JP2003152131A - Hollow sealed package and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hollow sealed package which can be manufactured easily and inexpensively and in which the reliability of electromagnetic shield effect can be sustained over a long term, and to provide a hollow sealed package in which high reliability of electromagnetic shield effect can be sustained even if a silicon control element is mounted simultaneously. SOLUTION: The hollow sealed package comprises a high frequency semiconductor element 10 located in a cavity 70, high frequency circuit wiring performing electrical lead out of the high frequency semiconductor element 10 to the outside of the package, and a frame 50 and a cap 60 surrounding the cavity 70, wherein the frame 50 and the cap 60 are bonded through an anisotropic conductive film (ACF) 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hollow sealed package for hermetically sealing a high frequency semiconductor element and a method for manufacturing the same, and in particular, a hollow package provided with an electromagnetic shield so that electromagnetic waves generated from the high frequency semiconductor element do not leak to the outside. The present invention relates to a sealed package and a manufacturing method thereof.

[0002]

2. Description of the Related Art As one form of an integrated circuit package,
There is a hollow sealed package. In this hollow sealed package, a high reliability of the product is maintained by mounting an integrated circuit in a space provided inside the package and hermetically sealing this space. Therefore, it is used for mounting various integrated circuits.

An example of an integrated circuit mounted in this hollow sealed package is a high frequency semiconductor element such as a microwave semiconductor element or a millimeter wave semiconductor element. High-frequency semiconductor elements are widely used in commercial communication devices, satellites, radars, etc., and it is essential that they have high reliability and long product life. Therefore, by mounting the high frequency semiconductor element in the airtight space of the hollow sealed package, the reliability of the product is improved. Recently, in addition to high frequency semiconductor devices, ASICs (Application Specified Integr
There are many packages that simultaneously mount a control semiconductor device such as an ated circuit in an airtight space.

Among these hollow sealed packages, in particular, the hollow sealed package for a high frequency semiconductor element used as a high frequency amplifier, in addition to the high reliability described above, has a high frequency semiconductor element and a high frequency circuit wiring (hereinafter, high frequency semiconductor element). It is necessary to block the leakage of electromagnetic waves generated from the outside of the package. For this reason, it is necessary to use a package having an electromagnetic shielding effect, and a metal package or a package made of an insulating material such as ceramics or resin partially used as a conductor material is used. In any case, it is necessary to surround the high-frequency semiconductor element or the like with a conductor material in order to block electromagnetic waves generated from the high-frequency semiconductor element or the like mounted in the airtight space.

FIG. 25 is a sectional view for explaining the structure of a conventional general hollow sealing package used for mounting a high frequency semiconductor device. The hollow sealed package includes a metal frame 1050 having a container shape with an upper opening,
The cap 1060 is also made of a metal and is attached to the upper portion of the frame 1050 so as to close the opening. The frame 1050 and the cap 1060 are sealed by a brazing material 1090, thereby forming a cavity 1070 which is an airtight space inside the package.
A high frequency semiconductor element 1010 is mounted on the bottom surface of the concave portion of the frame 1050 forming the cavity 1070.

The high frequency semiconductor device 1010 is connected to the lead 1055 provided on the bottom surface of the concave portion of the frame 1050 forming the cavity 1070 by a bonding wire 1020. The leads 1055 are for electrically drawing out from the package. The leads 1055 are connected to the terminals of the parent circuit board (not shown). The lead 1055 is connected to the frame 1050.
A hermetically sealed via ceramic material 1056 to avoid short circuit with.

In the above-mentioned conventional example, the metal material is selected as the material of the package. However, as described above, a package in which an insulating material such as ceramics or resin is used as a main material and a conductor material is used for a part of the package is used. It may be used. In this case, for example, the surface of the frame and the cap made of a ceramic material is metalized by plating or the like, and the frame and the cap are joined by a conductive joining member such as a brazing material to obtain an electromagnetic shield effect.

[0008] However, in the hollow sealed package having the above-mentioned structure, there is a case where the molten brazing material or the flux contained in the brazing material flows into the cavity to cause a problem. For example, a brazing material or flux may contact a bonding wire or an electrode to cause a short circuit or stain the inside of the package. As a result, not only the yield is lowered, but also the reliability of the product may be significantly impaired.

As a structure for preventing the brazing material from flowing into the cavity, there are structures disclosed in Japanese Utility Model Laid-Open No. 1-174939 and Japanese Patent Application Laid-Open No. 10-303323.
In the structures disclosed in these publications, a groove is formed on the joint surface with the cap on the upper part of the frame to collect the brazing material and flux that try to flow into the cavity during brazing and to flow into the cavity. To prevent it.

Also, when the frame and the cap are joined using a conductive adhesive, the conductive adhesive may be liquefied in the curing step and flow into the cavity. Also in this case, the same problem as that of the brazing material described above occurs.

As a structure for preventing the inflow of the conductive adhesive, there is a structure disclosed in Japanese Patent No. 2842355. This is to prevent the resin from flowing into the inside by providing a bank portion inside the cap and damming the resin at the bank portion.

[0012]

However, when the above-mentioned structure is applied to the hollow sealed package having the electromagnetic shield, a problem occurs in any structure.
The problems will be individually described below.

Japanese Utility Model Laid-Open No. 1-174939 and Japanese Unexamined Patent Publication No.
In the structure disclosed in Japanese Patent Laid-Open No. 0-303323, it is necessary to provide a groove for preventing the inflow of the brazing material on the joint surface of the frame, but especially when the frame is made of ceramics, this groove should be formed. Is very difficult. In order to form a groove in a ceramic frame, it is necessary to make the process extremely complicated in the manufacturing process of the frame, and the yield is also reduced accordingly, which is not practical. Further, in the case of a resin frame, it is easy to provide the groove, but since it has poor heat resistance, it may not be able to withstand the high temperature of brazing.

In general, in a high frequency semiconductor element, die bonding is performed on the mounting surface inside the cavity by gold-tin solder. The gold-tin solder used for this die bond has a melting point of about 280 ° C. (for example, 80 Au-20
Sn) is used. Generally, a high-frequency semiconductor element is a compound semiconductor, and therefore, even if it is exposed to a high temperature of about 280 ° C., no particular problem occurs in the element. However, in recent years, the control element used in the simultaneous sealing of control elements is often a semiconductor element made of silicon such as ASIC, and there is a concern that the characteristics may be adversely affected by exposure to such a high temperature.

Therefore, it is necessary to select a resin-made die bond material as the die bond material. However, when a resin die bond material is used, the resin die bond material may be deteriorated by being exposed to a high temperature in the subsequent step of joining the frame and the cap. The deterioration of the die-bonding material adversely affects the reliability of the hollow sealed package, so that the brazing of the package and the cap is not preferable for the purpose of simultaneously sealing the control elements.

In the structure disclosed in Japanese Patent No. 2842355, it is described that an epoxy resin or a phenol resin is used as an adhesive made of resin for connecting the frame and the cap. Since each of these is an insulating resin, the electromagnetic shield effect cannot be obtained by this adhesive alone.

Although it is easily conceivable to use a conductive adhesive to solve this problem, this conductive adhesive is used in large amounts in order to make a resin, which is originally a non-conductor, electrically conductive. Since a conductive material such as carbon or carbon is mixed in, the adhesiveness is significantly inferior to that of an insulating adhesive. Further, since the moisture resistance is insufficient, it is difficult to maintain reliability for a long period of time, and it is not suitable for mounting a high frequency semiconductor element.

Therefore, an object of the present invention is to provide a hollow sealed package having an electromagnetic shield effect which can be manufactured easily and inexpensively and which can maintain reliability for a long period of time. Another object of the present invention is to provide a hollow sealed package having an electromagnetic shield effect that maintains high reliability even when a control element made of silicon is simultaneously mounted in the cavity.

