JP2010086254A - Heat-resistant ic tag strap - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate a traceability management without deterioration of quality when manufacturing a board. <P>SOLUTION: The heat-resistant IC tag strap includes at least a board having a chip container and an IC tag. The IC tag has a chip package including an antenna and an IC chip formed on one surface of the heat-resistant substrate, wherein the heat-resistant substrate is attached to the board via adhesive layer and the IC chip on the heat-resistant substrate is contained in the chip container of the board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat-resistant IC tag strap having an IC tag attached to a substrate.

  2. Description of the Related Art In recent years, an RFID system that communicates information in a non-contact manner by communicating a reader / writer that generates an induction electromagnetic field and an IC tag that records predetermined information attached to an article has been developed as an article management system. . Since the IC tag can freely read and write information, it can be used for traceability management in the manufacturing process and distribution process of products. Therefore what stage do the malfunction occurs easily identified in becomes possible. For example, Patent Document 1 discloses a management method using an RFID system for manufacturing process management of a substrate unit.

  When managing the process of mounting various components such as printed wiring boards, it has traditionally been possible to manage the progress of manufacturing by attaching a heat-resistant barcode to the board and reading the barcode in each manufacturing process. I was going. However, since the barcode is used, there is a problem that information cannot be written, and the barcode cannot be read when the barcode is stained or scratched in various manufacturing processes.

Therefore, it is conceivable to use an IC tag that can read and write information on an external terminal instead of a barcode. Since the IC tag can read and write information with an external reader / writer using wireless communication, it does not become impossible to read information due to dirt like a barcode, and new information can be written.
However, the IC tag has a convex structure by laminating the antenna and the IC chip on the base material, and becomes thicker than the barcode. Therefore, if the substrates with IC tags attached are stacked and stored, the IC chip is destroyed due to the weight of the substrate, or the substrate coating has a problem in that the quality is inferior due to the unevenness of the base material. It was.
JP 2005-236097 A

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and enable traceability management without causing a defect in quality in manufacturing a substrate.

  In this invention, since the heat resistant base material is flattened by accommodating the IC chip in the chip accommodating portion provided on the substrate, the IC chip can be affixed without causing any trouble in the process before mounting. The purpose is to manage the process before mounting various components, and the following configuration is provided in order to solve the above problems.

  The invention according to claim 1 is a heat-resistant IC tag strap having at least a substrate having a chip housing portion and an IC tag, wherein the IC tag is formed on one surface of the heat-resistant substrate. A chip package having an antenna and an IC chip, wherein the heat-resistant substrate is affixed to the substrate via an adhesive layer, and the IC chip on the heat-resistant substrate is in a chip housing portion of the substrate It is a heat-resistant IC tag strap characterized by being accommodated.

The invention according to claim 2 is the heat-resistant IC tag strap according to claim 1, wherein the chip package includes an antenna, an IC chip, a matching circuit, and an electromagnetic coupling circuit.
According to the present invention, the matching between the antenna and the IC chip is optimized. In addition, since the band is wide, uniform performance can be exhibited even if a frequency shift occurs.

The invention according to claim 3 is characterized in that the substrate has an external antenna and is electrically connected to the external antenna and an antenna formed on a heat-resistant substrate. The heat-resistant IC tag strap according to any one of the above.
According to the present invention, by providing the substrate with an antenna larger than the IC tag antenna, it is possible to provide a function as a booster antenna capable of extending the communication distance as compared with the IC tag antenna alone. it can.

The invention according to claim 4 is characterized in that the chip accommodating portion has a concave shape, a hole shape or a notch shape formed on a base material. It is a sex IC tag strap.
According to the invention of this claim, since the convex portion of the IC chip of the IC tag can be accommodated by making the chip accommodating portion into a concave shape, a hole shape or a cut shape, the unevenness formed on the substrate is minimized. It becomes possible to. In addition, it can be arranged freely regardless of the edge or center of the substrate.

A fifth aspect of the present invention is the heat resistant IC tag strap according to any one of the first to fourth aspects, wherein a barcode is printed on the other surface of the heat resistant base material.
According to the invention described in this claim, even when the IC chip breaks down, information on the manufacturing process can be obtained from the barcode.

  According to the present invention, it is possible to manage traceability without causing a defect in quality in manufacturing a substrate.

  Embodiments of the heat-resistant IC tag strap according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an example of the present invention, and an IC chip 5 on a heat-resistant substrate 1 is accommodated in a chip accommodating portion 3 of a substrate 2.

