JPH108006A - Electroconductive adhesive composition and electronic part connected with the same - Google Patents
Electroconductive adhesive composition and electronic part connected with the sameInfo
- Publication number
- JPH108006A JPH108006A JP19949796A JP19949796A JPH108006A JP H108006 A JPH108006 A JP H108006A JP 19949796 A JP19949796 A JP 19949796A JP 19949796 A JP19949796 A JP 19949796A JP H108006 A JPH108006 A JP H108006A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- connection resistance
- adhesive composition
- phenol
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は新規な導電性樹脂組成物
及びその用途に関し、特に接続抵抗値を低くさせ、熱エ
ージングに対しても安定した接続抵抗値を得られる導電
性樹脂組成物を提供するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel conductive resin composition and its use, and more particularly to a conductive resin composition which can reduce the connection resistance and obtain a stable connection resistance against thermal aging. To provide.
【０００２】[0002]
【従来の技術】従来からフェノール樹脂は導電性樹脂組
成物のバインダーおよび硬化剤に使用されることは知ら
れているが（特開昭５０−１５８６２６、特開平７−１
７９８３３）それらは接続抵抗値を低く安定化させよう
とするものではなく、吸水率、接着強度、弾性率といっ
た物理特性に着目したものであった。2. Description of the Related Art It has been known that a phenol resin is used as a binder and a curing agent for a conductive resin composition (Japanese Patent Application Laid-Open Nos. 50-158626 and 7-1).
79833) They did not attempt to stabilize the connection resistance value low, but focused on physical properties such as water absorption, adhesive strength, and elasticity.
【０００３】[0003]
【発明が解決しようとする課題】電極ａと電極ｂを導電
性接着剤で接続したした場合の電極間接続値は、下式で
あらわすことができる。The connection value between the electrodes when the electrodes a and b are connected by a conductive adhesive can be expressed by the following equation.
【０００４】 Ｒｔｏ＝Ｒａ＋Ｒｂ＋Ｒａｈ＋α （式１）R to = R a + R b + R ah + α (Equation 1)
【０００５】ここで、Ｒｔｏは実際の電極間の接続抵抗
の測定値、ＲａおよびＲｂは電極ａと電極ｂの各々の固
有の抵抗値、Ｒａｈは電極間の導電性接着剤の導電粒子
の固有の抵抗値、αは電極間の導電性接着剤の抵抗値で
ある。[0005] Here, the measurement value of the connection resistance between the R-to the actual electrode, R a and R b each particular resistance value of the electrode a and the electrode b, R ah is the conductive adhesive between the electrodes The intrinsic resistance value of the conductive particles, α, is the resistance value of the conductive adhesive between the electrodes.
【０００６】つまり、導電性接着剤の抵抗値αが介在す
るので、実際の電極間接続抵抗値は接続抵抗の理論値の
Ｒａ＋Ｒｂ＋Ｒａｈより大きくなる。That is, since the resistance value α of the conductive adhesive is interposed, the actual connection resistance value between the electrodes becomes larger than the theoretical value of connection resistance Ra + Rb + Rah .
【０００７】従って、導電性樹脂材料が電極間の接続材
として使用される場合、特に高周波で低電流の接続の場
合は、電極間接続抵抗値を低く安定化させることが強く
要求される。[0007] Therefore, when a conductive resin material is used as a connecting material between electrodes, particularly in the case of high-frequency and low-current connection, it is strongly required to stabilize the inter-electrode connection resistance value to a low level.
【０００８】接続抵抗値の高い導電性接着剤で接続した
場合の課題としては、例えばＥＭＩフィルター用コンデ
ンサーの電極の接続材に接続抵抗値の高い導電性樹脂材
料が使用される場合、減衰量が低くなるためフィルター
特性が悪くなる。また水晶振動子の電極の接続材に接続
抵抗値の高い導電性樹脂材料が使用された場合、クリス
タルインピーダンス（ＣＩ値）が高くなり周波数変動の
原因となる。[0008] When the connection is made with a conductive adhesive having a high connection resistance value, for example, when a conductive resin material having a high connection resistance value is used for the connection material of the electrodes of the capacitor for the EMI filter, the attenuation is reduced. Because of the lowering, the filter characteristics deteriorate. Further, when a conductive resin material having a high connection resistance value is used for the connection material of the electrodes of the crystal unit, the crystal impedance (CI value) becomes high, which causes frequency fluctuation.