[0019]

A hollow sealed package according to a first aspect of the present invention is a high frequency semiconductor device located in an airtight space, and a high frequency circuit wiring for electrically drawing the high frequency semiconductor device to the outside. And a frame and a cap surrounding the airtight space, wherein the frame and the cap are joined by an anisotropic conductive film.

By joining the frame and the cap using the anisotropic conductive film as in the present construction, the joining member is prevented from flowing into the airtight space. This makes it possible to improve the yield and provide a highly reliable hollow sealed package. In addition, since bonding can be performed at a lower temperature than that of a brazing material, it is also suitable when simultaneously mounting silicon semiconductor elements such as ASIC in an airtight space. Furthermore, since the film-shaped joining member is used in this configuration, the work can be performed more easily and quickly than conventional brazing materials and adhesives, and the hollow sealed package can be efficiently produced.

In the hollow sealed package according to the first aspect of the present invention, for example, at least one of the frame and the cap is a conductor portion for blocking an electromagnetic wave generated from the high frequency semiconductor element or the high frequency circuit wiring. It is preferable to have

By using a package having an electromagnetic shield in a part of the frame and the cap as in this configuration, it is possible to block the leakage of electromagnetic waves generated from the high-frequency semiconductor element or the like to the outside. At the same time, it is possible to prevent electromagnetic waves from leaking into the airtight space from the outside. The electrical connection between the conductor portions provided on the frame and the cap can be easily and surely made by using the anisotropic conductive film.

In the hollow sealed package according to the first aspect of the present invention, for example, the conductor portion is a wall-shaped conductor arranged in the frame and the cap so as to surround the airtight space, and is seen from the high frequency semiconductor device. It is desirable to be located in all directions.

In particular, when it is desired to completely block the leakage of electromagnetic waves, it is preferable to form the conductor portion in all directions as viewed from the high frequency semiconductor element, that is, so as to surround the high frequency semiconductor element as in this configuration. In this case, conductor portions are formed on all the side surfaces and the lower surface of the cap and the frame. However, it is also possible to partially substitute the ground wiring of the parent circuit board on which the hollow sealed package is mounted.

In the hollow sealed package according to the first aspect of the present invention, for example, when at least one of the frame and the cap is provided with a partition for dividing the airtight space into a plurality of spaces, It is desirable that the frame or cap and the partition wall be joined by a conductive paste.

Thus, when it is necessary to electromagnetically separate a plurality of electronic circuits mounted in the airtight space from each other, the airtight space is separated by the partition wall provided on either the frame or the cap. . In this case, it is preferable that an anisotropic conductive film is used to bond the portion of the bonding surface between the cap and the frame that corresponds to the outer periphery, and a conductive paste is used to bond the frame or the cap to the partition wall. As a result, electrical continuity between the partition wall and the cap is secured, and the electromagnetic shield effect is realized.

In the hollow sealed package according to the first aspect of the present invention, for example, the frame-side terminal electrode is formed on the joint surface of the frame with the cap, and the cap is opposed to the frame-side terminal electrode. It is preferable that the cap-side terminal electrode is formed at a position corresponding to the frame-side terminal electrode on the joint surface of.

By forming the terminal electrodes on the joint surfaces of the frame and the cap as in this structure, the conductive filler contained in the anisotropic conductive film interposed therebetween is efficiently captured, and more reliable electrical conductivity is obtained. Continuity is ensured.

In the hollow sealed package according to the first aspect of the present invention, for example, a bump made of a metal material is provided on at least one of the frame-side terminal electrode and the cap-side terminal electrode. Is desirable.

By providing the bumps on the terminal electrodes as in the present structure, it is possible to capture the conductive filler of the anisotropic conductive film more efficiently as compared with the structure having only the terminal electrodes, and thus more reliable. Electrical continuity is ensured.

In the hollow sealed package according to the first aspect of the present invention, for example, the frame-side terminal electrodes and the cap-side terminal electrodes are provided in a dot array on the joint surface between the frame and the cap. Therefore, it is desirable that the interval between the frame-side terminal electrodes adjacent to each other is not more than (1/4) of the wavelength of the electromagnetic wave generated from the high-frequency semiconductor element and the high-frequency circuit wiring.

As in this structure, both the terminal electrodes of the frame and the cap are arranged in a dot array, and the interval between the terminal electrodes arranged in the dot array is set to the wavelength of the electromagnetic wave generated from the high frequency semiconductor element or the like. By setting the ratio to (1/4) or less, it becomes possible to obtain the electromagnetic shield effect without performing bonding with a conductive material on the entire surface of the bonding portion between the frame and the cap. Further, since the base of the frame and the cap made of ceramics or resin is exposed between the terminal electrodes arranged in a dot array, a high bonding strength with the anisotropic conductive film is secured. That is, with this configuration, high bonding strength and reliable electrical connection are possible, and it is possible to provide a highly reliable hollow sealed package having an electromagnetic shield effect.

A hollow sealed package according to the second aspect of the present invention includes a high-frequency semiconductor element located in an airtight space,
A hollow sealing package including a high-frequency circuit wiring for electrically pulling out a high-frequency semiconductor element to the outside, and a frame and a cap surrounding an airtight space, wherein a connecting member for connecting the frame and the cap is located inside. The inner connecting member is a film that seals the airtight space, and the outer connecting member is a brazing material.

When the frame and the cap are connected to each other by connecting the inner side with a film for sealing the airtight space and joining the outer side with a brazing material as in this structure, It is possible to prevent the inflow to. This is because the previously connected film prevents the brazing material from flowing into the airtight space. Further, by using the brazing material, the electric connection between the frame and the cap is realized, so that it is possible to secure the electromagnetic shield effect. As a result, a highly reliable hollow sealed package that can maintain the electromagnetic shield effect while preventing the brazing material from flowing into the airtight space is realized.

In the hollow sealed package according to the second aspect of the present invention, for example, the film which is the inner connecting member is preferably a resin adhesive film.

As described above, by using a resin adhesive film as the inner connecting member, it is possible to prevent the brazing material and the flux from flowing into the airtight space even during the later brazing. It Further, since the frame and the cap can be temporarily fixed by using the adhesive film, workability in manufacturing can be improved.

In the hollow sealed package according to the second aspect of the present invention, for example, the film which is the inner connecting member is preferably a seal member which comes into close contact with the frame and the cap by being compressed and deformed. .

As described above, by using the film which is the inner connecting member as the sealing member, it is possible to prevent the brazing material and the flux from flowing into the airtight space even when brazing is performed later. Further, since the sealing member is compressed and used, the airtight space can be surely sealed, so that an improvement in yield can be expected.

In the hollow sealed package according to the second aspect of the present invention, for example, the film which is the inner connecting member may be an anisotropic conductive film.

As described above, the film as the inner connecting member can be an anisotropic conductive film. This anisotropic conductive film prevents the brazing material and the flux from flowing into the airtight space even during brazing performed later. Further, by using the anisotropic conductive film, it is possible to obtain the same effect as that of the hollow sealed package based on the first aspect of the present invention described above.

In the hollow sealed package according to the second aspect of the present invention, for example, at least one of the frame and the cap is a conductor portion for blocking electromagnetic waves generated from the high frequency semiconductor element or the high frequency circuit wiring. It is preferable to have

With this configuration, even in the hollow sealed package according to the second aspect of the present invention, it is possible to prevent the electromagnetic waves generated from the high frequency semiconductor element or the like from leaking to the outside. At the same time, it becomes possible to prevent leakage of electromagnetic waves from the outside into the airtight space.

In the hollow sealed package according to the second aspect of the present invention, for example, the conductor portion is a wall-shaped conductor arranged in the frame and the cap so as to surround the airtight space, and is seen from the high frequency semiconductor device. It is desirable to be located in all directions.

