JPH10510356A - 力検出インク、その製造方法及び改良力センサー - Google Patents
力検出インク、その製造方法及び改良力センサーInfo
- Publication number
- JPH10510356A JPH10510356A JP8517592A JP51759296A JPH10510356A JP H10510356 A JPH10510356 A JP H10510356A JP 8517592 A JP8517592 A JP 8517592A JP 51759296 A JP51759296 A JP 51759296A JP H10510356 A JPH10510356 A JP H10510356A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- conductive
- ink
- volume
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
- H01C10/10—Adjustable resistors adjustable by mechanical pressure or force
- H01C10/106—Adjustable resistors adjustable by mechanical pressure or force on resistive material dispersed in an elastic material
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 一対の導体間に薄層として付着させるための炭素を含まない力検出イン クであって、各導体は、基体表面に配置され、前記薄層は、そこに加えられる力 の関数として変化する抵抗を有し、前記薄層は、150〜350°F の温度で力 検出用途に使用でき、前記インクが、耐熱性バインダーと、真性半導体粒子と、 酸素価を2とした化学量論から逸脱する導電性金属酸化物化合物を含む導体粒子 とを含むことを特徴とする力検出インク。 2. 前記導電性酸化物粒子が、導電性酸化スズ粒子、F3O4酸化鉄粒子及び それらの混合物のうち1種を含む請求項1記載の炭素を含まない力検出インク。 3. さらに誘電体粒子を含む請求項1記載の炭素を含まない力検出インク。 4. 前記誘電体粒子が、10ミクロン以下の平均粒径を有するシリカである 請求項3記載の炭素を含まない力検出インク。 5. 前記半導体粒子が、二硫化モリブデン粒子である請求項1記載の炭素を 含まない力検出インク。 6. 前記粒子が、10ミクロン以下の粒径のものである請求項1記載の炭素 を含まない力検出インク。 7. 前記耐熱性バインダーが、熱可塑性ポリイミド樹脂である請求項1記載 の炭素を含まない力検出インク。 8. 前記導体粒子及び前記半導体粒子が、薄層として付着させた時の乾燥イ ンクの少なくとも20容量%の濃度で存在する請求項1記載の炭素を含まない力 検出インク。 9. 薄層として付着させた時に、前記バインダーが、20容量%から80容 量%の量で存在し、前記導体粒子及び前記半導体粒子が、80容量%から20容 量%の量で存在する請求項8記載の炭素を含まない力検出インク。 10. 15〜65容量部の半導体粒子対55〜5容量部の導体 粒子の比率で真性半導体粒子及び導体粒子を含み、残りが耐熱性バインダーであ る第一の混合物を用意し、15〜65容量部の半導体粒子対55〜5容量部の誘 電体粒子の比率で真性半導体粒子及び誘電体粒子を含み、残りが耐熱性バインダ ーである第二の混合物を用意し、それぞれ同容量の半導体粒子を有する量の前記 第一の混合物及び前記第二の混合物を混合して、4〜96%の第一の混合物対9 6〜4%の第二の混合物の比率の力検出粒子を製造して、付着用インクを提供し 、かつ力センサーに使用する工程を含むことを特徴とする炭素を含まない感圧力 検出インク層の温度及び圧力応答性を調整する方法。 11. 前記半導体粒子が、二硫化モリブデン粒子である請求項10記載の方 法。 12. 前記半導体及び導体粒子が、1.0ミクロン以下の平均粒径のもので ある請求項10記載の方法。 13. 前記バインダーが、熱可塑性ポリイミドバインダーである請求項10 記載の方法。 14. 前記導体粒子及び前記半導体粒子が、薄層として付着させた場合の乾 燥インクの20容量%以上、80容量%未満の量で存在する請求項10記載の方 法。 15. 前記バインダーが、20〜80容量%の量で存在し、そして前記導体 粒子及び前記半導体粒子が、80〜20容量%の量で存在する請求項10記載の 方法。 16. 薄い可撓性フィルムと、該フィルム上の第一の電極と、該電極上に付 着させた炭素を含まない感圧抵抗材料とを有し、 該抵抗材料は、耐熱性バインダーと、真性半導体粒子と、酸素価を2とした化学 量論から逸脱する導電性金属酸化物化合物を含む導体粒子とを有し、 前記半導体粒子が前記抵抗材料の20〜80容量%の量で存在し、 前記抵抗材料を電極間に挟み、加荷重の関数としてそこを通る電流 の流れを変えるように前記感圧抵抗材料によって第一の電極から間を置いて設け られた第二の電極を有することを特徴とする感圧力センサー。 17. 前記導体粒子が、導電性酸化スズ、Fe3O4酸化第二鉄及びそれらの 混合物の1種を含む請求項16記載の力センサー。 18. 前記材料が、さらに誘電体粒子を含む請求項16記載の力センサー。 19. 前記半導体粒子が、二硫化モリブデンである請求項16記載の力セン サー。 20. 前記半導体及び導体粒子が、1.0ミクロン以下の平均粒径のもので ある請求項16記載の力センサー。 21. 前記バインダーが、熱可塑性ポリイミドバインダーである請求項16 記載の力センサー。 22. 前記導体粒子及び前記半導体粒子が、薄層として付着させた場合の前 記インクの20容量%以上、80容量%未満の量で存在する請求項16記載の力 センサー。 23. 薄層として付着させた場合に、前記バインダーが、20〜80容量% の量で存在し、前記導体粒子及び前記半導体粒子が、80〜20容量%の量で存 在する請求項16記載の力センサー。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/353,051 | 1994-12-09 | ||
US08/353,051 US5541570A (en) | 1994-12-09 | 1994-12-09 | Force sensing ink, method of making same and improved force sensor |
PCT/US1995/014591 WO1996018197A1 (en) | 1994-12-09 | 1995-11-09 | Force sensing ink, method of making same and improved force sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10510356A true JPH10510356A (ja) | 1998-10-06 |
JP3499877B2 JP3499877B2 (ja) | 2004-02-23 |
Family
ID=23387572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51759296A Expired - Fee Related JP3499877B2 (ja) | 1994-12-09 | 1995-11-09 | 力検出インク |
Country Status (8)
Country | Link |
---|---|
US (1) | US5541570A (ja) |
EP (1) | EP0796497B1 (ja) |
JP (1) | JP3499877B2 (ja) |
KR (1) | KR100353314B1 (ja) |
CA (1) | CA2207285C (ja) |
DE (1) | DE69521143T2 (ja) |
MX (1) | MX9702762A (ja) |
WO (1) | WO1996018197A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7785704B2 (en) | 2003-05-14 | 2010-08-31 | Tekscan, Inc. | High temperature pressure sensitive devices and methods thereof |
JP2012501087A (ja) * | 2008-08-29 | 2012-01-12 | ペラテック リミテッド | 電気的に応答する複合材料、その製造方法及び該材料を使用して製造された変換器 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6230501B1 (en) | 1994-04-14 | 2001-05-15 | Promxd Technology, Inc. | Ergonomic systems and methods providing intelligent adaptive surfaces and temperature control |
US7126583B1 (en) | 1999-12-15 | 2006-10-24 | Automotive Technologies International, Inc. | Interactive vehicle display system |
US5989700A (en) * | 1996-01-05 | 1999-11-23 | Tekscan Incorporated | Pressure sensitive ink means, and methods of use |
US5991676A (en) * | 1996-11-22 | 1999-11-23 | Breed Automotive Technology, Inc. | Seat occupant sensing system |
US5905485A (en) * | 1997-02-13 | 1999-05-18 | Breed Automotive Technology, Inc. | Controller with tactile sensors and method of fabricating same |
US5952585A (en) * | 1997-06-09 | 1999-09-14 | Cir Systems, Inc. | Portable pressure sensing apparatus for measuring dynamic gait analysis and method of manufacture |
US6147677A (en) * | 1998-03-10 | 2000-11-14 | Universal Electronics Inc. | Sensing and control devices using pressure sensitive resistive elements |
US6603420B1 (en) * | 1999-12-02 | 2003-08-05 | Koninklijke Philips Electronics N.V. | Remote control device with motion-based control of receiver volume, channel selection or other parameters |
US6427540B1 (en) | 2000-02-15 | 2002-08-06 | Breed Automotive Technology, Inc. | Pressure sensor system and method of excitation for a pressure sensor |
AUPR725601A0 (en) * | 2001-08-24 | 2001-09-20 | Commonwealth Scientific And Industrial Research Organisation | Strain gauges |
US6867983B2 (en) * | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
US7930815B2 (en) * | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
US20040217844A1 (en) * | 2003-04-25 | 2004-11-04 | Robert Podoloff | Thick film thermistor and method of manufacture |
US7106208B2 (en) * | 2003-09-05 | 2006-09-12 | Hewlett-Packard Development Company, L.P. | Printed sensor having opposed areas of nonvisible conductive ink |
US20050093690A1 (en) * | 2003-09-11 | 2005-05-05 | Joseph Miglionico | Pressure-detection device and method |
US7584016B2 (en) * | 2003-09-30 | 2009-09-01 | Intrinsic Marks International Llc | Item monitoring system and methods |
US6964205B2 (en) * | 2003-12-30 | 2005-11-15 | Tekscan Incorporated | Sensor with plurality of sensor elements arranged with respect to a substrate |
US7921727B2 (en) * | 2004-06-25 | 2011-04-12 | University Of Dayton | Sensing system for monitoring the structural health of composite structures |
US6993954B1 (en) * | 2004-07-27 | 2006-02-07 | Tekscan, Incorporated | Sensor equilibration and calibration system and method |
US7849751B2 (en) | 2005-02-15 | 2010-12-14 | Clemson University Research Foundation | Contact sensors and methods for making same |
DE102006053949A1 (de) * | 2006-11-15 | 2008-05-21 | Siemens Ag | DMS-Faser-Gurt |
GB0708702D0 (en) | 2007-05-04 | 2007-06-13 | Peratech Ltd | Polymer composition |
EP2234134A4 (en) * | 2007-12-27 | 2011-09-14 | Nissha Printing | ELECTRONIC DEVICE WITH PROTECTIVE PLATE |
US8820173B2 (en) | 2009-03-06 | 2014-09-02 | Andrew C. Clark | Contact sensors and methods for making same |
WO2010141742A1 (en) * | 2009-06-03 | 2010-12-09 | Sensortech Corporation | Contact sensors and methods for making same |
TWI467601B (zh) * | 2009-08-31 | 2015-01-01 | Universal Cement Corp | 微形變壓阻材料及其製作方法 |
US20120092127A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Multifunctional input device for authentication and security applications |
GB201111340D0 (en) * | 2011-07-04 | 2011-08-17 | Meso Ltd | Load measuring system |
US9024910B2 (en) | 2012-04-23 | 2015-05-05 | Qualcomm Mems Technologies, Inc. | Touchscreen with bridged force-sensitive resistors |
ITTO20150046U1 (it) * | 2015-04-10 | 2016-10-10 | Guido Maisto | Dispositivo per la rilevazione di deformazioni e la trasmissione dei dati rilevati |
EP3350585A4 (en) | 2015-09-15 | 2019-07-17 | Sencorables LLC | SOIL CONTACT SENSOR SYSTEM AND METHODS OF USING SAME |
WO2017103592A1 (en) * | 2015-12-15 | 2017-06-22 | David Lussey | Electrically conductive composition |
GB201622299D0 (en) * | 2016-12-27 | 2017-02-08 | Lussey David And Lussey David | Control Charge Composite |
GB201821211D0 (en) * | 2018-12-24 | 2019-02-06 | Lussey David | New composition of matter |
CN109682508A (zh) * | 2018-12-29 | 2019-04-26 | 贝骨新材料科技(上海)有限公司 | 一种敏感油墨材料和柔性压力薄膜传感器及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3806471A (en) * | 1968-04-29 | 1974-04-23 | R Mitchell | Pressure responsive resistive material |
US4120828A (en) * | 1972-05-07 | 1978-10-17 | Dynacon Industries, Inc. | Pressure sensitive resistance and process of making same |
GB1360559A (en) * | 1972-11-24 | 1974-07-17 | Standard Telephones Cables Ltd | Carbon microphone |
US3926916A (en) * | 1972-12-22 | 1975-12-16 | Du Pont | Dielectric composition capable of electrical activation |
US4152304A (en) * | 1975-02-06 | 1979-05-01 | Universal Oil Products Company | Pressure-sensitive flexible resistors |
JPS5367856A (en) * | 1976-11-29 | 1978-06-16 | Shinetsu Polymer Co | Pressure sensitive resistance element |
US4489302A (en) * | 1979-09-24 | 1984-12-18 | Eventoff Franklin Neal | Electronic pressure sensitive force transducer |
US4315238A (en) * | 1979-09-24 | 1982-02-09 | Eventoff Franklin Neal | Bounceless switch apparatus |
US4401590A (en) * | 1980-03-26 | 1983-08-30 | Matsushita Electric Industrial Company, Limited | Conductive pyrolytic product and composition using same |
US4763534A (en) * | 1985-01-31 | 1988-08-16 | Robert G. Fulks | Pressure sensing device |
US4734034A (en) * | 1985-03-29 | 1988-03-29 | Sentek, Incorporated | Contact sensor for measuring dental occlusion |
US4856993A (en) * | 1985-03-29 | 1989-08-15 | Tekscan, Inc. | Pressure and contact sensor system for measuring dental occlusion |
US5132583A (en) * | 1989-09-20 | 1992-07-21 | Intevep, S.A. | Piezoresistive material, its preparation and use |
US5033291A (en) * | 1989-12-11 | 1991-07-23 | Tekscan, Inc. | Flexible tactile sensor for measuring foot pressure distributions and for gaskets |
US5296837A (en) * | 1992-07-10 | 1994-03-22 | Interlink Electronics, Inc. | Stannous oxide force transducer and composition |
US5302936A (en) * | 1992-09-02 | 1994-04-12 | Interlink Electronics, Inc. | Conductive particulate force transducer |
US5473938A (en) * | 1993-08-03 | 1995-12-12 | Mclaughlin Electronics | Method and system for monitoring a parameter of a vehicle tire |
-
1994
- 1994-12-09 US US08/353,051 patent/US5541570A/en not_active Expired - Lifetime
-
1995
- 1995-11-09 WO PCT/US1995/014591 patent/WO1996018197A1/en active IP Right Grant
- 1995-11-09 EP EP95940667A patent/EP0796497B1/en not_active Expired - Lifetime
- 1995-11-09 MX MX9702762A patent/MX9702762A/es unknown
- 1995-11-09 JP JP51759296A patent/JP3499877B2/ja not_active Expired - Fee Related
- 1995-11-09 KR KR1019970703811A patent/KR100353314B1/ko not_active IP Right Cessation
- 1995-11-09 CA CA002207285A patent/CA2207285C/en not_active Expired - Fee Related
- 1995-11-09 DE DE69521143T patent/DE69521143T2/de not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7785704B2 (en) | 2003-05-14 | 2010-08-31 | Tekscan, Inc. | High temperature pressure sensitive devices and methods thereof |
JP2012501087A (ja) * | 2008-08-29 | 2012-01-12 | ペラテック リミテッド | 電気的に応答する複合材料、その製造方法及び該材料を使用して製造された変換器 |
Also Published As
Publication number | Publication date |
---|---|
CA2207285C (en) | 2005-01-25 |
JP3499877B2 (ja) | 2004-02-23 |
DE69521143D1 (de) | 2001-07-05 |
MX9702762A (es) | 1997-07-31 |
EP0796497A4 (en) | 1998-11-11 |
CA2207285A1 (en) | 1996-06-13 |
EP0796497A1 (en) | 1997-09-24 |
DE69521143T2 (de) | 2001-11-15 |
KR100353314B1 (ko) | 2002-11-18 |
US5541570A (en) | 1996-07-30 |
EP0796497B1 (en) | 2001-05-30 |
WO1996018197A1 (en) | 1996-06-13 |
KR987000668A (ko) | 1998-03-30 |
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