【０００９】本発明は接続抵抗値を低くさせ、熱エージ
ングに対しても安定した接続抵抗値を得られる導電性樹
脂組成物を提供することにより上記のような問題点を解
決するものである。[0009] The present invention solves the above-mentioned problems by providing a conductive resin composition capable of lowering the connection resistance value and obtaining a stable connection resistance value against thermal aging.
【００１０】[0010]
【課題を解決するための手段】本発明は、絶縁性樹脂
（Ａ）と導電フィラー（Ｂ）で構成される導電性樹脂組
成物において、接続抵抗値を低下させる作用をもつフェ
ノール化合物（Ｃ）をさらに添加させることを特徴とす
る低接続抵抗の導電性接着剤組成物である。According to the present invention, there is provided a conductive resin composition comprising an insulating resin (A) and a conductive filler (B), a phenol compound (C) having an action of lowering a connection resistance value. And a conductive adhesive composition having a low connection resistance.
【００１１】上記絶縁性樹脂（Ａ）は既存の熱硬化性樹
脂あればいずれでもよいが、好ましくはエポキシ樹脂、
ウレタン樹脂、シリコーン樹脂、アクリル樹脂、または
イミド樹脂の熱硬化性樹脂のうちから一種類以上を選ぶ
ことができる。The insulating resin (A) may be any existing thermosetting resin, but is preferably an epoxy resin,
One or more types can be selected from thermosetting resins such as urethane resins, silicone resins, acrylic resins, and imide resins.
【００１２】また、上記導電フィラー（Ｂ）は既存の導
電性を有する粒子であればいずれでもよいが、好ましく
は銀粉、銅粉、ニッケル粉、カーボン粉、パラジウム粉
の導電体の粉、または樹脂ボールの表面に金属、導電セ
ラミックをメッキもしくは蒸着させた導電性メッキ粉い
ずれかである。The conductive filler (B) may be any of existing conductive particles, but is preferably a conductive powder of silver powder, copper powder, nickel powder, carbon powder, palladium powder, or resin. Either a conductive plating powder obtained by plating or depositing a metal or conductive ceramic on the surface of the ball.
【００１３】接続抵抗値を低下させる作用をもつ上記フ
ェノール樹脂化合物（Ｃ）とは、レゾールフェノール樹
脂、ノボラックフェノール樹脂、ビニールフェノール化
合物、またはヒンダートフェノール化合物のうちからい
ずれか一種類以上を選ぶことができる。ここで、フェノ
ール樹脂化合物は溶剤に溶かしたり加熱溶融させたりし
て上記絶縁性樹脂（Ａ）に添加して使用する。[0013] The phenolic resin compound (C) having a function of lowering the connection resistance value is selected from one or more of a resole phenolic resin, a novolak phenolic resin, a vinyl phenolic compound, and a hindered phenolic compound. Can be. Here, the phenolic resin compound is used by dissolving it in a solvent or melting it by heating and adding it to the insulating resin (A).
【００１４】レゾールフェノール樹脂とは、下記の構造
式で代表される樹脂をいう。The resole phenolic resin is a resin represented by the following structural formula.
【００１５】[0015]
【化１】 Embedded image
【００１６】ノボラックフェノールとは、下記の構造式
で代表される樹脂をいう。Novolak phenol is a resin represented by the following structural formula.
【００１７】[0017]
【化２】 Embedded image
【００１８】ビニールフェノールとは、下記の構造式で
代表される樹脂をいう。Vinyl phenol refers to a resin represented by the following structural formula.