With this configuration, also in the hollow sealed package according to the second aspect of the present invention, a conductor is provided on the frame and the cap so as to surround the high frequency semiconductor element, especially when it is desired to completely block the leakage of electromagnetic waves. By forming the portion, it becomes possible to completely block the leakage of electromagnetic waves.

In the hollow sealed package according to the second aspect of the present invention, for example, when at least one of the frame and the cap is provided with a partition wall that divides the airtight space into a plurality of spaces, It is desirable that the frame or cap and the partition wall be joined by a conductive paste.

With this structure, electrical continuity between the frame or the cap and the partition wall is ensured even in the hollow sealed package according to the second aspect of the present invention.
The electromagnetic shield effect between the airtight spaces is realized.

In the hollow sealed package according to the second aspect of the present invention, the castellation is formed on at least one of the frame and the cap on the side surface of the package including the frame and the cap. It is preferable that the frame and the cap are joined by brazing at the site where the castellation is formed.

As in this structure, a castellation is formed on the outer surface of the package, and the frame and the cap are joined to each other with a brazing material at the portion where the castellation is formed, whereby the hollow sealed package is efficiently manufactured. It becomes possible to do.

In the hollow sealed package according to the second aspect of the present invention, for example, on the side surface of the package including the frame and the cap, the castellation is formed on either one of the frame and the cap, and the other is formed on the other side. It is preferable that a terminal electrode facing the end portion of the castellation is formed, and a fillet of brazing material is formed between the castellation and the terminal electrode.

Since the fillet is formed in the brazing material that joins the frame and the cap as in this structure, it is possible to relieve stress caused by thermal history. As a result, it is possible to provide a highly reliable hollow sealed package that is resistant to heat history.

A method for manufacturing a hollow sealed package according to the first aspect of the present invention is directed to a high-frequency semiconductor element located in an airtight space, a high-frequency circuit wiring for electrically pulling out the high-frequency semiconductor element to the outside, and an airtight A method for manufacturing a hollow sealed package including a frame surrounding a space and a cap, comprising the following steps.

(A) A step of inserting a seal member in a portion adjacent to the airtight space in a connecting portion between the frame and the cap.

(B) A step of bringing the seal member into close contact with the frame and the cap by compressing and deforming the seal member.

(C) A step of joining the frame and the cap by brazing while the seal member is compressed and deformed.

As in the present structure, first, the airtight space is sealed by using a seal member which is brought into close contact with the frame and the cap by being compressed and deformed, and the frame and the cap are connected in the compressed state of the seal member. By joining the parts with the brazing material, it becomes possible to join the cap and the frame without the brazing material flowing into the airtight space. This makes it possible to easily manufacture a highly reliable hollow sealed package.

A method for manufacturing a hollow sealed package according to the second aspect of the present invention is directed to a high-frequency semiconductor element located in an airtight space, a high-frequency circuit wiring for electrically pulling out the high-frequency semiconductor element to the outside, and an airtight seal. A frame and a cap that surround the space are provided, and a castellation is formed on the outer surface of at least one of the frame and the cap, and the frame and the cap are joined by brazing at least in a portion including the castellation. A method for manufacturing a hollow sealed package, in which a brazing filler metal before melting is closely arranged below the castellation, and the brazing filler metal is melted by heat treatment, and the molten brazing filler metal comes up in contact with the castellation. By reaching the connection part between the frame and the cap, Joining of the cap is performed.

In the hollow sealed package having the castellation formed on the outer surface of the package as in the present structure, the frame and the cap are connected by utilizing the crawling of the brazing filler metal so that the hollow can be easily and efficiently formed. It becomes possible to manufacture a sealed package.

[0058]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is an exploded perspective view for explaining an assembly structure of a hollow sealed package according to Embodiment 1 of the present invention, and FIG. 2 is an exploded perspective view of FIG.
It is sectional drawing in the AA surface. In addition, FIG.
3B is a top view for explaining the shape of the joint surface of the frame, and FIG. 3B is a bottom view for explaining the shape of the joint surface of the cap. Further, FIG. 4 is a schematic cross-sectional view showing the structure of the connecting portion between the frame and the cap.

(Structure) First, the structure of the hollow sealed package in the present embodiment will be described with reference to FIGS. The hollow sealed package is composed of a frame 50 having a container shape with an upper surface opening, and a cap 60 attached so as to close the opening.
By hermetically joining the frame 50 and the cap 60, a cavity 70 that is an airtight space is formed inside the package.

The frame 50 is made of a ceramic material, and a container shape is formed by stacking green sheets and firing them. In each of these green sheets, a ground wiring 54, which is a conductor portion for blocking an electromagnetic wave generated from a high-frequency semiconductor element or the like, is arranged in advance so as to surround the opening to be the cavity 70. When the green sheets are stacked, the ground wirings 54 are brought into contact with each other to be electrically connected, and serve as walls that exhibit an electromagnetic shield effect. Further, frame pads 51, which are terminal electrodes on the frame side, which are electrically connected to the ground wiring 54, are arranged in a dotted line on the joint surface above the frame 50 so as to surround the openings at a predetermined interval.

Cavity 70 provided in frame 50
Circuit wiring (not shown) is provided on the bottom surface of, and the high-frequency semiconductor element 10 is mounted at a predetermined position thereof.
The high frequency semiconductor element 10 and the circuit wiring are connected by a bonding wire 20 such as a gold wire. By these, the high-frequency circuit wiring for electrically pulling out the high-frequency semiconductor element 10 to the outside of the package is configured.

On the other hand, external connection pads 55 are provided on the lower surface of the frame 50, and solder balls 56 are formed on the external connection pads 55. When the hollow sealed package is mounted on the parent circuit board 80, the solder balls 56 are attached to the board pads 81 of the parent circuit board 80, whereby the hollow sealed package is mounted on the parent circuit board 80. The above-mentioned ground wiring 54 is also connected to the ground wiring of the parent circuit board 80 via this external connection pad 55.

On the bottom surface of the frame 50, it is practically impossible to surround the entire high-frequency circuit wiring with a conductor portion serving as an electromagnetic shield because of the circuit wiring that electrically draws the high-frequency semiconductor element 10 out of the package. Is. For this reason, two conductor parts are provided on the bottom surface of the frame 50.
Electromagnetic shielding effect can be obtained by providing the circuit wiring so as to be sewn between the layers separately or by substituting the ground wiring of the parent circuit board 80 without providing the frame 50 with the conductor portion serving as the electromagnetic shield. Often the method of obtaining or using is used. In the present embodiment, the latter is adopted.

The cap 60 is made of a ceramic material like the frame 50, and a metallized region 62, which is a conductor portion exhibiting an electromagnetic shield effect, is formed on the lower surface of the cap 60. A cap pad 61, which is a cap-side terminal electrode and is continuous with the metallized region 62, is formed at a position facing the frame pad 51.

Next, with reference to FIG. 4, the connecting portion between the frame 50 and the cap 60 will be described in detail. Frame 50
An anisotropic conductive film (hereinafter referred to as ACF (ACF)) 30 is used for joining the cap and the cap 60. The ACF 30 is an adhesive film in which a conductive filler 32 is dispersed in a resin 31 which is an insulating binder, and the conductive filler 32 is pushed away in a portion where the binder resin 31 is pushed away by the proximity of electrically connected terminal electrodes. The interposition of 32 establishes conduction between the two. In addition, in the portion other than the conductive portion, the conductive filler 32 is used as the binder resin 3
By being dispersed in 1, the insulation is maintained.

Next, the shapes of the joint surfaces of the frame 50 and the cap 60 will be described with reference to FIG. First, referring to FIG. 3A, the joint surface of the frame 50 is
It is shaped like a square bracket so as to surround the opening forming the cavity 70. On the bonding surface of the frame 50, the frame pads 51 described above are arranged in a dot array at intervals shorter than (1/4) of the wavelength of the electromagnetic wave generated from the high frequency semiconductor element 10 or the like. The ceramic substrate is exposed on the bonding surfaces other than.

