JPH1098296A - Device for mounting semiconductor package component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably solder the leads of parts to the pads of a substrate, even when the substrate is warped and, in addition, to obtain sufficiently high electrical or heat conductivity between the parts and substrate. SOLUTION: An arm 31 which holds a suction head 11 at a fixed height from the surface of a substrate 35 is provided at a position near the head 11, where the head 11 does not overlap the leads 17 of component 13 when the head 11 sucks the component 13. Therefore, the leads 17 can be soldered well to the pads of the substrate 35, because the contacting states between the leads 17 and solder can be stabilized. An internal shaft 23 is provided in a hollow supporting shaft 23, so that the shaft 23 can be moved vertically, and at the time of soldering the leads 17 to the pads, the conductivity of an adhesive is improved by pressurizing the component 13 with the shaft 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a TCP (tape car)
The present invention relates to an apparatus for mounting a semiconductor package component having leads around the periphery such as a carrier package (QFP) component and a QFP (quad flat package) component on a substrate.

[0002]

2. Description of the Related Art A semiconductor package component mounting apparatus has a suction head at the tip of a robot. The suction head sucks a semiconductor package component at a component supply position and transfers it to a substrate. Then, the leads of the components are soldered to the pads of the board. When the soldering is completed, the suction head releases the suction of the component, returns to the standby position, and prepares for the next component supply.

[0003]

When a semiconductor package component is mounted on a substrate, the substrate is placed on a flat support base so that the surface of the substrate has a constant height. However, if the substrate is warped, a part of the substrate rises from the support, and the height of the substrate surface is not constant. For this reason, even if the semiconductor package component is transported to a predetermined position on the substrate by the suction head and the suction head is lowered to a predetermined height, if the substrate is warped, the lead of the component and the solder on the board pad are removed. Is not stable, and it is difficult to perform good soldering.

When mounting a semiconductor package component on a substrate, it is necessary to apply an adhesive containing a conductive (or thermally conductive) filler to the substrate and then bond the chip lower surface of the semiconductor package component to the substrate. However, at this time, simply lowering the suction head to a predetermined height suitable for soldering makes it difficult to bring the conductive filler (silver particles, etc.) in the adhesive into close contact, and there is not enough space between the semiconductor package component and the substrate. There is a problem that electrical conductivity (or thermal conductivity) cannot be obtained.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to stably solder a lead of a semiconductor package component to a pad of a substrate even if the substrate is slightly warped, and An object of the present invention is to provide a semiconductor package component mounting apparatus capable of bonding a semiconductor package component and a substrate so that sufficient electrical conductivity (or thermal conductivity) can be obtained between them.

[0006]

To achieve this object, a semiconductor package component mounting apparatus according to the present invention comprises a suction head for sucking a semiconductor package component, and a hollow support for air suction rising from an upper surface of the suction head. An arm for holding the suction head at a predetermined height from the surface of the substrate at a position around the suction head and not overlapping with the lead of the semiconductor package component when the suction head sucks the semiconductor package component. And an inner shaft is provided in the hollow support shaft so as to be vertically movable.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 3 show one embodiment of a mounting apparatus according to the present invention. FIG. 1 is a partially cutaway front view showing a state in which a suction head 11 of the apparatus sucks a TCP component 13, FIG. 2 is a plan view of the same, and FIG. 3 is a bottom view of the suction head 11.

The TCP component 13 has a semiconductor chip 19 connected to the inner end of a lead 17 supported by a carrier tape 15, and the upper surface of the semiconductor chip 19 is sealed with a heat-resistant resin 21 including a connection portion with the lead 17. It was done.

The suction head 11 is integrated with a hollow support shaft 23 rising from the center of the upper surface, and a hollow portion 23a of the hollow support shaft 23 is opened at the lower surface of the suction head 11. As shown in FIG. 3, a peripheral wall 25 and a radial partition wall 27 are formed on the lower surface of the suction head 11, and a portion surrounded by these walls 25 and 27 is a concave portion 29. These recesses 29 are respectively provided in the hollow portions 23 of the hollow support shaft 23.
a. Therefore, the suction head 11 is
When the air inside the hollow support shaft 23 is sucked from the upper portion of the hollow support shaft 23 while being placed on the component 13, the pressure in the concave portion 29 is reduced,
The TCP component 13 can be sucked. The above configuration is the same as the conventional one.

The features of this device are that an arm 31 for holding the suction head at a constant height from the substrate surface is formed around the suction head 11 and that the inner shaft 33 is moved up and down in the hollow support shaft 23. It has been made possible.