【００１９】[0019]
【化３】 Embedded image
【００２０】ヒンダートフェノールの具体的な例として
は、ペンタエリスリチル−テトラキス［３−（３，５−
ｔ−ブチル−４−ヒドロキシフェニル）プロピオネー
ト］、２，２−チオ−ジエチレンビス［３−（３，５−
ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネ
ート］、２，２−チオビス（４−メチル−６−ｔ−ブチ
ルフェノール）、Ｎ，Ｎ’−ビス［３−（３，５−ジ−
ｔ−ブチル−４−ヒドロキシフェニル）プロピオニル］
ヒドラジン等が挙げらる。Specific examples of the hindered phenol include pentaerythrityl-tetrakis [3- (3,5-
t-butyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylenebis [3- (3,5-
Di-tert-butyl-4-hydroxyphenyl) propionate], 2,2-thiobis (4-methyl-6-tert-butylphenol), N, N'-bis [3- (3,5-di-
t-butyl-4-hydroxyphenyl) propionyl]
Hydrazine and the like.
【００２１】本発明の好ましい導線性接着剤として、絶
縁性樹脂（Ａ）が硬化剤を含むエポキシ樹脂１０〜３０
重量部と、導電フィラー（Ｂ）が銀粉７０〜９０重量部
と、接続抵抗値を低下させる作用をもつフェノール化合
物（Ｃ）がレゾールフェノール樹脂、ビニルフェノー
ル、ヒンダートフェノールのうちから少なくとも一種類
以上であって０．１〜２０重量部である組成が挙げられ
る。As a preferred conductive adhesive according to the present invention, the insulating resin (A) is an epoxy resin 10 to 30 containing a curing agent.
Parts by weight, the conductive filler (B) is 70 to 90 parts by weight of silver powder, and the phenol compound (C) having an action of lowering the connection resistance is at least one or more of resole phenol resin, vinyl phenol, and hindered phenol. And 0.1 to 20 parts by weight.
【００２２】さらに、絶縁性樹脂（Ａ）が付加重合型シ
リコーン樹脂１０〜３０重量部と、導電フィラー（Ｂ）
が銀粉７０〜９０重量部と、接続抵抗値を低下させる作
用をもつフェノール化合物（Ｃ）がレゾールフェノール
樹脂、ビニルフェノール、ヒンダートフェノールのうち
から少なくとも一種類以上であって０．１〜２０重量部
も好ましい組成である。Further, the insulating resin (A) comprises 10 to 30 parts by weight of an addition polymerization type silicone resin, and the conductive filler (B)
Is from 70 to 90 parts by weight of silver powder, and the phenol compound (C) having an action of lowering the connection resistance is at least one or more of resole phenol resin, vinyl phenol, and hindered phenol, and is 0.1 to 20 parts by weight. Is also a preferred composition.
【００２３】本発明において、導電フィラーの分散性を
改良するための界面活性剤、樹脂の劣化防止剤、粘度調
整のための溶剤またはチクソトロピック剤、接着性を改
良するための粘着剤またはカップリング剤などの既知の
改質剤を添加してもよい。In the present invention, a surfactant for improving the dispersibility of the conductive filler, a deterioration preventing agent for the resin, a solvent or thixotropic agent for adjusting the viscosity, a pressure-sensitive adhesive or a coupling for improving the adhesiveness. A known modifier such as an agent may be added.
【００２４】また、本発明には請求項１の低接続抵抗の
導電性接着剤組成物を用いて接続された高周波のかかる
チップ電子部品、具体的には、請求項５の低接続抵抗の
導電性接着剤組成物を用いて接続されたＥＭＩフィルタ
ー用コンデンサー、または請求項６の低接続抵抗の導電
性接着剤組成物を用いて接続された水晶振動子も含まれ
る。Further, in the present invention, a chip electronic component to which a high frequency is applied by using the conductive adhesive composition having a low connection resistance according to the first aspect of the present invention, more specifically, a conductive element having a low connection resistance according to the fifth aspect of the present invention. Also included are a capacitor for an EMI filter connected using a conductive adhesive composition, and a crystal unit connected using a conductive adhesive composition having a low connection resistance according to claim 6.
