JPH1075075A - Manufacture of electronic part using mid package, and structure of electronic part - Google Patents
Manufacture of electronic part using mid package, and structure of electronic partInfo
- Publication number
- JPH1075075A JPH1075075A JP24865896A JP24865896A JPH1075075A JP H1075075 A JPH1075075 A JP H1075075A JP 24865896 A JP24865896 A JP 24865896A JP 24865896 A JP24865896 A JP 24865896A JP H1075075 A JPH1075075 A JP H1075075A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- groove
- concave portion
- case
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、MID(樹脂成形
基板)でなるケースに、弾性表面波フィルタ(SAWフ
ィルタ)等のように気密封止を必要とする素子を収容し
てなる電子部品の製造方法と電子部品の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component comprising a case made of an MID (resin molded substrate) and containing an element requiring hermetic sealing such as a surface acoustic wave filter (SAW filter). The present invention relates to a manufacturing method and a structure of an electronic component.
【0002】[0002]
【従来の技術】SAWフィルタは、表面弾性波を利用す
る素子であって、電極形成面に保護膜を形成することが
できない。また、湿分に弱いため、気密封止したケース
内に収容しなければならない。このような封止構造の従
来例として、図6(A)に示すように、セラミック製の
ケース50に素子51を収容し、ケース50に形成した
導体52と素子51のパッドとをボンディングワイヤ5
3により接続し、金属製の蓋54をハーメチックシール
55により接合したものがある。この構造においては、
ケース50は3枚の素材50a、50b、50cを重ね
て焼成することにより一体化し、素子51を接続する導
体52は、2段目のケース素材50bの上面に形成さ
れ、側面の電極56に接続される。該素子51は、ケー
ス50の側面の電極56を、基板57上のパッド58に
半田59により電気的に接続されかつ固定される。2. Description of the Related Art A SAW filter is an element utilizing surface acoustic waves, and cannot form a protective film on an electrode formation surface. In addition, since it is weak to moisture, it must be housed in a hermetically sealed case. As a conventional example of such a sealing structure, as shown in FIG. 6A, a device 51 is housed in a ceramic case 50, and a conductor 52 formed in the case 50 and a pad of the device 51 are bonded to each other by a bonding wire 5.
3 and a metal lid 54 joined by a hermetic seal 55. In this structure,
The case 50 is integrated by stacking and firing three materials 50a, 50b and 50c, and the conductor 52 connecting the elements 51 is formed on the upper surface of the second-stage case material 50b and connected to the electrode 56 on the side surface. Is done. In the element 51, an electrode 56 on the side surface of the case 50 is electrically connected to a pad 58 on a substrate 57 by solder 59 and fixed.
【0003】[0003]
【発明が解決しようとする課題】図6(A)に示した気
密封止パッケージは、ケース50がセラミックでなり、
これらを重ね、焼成してケース50を作製しなければな
らず、さらにハーメチックシール55により蓋54を接
合しなければならないため、設備費、材料費がかかる
上、工数、時間がかかり、コスト高になるという問題点
がある。In the hermetically sealed package shown in FIG. 6A, the case 50 is made of ceramic,
These must be stacked and fired to produce the case 50, and the lid 54 must be joined with the hermetic seal 55, which requires equipment and material costs, as well as man-hours, time and costs. There is a problem that becomes.
【0004】このようなコスト高の問題は、多数個取り
可能なMIDパッケージ構造の電子部品を構成すること
により解消できる。本発明者は、このような多数個取り
可能なMIDパッケージとして、図6(B)の側面図あ
るいは図6(C)の平面図に示すように、樹脂成形基板
8に、内面にリード電極を形成した複数の電子部品収容
用凹部61を縦横に配設しておき、該凹部61間に端子
電極となるスルーホール11を形成しておき、凹部61
の中にSAWフィルタ等の素子62を、リード電極に端
子を接続して固定し、その上にペレット状の接着剤63
を載せ、樹脂成形基板8全体に蓋素材64を被せ、全体
に熱を加えて接着剤63を溶融、硬化させて蓋素材64
の接着と素子62の封止を行い、各凹部61間を切断し
て個々の電子部品を得る方法を開発している。[0004] Such a problem of high cost can be solved by forming an electronic component having a MID package structure capable of taking many pieces. The inventor of the present invention has provided a lead electrode on the inner surface of the resin molded substrate 8 as shown in the side view of FIG. 6B or the plan view of FIG. A plurality of formed recesses 61 for accommodating electronic components are arranged vertically and horizontally, and through holes 11 serving as terminal electrodes are formed between the recesses 61.
