JPH1110055A - Coating device - Google Patents
Coating deviceInfo
- Publication number
- JPH1110055A JPH1110055A JP16702197A JP16702197A JPH1110055A JP H1110055 A JPH1110055 A JP H1110055A JP 16702197 A JP16702197 A JP 16702197A JP 16702197 A JP16702197 A JP 16702197A JP H1110055 A JPH1110055 A JP H1110055A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- slit
- substrate support
- substrate
- coating head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体、液晶表示
装置やカラーフィルタ等の製造工程において、基板上に
レジスト、着色感材などの種々の材料を塗布するための
コーティング装置に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for applying various materials such as a resist and a coloring material on a substrate in a manufacturing process of a semiconductor, a liquid crystal display, a color filter, and the like.
【０００２】[0002]
【従来の技術】従来、スリットコータとスピンコータの
機能を合わせたコーティング装置が知られている。これ
を図２により説明すると、回転軸１には基板支持台２が
固定され、基板支持台２上に基板３が支持されている。
基板３に対向してスリット５ａを有する塗布ヘッド５が
上下方向ｙ及び水平方向ｘに移動可能に設置されてい
る。塗布方法について説明すると、回転軸１を回転させ
基板支持台２の回転が安定すると、スリット５ａと基板
３間のギャプを３００〜５００μｍ程度に維持するよう
に塗布ヘッド５を下降させ、スリット５ａから塗布液を
基板３上に供給しつつ塗布ヘッド５をｘ方向に移動さ
せ、塗布液に作用する遠心力により基板３全面に均一な
厚さで塗布液を塗布するようにしている。2. Description of the Related Art Conventionally, there has been known a coating apparatus having functions of a slit coater and a spin coater. This will be described with reference to FIG. 2. A substrate support 2 is fixed to the rotating shaft 1, and a substrate 3 is supported on the substrate support 2.
A coating head 5 having a slit 5a is provided so as to face the substrate 3 so as to be movable in the vertical direction y and the horizontal direction x. The application method will be described. When the rotation of the rotating shaft 1 is stabilized and the rotation of the substrate support 2 is stabilized, the application head 5 is lowered so that the gap between the slit 5a and the substrate 3 is maintained at about 300 to 500 μm, and The coating head 5 is moved in the x direction while supplying the coating liquid onto the substrate 3, and the coating liquid is applied to the entire surface of the substrate 3 with a uniform thickness by the centrifugal force acting on the coating liquid.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の塗布方法に
おいては、基板支持台２の周辺が回転機構のがたつきに
よりｙ方向に振れるため、スリット５ａと基板３間を所
定のギャプに維持することは困難であり、高い機械精
度、加工精度が要求されるという問題を有している。ま
た、水平移動機構についても同様であった。In the above-mentioned conventional coating method, the periphery of the substrate support 2 swings in the y direction due to the backlash of the rotating mechanism, so that a predetermined gap is maintained between the slit 5a and the substrate 3. It is difficult to do so, and there is a problem that high mechanical precision and processing precision are required. The same applies to the horizontal movement mechanism.
【０００４】本発明は、上記従来の問題を解決するもの
であって、回転機構に高い機械精度を必要とすることな
く、また、移動機構を簡略化することができるコーティ
ング装置を提供することを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and to provide a coating apparatus capable of simplifying a moving mechanism without requiring high mechanical accuracy in a rotating mechanism. Aim.
【０００５】[0005]
【課題を解決するための手段】そのために本発明のコー
ティング装置は、回転可能にされた基板支持台と、該基
板支持台の中央部に対向して上下方向移動可能に設置さ
れた塗布ヘッドと、塗布ヘッドに長手方向に形成された
スリットとを備えたことを特徴とする。なお、上記スリ
ットの幅をセンター部で大きく、左右両端部にいくに従
い小さくするようにすれば、さらに均一に塗布すること
ができる。For this purpose, a coating apparatus according to the present invention comprises a rotatable substrate support, and a coating head mounted to be movable in the vertical direction in opposition to the center of the substrate support. And a slit formed in the coating head in the longitudinal direction. If the width of the slit is made larger at the center portion and becomes smaller toward both right and left ends, coating can be performed more uniformly.
【０００６】[0006]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しつつ説明する。図１は、本発明のコーティング
装置の１実施形態を示し、図１（Ａ）は正面図、図１
（Ｂ）は平面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the coating apparatus of the present invention, and FIG.
(B) is a plan view.
【０００７】図１（Ａ）及び図１（Ｂ）において、回転
軸１には基板支持台２が固定され、基板支持台２上に基
板３が支持されている。基板支持台２の中央部に対向し
て塗布ヘッド５が上下方向に移動可能に設置されてい
る。塗布ヘッド５は塗布液を貯留するボックス形状をな
し、その長手方向にスリット５ａが形成されている。In FIGS. 1A and 1B, a substrate support 2 is fixed to a rotating shaft 1, and a substrate 3 is supported on the substrate support 2. A coating head 5 is installed so as to be movable in the vertical direction, facing the center of the substrate support 2. The coating head 5 has a box shape for storing a coating liquid, and has a slit 5a formed in its longitudinal direction.