【００２５】[0025]
【作用】本発明の導電性接着剤の接続抵抗値が、従来の
導電性接着剤に比べて低くなる理由は定かではない。The reason why the connection resistance of the conductive adhesive of the present invention is lower than that of the conventional conductive adhesive is not clear.
【００２６】しかし、前述の（式１）の中の導電性接着
剤の抵抗値αが、フェノール樹脂化合物（Ｃ）により低
下するためと考えられる。おそらく、フェノール樹脂化
合物（Ｃ）が、電極と導電接着剤との接触界面の領域に
おいて何らかの作用をして抵抗値αを低下させていると
推定する。However, it is considered that the resistance value α of the conductive adhesive in the above-mentioned (formula 1) is reduced by the phenol resin compound (C). Presumably, it is presumed that the phenolic resin compound (C) acts in the region of the contact interface between the electrode and the conductive adhesive to reduce the resistance value α.
【００２７】ところで、フェノール樹脂はエポキシ樹脂
の硬化剤として使用される場合がある。本発明の絶縁性
樹脂（Ａ）をエポキシ樹脂とした場合、フェノール樹脂
化合物（Ｃ）は、硬化剤として当量および接続抵抗値の
低下作用の効果量を添加させて、エポキシ樹脂の硬化お
よび接続抵抗値の低下の二つを作用を兼用させる。Incidentally, a phenol resin is sometimes used as a curing agent for an epoxy resin. When the insulating resin (A) of the present invention is an epoxy resin, the phenol resin compound (C) is added with an equivalent amount as a curing agent and an effective amount of a lowering effect of the connection resistance value to cure the epoxy resin and to reduce the connection resistance. The two functions of decreasing the value are combined.
【００２８】フェノール樹脂化合物の接続抵抗値を低下
させる効果量は、接続する電極の金属の種類、導電性接
着剤の導電性フィラーの種類によって変動するが、導電
性接着剤１００重量部に対して０．１〜２０重量部のフ
ェノール樹脂化合物の添加が好ましい。０．１重量部以
下であると接続抵抗値の低下の効果が発現せず、２０重
量部以上であると絶縁性樹脂（Ａ）の物性や特性が損な
われるからである。The effect of reducing the connection resistance value of the phenolic resin compound varies depending on the type of metal of the electrode to be connected and the type of conductive filler of the conductive adhesive. It is preferable to add 0.1 to 20 parts by weight of a phenol resin compound. If the amount is less than 0.1 part by weight, the effect of lowering the connection resistance value will not be exhibited, and if it is more than 20 parts by weight, the physical properties and characteristics of the insulating resin (A) will be impaired.
【００２９】[0029]
【実施例】 実施例１〜３ 絶縁性樹脂（Ａ）として付加型加熱硬化シリコーン樹脂
３０重量部に対して、各々レゾールフェノール樹脂（Ｐ
Ｌ−２３１２、群栄化学工業社製）、ヒンダートフェノ
ール（イルガノックス１０１０、チバガイギ社製）、ビ
ニルフェノール（マルカリンカーＭ、丸善石油化学社
製）を１重量部を混合し３種類のバインダーを製造し
た。これらのバインダーに対し銀粉を７０重量部に有機
溶剤を１０重量部を混合した。なお、比較例１としてフ
ェノールを混合しないものを製造した。実施例１〜３、
比較例１の組成物の配合を表１に示す。EXAMPLES Examples 1 to 3 Resole phenolic resin (P) was added to 30 parts by weight of an additional heat-curable silicone resin as an insulating resin (A).
L-2312, manufactured by Gun Ei Chemical Co., Ltd.), 1 part by weight of hindered phenol (Irganox 1010, manufactured by Ciba Geigy), and vinyl phenol (Marcalinker M, manufactured by Maruzen Petrochemical Co., Ltd.), and three types of binders were mixed. Manufactured. 70 parts by weight of silver powder and 10 parts by weight of an organic solvent were mixed with these binders. In addition, the thing which does not mix phenol was manufactured as the comparative example 1. Examples 1 to 3,
Table 1 shows the composition of the composition of Comparative Example 1.