An element 62 such as a SAW filter is connected to a terminal connected to a lead electrode, and a pellet-shaped adhesive 63 is placed thereon.
To cover the entire resin molded substrate 8 with a lid material 64, and apply heat to melt and cure the adhesive 63 to form a lid material 64.
And a method of obtaining individual electronic components by cutting the gaps between the concave portions 61.
【0005】しかしこの方法によれば、加熱により接着
剤63を溶融し、硬化させる際、凹部61内の空気が熱
により膨張し、この膨張空気65が、接着剤63の硬化
によりケースと蓋との間に残留し、個品として切断した
ときに、切断後の製品としての電子部品の気密性を確保
することができないという問題点がある。However, according to this method, when the adhesive 63 is melted and cured by heating, the air in the concave portion 61 expands due to the heat, and the expanded air 65 is cured by the curing of the adhesive 63 so that the case, the lid, There is a problem that when cut as an individual product, the airtightness of an electronic component as a cut product cannot be ensured.
【0006】本発明は、上記問題点に鑑み、接着剤の加
熱、硬化におけるケースと蓋との間における気泡の残留
を防止でき、気密性を向上させることができるMIDパ
ッケージを用いた電子部品の製造方法と電子部品の構造
を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an electronic component using an MID package which can prevent air bubbles from remaining between a case and a lid during heating and curing of an adhesive and can improve airtightness. An object is to provide a manufacturing method and a structure of an electronic component.
【0007】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明の製造方法は、複数の電子部品収容用凹部を
縦横に配列した樹脂成形基板の前記凹部間に、縦方向ま
たは横方向の少なくともいずれかの方向に向けて溝を設
け、前記各凹部にそれぞれ素子を収容固定し、かつ凹部
内の素子の上にペレット状の接着剤を載置しておき、前
記樹脂成形基板上に、該基板および接着剤を覆うよう
に、蓋素材を重ね、前記接着剤および樹脂成形基板を蓋
素材で加圧した状態で加熱して接着剤を溶融、硬化さ
せ、該接着剤の加熱状態において膨張する前記凹部内の
空気の一部を前記溝を通して外部に逃がすことを特徴と
する(請求項1)。In order to achieve this object, a manufacturing method according to the present invention is characterized in that a plurality of recesses for accommodating electronic parts are vertically and horizontally arranged between the recesses of a resin molded substrate. A groove is provided in at least one direction, the element is housed and fixed in each of the concave portions, and a pellet-like adhesive is placed on the element in the concave portion, and on the resin molded substrate, A lid material is overlapped so as to cover the substrate and the adhesive, and the adhesive and the resin molded substrate are heated while being pressed by the lid material to melt and cure the adhesive, and expand in the heated state of the adhesive. A part of the air in the recess is released to the outside through the groove (claim 1).
【0008】また、本発明の製造方法は、前記樹脂成形
基板の上面に、予め、前記凹部と前記溝とを連絡する誘
導溝を設けておき、前記接着剤の加熱溶融の際の凹部内
の膨張空気を前記誘導溝を介して前記凹部間の溝に導く
ことを特徴とする(請求項2)。また、本発明による電
子部品の構造は、樹脂製ケースに凹部を設け、該凹部に
素子を収容し、該凹部を塞ぐ蓋を前記ケースの開口面に
接着し、該開口面に凹部からケース外面にわたって誘導
溝が形成されていることを特徴とする(請求項3)。Further, according to the manufacturing method of the present invention, a guide groove for connecting the concave portion and the groove is provided in advance on the upper surface of the resin molded substrate, and the guide groove in the concave portion when the adhesive is heated and melted is provided. The expansion air is guided to the groove between the recesses via the guide groove (claim 2). In the structure of the electronic component according to the present invention, a concave portion is provided in a resin case, an element is accommodated in the concave portion, a lid for closing the concave portion is adhered to an opening surface of the case, and a case outer surface is formed from the concave portion to the opening surface. A guide groove is formed over the entire surface (claim 3).
