JPH1075075A - Manufacture of electronic part using mid package, and structure of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of an electronic part using a MID (substrate molded of resin) which can prevent the remaining of bubbles between the case and the cover during heating and hardening of an adhesive and can improve airtightness and the structure of the electronic part. SOLUTION: This electronic part is provided beforehand with grooves 13 at least either in the longitudinal direction or in the lateral direction, between the recesses 7 of the recesses 7 of a board 8 made of resin where a plurality of recesses for accommodation of electronic parts are arranged longitudinally and latitudinally. Elements 4 are accommodated and fixed individually in each recess 7, and further a pellet-from adhesive 5 is placed on the element 4 within the recess 7. Cover material 6A is laid to cover this board 8 and the adhesive 5, on the board 8 molded of resin. The adhesive 5 and the board 8 molded of resin are heated with the condition that they are pressed with the cover 6A, so as to fuse and then harden, and a part of the air within the recess 7 expanding in the heated condition of the adhesive 5 is let go outside, through the groove 13. Moreover, this is provided with an induction groove 14 which connects the recess 7 with the groove 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component comprising a case made of an MID (resin molded substrate) and containing an element requiring hermetic sealing such as a surface acoustic wave filter (SAW filter). The present invention relates to a manufacturing method and a structure of an electronic component.

[0002]

2. Description of the Related Art A SAW filter is an element utilizing surface acoustic waves, and cannot form a protective film on an electrode formation surface. In addition, since it is weak to moisture, it must be housed in a hermetically sealed case. As a conventional example of such a sealing structure, as shown in FIG. 6A, a device 51 is housed in a ceramic case 50, and a conductor 52 formed in the case 50 and a pad of the device 51 are bonded to each other by a bonding wire 5.
3 and a metal lid 54 joined by a hermetic seal 55. In this structure,
The case 50 is integrated by stacking and firing three materials 50a, 50b and 50c, and the conductor 52 connecting the elements 51 is formed on the upper surface of the second-stage case material 50b and connected to the electrode 56 on the side surface. Is done. In the element 51, an electrode 56 on the side surface of the case 50 is electrically connected to a pad 58 on a substrate 57 by solder 59 and fixed.

[0003]

In the hermetically sealed package shown in FIG. 6A, the case 50 is made of ceramic,
These must be stacked and fired to produce the case 50, and the lid 54 must be joined with the hermetic seal 55, which requires equipment and material costs, as well as man-hours, time and costs. There is a problem that becomes.

[0004] Such a problem of high cost can be solved by forming an electronic component having a MID package structure capable of taking many pieces. The inventor of the present invention has provided a lead electrode on the inner surface of the resin molded substrate 8 as shown in the side view of FIG. 6B or the plan view of FIG. A plurality of formed recesses 61 for accommodating electronic components are arranged vertically and horizontally, and through holes 11 serving as terminal electrodes are formed between the recesses 61.
An element 62 such as a SAW filter is connected to a terminal connected to a lead electrode, and a pellet-shaped adhesive 63 is placed thereon.
To cover the entire resin molded substrate 8 with a lid material 64, and apply heat to melt and cure the adhesive 63 to form a lid material 64.
And a method of obtaining individual electronic components by cutting the gaps between the concave portions 61.

However, according to this method, when the adhesive 63 is melted and cured by heating, the air in the concave portion 61 expands due to the heat, and the expanded air 65 is cured by the curing of the adhesive 63 so that the case, the lid, There is a problem that when cut as an individual product, the airtightness of an electronic component as a cut product cannot be ensured.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an electronic component using an MID package which can prevent air bubbles from remaining between a case and a lid during heating and curing of an adhesive and can improve airtightness. An object is to provide a manufacturing method and a structure of an electronic component.