【００３０】実施例および比較例の導電性接着剤組成物
を、ハンダメッキした基板に塗布し適当なギャップで導
線と接着させ、基板と銅線との抵抗値を測定した。さら
に、発信周波数１５ＭＨｚの水晶振動子の接続部分に塗
布し、そのクリスタルインピーダンスを測定した。The conductive adhesive compositions of Examples and Comparative Examples were applied to a solder-plated substrate and bonded to a conductive wire at an appropriate gap, and the resistance between the substrate and the copper wire was measured. Further, it was applied to a connection portion of a crystal oscillator having a transmission frequency of 15 MHz, and its crystal impedance was measured.
【００３１】実施例１〜３、比較例１の組成物のその評
価結果を表１に示す。Table 1 shows the evaluation results of the compositions of Examples 1 to 3 and Comparative Example 1.
【００３２】[0032]
【表１】 [Table 1]
【００３３】実施例４〜６ ビスフェノールＦ型エポキシ樹脂（エピコート８０７、
油化シェルエポキシ社製）を２０重量部に硬化剤として
ジシアンジアミドを１重量部とを混合して熱硬化性樹脂
（Ａ）を製造した。この熱硬化性樹脂（Ａ）に各々レゾ
ールフェノール（ＰＬ−２３１２）、ヒンダートフェノ
ール（イルガノックス１０１０、チバガイギ社製）、ビ
ニルフェノール（マルカリンカーＭ、丸善石油化学社
製）を混合し３種類のバインダーを製造した。これらの
バインダーに対し銀粉を８０重量部、セルソルブ系有機
溶剤を２０重量部を混合し三本ロールを用いて混練し
た。なお、比較例２としてフェノールを混合しないもの
を製造した。実施例４〜６、比較例２の組成物の配合を
表１に示す。Examples 4 to 6 Bisphenol F type epoxy resin (Epicoat 807,
20 parts by weight of Yuka Shell Epoxy Co., Ltd.) and 1 part by weight of dicyandiamide as a curing agent were mixed to prepare a thermosetting resin (A). This thermosetting resin (A) was mixed with resole phenol (PL-2312), hindered phenol (Irganox 1010, manufactured by Ciba-Geigy) and vinyl phenol (Marcarlinker M, manufactured by Maruzen Petrochemical Co., Ltd.) to obtain three types. A binder was produced. To these binders, 80 parts by weight of silver powder and 20 parts by weight of a cellosolve organic solvent were mixed and kneaded using a three-roll mill. In addition, the thing which does not mix phenol was manufactured as the comparative example 2. Table 1 shows the compositions of the compositions of Examples 4 to 6 and Comparative Example 2.
【００３４】実施例および比較例の導電性接着剤組成物
を、スズメッキした基板に塗布し適当なギャップで導線
と接着させ、基板と銅線との抵抗値を測定した。さら
に、ＥＭＩフィルター用コンデンサーの接続部分に塗布
し、その減衰値を測定した。The conductive adhesive compositions of Examples and Comparative Examples were applied to a tin-plated substrate, bonded to a conductive wire at an appropriate gap, and the resistance between the substrate and the copper wire was measured. Furthermore, it was applied to the connection part of the condenser for the EMI filter, and the attenuation value was measured.
【００３５】実施例４〜６、比較例２の組成物のその評
価結果を表２に示す。Table 2 shows the evaluation results of the compositions of Examples 4 to 6 and Comparative Example 2.
【００３６】[0036]
【表２】 [Table 2]
【００３７】[0037]
【発明の効果】本発明の導電性樹脂組成物は、接続抵抗
値が低く且つ安定しているため接続抵抗値が低いことを
要求されるチップ部品の導電接続に用いることができ
る。特にＥＭＩフィルター用コンデンサーの電極の接続
材として使用される場合、接続抵抗値が低いため減衰量
が高くなるのでフィルター特性の良好なコンデンサーが
得られる。。また水晶振動子の電極の接続材として使用
された場合、接続抵抗値が低いとクリスタルインピーダ
ンス（ＣＩ値）が低く安定するため周波数変動の少ない
水晶振動子が得られる。The conductive resin composition of the present invention has a low and stable connection resistance and can be used for conductive connection of chip components which require a low connection resistance. In particular, when used as a connection material for electrodes of a capacitor for an EMI filter, a capacitor having excellent filter characteristics can be obtained because the connection resistance is low and the amount of attenuation is high. . When used as a connection material for electrodes of a crystal resonator, a low connection resistance value results in a low crystal impedance (CI value) and stability, so that a crystal resonator with little frequency fluctuation can be obtained.