  2 and 3 are cross-sectional views showing a state where the chip package 16 is provided on the heat-resistant substrate 1.

The heat-resistant base material 1 is a base material that can withstand a temperature of about 200 ° C. because heat of about 200 ° C. is applied in a solder reflow process to be described later when pasted to the substrate 2. Specifically, polyimide, PET, polypropylene, polyethylene, polystyrene, nylon and the like can be used.
The thickness of the heat resistant substrate 1 is preferably in the range of 10 to 100 μm. This is because when the thickness of the heat-resistant substrate 1 is 100 μm or more, a step is generated between the heat-resistant substrate 1 and the mask used for solder formation during the solder reflow process described later, and the mask floats. Adversely affects solder formation. Moreover, when it is 10 μm or less, the strength as the heat-resistant substrate 1 is not provided.
The solder reflow process is a process of forming solder on the substrate 2 while applying heat with a roll or the like.

  The chip package 16 has at least the antenna 4 and the IC chip 5, and the antenna 4 and the IC chip 5 are electrically connected.

The antenna 4 is made of a conductive material such as aluminum foil or copper foil. Examples of the forming method include a method of printing a conductive material on the heat-resistant substrate 1, a method of laminating a thin film made of a conductive material, and the like.
Further, the shape of the antenna 4 can be suitably used as a half-wave dipole antenna with open both ends, but is not limited thereto.
The thickness of the antenna 4 is preferably in the range of 1 to 50 μm.

The IC chip 5 is contained in the mold resin 6 and is electrically connected to the antenna 4. The connection may be a method using a bonding wire as shown in FIG. 2 or a direct connection to the antenna 4 with a newly provided external electrode. In this case, the antenna 4 and the external electrode can be connected by solder, a conductive adhesive, a conductive double-sided tape or the like.
The thickness of the IC chip 5 is generally in the range of 50 to 100 μm. The thickness of the adhesive 8 such as a conductive adhesive is about 0.1 to 10 μm. A double-sided tape may be used instead of the adhesive 8.

The chip package 16 may include a matching circuit 10 and an electromagnetic field coupling circuit 9 in addition to the antenna 4 and the IC chip 5. In FIG. 3, a chip package 16 includes an antenna 4, an adhesive 8, a ceramic 11, and an insulator 12. A matching circuit 10 and an electromagnetic coupling circuit 9 are disposed in the ceramic 11, and an IC chip. 5 is arranged in the insulator 12.
The total thickness of the ceramic 11 and the insulator 12 is preferably 200 to 500 μm. If this thickness is too thick, problems are likely to occur when affixing to the substrate 1.

The antenna 4 and the IC chip 5 can be connected via an electromagnetic field coupling circuit 9. The antenna 4 and the electromagnetic field coupling circuit 9 can be connected using a non-conductive adhesive and double-sided tape.
The antenna 4 and the electromagnetic field coupling circuit 9 are mainly coupled via a magnetic field, but may be coupled via an electric field. In the present invention, “electromagnetic field coupling” means coupling via an electric field or a magnetic field. Electric power and signals are transmitted by electromagnetic coupling.

  In the electromagnetic field coupling circuit 9, the resonance frequency characteristic is determined by a resonance circuit composed of the inductance element L and the capacitance elements C1 and C2. The resonance frequency of the signal radiated from the antenna 4 substantially corresponds to the self-resonance frequency of the electromagnetic field coupling circuit 9, and the maximum gain of the signal depends on the size and shape of the electromagnetic field coupling circuit 9, the electromagnetic field coupling circuit 9 and It is substantially determined by the distance from the antenna 4 and at least one of the media. Therefore, since the resonance frequency characteristic is determined by the resonance circuit composed of the inductance element L and the capacitance elements C1 and C2, the resonance frequency characteristic does not change even if it is sandwiched between books.

  The resonance circuit may serve as the matching circuit 10 in order to match the impedance of the IC chip 5 and the impedance of the antenna, or may further include a matching circuit 10 provided separately from the resonance circuit. By providing the matching circuit 10, power transmission between the antenna 4 and the IC chip 5 can be made efficient.

Further, it is possible to connect the antenna 4 directly to the newly provided external electrode without using the electromagnetic field coupling circuit 9. In this case, the antenna 4 and the external electrode can be connected by solder, a conductive adhesive, a conductive double-sided tape, or the like.
The IC chip 5 includes a clock circuit, a logic circuit, and a memory circuit. Necessary information is stored in the IC chip 5, and the connection to the matching circuit 10 is direct electrical or electromagnetic coupling.
The insulator 12 is formed on the ceramic 11, and the IC chip 5 is disposed in the insulator 12.