【0009】[0009]
【作用】請求項1においては、接着剤を蓋素材と素子と
の間に挟んで加熱、硬化する場合に、電子部品収容用凹
部内の膨張した空気が前記凹部間の溝を通して外部に排
出されるので、蓋部材と樹脂成形基板との間の気泡の残
留がなくなり、各電子部品として切断した後の製品とし
ての気密性が確保される。According to the first aspect, when the adhesive is sandwiched between the lid material and the element and heated and cured, the expanded air in the concave part for accommodating the electronic component is discharged to the outside through the groove between the concave parts. Therefore, no air bubbles remain between the lid member and the resin molded substrate, and the airtightness of the product after being cut as each electronic component is secured.
【0010】請求項2、3においては、樹脂成形基板の
凹部と溝との間を連絡する誘導溝を設けたので、凹部内
の膨張空気の移動が該誘導溝を通してスムーズに行わ
れ、気泡残留防止がより確実に行われる。In the second and third aspects, since the guide groove is provided for communicating between the concave portion and the groove of the resin molded substrate, the movement of the inflated air in the concave portion is smoothly performed through the guide groove, and the bubbles remain. Prevention is performed more reliably.
【0011】[0011]
【発明の実施の形態】図1は本発明の製造方法を実施す
る部材の一例を示す分解斜視図、図2(A)はその一部
を示す平面図、図2(B)、(C)は図2(A)のそれ
ぞれE−E、F−F断面図、図3は本実施例の工程図、
図4(A)は該実施例のケースの平面図、図4(B)は
分解側面図、図5は本実施例により製造された電子部品
を示す縦断面図である。FIG. 1 is an exploded perspective view showing an example of a member for carrying out the manufacturing method of the present invention, FIG. 2 (A) is a plan view showing a part thereof, and FIGS. 2 (B) and 2 (C). 2A is a cross-sectional view taken along line EE and FF of FIG. 2A, FIG.
4A is a plan view of the case of this embodiment, FIG. 4B is an exploded side view, and FIG. 5 is a longitudinal sectional view showing an electronic component manufactured according to this embodiment.
【0012】本実施例の製造方法により得られる電子部
品の構成をまず図4、図5により説明しておく。図4
(B)に示すように、本実施例の電子部品は、MIDケ
ース1と、SAWフィルタ等の素子4と、電子部品組立
前はペレット状をなす接着剤5と、蓋6とからなる。ケ
ース1は、上面開口の凹部7を有し、該凹部7は、底面
aと、中間段部bとからなる2段構造を有し、中間段部
bと上面c、底面aとの間の対向する2面には傾斜面d
が形成されている。First, the structure of an electronic component obtained by the manufacturing method of this embodiment will be described with reference to FIGS. FIG.
As shown in (B), the electronic component of the present embodiment includes an MID case 1, an element 4 such as a SAW filter, an adhesive 5 in a pellet shape before assembling the electronic component, and a lid 6. The case 1 has a concave portion 7 having an upper surface opening, and the concave portion 7 has a two-stage structure including a bottom surface a and an intermediate step portion b, and is provided between the intermediate step portion b, the upper surface c, and the bottom surface a. Slope d
Are formed.
【0013】該凹部7の内面には金でなるリード電極2
が形成される。素子4はくし形電極が下面に形成された
フリップチップでなり、素子4を前記底面aに、ケース
1を加熱した状態で超音波により金バンプ4aをリード
電極2に電気的に接続し、かつ機械的に固定する。A lead electrode 2 made of gold is provided on the inner surface of the recess 7.
Is formed. The element 4 is a flip chip having a comb-shaped electrode formed on the lower surface. The element 4 is electrically connected to the lead electrode 2 by ultrasonic waves while the case 1 is heated while the case 1 is heated. Fixed.
【0014】図5に示すように、ケース1の底面に形成
した基板接続用端子部3とが、前記凹部7の中間段部b
からケースの底面にわたって設けたスルーホール9によ
り接続される。9aはスルーホール9の内壁にメッキさ
れた導体を示す。前記凹部7内における前記蓋6と素子
4との間に接着剤5が充填され、該接着剤5により前記
スルーホール9の少なくとも一部を閉塞する。ケース1
の側面には、半円形の水平断面形状を有する面に、前記
基板接続用端子部3に接続された側面電極10が、後述
のスルーホールを切断する工程により形成される。As shown in FIG. 5, the substrate connecting terminal portion 3 formed on the bottom surface of the case 1 is
And through a through hole 9 provided over the bottom surface of the case. 9a denotes a conductor plated on the inner wall of the through hole 9. An adhesive 5 is filled between the lid 6 and the element 4 in the recess 7, and the adhesive 5 closes at least a part of the through hole 9. Case 1
A side electrode 10 connected to the substrate connection terminal portion 3 is formed on a side surface having a semicircular horizontal cross-sectional shape by a step of cutting through holes described later.