[0007]

In order to achieve this object, a manufacturing method according to the present invention is characterized in that a plurality of recesses for accommodating electronic parts are vertically and horizontally arranged between the recesses of a resin molded substrate. A groove is provided in at least one direction, the element is housed and fixed in each of the concave portions, and a pellet-like adhesive is placed on the element in the concave portion, and on the resin molded substrate, A lid material is overlapped so as to cover the substrate and the adhesive, and the adhesive and the resin molded substrate are heated while being pressed by the lid material to melt and cure the adhesive, and expand in the heated state of the adhesive. A part of the air in the recess is released to the outside through the groove (claim 1).

Further, according to the manufacturing method of the present invention, a guide groove for connecting the concave portion and the groove is provided in advance on the upper surface of the resin molded substrate, and the guide groove in the concave portion when the adhesive is heated and melted is provided. The expansion air is guided to the groove between the recesses via the guide groove (claim 2). In the structure of the electronic component according to the present invention, a concave portion is provided in a resin case, an element is accommodated in the concave portion, a lid for closing the concave portion is adhered to an opening surface of the case, and a case outer surface is formed from the concave portion to the opening surface. A guide groove is formed over the entire surface (claim 3).

[0009]

According to the first aspect, when the adhesive is sandwiched between the lid material and the element and heated and cured, the expanded air in the concave part for accommodating the electronic component is discharged to the outside through the groove between the concave parts. Therefore, no air bubbles remain between the lid member and the resin molded substrate, and the airtightness of the product after being cut as each electronic component is secured.

In the second and third aspects, since the guide groove is provided for communicating between the concave portion and the groove of the resin molded substrate, the movement of the inflated air in the concave portion is smoothly performed through the guide groove, and the bubbles remain. Prevention is performed more reliably.

[0011]

FIG. 1 is an exploded perspective view showing an example of a member for carrying out the manufacturing method of the present invention, FIG. 2 (A) is a plan view showing a part thereof, and FIGS. 2 (B) and 2 (C). 2A is a cross-sectional view taken along line EE and FF of FIG. 2A, FIG.
4A is a plan view of the case of this embodiment, FIG. 4B is an exploded side view, and FIG. 5 is a longitudinal sectional view showing an electronic component manufactured according to this embodiment.

First, the structure of an electronic component obtained by the manufacturing method of this embodiment will be described with reference to FIGS. FIG.
As shown in (B), the electronic component of the present embodiment includes an MID case 1, an element 4 such as a SAW filter, an adhesive 5 in a pellet shape before assembling the electronic component, and a lid 6. The case 1 has a concave portion 7 having an upper surface opening, and the concave portion 7 has a two-stage structure including a bottom surface a and an intermediate step portion b, and is provided between the intermediate step portion b, the upper surface c, and the bottom surface a. Slope d
Are formed.

A lead electrode 2 made of gold is provided on the inner surface of the recess 7.
Is formed. The element 4 is a flip chip having a comb-shaped electrode formed on the lower surface. The element 4 is electrically connected to the lead electrode 2 by ultrasonic waves while the case 1 is heated while the case 1 is heated. Fixed.

As shown in FIG. 5, the substrate connecting terminal portion 3 formed on the bottom surface of the case 1 is
And through a through hole 9 provided over the bottom surface of the case. 9a denotes a conductor plated on the inner wall of the through hole 9. An adhesive 5 is filled between the lid 6 and the element 4 in the recess 7, and the adhesive 5 closes at least a part of the through hole 9. Case 1
A side electrode 10 connected to the substrate connection terminal portion 3 is formed on a side surface having a semicircular horizontal cross-sectional shape by a step of cutting through holes described later.