The substrate 2 includes a chip accommodating portion 3.
The chip accommodating part 3 can use the same method of forming a concave shape, a hole shape, or a notch shape. In the case of a hole shape, it can be formed at a time by punching together in a stacked state. Further, in the case of a cut-off shape, the substrate can be formed in a stacked state at the time of external processing of the substrate.
The size (area) of the chip accommodating portion 3 is slightly larger than the size of the IC chip 5 so that the IC chip 5 can be accommodated. Moreover, since the area which can mount components in the board | substrate 2 will become narrow if too large, the size larger about 0.1 mm-10 mm than the size of IC chip 5 is good. The size (area) of the IC chip 5 is various, such as 0.4 mm × 0.4 mm, 0.9 mm × 0.8 mm.

  Further, as shown in FIG. 4, the substrate 2 may be provided with an external antenna 13. The antenna 4 on the heat resistant substrate 1 and the external antenna 13 can be directly connected by electrical or electromagnetic coupling. Specifically, a conductive adhesive (conductive tape) or a non-conductive adhesive (non-conductive tape) is used so that the antenna 4 on the heat-resistant substrate 1 and the external antenna 13 provided on the substrate 2 overlap. Can be used together.

The external antenna 13 can be provided by the same material and method used for the antenna 4.
The shape and size of the external antenna 13 can be appropriately selected from the relationship of the frequency characteristics of the electromagnetic field coupling circuit 9 and the like connected to the IC chip 5.

  A bar code can be provided on the side of the heat-resistant substrate 1 where the IC chip 5 or the like is not provided. By doing in this way, when the heat resistant base material 1 is affixed to the board | substrate 2, a barcode is located in the surface. As a method for forming the bar code, a printing method or the like can be used. As the printing method, a screen method or the like can be used, and it can be appropriately selected according to the heat-resistant substrate 1 without any particular limitation.

As shown in FIG. 5, when the substrate 2 is a printed wiring board 14, a wiring pattern 15 made of a conductive material is first formed on a substrate using a resin material such as an epoxy resin. At this time, the external antenna 13 may be formed simultaneously with the wiring pattern 15. The printed wiring board 14 may have a multilayer structure.
Next, solder is provided in a solder reflow process, components are mounted, and the wiring pattern 15 is joined via the solder. Here, when solder is provided, the solder can be formed at a specific location by using a mask on the substrate.
In the present invention, since the substrate 2 is provided with the chip accommodating portion 3, the IC chip 5 of the chip package 16 provided on the heat resistant base material 1 is accommodated in the chip accommodating portion 3, so that there is almost no step on the surface. They can be stacked on the board 2 before mounting the components.
Moreover, since the heat resistant base material 1 is used, it is resistant to the solder reflow process.

FIG. 3 is a diagram showing an embodiment of the present invention housed in a chip housing portion of a substrate. It is sectional drawing of one Example of this invention. It is sectional drawing of one Example of this invention. FIG. 5 is a diagram showing an embodiment of the present invention connected to a substrate provided with an external antenna. Printed wiring board according to one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat resistant base material 2 Board | substrate 3 Chip accommodating part 4 Antenna 5 IC chip 6 Mold resin 7 Bonding wire 8 Adhesive 9 Electromagnetic field coupling circuit 10 Matching circuit 11 Ceramic 12 Insulator 13 External antenna 14 Printed wiring board 15 Wiring pattern 16 Chip package

Claims (5)

A substrate having a chip housing portion;
In a heat-resistant IC tag strap having at least an IC tag,
The IC tag was formed on one surface of the heat-resistant substrate.
A chip package having an antenna and an IC chip;
The heat-resistant substrate is attached to the substrate via an adhesive layer;
An IC chip on the heat-resistant substrate is accommodated in a chip accommodating portion of the substrate;
Heat-resistant IC tag strap characterized by   The heat-resistant IC tag strap according to claim 1, wherein the chip package includes an antenna, an IC chip, a matching circuit, and an electromagnetic field coupling circuit. The substrate has an external antenna;
3. The heat resistant IC tag strap according to claim 1, wherein the external antenna and the antenna formed on the heat resistant substrate are electrically connected.   The heat-resistant IC tag strap according to any one of claims 1 to 3, wherein the chip housing portion has a concave shape, a hole shape, or a notch shape formed on a base material.   The heat-resistant IC tag strap according to any one of claims 1 to 4, wherein a barcode is printed on the other surface of the heat-resistant substrate.

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