【0015】次に上述した電子部品の製造方法を図1な
いし図3により説明する。図1に示すように、樹脂成形
基板8には予め電子部品収容用凹部7を縦横に複数個ず
つ整列させて形成しておき、これらの凹部7には図4、
図5に示した前記リード電極2を形成し、かつ底面に基
板接続用端子部3を形成しておき、かつ前記側面電極1
0を形成するための複数個のスルーホール11を、凹部
7の間に図1における横(X)方向に配設しておく。ま
た、凹部7の間に、蓋素材12の取付けの際に、凹部7
内の熱膨張した空気を抜く溝13を縦(Y)方向に設け
ておき、さらに、凹部7の縁と溝13との間に、凹部7
内の膨張空気を溝13に導くための誘導溝14を設けて
おく。Next, a method for manufacturing the above-described electronic component will be described with reference to FIGS. As shown in FIG. 1, a plurality of recesses 7 for accommodating electronic components are formed in the resin molded substrate 8 in advance in rows and columns, and these recesses 7 are formed in FIG.
The lead electrode 2 shown in FIG. 5 is formed, the substrate connection terminal portion 3 is formed on the bottom surface, and the side electrode 1 is formed.
A plurality of through holes 11 for forming 0 are arranged between the recesses 7 in the horizontal (X) direction in FIG. Further, when the cover material 12 is attached between the recesses 7,
A groove 13 is provided in the vertical (Y) direction for removing the thermally expanded air in the inside, and a recess 7 is provided between the edge of the recess 7 and the groove 13.
A guide groove 14 for guiding the inflation air inside the groove 13 to the groove 13 is provided.
【0016】図3はこの電子部品の樹脂成形基板8製造
後の製造工程を示す図であり、まず図3(A)に示すよ
うに、凹部7に固定された素子4上にペレット状の接着
剤5を嵌め込み、次に図3(B)に示すように、樹脂成
形基板8全体を覆う広さの蓋素材6Aを基板8上に重
ね、次に図3(C)に示すように上下面より加圧し、図
3(D)に示すように反転させて加熱することにより、
一時的に流動状態となった接着剤5をスルーホール9の
少なくとも一部に充填してこれを閉塞すると共に、蓋素
材6Aを接着剤5により接着し、かつ素子4と蓋素材6
Aとの間の隙間を接着剤5で覆い、素子4と外気との間
を接着剤5で遮断する。FIG. 3 is a view showing a manufacturing process after manufacturing the resin molded substrate 8 of the electronic component. First, as shown in FIG. 3A, a lid material 6A having a size covering the entire resin molded substrate 8 is superimposed on the substrate 8 as shown in FIG. 3B, and then the upper and lower surfaces as shown in FIG. By applying more pressure and inverting and heating as shown in FIG. 3 (D),
At least a part of the through-hole 9 is filled with the adhesive 5 which has been temporarily in a fluid state, and the through-hole 9 is closed. The lid material 6A is adhered with the adhesive 5, and the element 4 and the lid material 6 are bonded.
The gap between A and the element A is covered with an adhesive 5, and the element 4 and the outside air are shut off with the adhesive 5.
【0017】図4(B)に示すように、凹部7の底面a
から中間段部bまでの高低差をA、中間段部bから上面
cまでの高低差をB、素子4のバンプ4aを含めた厚み
をC、溶融前のペレット状の接着剤5の厚みをDとした
場合、A≧C、D≧B(好ましくはDがBよりやや大き
くなる大小関係が成立するように寸法設定する)ことに
より、図3(C)のように接着剤5を押圧する際に素子
4に無理な力を作用させず、またスルーホール9に接着
剤5を充填させることができる。As shown in FIG. 4B, the bottom
A, the height difference from the middle step b to the upper surface c is B, the thickness including the bumps 4a of the element 4 is C, and the thickness of the pellet-shaped adhesive 5 before melting is A. In the case of D, the adhesive 5 is pressed as shown in FIG. 3C by setting A ≧ C and D ≧ B (preferably, dimensions are set so that a magnitude relation in which D is slightly larger than B is established). In this case, the adhesive 4 can be filled in the through hole 9 without exerting an excessive force on the element 4.