Here, the wavelength of the electromagnetic wave generated from the high-frequency semiconductor element or the like is the wavelength λd of the electromagnetic wave in the dielectric material at the site where the action of the electromagnetic wave is a problem. In the present embodiment, the high-frequency semiconductor element is used. Of the wavelengths of the electromagnetic waves generated from the like in air, ceramics, or resin, it refers to the wavelength in the dielectric having the shortest wavelength. That is, the pitch of the dot array on the frame pad is
They are arranged at (1/4) λd or less. In addition, there is an inert gas such as helium as another gas filled in the cavity, but in this case, it means the wavelength of the electromagnetic wave in the inert gas.

Next, as shown in FIG. 3B, a portion of the lower surface of the cap 60, which does not face the joint surface of the frame 50 and serves as the top surface of the cavity 70, is entirely metalized to serve as an electromagnetic shield. A region 62 is formed. The metallized region 62 is formed by plating the ceramic surface of the cap 60. The metallized region 62 constitutes the electromagnetic shield of the cap 60 portion.

As described above, a cap pad 61 is formed on the joint surface of the cap 60 facing the joint surface of the frame 50 so as to be continuous with the metallized region 62 provided on the lower surface of the cap 60. This cap pad 61
Are arranged in a dot array so as to correspond to the above-mentioned frame pad 51 on the joint surface. The frame pad 61 may be formed by plating at the same time when the metallized region 62 is formed.

(Operation / Effect) As described above, by using the ACF for joining the frame and the cap, it is possible to prevent the joining member from flowing into the cavity without providing a groove or a bank portion in the frame. It will be possible. Also, A
By using a film-shaped joining member called CF, the frame and the cap can be joined easily and quickly. Furthermore, even when a silicon control element such as an ASIC is mounted at the same time, brazing is not required, so that it is not necessary to expose it to high temperatures. As a result, it is possible to provide a hollow sealed package which can be manufactured at low cost and has a highly reliable electromagnetic shield effect.

Example 1 An example based on the first embodiment will be shown below.

In this embodiment, the cap and frame, which are the components of the package, are connected to LTCC (Low Temperatur).
e Co-fired Ceramics). The width and depth of the frame are both 10 mm and the height is 2.5 m.
m. The width and depth of the cap were set to 10 mm according to the frame, and the thickness of the cap was set to 0.5 mm.

For the conductor portion serving as the electromagnetic shield, silver paste is used for the inner layer portion of the frame and cap, and for the exposed portion, Ni / Au is used on the underlying silver paste.
Was plated. The underlying silver paste of the exposed portion is supplied by a printing method, and the finished thickness after firing is 10 μm. The nickel plating was performed by electrolytic plating so that the average plating thickness was 4 μm. The gold plating applied on this nickel plating was also made to have an average plating thickness of 0.3 μm by the same electrolytic plating method. The gold plating was carried out for the purpose of enabling the bonding of a fine metal wire such as a gold wire, reducing the electric resistance of the connection portion, and preventing the oxidation of the exposed wiring portion.

Next, the procedure for producing a hollow sealed package using these components will be described. First, a high frequency semiconductor element was die-bonded to the bottom surface of the cavity of the frame, and was bonded at a predetermined position using a gold wire. Next, the ACF cut slightly smaller than the cap was attached to the lower surface of the cap. The length of one side of the ACF is 9 mm,
The thickness was 0.05 mm. Since ACF before curing has an appropriate viscosity, it can be easily attached to the metallized portion. Subsequently, the ACF was cured at a load of 2 kg, a heating temperature of 180 ° C., and a curing time of 20 seconds. Finally, solder balls were formed on the external connection terminals on the lower surface of the frame to complete the hollow sealed package.

The results of a reliability test conducted using the hollow sealed package manufactured under the above conditions and procedures are shown below.

First, a gross leak test was conducted to confirm the airtightness of the package by ACF sealing. The gloss leak test is a test for confirming the sealing property by immersing the package in a fluorine-based inert liquid (Fluorinert (R)) and confirming the discharge of bubbles. When the quality of the airtightness was judged using 11 hollow sealed packages manufactured in this example, no abnormality was detected and it was confirmed that a high level of airtightness was ensured.

Next, a thermal cycle test was carried out as a long-term reliability test of the package by ACF sealing. The thermal cycle test is a test in which the package after mounting on the substrate is repeatedly exposed to the thermal cycle environment, and after the test, the presence or absence of damage to the sealed portion is confirmed by electrical conduction and cross-section polishing observation. Hollow sealing package 11 manufactured in this embodiment
After carrying out 1000 cycles of the cooling / heating cycle test of −40 ° C. to + 125 ° C. using each piece, it was first confirmed that there was no abnormality in electrical continuity. Next, cross-section polishing observation of the sealed portion on the four sides of each sample confirmed that no abnormality occurred in the sealed portion even after the thermal cycle test, and that high airtightness was secured. It was

As described above, by providing the hollow sealed package having the structure of the first embodiment, a highly reliable hollow sealed package having an electromagnetic shielding effect and maintaining high airtightness can be realized. Was confirmed.

(Embodiment 2) FIG. 5 is a schematic sectional view for explaining the structure of the connecting portion between the frame and the cap of the hollow sealing package according to Embodiment 2 of the present invention. The same parts as those in the first embodiment described above are denoted by the same reference numerals in the drawings, and the description thereof will be omitted. The hollow sealed package according to the present embodiment has substantially the same structure as that of the first embodiment described above, and is different only in that bumps are formed on the frame pads.

Since the cap and frame, which are the components of the package, are made of an insulating material such as ceramics or resin, they may be deformed such as warp, twist, or swell depending on the manufacturing conditions or manufacturing lot, unlike the metal material. May occur. If this is ignored, a gap may occur between the frame pad and the cap pad, and a state in which electrical continuity cannot be obtained between the pads (hereinafter referred to as an open state) may occur.

When the open state occurs, it becomes impossible to satisfy the connection pitch of (1/4) or less of the wavelength λd introduced from the electromagnetic wave generated from the high frequency semiconductor device described in the first embodiment. As a result, the electromagnetic shield cannot be formed at the joint between the frame and the cap, and the purpose of blocking the leakage of electromagnetic waves cannot be realized.

In order to avoid this, in the present embodiment, as shown in FIG. 5, the bump 5 that is deformed by the load at the time of sealing is used.
By forming 7 on the frame pad 51, it is possible to absorb voids caused by warping, twisting, waviness or the like of the frame 50 or the cap 60. As a result, good airtightness and electromagnetic shield of the cavity 70 are secured, and the yield is improved.

Here, the applicable bump material may be a soft metal material such as gold or solder. By sealing through the bumps made of soft metal material, the bumps in the parts where the distance between the cap and the frame is short are large and the bumps in the parts where the distance is long are small, so that good coverage is achieved over all areas. It becomes possible to maintain electrical continuity.

In this case, if the curing conditions are optimized, the ACF used in Embodiment 1 does not necessarily have to be used as the joining member. Even when a normal insulating adhesive or adhesive film is used, the bumps made of a soft metal material may be deformed by contacting the pads during heating and pressurization in the curing process, so that the bumps between the frame pad and the cap pad may be deformed. Since the insulating resin is eliminated, conduction can be obtained. However, when an insulating adhesive is used, there is a concern that the joining member will flow into the cavity, so it is preferable to use an adhesive film.

Although the bumps are formed on the frame pad in the present embodiment, the same effect can be obtained by forming them on the cap pad. Further, although the gold bumps in the present embodiment are configured in one step, the bumps are
Larger warpage, twisting, and swell can be dealt with by using multi-stage bumps that stack more than one stage.

Example 2 Hereinafter, an example based on the above-described Embodiment 2 will be described in detail. The shapes and sizes of the frame and the cap are the same as those in the above-described first embodiment.