【図１】接続抵抗値を測定するためのテストピースの斜
視図FIG. 1 is a perspective view of a test piece for measuring a connection resistance value.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０９Ｊ 175/04 ＪＦＢ Ｃ０９Ｊ 175/04 ＪＦＢ 179/08 ＪＧＥ 179/08 ＪＧＥ 183/04 ＪＧＨ 183/04 ＪＧＨ 201/00 ＪＡＷ 201/00 ＪＡＷ ＪＢＣ ＪＢＣ Ｈ０１Ｂ 1/22 Ｈ０１Ｂ 1/22 Ｄ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical indication location C09J 175/04 JFB C09J 175/04 JFB 179/08 JGE 179/08 JGE 183/04 JGH 183/04 JGH 201/00 JAW 201/00 JAW JBC JBC H01B 1/22 H01B 1/22 D
Claims (9)
で構成される導電性樹脂組成物において、接続抵抗値を
低下させる作用をもつフェノール化合物（Ｃ）をさらに
添加させることを特徴とする低接続抵抗の導電性接着剤
組成物。1. Insulating resin (A) and conductive filler (B)
A conductive adhesive composition having a low connection resistance, characterized by further adding a phenol compound (C) having a function of lowering the connection resistance value to the conductive resin composition constituted by:
ゾールフェノール樹脂、ノボラックフェノール樹脂、ビ
ニールフェノール化合物、またはヒンダートフェノール
化合物のうちからいずれか一種類以上を選ぶことを特徴
とする請求項１の低接続抵抗の導電性接着剤組成物。2. The method according to claim 1, wherein the phenol resin compound (C) is at least one selected from the group consisting of a resol phenol resin, a novolac phenol resin, a vinyl phenol compound, and a hindered phenol compound. A conductive adhesive composition having low connection resistance.
脂、ウレタン樹脂、シリコーン樹脂、アクリル樹脂、ま
たはイミド樹脂の熱硬化性樹脂のうちから一種以上を選
ぶことを特徴とする請求項１の低接続抵抗の導電性接着
剤組成物。3. The method according to claim 1, wherein the insulating resin (A) is at least one selected from thermosetting resins of epoxy resin, urethane resin, silicone resin, acrylic resin, and imide resin. A conductive adhesive composition having low connection resistance.
ニッケル粉、カーボン粉、パラジウム粉の導電体の粉、
または樹脂ボールの表面に金属、導電セラミックをメッ
キもしくは蒸着させた導電性メッキ粉のいずれかである
ことを特徴とする請求項１の低接続抵抗の導電性接着剤
組成物。4. The method according to claim 1, wherein the conductive filler (B) is silver powder, copper powder,
Nickel powder, carbon powder, palladium powder conductor powder,
2. The conductive adhesive composition according to claim 1, wherein the conductive adhesive powder is a conductive plating powder obtained by plating or depositing a metal or a conductive ceramic on a surface of a resin ball.
シ樹脂１０〜３０重量部と、導電フィラー（Ｂ）が銀粉
７０〜９０重量部と、接続抵抗値を低下させる作用をも
つフェノール化合物（Ｃ）がレゾールフェノール樹脂、
ビニルフェノール、ヒンダートフェノールのうちから少
なくとも一種類以上であって０．１〜２０重量部である
ことを特徴とする低接続抵抗の導電性接着剤組成物。5. A phenol compound having an action of lowering connection resistance, wherein the insulating resin (A) is 10 to 30 parts by weight of an epoxy resin containing a curing agent, and the conductive filler (B) is 70 to 90 parts by weight of silver powder. (C) is a resole phenol resin,
A conductive adhesive composition having a low connection resistance, which is at least one kind of vinyl phenol and hindered phenol and is 0.1 to 20 parts by weight.