【0018】接着剤5を溶融させるために加熱する際、
凹部7内の空気の熱膨張により、空気が接着剤5を押し
のけ、溝13に至るので、気泡が蓋素材6Aと基板8と
の間に残留することがなく、蓋素材6Aと素子4との間
が接着剤5により充填され、気密性が確保される。When heating the adhesive 5 to melt it,
Due to the thermal expansion of the air in the concave portion 7, the air pushes the adhesive 5 and reaches the groove 13, so that no air bubbles remain between the lid material 6A and the substrate 8, and the gap between the lid material 6A and the element 4 The space is filled with the adhesive 5 to ensure airtightness.
【0019】このような工程で蓋素材6Aの固定を行っ
た後、溝13の幅の回転ブレードにより溝13に沿って
Y方向に蓋素材6Aと共に基板8を切断すると共に、ス
ルーホール11の中心部に沿ってX方向に切断して個々
の電子部品を得る。After the lid material 6A is fixed in such a process, the substrate 8 is cut together with the lid material 6A in the Y direction along the groove 13 by a rotating blade having a width of the groove 13, and the center of the through hole 11 is formed. The individual electronic components are obtained by cutting in the X direction along the portion.
【0020】本実施例においては、樹脂成形基板8の上
面に、凹部7と溝13とを連絡する誘導溝14を設けて
いるので、気泡は誘導溝14に導かれて溝13に至り、
円滑な膨張空気の排出が可能となる上、スルーホール1
1(側面電極10)側ではなく、溝13側に誘導溝14
を設けることにより、気泡の流れに伴なって溶融状態の
接着剤5がスルーホール11側に流れて接着剤により覆
われることが防止される。In the present embodiment, since the guide groove 14 for connecting the concave portion 7 and the groove 13 is provided on the upper surface of the resin molded substrate 8, air bubbles are guided to the guide groove 14 and reach the groove 13.
Smooth expansion air can be discharged and through hole 1
The guide groove 14 is not provided on the side of the groove 1 but on the side of the groove 13.
Is provided, it is possible to prevent the adhesive 5 in the molten state from flowing toward the through hole 11 with the flow of air bubbles and being covered with the adhesive.
【0021】このようにして作製した電子部品は、図5
に示すように、印刷基板15上のパッド16に半田17
等により電気的に接続され、かつ固定される。The electronic component manufactured in this way is shown in FIG.
As shown in FIG.
Are electrically connected and fixed.
【0022】なお、本発明のようにMIDパッケージを
用いて電子部品を構成する場合、ケース1と蓋6とは高
密着性の接着剤5によって接着させなければならない。
実施例においては、ケース1の材質としてLCP(液晶
ポリマー)、エポキシ樹脂(東芝ケミカル(株)製、E
P−H)のいずれかを用い、蓋6として、BTレジン、
エポキシ樹脂(東芝ケミカル(株)製、EP−H)の表
面に銅メッキ+ニッケルメッキ+金メッキを施してなる
ものを用い、これらを組み合わせてプレッシャークッカ
ーテスト(試験条件、121℃、2気圧、湿度100
%)を行い、125℃のフロリナート液に入れて気泡が
出るか否かのバブルリークテストを行った結果、LCP
の場合には48時間程度でリークが見られたが、前記エ
ポキシ樹脂の場合には96時間経過後においてもリーク
は見られなかった。従って、ケース1としては、エポキ
シ樹脂を用いることが好ましい。When an electronic component is formed using an MID package as in the present invention, the case 1 and the lid 6 must be adhered to each other with an adhesive 5 having high adhesion.
In the embodiment, as the material of the case 1, LCP (liquid crystal polymer), epoxy resin (Effect of Toshiba Chemical Corporation, E
PH), BT resin,
An epoxy resin (EP-H, manufactured by Toshiba Chemical Co., Ltd.) with copper plating + nickel plating + gold plating applied to its surface is used in combination with a pressure cooker test (test conditions, 121 ° C., 2 atm, humidity) 100
%) And put into a Fluorinert solution at 125 ° C. to perform a bubble leak test to determine whether or not air bubbles appear.
In the case of (1), a leak was observed in about 48 hours, but in the case of the epoxy resin, no leak was observed even after 96 hours. Therefore, it is preferable to use an epoxy resin for the case 1.