In this embodiment, the material of the bump is gold, the diameter of the bump before joining is 80 μm, and the height is 40 μm.
The cap of this embodiment has undulations, and its value is one side 1.
The maximum is 30 μm for 0 mm.

Using these components, a hollow sealed package was manufactured under the same conditions and procedures as in Example 1.
However, the load was 3 kg in order to deform the gold bumps. After the sample was prepared, an electrical continuity test and cross-section polishing were carried out, and it was confirmed that good bonding was performed also in this example. Further, as a result of carrying out a reliability test similar to that in Example 1, no abnormality was detected also in this example.

(Third Embodiment) FIG. 6 is a schematic sectional view for explaining the structure of a hollow sealed package according to a third embodiment of the present invention. FIG. 7A is a top view for explaining the shape of the connection surface of the frame.
(B) is a bottom view for explaining the shape of the connection surface of the cap. The same parts as those in the first embodiment are designated by the same reference numerals in the drawings, and the description thereof will be omitted.

(Structure) First, the frame 50 and the cap 6
The shape of the connection surface of 0 will be described. With reference to FIG. 7A, the connection surface of the frame 50 is divided into an inner connection area formed adjacent to the opening to be the cavity 70 and an outer connection area located outside the inner connection area. In the area, the ceramic base is exposed, and in the outer connection area, the metallized area 5 is formed on the surface of the ceramic substrate by plating.
2 is formed. The metallized region 52 is electrically connected to the ground wiring 54 inside the frame 50 and also serves as a frame-side terminal electrode.

Next, as shown in FIG. 7B, in a portion of the cap 60 not facing the connection surface of the frame 50, a metallized region 62 formed by plating is placed on the top of the cavity 70 as in the first embodiment. It is formed so as to cover the entire surface. An outer metallized region 63 is also formed by plating on the connection surface of the cap 60 facing the outer connection region of the frame 60. These caps 6
A metallized region and a non-metallized region where a ceramic underlayer is exposed are alternately provided on the connection surface of the cap located between the metallized regions 62 and 63 on the lower surface and facing the inner connection region of the frame. There is.

Different from the first embodiment, two kinds of joining members, that is, the non-conductive resin adhesive film 40 and the brazing material 90, are used for joining the frame 50 and the cap 60. First, in the inner connection region, the non-conductive resin adhesive film 40 is used. The non-conductive resin adhesive film 40 joins the inner connection regions of the frame 50 and the cap 60. In the outer connecting region, the brazing material 90 is joined after the inner connecting region is joined. This brazing is performed by a soldering iron, a heating tool, reflow, laser welding, or the like. In the present embodiment,
In the inner connection region of the cap 60, the metallized region and the non-metallized region are alternately arranged because the metallized region 6 serving as the top surface of the cavity 70 of the cap 60 is disposed.
2 and the outer metallized region 63 serving as the outer connection region are electrically connected, and the bonding force by the non-conductive resin adhesive film 40 is ensured.

(Operation / Effect) As in the above structure, the non-conductive resin adhesive film is used for adhesion in the inner connection region, so that the brazing material is prevented from flowing into the cavity. Moreover, since the non-metallized region is formed in the inner connection region, a high bonding force is secured. Further, the outside is brazed to prevent moisture from entering the cavity, which may occur when the resin film alone is used for joining. This makes it possible to provide a hollow sealed package having an electromagnetic shield effect with high reliability.

Example 3 An example based on the above-described Embodiment 3 will be described below. In this example,
A hollow sealed package was manufactured using a frame and a cap having the same size as in Example 1 described above.

The non-conductive resin adhesive film used for joining the frame and the cap has a side of 8.5.
mm, and the thickness was 0.05 mm. Further, as a solder used for brazing, a general lead-tin eutectic solder (37Pb-63Sn, melting point 183 ° C.) was used.

The hollow sealed package manufactured under the above conditions was subjected to the same reliability test as in Example 1, and as a result, no abnormality was confirmed. Further, in order to confirm whether corrosion of the high-frequency semiconductor element or the like due to the mixing of moisture from the outside is unlikely to occur, a pressure cooker test was performed at 121 ° C., 100% RH, 2 atmospheric pressure for 24 hours, and the results of Example 1 and Similar tests were performed, but no abnormality was detected in this reliability test, and it was confirmed that a good bonding state was secured.

(Fourth Embodiment) FIG. 8 is a schematic sectional view for explaining the structure of a hollow sealed package according to a fourth embodiment of the present invention. Further, FIG. 9A is a top view for explaining the shape of the connection surface of the frame.
9B is a bottom view for explaining the shape of the connection surface of the cap, and FIG. 9C is a top view of the cap. The same parts as those in the third embodiment are designated by the same reference numerals in the figure, and the description thereof will be omitted.

(Structure) As shown in FIG. 8, in the present embodiment, the side wall of the concave portion of the frame 50 serving as the cavity 70 is provided with a step shape, and the cap 60 is fitted in this step portion. The non-conductive resin adhesive film 40 is used to bond the fitted cap 60 to the stepped portion of the frame 50. Further, the brazing material 90 is poured from the upper part of the package into the vertical gap formed between the cap 60 and the frame 50.

As shown in FIG. 9A, an upper surface metallized region 58 is provided on the uppermost surface of the frame 50 adjacent to the opening into which the cap 60 is fitted. The outside of the upper surface metallized region 58 is a non-metallized region where the ceramic is exposed. The step portion is provided with a step surface metallized region 59, and the inside of the step surface metallized region 59 is an opening forming a cavity 70.

With reference to FIGS. 9B and 9C, a metallized region 62 is formed on the entire lower surface of the cap 60 by plating, and a peripheral metallized region is formed only on the peripheral portion on the upper surface of the cap 60. 64 is formed.

(Operation / Effect) In the present embodiment, it is not necessary to form the discrete metallized regions by providing the step structure as compared with the third embodiment. Therefore, the manufacturing can be performed more easily and the manufacturing cost can be reduced. Further, by providing a step structure and fitting a cap in the step, the assembling property is improved.

(Example 4) A hollow sealed package according to the fourth embodiment was manufactured and a reliability test was conducted in the same manner as in Example 1. As a result, it was confirmed that no abnormality occurred. However, detailed description thereof will be omitted here because it is repeated.

(Fifth Embodiment) FIG. 10 is a schematic sectional view for explaining the structure of a hollow sealed package according to a fifth embodiment of the present invention. 11A is a top view for explaining the shape of the connection surface of the frame, and FIG. 11B is a bottom view for explaining the shape of the connection surface of the cap. The hollow sealed package according to the present embodiment is different from the above-described third embodiment in that the inside connection region is connected by an elastically deformable seal member. In the following, only parts different from those of the above-described third embodiment will be described, and similar parts are denoted by the same reference numerals in the drawings, and description thereof will be omitted.

(Structure) First, the frame 50 and the cap 6
The shape of the connection surface of 0 will be described. With reference to FIG. 11A, the connection surface of the frame 50 is divided into an inner connection region formed adjacent to the opening to be the cavity 70 and an outer connection region located outside the inner connection region. In the area, the ceramic base is exposed, and in the outer connection area, a metallized area 52 is formed by plating on the surface of the ceramic substrate. Further, on the connection surface of the frame 50, frame pads 51 arranged in a dot array are formed. The metallized region 52 includes the frame pad 51, and a region where the underlying ceramics is exposed is secured between the adjacent frame pads,
The layout is as shown in FIG. The frame pad 51 is a ground wiring 54 inside the frame 50.
It is connected to the.