Next, a method for manufacturing the above-described electronic component will be described with reference to FIGS. As shown in FIG. 1, a plurality of recesses 7 for accommodating electronic components are formed in the resin molded substrate 8 in advance in rows and columns, and these recesses 7 are formed in FIG.
The lead electrode 2 shown in FIG. 5 is formed, the substrate connection terminal portion 3 is formed on the bottom surface, and the side electrode 1 is formed.
A plurality of through holes 11 for forming 0 are arranged between the recesses 7 in the horizontal (X) direction in FIG. Further, when the cover material 12 is attached between the recesses 7,
A groove 13 is provided in the vertical (Y) direction for removing the thermally expanded air in the inside, and a recess 7 is provided between the edge of the recess 7 and the groove 13.
A guide groove 14 for guiding the inflation air inside the groove 13 to the groove 13 is provided.

FIG. 3 is a view showing a manufacturing process after manufacturing the resin molded substrate 8 of the electronic component. First, as shown in FIG. 3A, a lid material 6A having a size covering the entire resin molded substrate 8 is superimposed on the substrate 8 as shown in FIG. 3B, and then the upper and lower surfaces as shown in FIG. By applying more pressure and inverting and heating as shown in FIG. 3 (D),
At least a part of the through-hole 9 is filled with the adhesive 5 which has been temporarily in a fluid state, and the through-hole 9 is closed. The lid material 6A is adhered with the adhesive 5, and the element 4 and the lid material 6 are bonded.
The gap between A and the element A is covered with an adhesive 5, and the element 4 and the outside air are shut off with the adhesive 5.

As shown in FIG. 4B, the bottom
A, the height difference from the middle step b to the upper surface c is B, the thickness including the bumps 4a of the element 4 is C, and the thickness of the pellet-shaped adhesive 5 before melting is A. In the case of D, the adhesive 5 is pressed as shown in FIG. 3C by setting A ≧ C and D ≧ B (preferably, dimensions are set so that a magnitude relation in which D is slightly larger than B is established). In this case, the adhesive 4 can be filled in the through hole 9 without exerting an excessive force on the element 4.

When heating the adhesive 5 to melt it,
Due to the thermal expansion of the air in the concave portion 7, the air pushes the adhesive 5 and reaches the groove 13, so that no air bubbles remain between the lid material 6A and the substrate 8, and the gap between the lid material 6A and the element 4 The space is filled with the adhesive 5 to ensure airtightness.

After the lid material 6A is fixed in such a process, the substrate 8 is cut together with the lid material 6A in the Y direction along the groove 13 by a rotating blade having a width of the groove 13, and the center of the through hole 11 is formed. The individual electronic components are obtained by cutting in the X direction along the portion.

In the present embodiment, since the guide groove 14 for connecting the concave portion 7 and the groove 13 is provided on the upper surface of the resin molded substrate 8, air bubbles are guided to the guide groove 14 and reach the groove 13.
Smooth expansion air can be discharged and through hole 1
The guide groove 14 is not provided on the side of the groove 1 but on the side of the groove 13.
Is provided, it is possible to prevent the adhesive 5 in the molten state from flowing toward the through hole 11 with the flow of air bubbles and being covered with the adhesive.

The electronic component manufactured in this way is shown in FIG.
As shown in FIG.
Are electrically connected and fixed.

When an electronic component is formed using an MID package as in the present invention, the case 1 and the lid 6 must be adhered to each other with an adhesive 5 having high adhesion.
In the embodiment, as the material of the case 1, LCP (liquid crystal polymer), epoxy resin (Effect of Toshiba Chemical Corporation, E
PH), BT resin,
An epoxy resin (EP-H, manufactured by Toshiba Chemical Co., Ltd.) with copper plating + nickel plating + gold plating applied to its surface is used in combination with a pressure cooker test (test conditions, 121 ° C., 2 atm, humidity) 100
%) And put into a Fluorinert solution at 125 ° C. to perform a bubble leak test to determine whether or not air bubbles appear.
In the case of (1), a leak was observed in about 48 hours, but in the case of the epoxy resin, no leak was observed even after 96 hours. Therefore, it is preferable to use an epoxy resin for the case 1.

