet housing for housing the inlet; and a cover capable of sealing the inlet housing. A non-contact type I, wherein a cover is adhered to the main body, and the inlet is movably sealed in the inlet storage portion.
C card. 3. An inlet having an IC chip and an antenna, a card body having an inlet storage portion for storing the inlet, a cover installation portion formed on the upper portion of the inlet storage portion, and a cover capable of sealing the inlet storage portion. Non-contact type IC card, wherein the cover is attached to the cover installation portion, the cover is adhered to the card body, and the inlet is movably sealed in the inlet storage portion. IC card. 4. The inlet storage section has a height equal to or greater than the thickness of the inlet, and is formed in such a shape that a side surface of the inlet storage section and a side surface of the inlet can be separated when the inlet is installed. The non-contact type IC card according to claim 1, wherein: 5. The inlet is formed by mounting an IC chip on a substrate on which an antenna is formed, and the inlet receiving portion is formed by recessing a second receiving portion from the first receiving portion and the first receiving portion. The non-contact type IC card according to claim 1, wherein: 6. The non-conductive device according to claim 5, wherein a distance from an outer peripheral end of the first storage unit to an outer end of the second storage unit is formed to be equal to or less than a length of an IC chip end to a substrate end. Contact IC
card. 7. The non-contact type IC chip according to claim 5, wherein the IC chip is sealed with a synthetic resin, and at least a side surface of the IC chip does not contact the inlet accommodating portion. IC card. 8. The method according to claim 1, wherein an appropriate number of projections surrounding the outer periphery of the upper end of the inlet accommodating portion are formed on the cover installation surface of the card body, and the projections and the cover are adhered. Non-contact IC card. 9. An inlet accommodating portion having a size equal to or larger than the size of the inlet is formed in the card body, an inlet having an IC chip and an antenna is installed in the inlet accommodating portion, a cover is adhered to the card body, and the inlet accommodating portion is provided. A method for manufacturing a non-contact type IC card, characterized by enclosing an inlet.