【0023】またLiNbO3系の素体でなる素子4を
構成する場合、図6(A)に示した従来のセラミックケ
ースとして代表的なアルミナを用いた場合と、エポキシ
樹脂と、LCPを用いた場合とを比較すると、熱膨張率
は、 LiNbO3:1.3×10-5、アルミナ:0.7×1
0-5 エポキシ樹脂:1.5×10-5、LCP:2〜5×10
-5 であって、熱衝撃によって素子とケースの接合部を破壊
しない意味においても、素子4の素体の材質と熱膨張率
が近いエポキシ樹脂を用いた場合の方が、セラミックを
用いる場合よりも有利となる。When the element 4 made of a LiNbO 3 -based element is formed, the conventional ceramic case shown in FIG. 6A is made of alumina, the epoxy resin and LCP are used. In comparison with the case, the thermal expansion coefficients are as follows: LiNbO 3 : 1.3 × 10 −5 , alumina: 0.7 × 1
0 -5 epoxy resin: 1.5 × 10 -5 , LCP: 2 to 5 × 10
-5 , and in the sense that the junction between the element and the case is not destroyed by thermal shock, the use of an epoxy resin having a coefficient of thermal expansion close to the material of the element body of the element 4 is better than the case of using a ceramic. Is also advantageous.
【0024】上記実施例においては、中間段部bから基
板接続用端子部3をスルーホール9によって接続するこ
とにより、素子4から端子部3までの長さを短縮し、こ
れにより、素子4の周波数特性の低下を防止し、フィル
タとしての減衰特性の向上を図っているが、本発明は、
スルーホール9を設けないものにも適用できる。また、
凹部7間の溝13は、一方向(Y方向)に設けるのでは
なく、X方向にも設けてもよく、またX、Y双方向に設
けてもよい。In the above embodiment, the length from the element 4 to the terminal section 3 is reduced by connecting the board connecting terminal section 3 from the intermediate stage section b to the substrate connecting terminal section 3 through the through hole 9. The frequency characteristics are prevented from lowering, and the attenuation characteristics as a filter are improved.
The present invention can also be applied to a case where the through hole 9 is not provided. Also,
The groove 13 between the concave portions 7 may be provided not only in one direction (Y direction) but also in the X direction, or may be provided in both X and Y directions.
【0025】[0025]
【発明の効果】請求項1によれば、接着剤を蓋素材と素
子との間に挟んで加熱、硬化する場合に、凹部内の膨張
した空気が凹部間の溝を通して外部に排出されるので、
蓋部材と樹脂成形基板との間の気泡の残留がなくなり、
各電子部品として切断した後の製品としての気密性の高
い製品が得られる。According to the first aspect of the present invention, when the adhesive is sandwiched between the lid material and the element and heated and cured, the expanded air in the concave portion is discharged outside through the groove between the concave portions. ,
No bubbles remain between the lid member and the resin molded substrate,
A highly airtight product as a product after cutting as each electronic component is obtained.
【0026】請求項2、3においては、樹脂成形基板の
凹部と溝との間を連絡する誘導溝を設けたので、凹部内
の膨張空気の移動がスムーズに行われ、気泡残留防止が
より確実に行われる。In the second and third aspects, since the guide groove is provided for communicating between the concave portion and the groove of the resin molded substrate, the expansion air in the concave portion is smoothly moved, and the prevention of the residual air bubbles is more reliable. Done in
【図1】本発明の製造方法を実施する部材の一例を示す
分解斜視図である。FIG. 1 is an exploded perspective view showing an example of a member for implementing a manufacturing method of the present invention.
【図2】(A)は図1の樹脂成形基板の一部を示す平面
図、(B)、(C)は(A)のそれぞれE−E、F−F
断面図である。2A is a plan view showing a part of the resin molded substrate of FIG. 1, and FIGS. 2B and 2C are EE and FF of FIG.
It is sectional drawing.
【図3】(A)〜(D)は本実施例の工程図である。FIGS. 3A to 3D are process diagrams of the present embodiment.
【図4】(A)は該実施例のケースの平面図、(B)は
本実施例の電子部品の組立前の分解側面図である。FIG. 4A is a plan view of a case of the embodiment, and FIG. 4B is an exploded side view of the electronic component of the embodiment before being assembled.
【図5】本実施例により製造された電子部品を示す縦断
面図である。FIG. 5 is a longitudinal sectional view showing an electronic component manufactured according to the embodiment.