Next, as shown in FIG. 11B, in the portion of the lower surface of the cap 60 that does not face the connection surface of the frame 50, the metallized region 62 by plating is formed as in the third embodiment. It is formed so as to cover the entire top surface of the cavity 70. An outer metallized region 63 is also formed by plating on the connection surface of the cap 60 facing the outer connection region of the frame 50. The connection surface of the cap 60, which is located between the metallized regions 62 and 63 on the lower surface of the cap 60 and faces the inner connection region of the frame 50, has metallized regions and non-metallized regions in which the ceramic base is exposed alternately. Is provided. Among the metallized regions and the non-metallized regions which are alternately arranged, the metallized region constitutes a cap pad 61 facing the frame pad of the frame 50.

Unlike the above-described third embodiment, the frame 50 and the cap 60 are connected to each other by using two kinds of connecting members, a seal member 100 and a brazing material 90. First, in the inner connection region, the seal member 100
Is used. As the seal member 100, an elastic material is used that is compressed and deformed when a load is applied and is brought into close contact with the connection surfaces of the frame 50 and the cap 60. The seal member 100 connects the frame 50 and the inner connection region of the cap 60 to seal the airtight space. In addition, the seal member 100 includes the frame 50 and the cap 60.
Even if there are warps, twists, and undulations, they are absorbed by elastically deforming them. At this time, when the compression-deformed seal member 100 reaches the metallized region 52 of the frame 50 by sticking out of the seal member 100, the adhesive force at a portion overlapping the metallized region 52 may be reduced. Therefore, in the present embodiment, the non-metallized region is formed between the frame pads 51, which prevents the decrease in adhesive strength.

In the outer connecting region, after the inner connecting region is sealed, brazing is performed by pouring a brazing material 90 from the outside of the package between the cap 60 and the frame 50. This brazing is performed by a soldering iron, a heating tool, reflow, laser welding, or the like.

(Operation / Effect) By using the hollow sealed package having the above structure, it is possible to provide a hollow sealed package having an electromagnetic shield effect with higher reliability. In other words, the elastically compressible seal member is used to prevent the joining member from flowing into the cavity, and the outside of the cavity is brazed to allow moisture to enter the cavity, which would occur if the sealing member were used alone. While securing the high joint strength.

Further, it is sufficient that the sealing member has a sealing effect until brazing of the outer connecting region is completed, and a rubber-like elastic material or the like can be used.
In this case, it is not always necessary to have adhesiveness. However, in the case of using an elastic material, it is necessary to surely maintain the sealing property by performing pressure holding from the outside until the joining with the brazing material is completed.

When a non-adhesive seal member is used, it is not necessary to alternately dispose metallized regions and non-metallized regions for improving adhesiveness in the inner connection region of the cap 60. That is, as shown in FIGS. 12A and 12B, both the metallized region 52 of the frame 50 and the metallized region 62 of the cap 60 may be solidly coated on the entire surface. In this case, the design of the metallized region is simplified, so that the design cost can be reduced.

As the applicable seal member, for example, a heat-resistant rubber material such as silicone rubber that withstands the brazing temperature of the brazing material, or a heat-resistant polymer material having elasticity such as Teflon (R) can be considered. . Further, the frame and the cap can be temporarily fixed by providing the seal member with adhesiveness. This significantly improves workability. As the sticky seal member,
A thermosetting resin such as conductive or insulating RTV (room temperature curing rubber) or elastic epoxy resin, or a thermoplastic resin can also be used. The seal member used here may be conductive or non-conductive, but is preferably conductive if the influence of static electricity or the like is eliminated.

Example 5 Hereinafter, an example based on the above described fifth embodiment will be described. In this example,
A hollow sealed package was manufactured using a frame and a cap having the same size as in Example 3 described above.

A silicone rubber sheet was used as the sealing member used for sealing the frame and the cap, and one side of the outer circumference was 8.5 mm, one side of the inner circumference was 7.5 mm, and the thickness thereof was 0.2 mm. . Further, as the solder used for brazing, general lead-tin eutectic solder (37Pb-63S
n, melting point 183 ° C.) was used.

In this embodiment, the seal member is interposed between the connecting surfaces of the frame and the cap, the seal member is pressed by an external jig to be compressed and deformed, and then the gap formed between the frame and the cap is closed. The frame and the cap were joined by pouring a brazing material from the outside of the package using a soldering iron.

After the sample was prepared, an electrical continuity test and cross-section polishing were carried out. As a result, it was confirmed that good bonding was performed also in this example. Further, as a result of carrying out a reliability test similar to that in Example 1, no abnormality was detected also in this example.

(Embodiment 6) FIG. 13 is a schematic sectional view for explaining the structure of a hollow sealed package according to Embodiment 6 of the present invention. 14A is a top view for explaining the shape of the connecting surface of the frame, and FIG. 14B is a bottom view for explaining the shape of the connecting surface of the cap. The same parts as those in the fifth embodiment are designated by the same reference numerals in the drawings, and the description thereof will be omitted.

(Structure) As shown in FIG. 13, in this embodiment, in order to ensure the isolation (electromagnetic separation) of the two electronic circuits mounted in the cavity 70, the cavity 70 is formed into a frame. It is divided into two chambers by a rib 53, which is a partition wall provided in 50. The rib 53 is formed at the same height as the side wall of the frame 50, and the ground wiring 54 is disposed inside the rib 53, similarly to the side wall of the frame 50.

As shown in FIG. 14A, the frame 50
A portion of the upper surface corresponding to the outer peripheral portion has a non-metallized region which is an inner connecting region and a metallized region 52 which is an outer connecting region, as in the fifth embodiment. On the upper surface of the rib 53, frame pads 51 are arranged in a dot array in a non-metallized region where the base of the ceramic substrate is exposed. As shown in FIG. 14B, metallized regions and non-metallized regions are alternately arranged in the region of the lower surface of the cap 60 facing the rib 53. Of these, the metallized region is formed so as to face the frame pads 51 arranged in a dot array on the upper surface of the rib 53.

The frame pad 51 provided on the upper surface of the rib 53 needs to be electrically connected to the metallized region forming the cap pad 61 of the cap 60. Therefore, the epoxy-based or silicone-based conductive paste 110 is used to connect the upper surface of the rib 53 and the lower surface of the cap 60.

(Operation / Effect) As described above, by connecting the rib and the cap using the conductive paste and connecting the frame and the cap by using the seal member and the brazing material together, It is possible to provide a hollow sealed package that achieves airtightness between cavities and an electromagnetic shield effect while ensuring airtightness and an electromagnetic shield effect.

Example 6 An example based on the fortieth embodiment will be described below. In this example, a hollow sealed package was manufactured using a frame and a cap having the same outer dimensions as those of Example 1 described above. However, the frame of this embodiment has a rib that includes the ground wiring, and the width of the rib is 1 mm, which is the same as the outer wall.

A non-conductive frame-shaped silicone rubber sheet is used to seal the frame and the cap, one side of the outer circumference is 8.5 mm, one side of the inner circumference is 7.5 mm, and the thickness is 0.2 mm. And A silicone adhesive for sealing was used as the conductive paste for bonding the rib and the cap. The silicone adhesive was supplied onto the rib by a syringe, and the protrusion from the rib was set to 0.3 to 0.5 mm. After aligning and assembling these, 5 g /
It was heated and cured while applying a load of mm ² . afterwards,
I brazed. As the solder used for brazing, general lead-tin eutectic solder (37Pb-63S) is used.
n, melting point 183 ° C.) was used.

A reliability test similar to that of Example 1 was conducted using the thus obtained hollow sealed package, and it was confirmed that no abnormality occurred.

(Embodiment 7) FIG. 15 is an exploded perspective view for explaining an assembly structure of a hollow sealed package according to Embodiment 7 of the present invention, and FIG. It is sectional drawing in the BB plane. In addition, FIG.
17A is a top view for explaining the shape of the connection surface of the frame 50, and FIG. 17B is a bottom view for explaining the shape of the connection surface of the cap 60. Furthermore, FIG.
23 to 23 are schematic views showing the manufacturing process of the hollow sealed package in the present embodiment. The same parts as those in Embodiment 5 described above are designated by the same reference numerals in the drawings,
The description is omitted.

(Structure) First, the structure of the hollow sealed package in the present embodiment will be described with reference to FIGS. In the hollow sealed package according to the present embodiment, the castellation 120 is formed on the outer surface of the frame 50, and the cap 60 is formed.
A castellation 130 is also formed on the outer surface of the. Castellation is a technique widely known as a form of ceramic leadless package.Through holes are formed in a green sheet before firing, and the wall surface of the through holes is covered with a conductive material, and then the through holes are crossed. It is the wall wiring manufactured by cutting the green sheet as described above. In this embodiment, the castellations 120 and 13 are used.
The 0 wall conductor is formed by metallization having the same structure as other wiring patterns.

In this embodiment, as shown in FIGS. 17 (a) and 17 (b), a frame 50 and a cap 60 having a connection surface shape similar to that of the above-mentioned fifth embodiment are used. It However, on the outer side surfaces of the frame 50 and the cap 60, a plurality of depressions are formed by the castellations 120 and 130,
The wall surface conductor on the surface of the depression is electrically connected to the metallized regions 52 and 63 which are the outer connection regions.

Similar to the fifth embodiment described above, the frame 50 is also used in the hollow sealed package of the present embodiment.
The seal member 100 and the brazing material 90 are used to connect the cap 60 and the cap 60. Of these, the brazing material 90, which is the outer connecting member, joins the frame 50 and the cap 60 to each other not only in the outer connecting region of the frame 50 and the cap 60 but also in the portion where the castellations 120 and 130 are formed.

(Manufacturing Method) Next, with reference to FIGS. 18 to 23, a process of connecting the cap and the frame, which is a characteristic part of the method of manufacturing the hollow sealed package according to the present embodiment, will be described. First, castellation 12
Frame 50 with 0 and castellation 130
The cap 60 having the is prepared (see FIG. 18). A seal member 100 is attached in advance to a predetermined position on the lower surface, which is the connection surface of the cap 60. By mounting the cap 60 on the frame 50 and applying a load to the cap 60, the seal member 1 is provided in the inner connection region of the connection surface.
00 is compressed and deformed, the frame 50 and the cap 60 are brought into close contact with each other, and the cavity 70 is hermetically sealed.

Separately from the above, the solder supply jig 30
0 is prepared (see FIG. 19). Solder supply jig 300
Is configured such that the frame 50 of the hollow sealed package can be set on the main surface thereof, and a recess is formed at a predetermined position on the main surface. This solder supply jig 3
The print mask 310 is placed on the main surface of the printed circuit board 00. Print mask 3
Reference numeral 10 has a through hole at a position corresponding to the recess of the solder supply jig 300. The solder paste 90a is printed on the print mask 310 using the squeegee 320 on the solder supply jig 300. Print mask 3 when printing is completed
10 is removed from the solder supply jig 300. From the above,
A predetermined amount of solder paste 90a is printed in and on the recess of the solder supply jig 300.

Next, the sub-assembly of the hollow sealing package including the frame 50 and the cap 60 connected by the seal member 100 is set on the solder supply jig 300 on which the solder paste 90a is printed (FIG. 20).
reference). At this time, the solder paste 90 a printed on the solder supply jig 300 is close to the castellation 120 provided on the frame 50.

Further, heat treatment is carried out with the sub-assembly set. Specifically, with the sub-assembly set, the temperature of the solder supply jig 350 is raised above the melting point of the brazing filler metal component of the solder paste 90a using a drying furnace, a reflow furnace, a hot plate, or the like. As a result, the brazing filler metal component of the solder paste 90a is melted, and the brazing filler metal that has propagated through the castellation 200 creeps up on the outer surface of the frame 50 (see FIG. 21).

The molten brazing material selectively wets and spreads on the metallized portion, filling the space between the frame 50 and the cap 60 (see FIG. 22). After that, when the heating is stopped, the brazing material cools and solidifies, thereby joining the frame 50 and the cap 60 (see FIG. 22). Further, by removing the sub-assembly from the solder supply jig 300, the step of connecting the frame 50 and the cap 60 is completed (see FIG. 23).

(Operation / Effect) As in the above-described structure, a castellation is formed on the outer surface of the package, and the frame and the cap are brazed at the portion where the castellation is formed. It is possible to easily manufacture the wearable package. Also,
By brazing using the solder supply jig as described above, it becomes possible to easily and efficiently manufacture a highly reliable hollow sealed package.

Example 7 Hereinafter, an example based on the above-described seventh embodiment will be described. In this example,
A hollow sealed package was manufactured using a frame and a cap having the same outer shape as that of the above-mentioned Example 5. However, it differs from the fifth embodiment in that metallized castellations are provided around the frame and the cap.

A hollow sealed package was manufactured by the method described above. When a reliability test similar to that of Example 1 was performed using this sample, it was confirmed that no abnormality occurred.

(Embodiment 8) FIG. 24 is a schematic cross-sectional view for explaining the structure of a hollow sealed package according to Embodiment 8 of the present invention. The same parts as those in Embodiment 7 described above are designated by the same reference numerals in the drawings, and the description thereof will be omitted.

(Structure) As shown in FIG. 24, the hollow sealing package according to the present embodiment is the same as that of the seventh embodiment.
The cap 60 has no castellation, but the castellation 120 is formed only on the frame 50, although the structure is similar to the above. A metallized region, which is a terminal electrode, is formed on the lower surface of the cap 60 corresponding to the end of the castellation 120 of the frame 50. Therefore, when the frame 50 and the cap 60 are connected in the same connecting step as in the above-described seventh embodiment,
A fillet 91 made of a brazing material 90 is formed between the frame 50 and the cap 60.

(Operation / Effect) By using the hollow sealed package having the above structure, it is possible to provide a hollow sealed package having an electromagnetic shield effect with higher reliability. This is because, as is well known, the formation of the fillet makes it possible to relax the stress generated by the thermal history. In Embodiment 7 described above,
Since the castellation of the frame and the castellation of the cap are located on the same plane, no fillet is formed, whereas in the present embodiment, the castellation of the frame and the metallized region of the cap are arranged so as to intersect with each other. Therefore, the fillet is formed by the wetting and spreading of the brazing filler metal in this portion.

Example 8 Hereinafter, an example based on the above-mentioned Embodiment 8 will be described. In this example,
The same frame was used as in Example 7 above. The cap is slightly larger than the frame and has a width and depth of 1
The thing of 1 mm was used.

A hollow sealed package was manufactured using the above members, and a reliability test was conducted in the same manner as in Example 1. As a result, it was confirmed that no abnormality occurred.

In the above embodiment, the method of using the solder balls as the means for mounting the hollow sealed package on the parent circuit board has been described. However, other methods such as mounting method using metal leads or metal pins are used. May be

Further, in the above embodiment, the high frequency semiconductor element to be mounted inside is mounted by wire bonding, but it is not particularly limited to this, and mounting is performed using a mounting technique such as flip chip mounting. May be.

Further, although in the above-mentioned embodiment, the packages made of ceramics are all used, naturally the packages made of resin may be used. As for the cap, it is also possible to use a metal cap.

In the third and fourth embodiments, the non-conductive resin adhesive film is used as the inner connecting member, and in the fifth to eighth embodiments, the seal member is used. ACF may be used.

Further, in the above-mentioned embodiment, the metallized region is formed by plating as an example, but the forming method is not particularly limited as long as the conductor portion is formed on the cap or the frame. Similarly, the terminal electrode may be of any type as long as it is made of a conductive material.

As described above, the above-described embodiments disclosed this time are examples in all respects, and are not restrictive. The technical scope of the present invention is defined by the claims, and includes the meaning equivalent to the description of the claims and all modifications within the scope.