ン樹脂１０〜３０重量部と、導電フィラー（Ｂ）が銀粉
７０〜９０重量部と、接続抵抗値を低下させる作用をも
つフェノール化合物（Ｃ）がレゾールフェノール樹脂、
ビニルフェノール、ヒンダートフェノールのうちから少
なくとも一種類以上であって０．１〜２０重量部である
ことを特徴とする低接続抵抗の導電性接着剤組成物。6. A phenol compound having an action of lowering a connection resistance value, wherein the insulating resin (A) is 10 to 30 parts by weight of an addition polymerization type silicone resin, and the conductive filler (B) is 70 to 90 parts by weight of silver powder. C) is a resole phenolic resin,
A conductive adhesive composition having a low connection resistance, which is at least one kind of vinyl phenol and hindered phenol and is 0.1 to 20 parts by weight.
剤組成物を用いて接続された高周波のかかるチップ電子
部品。7. A high-frequency chip electronic component connected using the conductive adhesive composition having a low connection resistance according to claim 1.
剤組成物を用いて接続されたＥＭＩフィルター用コンデ
ンサー。8. A capacitor for an EMI filter connected using the conductive adhesive composition having a low connection resistance according to claim 5.
剤組成物を用いて接続された水晶振動子。9. A quartz resonator connected using the conductive adhesive composition having a low connection resistance according to claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19949796A JPH108006A (en) | 1996-06-26 | 1996-06-26 | Electroconductive adhesive composition and electronic part connected with the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19949796A JPH108006A (en) | 1996-06-26 | 1996-06-26 | Electroconductive adhesive composition and electronic part connected with the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH108006A true JPH108006A (en) | 1998-01-13 |
Family
ID=16408812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19949796A Pending JPH108006A (en) | 1996-06-26 | 1996-06-26 | Electroconductive adhesive composition and electronic part connected with the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH108006A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003041226A (en) * | 2001-08-01 | 2003-02-13 | Mitsui Chemicals Inc | Paste material for connecting circuit |
| JP2006514144A (en) * | 2003-03-18 | 2006-04-27 | ダウ・コーニング・コーポレイション | Conductive adhesive composition |
| JP2007247671A (en) * | 2006-03-13 | 2007-09-27 | Ricoh Co Ltd | Heat-resistant endless belt and image forming apparatus therewith |
| JPWO2007074652A1 (en) * | 2005-12-26 | 2009-06-04 | 日立化成工業株式会社 | Adhesive composition, circuit connection material and circuit member connection structure |
| JP2009256612A (en) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive for semiconductor sealing, filmy adhesive for semiconductor sealing, semiconductor device, and its manufacturing method |
| JP2011510139A (en) * | 2008-01-17 | 2011-03-31 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Conductive adhesive |
-
1996
- 1996-06-26 JP JP19949796A patent/JPH108006A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003041226A (en) * | 2001-08-01 | 2003-02-13 | Mitsui Chemicals Inc | Paste material for connecting circuit |
| JP2006514144A (en) * | 2003-03-18 | 2006-04-27 | ダウ・コーニング・コーポレイション | Conductive adhesive composition |
| JPWO2007074652A1 (en) * | 2005-12-26 | 2009-06-04 | 日立化成工業株式会社 | Adhesive composition, circuit connection material and circuit member connection structure |
| JP2007247671A (en) * | 2006-03-13 | 2007-09-27 | Ricoh Co Ltd | Heat-resistant endless belt and image forming apparatus therewith |
| JP2011510139A (en) * | 2008-01-17 | 2011-03-31 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Conductive adhesive |
| JP2009256612A (en) * | 2008-03-26 | 2009-11-05 | Hitachi Chem Co Ltd | Adhesive for semiconductor sealing, filmy adhesive for semiconductor sealing, semiconductor device, and its manufacturing method |
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