【０００８】塗布方法について説明すると、回転軸１を
回転させ基板支持台２の回転が安定すると、塗布ヘッド
５ａと基板３間のギャプを３００〜５００μｍ程度に維
持するように塗布ヘッド５を下降させ、スリット５ａか
ら塗布液を基板３上に供給すると、塗布液は遠心力によ
り基板３全面に均一な厚さで塗布されることになる。本
発明においては、塗布ヘッド５が回転支持台２の中央部
に設置されているため、回転機構の精度の影響により基
板支持台２の周辺が振れても塗布液を均一に供給するこ
とができ、また、水平移動機構を省略することができ
る。The coating method will be described. When the rotation of the rotating shaft 1 and the rotation of the substrate support 2 are stabilized, the coating head 5 is lowered so that the gap between the coating head 5a and the substrate 3 is maintained at about 300 to 500 μm. When the coating liquid is supplied onto the substrate 3 from the slit 5a, the coating liquid is applied to the entire surface of the substrate 3 with a uniform thickness by centrifugal force. In the present invention, since the coating head 5 is installed at the center of the rotary support 2, the coating liquid can be supplied uniformly even when the periphery of the substrate support 2 shakes due to the influence of the accuracy of the rotation mechanism. Also, the horizontal movement mechanism can be omitted.
【０００９】図１（Ｃ）は塗布ヘッド５スリット５ａの
改良例を説明するための図である。スリット５ａから基
板３上に供給される塗布液の量は、基板支持台２の回転
による遠心力の作用によりスリット５ａのセンター部で
少なく、左右両端部にいくに従い多くなる。そこで、ス
リット５ａの幅をセンター部で大きく、左右両端部にい
くに従い小さくすれば、より均一な厚さで塗布すること
ができる。FIG. 1C is a view for explaining an improved example of the coating head 5 slit 5a. The amount of the coating liquid supplied from the slit 5a onto the substrate 3 is small at the center of the slit 5a due to the effect of centrifugal force due to the rotation of the substrate support 2, and increases toward the left and right ends. Therefore, if the width of the slit 5a is increased at the center portion and reduced toward both right and left ends, the coating can be performed with a more uniform thickness.
【００１０】[0010]
【発明の効果】以上の説明から明らかなように本発明に
よれば、回転可能にされた基板支持台と、該基板支持台
の中央部に対向して上下方向移動可能に設置された塗布
ヘッドと、塗布ヘッドに長手方向に形成されたスリット
とを備えたので、回転機構に高い機械精度を必要とする
ことなく、また、移動機構を簡略化することができる。As is apparent from the above description, according to the present invention, a rotatable substrate support, and a coating head mounted to be movable vertically in opposition to the center of the substrate support. In addition, since the coating head is provided with a slit formed in the longitudinal direction, the rotating mechanism does not require high mechanical accuracy, and the moving mechanism can be simplified.
【図１】本発明のコーティング装置の１実施形態を示
し、図１（Ａ）は正面図、図１（Ｂ）は平面図、図１
（Ｃ）は塗布ヘッドのスリットの改良例を説明するため
の図である。1 shows an embodiment of a coating apparatus of the present invention, FIG. 1 (A) is a front view, FIG. 1 (B) is a plan view, FIG.
(C) is a figure for explaining an improvement example of a slit of a coating head.
【図２】従来のコーティング装置を説明するための図で
ある。FIG. 2 is a view for explaining a conventional coating apparatus.
１…回転軸 ２…回転支持台 ３…基板 ５…塗布ヘッド ５ａ…スリット DESCRIPTION OF SYMBOLS 1 ... Rotation axis 2 ... Rotation support base 3 ... Substrate 5 ... Coating head 5a ... Slit
Claims (2)
持台の中央部に対向して上下方向移動可能に設置された
塗布ヘッドと、塗布ヘッドに長手方向に形成されたスリ
ットとを備えたことを特徴とするコーティング装置。1. A coating apparatus comprising: a rotatable substrate support; a coating head installed to be vertically movable facing a center of the substrate support; and a slit formed in the coating head in a longitudinal direction. A coating apparatus, comprising:
左右両端部にいくに従い小さくしたことを特徴とする請
求項１記載のコーティング装置。2. The width of the slit is large at a center portion,
2. The coating apparatus according to claim 1, wherein the size of the coating apparatus is reduced toward both right and left ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16702197A JPH1110055A (en) | 1997-06-24 | 1997-06-24 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16702197A JPH1110055A (en) | 1997-06-24 | 1997-06-24 | Coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1110055A true JPH1110055A (en) | 1999-01-19 |
Family
ID=15841929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16702197A Pending JPH1110055A (en) | 1997-06-24 | 1997-06-24 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1110055A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11551949B2 (en) | 2019-09-10 | 2023-01-10 | Kioxia Corporation | Substrate processing device |
-
1997
- 1997-06-24 JP JP16702197A patent/JPH1110055A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11551949B2 (en) | 2019-09-10 | 2023-01-10 | Kioxia Corporation | Substrate processing device |
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Legal Events
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| A131 | Notification of reasons for refusal |
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| A521 | Written amendment |
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| A02 | Decision of refusal |
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