The arm 31 is one of the square suction heads 11.
Only one pair is formed in the extension direction of one diagonal line. This is because the arm 31 does not overlap with the lead 17 of the TCP component 13 when the suction head 11 sucks the TCP component 13 (to prevent the arm 31 from obstructing soldering), and This is to prevent the reference position mark (usually provided near a pair of corners having a diagonal relationship) from being covered with the arm 31. The arm 31 has a projection 31a directed downward at the distal end, and the height of the suction head 11 from the surface of the substrate can be set by the height of the projection 31a.

On the other hand, the upper end of the inner shaft 33 is supported by an air cylinder or the like, and can be moved up and down. In addition, the position of the hollow support shaft 15 in the vertical direction can usually be precisely controlled by a servomotor and a ball screw.

FIG. 1 shows a state immediately before the TCP component 13 sucked by the suction head 11 is placed on the substrate 35.
The solder 37 is pre-coated on the pads of the substrate 35, and a conductive adhesive 39 is applied to a region of the substrate 35 where the semiconductor chip 19 of the TCP component is mounted.
The substrate 35 is placed on a flat support 41.
If there is no warp, there is no gap between the substrate 35 and the support table 41 as shown in the figure.
There is a gap between the two.

When the suction head 11 is lowered from the state shown in FIG. 1 to a predetermined height, as shown in FIG.
1a strikes the surface of the substrate 35, and the suction head 11 is kept at a certain height from the surface of the substrate 35. This is the same even when the substrate 35 is warped. Therefore, the contact state between the lead 17 of the TCP component 13 sucked by the suction head 11 and the pre-coated solder 37 on the substrate 35 becomes substantially constant.

Thereafter, as shown in FIG. 5, the hot air heater 43 for soldering is lowered, and hot air is blown from above the leads 17 to melt the pre-coated solder 37 and perform soldering. A heat tool can be used instead of the hot air heater 43. In this soldering, since the contact state between the lead 17 and the precoat solder 37 is kept substantially constant in advance, good soldering can be performed. When the solder 37 on the substrate 35 is melted, the inner shaft 33 is lowered, and the semiconductor chip 19 is pressed on the adhesive 39. As a result, the adhesive 39 is pressurized, and the conductive filler inside is brought into close contact, so that the semiconductor chip 19 and the substrate 35 can be bonded with good conductivity (or heat conductivity).

In the above embodiment, the case where the TCP component is mounted is described. However, the component mounted by the apparatus of the present invention is not limited to this. For example, a QFP component can be mounted similarly. It is.

[0017]

As described above, according to the present invention, an arm for holding the suction head at a predetermined height from the substrate surface is formed on the suction head, so that when the semiconductor package component is mounted on the substrate, the component can be removed. The contact state between the lead and the solder on the pad of the substrate is stabilized, and good soldering can be performed. In addition, since the vertically movable inner shaft is provided in the hollow support shaft that supports the suction head, after the semiconductor package component is mounted on the substrate, the semiconductor package component can be pressed from above by the inner shaft. Therefore, the semiconductor package component and the substrate can be bonded to each other with a conductive (or heat conductive) adhesive in a state of good conductivity (or heat conductivity).

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view showing a suction head portion of a semiconductor package component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a suction head portion of the apparatus of FIG.

FIG. 3 is a bottom view of the suction head of the apparatus shown in FIG. 1;

FIG. 4 is a partially cutaway front view showing a state where a semiconductor package component is mounted on a substrate in the apparatus shown in FIG. 1;

5 is a partially cutaway front view showing a state where a semiconductor package component is soldered to a substrate in the apparatus of FIG. 1;

[Explanation of symbols]

 11: Suction head 13: TCP component 17: Lead 19: Semiconductor chip 23: Hollow support shaft 23a: Hollow portion 31: Arm 31a: Projection 33: Inner shaft 35: Substrate 37: Solder 39: Conductive adhesive 41: Support base

Claims (1)

[Claims] 1. A suction head for sucking a semiconductor package component, and a hollow support shaft for sucking air rising from an upper surface of the suction head, wherein the suction head around the suction head sucks the semiconductor package component. An arm for holding the suction head at a certain height from the substrate surface is formed at a position where the lead does not overlap with the lead of the semiconductor package component, and an inner shaft is provided in the hollow support shaft so as to be vertically movable. A semiconductor package component mounting apparatus, characterized in that: