JPH11106918A - 薄膜形成用治具 - Google Patents

薄膜形成用治具

Info

Publication number
JPH11106918A
JPH11106918A JP28464297A JP28464297A JPH11106918A JP H11106918 A JPH11106918 A JP H11106918A JP 28464297 A JP28464297 A JP 28464297A JP 28464297 A JP28464297 A JP 28464297A JP H11106918 A JPH11106918 A JP H11106918A
Authority
JP
Japan
Prior art keywords
jig
thin film
forming
silver
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28464297A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11106918A5 (enExample
Inventor
Hiroyuki Arioka
博之 有岡
Mamoru Usami
守 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP28464297A priority Critical patent/JPH11106918A/ja
Publication of JPH11106918A publication Critical patent/JPH11106918A/ja
Publication of JPH11106918A5 publication Critical patent/JPH11106918A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP28464297A 1997-10-01 1997-10-01 薄膜形成用治具 Pending JPH11106918A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28464297A JPH11106918A (ja) 1997-10-01 1997-10-01 薄膜形成用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28464297A JPH11106918A (ja) 1997-10-01 1997-10-01 薄膜形成用治具

Publications (2)

Publication Number Publication Date
JPH11106918A true JPH11106918A (ja) 1999-04-20
JPH11106918A5 JPH11106918A5 (enExample) 2005-06-09

Family

ID=17681117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28464297A Pending JPH11106918A (ja) 1997-10-01 1997-10-01 薄膜形成用治具

Country Status (1)

Country Link
JP (1) JPH11106918A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014194085A (ja) * 2007-12-19 2014-10-09 Quantam Global Technologies Llc プロセスキット及びチャンバをクリーニングするための方法、及び、ルテニウムを回収するための方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014194085A (ja) * 2007-12-19 2014-10-09 Quantam Global Technologies Llc プロセスキット及びチャンバをクリーニングするための方法、及び、ルテニウムを回収するための方法

Similar Documents

Publication Publication Date Title
TWI771394B (zh) 清洗靶材的方法、靶材的製造方法、再生鑄錠的製造方法以及再生鑄錠
EP1785505B1 (en) Barrier film for flexible copper substrate and sputtering target for forming barrier film
KR20030045138A (ko) 물리적 증기 증착 타겟/백플레이트 조립체 및 물리적 증기증착 타겟/백플레이트 조립체를 형성하는 방법
TWI408241B (zh) 用於電子機械和工具的銅合金與其製造的方法
EP0790327B1 (en) Deposition-preventing part for physical vapor deposition apparatuses
JPH05230628A (ja) 金属膜形成装置、金属膜形成装置における金属材回収方法
US4025404A (en) Ohmic contacts to thin film circuits
JP6872514B2 (ja) ターゲット材を洗浄するための方法、ターゲット材の製造方法、リサイクル鋳塊の製造方法およびリサイクル鋳塊
JPH11106918A (ja) 薄膜形成用治具
KR102104013B1 (ko) 사용이 끝난 타깃재를 세정하는 방법, 타깃재의 제조 방법, 리사이클 주괴의 제조 방법 및 리사이클 주괴
JP2008133538A (ja) ターゲット廃材とインジウムの分離回収方法。
TWI364342B (en) Whisker-free coating structure and method of fabricating the same
JP4436802B2 (ja) 成膜装置用構成部品およびその洗浄方法
CN106191793B (zh) 成膜装置及其清洗方法
JPH07216530A (ja) 蒸着用治具及び蒸着用治具の再生方法
JPH06228746A (ja) 高融点金属スパッタターゲット
JPH0841624A (ja) 蒸着用治具及び蒸着用治具の再生方法
JPH10259471A (ja) 蒸着用治具及び該蒸着用治具からの貴金属回収方法
JPH11106918A5 (enExample)
JP2003105561A (ja) 装飾部材
JPH0949070A (ja) 蒸着用治具
JPH1088385A (ja) タングステン合金のメッキ方法
JPH07216529A (ja) 蒸着用治具及び蒸着用治具の再生方法
JPH0832940B2 (ja) 薄膜形成装置用しゃへい板
JP2006249534A (ja) 貴金属膜の剥離方法

Legal Events

Date Code Title Description
A521 Written amendment

Effective date: 20040824

Free format text: JAPANESE INTERMEDIATE CODE: A523

A621 Written request for application examination

Effective date: 20040824

Free format text: JAPANESE INTERMEDIATE CODE: A621

A977 Report on retrieval

Effective date: 20070213

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Effective date: 20070522

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070723

A02 Decision of refusal

Effective date: 20070904

Free format text: JAPANESE INTERMEDIATE CODE: A02