【図6】(A)は従来の気密封止電子部品の縦断面図、
(B)、(C)はMIDパッケージにより多数個取りで
電子部品を製造する場合の問題点を説明する素材の側面
図および平面図である。FIG. 6A is a longitudinal sectional view of a conventional hermetically sealed electronic component,
FIGS. 4B and 4C are a side view and a plan view of a material for explaining a problem in the case where an electronic component is manufactured in a large number of pieces by the MID package.
1:ケース、2:リード電極、3:基板接続用端子部、
4:素子、5:接着剤、6:蓋、6A:蓋素材、7:凹
部、8:樹脂成形基板、9:スルーホール、10:側面
電極、11:スルーホール、13:溝、14:誘導溝、
15:印刷基板、16:パッド、17:半田1: Case, 2: Lead electrode, 3: Terminal part for board connection,
4: element, 5: adhesive, 6: lid, 6A: lid material, 7: concave, 8: resin molded board, 9: through hole, 10: side electrode, 11: through hole, 13: groove, 14: induction groove,
15: printed circuit board, 16: pad, 17: solder
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山本 修一郎 東京都中央区日本橋一丁目13番1号 ティ −ディ−ケイ株式会社内 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Shuichiro Yamamoto 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation
Claims (3)
た樹脂成形基板の前記凹部間に、縦方向または横方向の
少なくともいずれかの方向に向けて溝を設け、 前記各凹部にそれぞれ素子を収容固定し、かつ凹部内の
素子の上に接着剤を載置しておき、 前記樹脂成形基板上に、該基板および接着剤を覆うよう
に、蓋素材を重ね、 前記接着剤および樹脂成形基板を蓋素材で加圧した状態
で加熱して接着剤を溶融、硬化させ、該接着剤の加熱状
態において膨張する前記凹部内の空気の一部を前記溝を
通して外部に逃がすことを特徴とするMIDパッケージ
を用いた電子部品の製造方法。1. A resin-molded substrate in which a plurality of recesses for accommodating electronic components are vertically and horizontally arranged, and a groove is provided between the recesses in at least one of a vertical direction and a horizontal direction. And an adhesive is placed on the element in the concave portion, and a lid material is overlaid on the resin molded substrate so as to cover the substrate and the adhesive. The substrate is heated while being pressed with the lid material to melt and cure the adhesive, and a part of the air in the concave portion that expands in the heated state of the adhesive is released to the outside through the groove. An electronic component manufacturing method using an MID package.
を連絡する誘導溝を設けておき、 前記接着剤の加熱溶融の際の凹部内の膨張空気を前記誘
導溝を介して前記凹部間の溝に導くことを特徴とするM
IDパッケージを用いた電子部品の製造方法。2. The method according to claim 1, wherein a guide groove for connecting the concave portion and the groove is provided in advance on an upper surface of the resin molded substrate, and expanded air in the concave portion when the adhesive is heated and melted. M is guided to the groove between the recesses through the guide groove.
A method for manufacturing an electronic component using an ID package.
を収容し、該凹部を塞ぐ蓋を前記ケースの開口面に接着
し、該開口面に凹部からケース外面にわたって誘導溝が
形成されていることを特徴とするMIDパッケージを用
いた電子部品の構造。3. A concave portion is provided in a resin case, an element is accommodated in the concave portion, and a lid for closing the concave portion is bonded to an opening surface of the case, and a guide groove is formed in the opening surface from the concave portion to the outer surface of the case. A structure of an electronic component using an MID package, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24865896A JPH1075075A (en) | 1996-08-30 | 1996-08-30 | Manufacture of electronic part using mid package, and structure of electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24865896A JPH1075075A (en) | 1996-08-30 | 1996-08-30 | Manufacture of electronic part using mid package, and structure of electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1075075A true JPH1075075A (en) | 1998-03-17 |
Family
ID=17181414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24865896A Pending JPH1075075A (en) | 1996-08-30 | 1996-08-30 | Manufacture of electronic part using mid package, and structure of electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1075075A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7375974B2 (en) | 2004-03-15 | 2008-05-20 | Denso Corporation | Electronic device |
-
1996
- 1996-08-30 JP JP24865896A patent/JPH1075075A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7375974B2 (en) | 2004-03-15 | 2008-05-20 | Denso Corporation | Electronic device |
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