When the element 4 made of a LiNbO ₃ -based element is formed, the conventional ceramic case shown in FIG. 6A is made of alumina, the epoxy resin and LCP are used. In comparison with the case, the thermal expansion coefficients are as follows: LiNbO ₃ : 1.3 × 10 ⁻⁵ , alumina: 0.7 × 1
0 ^-5 epoxy resin: 1.5 × 10 ^-5 , LCP: 2 to 5 × 10
^-5 , and in the sense that the junction between the element and the case is not destroyed by thermal shock, the use of an epoxy resin having a coefficient of thermal expansion close to the material of the element body of the element 4 is better than the case of using a ceramic. Is also advantageous.

In the above embodiment, the length from the element 4 to the terminal section 3 is reduced by connecting the board connecting terminal section 3 from the intermediate stage section b to the substrate connecting terminal section 3 through the through hole 9. The frequency characteristics are prevented from lowering, and the attenuation characteristics as a filter are improved.
The present invention can also be applied to a case where the through hole 9 is not provided. Also,
The groove 13 between the concave portions 7 may be provided not only in one direction (Y direction) but also in the X direction, or may be provided in both X and Y directions.

[0025]

According to the first aspect of the present invention, when the adhesive is sandwiched between the lid material and the element and heated and cured, the expanded air in the concave portion is discharged outside through the groove between the concave portions. ,
No bubbles remain between the lid member and the resin molded substrate,
A highly airtight product as a product after cutting as each electronic component is obtained.

In the second and third aspects, since the guide groove is provided for communicating between the concave portion and the groove of the resin molded substrate, the expansion air in the concave portion is smoothly moved, and the prevention of the residual air bubbles is more reliable. Done in

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example of a member for implementing a manufacturing method of the present invention.

2A is a plan view showing a part of the resin molded substrate of FIG. 1, and FIGS. 2B and 2C are EE and FF of FIG.
It is sectional drawing.

FIGS. 3A to 3D are process diagrams of the present embodiment.

FIG. 4A is a plan view of a case of the embodiment, and FIG. 4B is an exploded side view of the electronic component of the embodiment before being assembled.

FIG. 5 is a longitudinal sectional view showing an electronic component manufactured according to the embodiment.

FIG. 6A is a longitudinal sectional view of a conventional hermetically sealed electronic component,
FIGS. 4B and 4C are a side view and a plan view of a material for explaining a problem in the case where an electronic component is manufactured in a large number of pieces by the MID package.

[Explanation of symbols]

1: Case, 2: Lead electrode, 3: Terminal part for board connection,
4: element, 5: adhesive, 6: lid, 6A: lid material, 7: concave, 8: resin molded board, 9: through hole, 10: side electrode, 11: through hole, 13: groove, 14: induction groove,
15: printed circuit board, 16: pad, 17: solder

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Shuichiro Yamamoto 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation

Claims (3)

[Claims] 1. A resin-molded substrate in which a plurality of recesses for accommodating electronic components are vertically and horizontally arranged, and a groove is provided between the recesses in at least one of a vertical direction and a horizontal direction. And an adhesive is placed on the element in the concave portion, and a lid material is overlaid on the resin molded substrate so as to cover the substrate and the adhesive. The substrate is heated while being pressed with the lid material to melt and cure the adhesive, and a part of the air in the concave portion that expands in the heated state of the adhesive is released to the outside through the groove. An electronic component manufacturing method using an MID package. 2. The method according to claim 1, wherein a guide groove for connecting the concave portion and the groove is provided in advance on an upper surface of the resin molded substrate, and expanded air in the concave portion when the adhesive is heated and melted. M is guided to the groove between the recesses through the guide groove.
A method for manufacturing an electronic component using an ID package. 3. A concave portion is provided in a resin case, an element is accommodated in the concave portion, and a lid for closing the concave portion is bonded to an opening surface of the case, and a guide groove is formed in the opening surface from the concave portion to the outer surface of the case. A structure of an electronic component using an MID package, characterized in that: