JPH1056285A - 電磁障害と無線周波数妨害から電子部品を遮蔽するためのフタアセンブリー - Google Patents
電磁障害と無線周波数妨害から電子部品を遮蔽するためのフタアセンブリーInfo
- Publication number
- JPH1056285A JPH1056285A JP11823397A JP11823397A JPH1056285A JP H1056285 A JPH1056285 A JP H1056285A JP 11823397 A JP11823397 A JP 11823397A JP 11823397 A JP11823397 A JP 11823397A JP H1056285 A JPH1056285 A JP H1056285A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- conductive
- frame
- assembly
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 230000001070 adhesive effect Effects 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 229920006223 adhesive resin Polymers 0.000 claims description 7
- 239000004840 adhesive resin Substances 0.000 claims description 6
- 230000007613 environmental effect Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
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- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000004064 recycling Methods 0.000 abstract description 3
- 239000007767 bonding agent Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 description 10
- -1 Polytetrafluoroethylene Polymers 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 241000272168 Laridae Species 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- VOKGLJIUCOOGGW-UHFFFAOYSA-N acetylene;buta-1,3-diene;styrene Chemical compound C#C.C=CC=C.C=CC1=CC=CC=C1 VOKGLJIUCOOGGW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007744 chromate conversion coating Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- KAATUXNTWXVJKI-UHFFFAOYSA-N cypermethrin Chemical compound CC1(C)C(C=C(Cl)Cl)C1C(=O)OC(C#N)C1=CC=CC(OC=2C=CC=CC=2)=C1 KAATUXNTWXVJKI-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229920000295 expanded polytetrafluoroethylene Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/643,292 US5761053A (en) | 1996-05-08 | 1996-05-08 | Faraday cage |
| US08/735838 | 1996-10-23 | ||
| US08/643292 | 1996-10-23 | ||
| US08/735,838 US5763824A (en) | 1996-05-08 | 1996-10-23 | Lid assembly for shielding electronic components from EMI/RFI interferences |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1056285A true JPH1056285A (ja) | 1998-02-24 |
| JPH1056285A5 JPH1056285A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2005-04-07 |
Family
ID=27094227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11823397A Pending JPH1056285A (ja) | 1996-05-08 | 1997-05-08 | 電磁障害と無線周波数妨害から電子部品を遮蔽するためのフタアセンブリー |
Country Status (3)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185888A (ja) * | 1999-12-27 | 2001-07-06 | Mitsubishi Electric Corp | シールドケース |
| US8400786B2 (en) | 2010-06-28 | 2013-03-19 | Fuji Xerox Co., Ltd. | Apparatus having a shield conductor placed outside of the circuit board |
| JP2017521876A (ja) * | 2015-05-21 | 2017-08-03 | シャオミ・インコーポレイテッド | 回路保護構造、及び電子装置 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486238U (en) * | 1996-08-18 | 2002-05-01 | Helmut Kahl | Shielding cap |
| US6090728A (en) * | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
| US6157546A (en) | 1999-03-26 | 2000-12-05 | Ericsson Inc. | Shielding apparatus for electronic devices |
| DE19932418B4 (de) * | 1999-05-20 | 2013-12-19 | Hans Schmied Gmbh | Rahmen für eine HF-Abdeckung, sowie Verfahren zu seiner Herstellung |
| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| US6740959B2 (en) * | 2001-08-01 | 2004-05-25 | International Business Machines Corporation | EMI shielding for semiconductor chip carriers |
| SG118244A1 (en) * | 2004-04-23 | 2006-01-27 | Mi Holdings Pte Ltd | Radio-frequency and electro-magnetic isolation forcover and isolated cover |
| JP2011018873A (ja) | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | 電磁シールド方法および電磁シールド用フィルム |
| CN103943610B (zh) * | 2014-04-16 | 2016-12-07 | 华为技术有限公司 | 一种电子元件封装结构及电子设备 |
| WO2016000184A1 (zh) | 2014-06-30 | 2016-01-07 | 华为技术有限公司 | 一种交换机模式切换方法、设备及系统 |
| CN109152230A (zh) * | 2018-08-28 | 2019-01-04 | 上海幂方电子科技有限公司 | 柔性电路及其制造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4575578A (en) * | 1983-01-05 | 1986-03-11 | Keene Corporation | Radiation shielding and thermally conductive gasket with internal bonding agent |
| WO1992016095A1 (en) * | 1991-03-04 | 1992-09-17 | Motorola, Inc. | Shielding apparatus for non-conductive electronic circuit package |
| DE9214394U1 (de) * | 1992-10-23 | 1992-12-17 | Siemens AG, 8000 München | Befestigung einer Abschirmung mit einer Leiterplatte |
| WO1996006520A1 (en) * | 1994-08-19 | 1996-02-29 | W. L. Gore & Associates, Inc. | A see-through radiation shielded assembly |
-
1997
- 1997-04-30 DE DE1997600126 patent/DE69700126T2/de not_active Expired - Lifetime
- 1997-04-30 EP EP19970302947 patent/EP0806891B1/en not_active Expired - Lifetime
- 1997-05-08 JP JP11823397A patent/JPH1056285A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185888A (ja) * | 1999-12-27 | 2001-07-06 | Mitsubishi Electric Corp | シールドケース |
| US8400786B2 (en) | 2010-06-28 | 2013-03-19 | Fuji Xerox Co., Ltd. | Apparatus having a shield conductor placed outside of the circuit board |
| JP2017521876A (ja) * | 2015-05-21 | 2017-08-03 | シャオミ・インコーポレイテッド | 回路保護構造、及び電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69700126T2 (de) | 1999-08-19 |
| DE69700126D1 (de) | 1999-04-15 |
| EP0806891A1 (en) | 1997-11-12 |
| EP0806891B1 (en) | 1999-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040507 |
|
| A621 | Written request for application examination |
Effective date: 20040507 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061003 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20061228 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070109 |
|
| A02 | Decision of refusal |
Effective date: 20070529 Free format text: JAPANESE INTERMEDIATE CODE: A02 |