[0148]

According to the present invention, it is possible to easily and inexpensively manufacture a hollow sealed package having a highly reliable electromagnetic shield effect in which the joining member is prevented from flowing into the cavity. Further, it is possible to provide a hollow sealed package having an electromagnetic shield effect that ensures high reliability even when a control element made of silicon is simultaneously mounted.

[Brief description of drawings]

FIG. 1 is an exploded perspective view for explaining a structure of a hollow sealed package according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the first embodiment of the present invention.

FIG. 3 is a top view of a frame and a bottom view of a cap of the hollow sealed package according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a joint portion between the frame and the cap of the hollow sealed package according to the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of a joint portion between a frame and a cap of the hollow sealed package according to the second embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the third embodiment of the present invention.

FIG. 7 is a top view of a frame and a bottom view of a cap of a hollow sealed package according to a third embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the fourth embodiment of the present invention.

9A and 9B are a top view of a frame, a bottom view of a cap, and a top view of a cap of a hollow sealed package according to a fourth embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the fifth embodiment of the present invention.

FIG. 11 is a top view of a frame and a bottom view of a cap of a hollow sealed package according to a fifth embodiment of the present invention.

FIG. 12 is a top view of a frame and a bottom view of a cap in a modification of the hollow sealed package according to the fifth embodiment of the present invention.

FIG. 13 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the sixth embodiment of the present invention.

FIG. 14 is a top view of a frame and a bottom view of a cap of a hollow sealed package according to a sixth embodiment of the present invention.

FIG. 15 is an exploded perspective view for explaining the structure of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 16 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 17 is a top view of a frame and a bottom view of a cap of a hollow sealed package according to a seventh embodiment of the present invention.

FIG. 18 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 19 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 20 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 21 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 22 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 23 is a diagram showing a manufacturing process of the hollow sealed package according to the seventh embodiment of the present invention.

FIG. 24 is a schematic cross-sectional view for explaining the structure of the hollow sealed package according to the eighth embodiment of the present invention.

FIG. 25 is a schematic cross-sectional view showing an example of a conventional hollow sealed package.

[Explanation of symbols]

10 high frequency semiconductor element, 20 bonding wire,
30 anisotropic conductive film (ACF), 31 binder resin, 32 conductive filler, 40 non-conductive resin adhesive film, 50 frame, 51 frame pad, 5
2 metallized area (of frame), 53 ribs, 54
Ground wiring, 55 external connection pad, 56 solder ball, 57 bump, 58 upper surface metallized region, 59
Step surface metallized region, 60 cap, 61 cap pad, 62 (cap's) metallized region, 6
3 outer peripheral metallized areas, 64 peripheral metallized areas,
70 cavity, 80 parent circuit board, 81 board pad, 90 brazing material, 90a solder paste, 100 sealing member, 110 conductive paste, 120 (frame) castellation, 130 (cap) castellation, 300 solder supply jig, 310 print mask, 320 squeegee.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Naoki Takagi             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Norio Takeuchi             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Hiroshi Ikematsu             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Tsuneo Hamaguchi             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Yasuo Kawashima             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd.

Claims (18)

[Claims] 1. A hollow sealed package comprising a high-frequency semiconductor element located in an airtight space, high-frequency circuit wiring for electrically drawing the high-frequency semiconductor element to the outside, and a frame and a cap surrounding the airtight space. The hollow sealed package, wherein the frame and the cap are joined by an anisotropic conductive film. 2. The hollow sealing according to claim 1, wherein at least one of the frame and the cap has a conductor portion for blocking an electromagnetic wave generated from the high-frequency semiconductor element and the high-frequency circuit wiring. package. 3. The conductor portion is a wall-shaped conductor arranged in the frame and the cap so as to surround the airtight space, and is located in all directions when viewed from the high-frequency semiconductor element. Hollow sealed package described in. 4. At least one of the frame and the cap includes a partition wall that divides the airtight space into a plurality of spaces, and the frame or the cap and the partition wall are joined by a conductive paste. The hollow sealed package according to any one of claims 1 to 3. 5. A frame-side terminal electrode is formed on a joint surface of the frame with the cap, and a joint surface of the cap facing the frame-side terminal electrode is formed with:
The hollow sealed package according to claim 1, wherein a cap-side terminal electrode is formed at a position corresponding to the frame-side terminal electrode. 6. The hollow sealed package according to claim 5, wherein a bump made of a metal material is provided on at least one of the frame-side terminal electrode and the cap-side terminal electrode. 7. The frame-side terminal electrodes and the cap-side terminal electrodes are provided in a dot array on the surfaces to be joined, and the intervals between the frame-side terminal electrodes adjacent to each other are all: Of the wavelength of the electromagnetic wave generated from the high-frequency semiconductor element and the high-frequency circuit wiring (1 /
4) The hollow sealed package according to claim 5, which is: 8. A hollow sealed package comprising a high-frequency semiconductor element located in an airtight space, high-frequency circuit wiring for electrically drawing the high-frequency semiconductor element to the outside, and a frame and a cap surrounding the airtight space. In the connection member, which connects the frame and the cap,
A hollow sealed package, comprising an inner connecting member located inside and an outer connecting member located outside, wherein the inner connecting member is a film that seals the airtight space, and the outer connecting member is a brazing material. 9. The hollow sealed package according to claim 8, wherein the film is a resin adhesive film. 10. The hollow sealed package according to claim 8, wherein the film is a sealing member that comes into close contact with the frame and the cap by being compressed and deformed. 11. The hollow sealed package according to claim 8, wherein the film is an anisotropic conductive film. 12. The frame according to claim 8, wherein at least one of the frame and the cap has a conductor portion for blocking an electromagnetic wave generated from the high frequency semiconductor element and the high frequency circuit wiring. Hollow sealed package as described. 13. The conductor part is a wall-shaped conductor arranged in the frame and the cap so as to surround the airtight space, and is located in all directions when viewed from the high-frequency semiconductor element. 13. The hollow sealed package according to any one of 1 to 12. 14. At least one of the frame and the cap has a partition wall that divides the airtight space into a plurality of spaces, and the frame or the cap and the partition wall are joined by a conductive paste. The hollow sealed package according to any one of claims 8 to 13. 15. A castellation is formed on at least one of the frame and the cap on a side surface of the package including the frame and the cap, and the frame and the cap are formed at a portion where the castellation is formed. The hollow sealed package according to any one of claims 8 to 14, which is brazed to the cap. 16. On a side surface of the package including the frame and the cap, a castellation is formed on one of the frame and the cap, and a terminal electrode facing the end of the castellation is formed on the other side. 16. The hollow sealed package according to claim 15, which is formed and has a fillet of a brazing material formed between the castellation and the terminal electrode. 17. A hollow sealed package including a high-frequency semiconductor element located in an airtight space, high-frequency circuit wiring for electrically drawing the high-frequency semiconductor element to the outside, and a frame and a cap surrounding the airtight space. A step of inserting a seal member into a portion adjacent to the airtight space, of the connection portion between the frame and the cap, and compressing and deforming the seal member to form the seal member. A method of manufacturing a hollow sealed package, comprising: a step of bringing the frame and the cap into close contact with each other; and a step of brazing the frame and the cap to each other while the seal member is compressed and deformed. 18. A high-frequency semiconductor element located in an airtight space, a high-frequency circuit wiring for electrically pulling out the high-frequency semiconductor element to the outside, and a frame and a cap surrounding the airtight space. A method of manufacturing a hollow sealed package, wherein castellation is formed on the outer surface of at least one of the caps, and the frame and the cap are joined by brazing at least at a portion including the castellation. Then, the frame and the cap are joined to each other by disposing the brazing filler metal before melting close to the castellation and subjecting the brazing filler metal to a heat treatment to melt the brazing filler metal to the castellation. Connecting part between the frame and the cap by coming up in contact It performed the method of manufacturing a hollow sealing packages by reaching the.