JPH104108A - Wire supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To transfer a wire from a wire housing portion to a loading member with high positioning accuracy and securely chuck a large quantity of wire so as to efficiently supply the wire. SOLUTION: In a wire supply device for arraying and supplying a plurality of wires, such as, wire diodes 2, to a loading frame, a slide chuck for holding portions near the other ends of the plurality of wire diodes 2 which are held in a rack housed in a magazine so as to transfer the wire diodes 2 to the loading frame is provided. The slide chuck includes fixed slide plates 38a, 38b and a moving slide plates 38c. Protrusions 38 of the fixed slide plates 38a, 38b and the moving slide plate 38c are caused to enter between the wire diodes 2, and the moving slide plate 38c is slid so that portions near the other ends of the wire diodes 2 are held from both lateral sides between the protrusions, thus transferring the wire diodes to the loading frame.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire feeder for aligning and feeding a plurality of wires to a loading member.

[0002]

2. Description of the Related Art Conventionally, in a resin molding apparatus for carrying a molded article between an upper mold and a lower mold that can be moved and separated, closing the mold and performing resin molding, for example, a wire is used as a molded article. When a wire material such as a diode is resin-molded, a loading frame in which the wire diodes are arranged and mounted is used. In this resin molding apparatus, the loading frame is configured to reciprocate between a wire diode setting position (a molded product take-out position) and a molding position of a mold by a loader having a chuck band.

In general, when a wire material such as a wire diode is supplied to the loading frame, FIG.
The wire diodes 63 are held one by one in racks 61 and 62 as shown in FIG.
Transfer from 62 to the loading frame. The rack 61 is composed of two support walls 61b of a support member 61a having a U-shaped cross section.
V-grooves 61c are formed at a plurality of locations in the longitudinal direction at the upper edge of
It supports both side leads of the wire diode 63. The rack 62 includes a housing-like support 62a.
A plurality of insertion holes 62b are formed in one side surface in the longitudinal direction, and one end side lead portion of the wire diode 63 is inserted and supported in the insertion hole 62a.

As a method of transferring the wire diode 63 from each of the racks 61 and 62 to a loading frame, as shown in FIG. 10B, a plurality of crab-clamped hands 64 are used to hold the wire diodes 63 on the loading frame. The drawn wire diode 63 chucks and lifts the lead portion, and the wire diode 63 held by the rack 62 chucks and pulls out the lead portion, thereby moving the wire diode 63 to the mounting position on the loading frame to perform chucking. When opened, the lead portion is dropped and mounted on the V-groove-shaped support portion so as to support the lead portion. As another method, the wire diodes 63 held by the racks 61 and 62 are carried together with the racks 61 and 62 onto a loading frame, and are mounted while correcting positional deviation by hand.

[0005]

However, in the above resin molding apparatus, the wire diode 63 mounted on the loading frame is chucked by the hand 64 in order to position both ends in the longitudinal direction by the wire guides. When the chuck of the wire diode 63 was released and dropped into the V-groove-shaped support portion of the loading frame, the lead portion sometimes did not enter well. In addition, since chucking is performed by the crab-clamping hand 64, a driving space for opening and closing the hand 64 is required, and the pitch of the wire diodes 63 held by the racks 61 and 62 must be widened to some extent. Therefore, the number of wire diodes 63 that can be held by the racks 61 and 62 is also limited, resulting in poor yield, and the number of pieces that can be chucked at once by the hand 64 is limited, resulting in a reduction in work efficiency.

When the hand 64 is a crab-sandwich type, it is difficult to reduce the pitch between the wires, and the wires may be damaged. In addition, since the hand 64 chucks a wire such as the wire diode 63 at two points, the hand 64 lacks stability during the chucking operation and may fall.

In the case where the wire is manually transferred to the loading frame, when transferring a large amount of wire,
It takes time and effort, and work efficiency is poor.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, perform the transfer operation of a wire from a wire container to a loading member with high positioning accuracy, and reliably supply a large amount of wire by chucking it efficiently. It is an object of the present invention to provide a wire rod supply device that can be used.

[0009]

The present invention has the following arrangement to achieve the above object. That is, in a wire feeder that supplies a plurality of wires in a row to the loading member,
A wire accommodating portion accommodating a plurality of racks that hold a plurality of wires in accordance with a pitch of the mounting portion of the loading member on the basis of one longitudinal end, and a plurality of racks held on the rack accommodated in the wire accommodating portion; Wire material transfer means for holding the wire member near the other end side and transferring the wire material to the loading member,
The wire transfer means includes a plurality of slide members formed with comb-shaped protrusions at substantially the same pitch as each other, and the protrusions of the respective slide members are interposed between the wires held by the rack of the wire storage unit. It is characterized in that a part thereof is slid after entering, and the vicinity of the other end of each wire is sandwiched between the projections from both sides to be held and transferred to the loading member.

[0010] The wire rod accommodating section may be provided with a defective product detecting means for detecting a bent wire rod. Further, the slide member is provided with fixed slide plates on both sides of the movable slide plate, and the protrusion of the slide member is inserted between the wires held in the rack, and the slide member is moved to move the slide member. After one side is brought into contact with the fixed slide plate, the movable slide member may be slid and brought into contact with the other side of the wire, thereby holding and holding the wire end from both sides. Further, the plurality of slide members may have flexible comb-shaped protrusions formed at substantially the same pitch.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. This embodiment describes a wire feeder that uses a wire diode as a wire and supplies the wire diode to a loading frame from a wire holder, and the wire feeder is provided with a resin molding device having a loading frame orbital moving mechanism. The case where it is equipped with will be described.

FIG. 1 is a plan view showing the overall structure of a resin molding apparatus having a wire feeder, FIG. 2 is a side view of the wire feeder, FIG. 3 is an explanatory view of a defective wire detection mechanism in a rack alignment mechanism, and FIG. Is an explanatory view showing a rectangular movement mechanism of a rack holder, FIG. 5 is a front view and a side view showing a configuration of a sliding hand, FIG. 6 is an enlarged explanatory view of a movable slide plate, and FIG. 7 is an explanatory view of chuck operation of a slide member. FIG. 8 is an explanatory view showing the transfer operation of the slide chuck.

First, an overall configuration of a resin molding apparatus having a wire feeder will be described with reference to FIG. Reference numeral 1 denotes a molding die, for example, which carries a resin molding by placing a wire material such as a wire diode 2 in which a semiconductor element is bonded to a wire on a lower die and moving the upper die toward and away from the die. In this embodiment, cavities are formed on both sides of the pot at a total of 12 places, 6 places on one side.

Reference numeral 3 denotes a tablet holder as tablet supply means for supplying a resin tablet to the mold 1. The tablet holder 3 is one in which resin tablets aligned and held at intervals corresponding to the pots formed in the mold 1 are manually or automatically loaded into the mold and loaded into each pot. It is. From the preheated state, the resin tablet is pressed by the plunger, and the molten resin is filled into the cavity through the respective resin paths, and the resin molding is performed.

Reference numeral 4 denotes a loading frame as a loading member on which the wire diodes 2 are arranged and mounted. The loading frame 4 has a total of 12 mounting portions for mounting the wire diodes 2 on both sides of the pot corresponding to the cavity of the mold 1. As the loading frame 4, a lightweight and highly portable metal plate such as an aluminum plate is preferably used, and the loading frame 4 is moved around by a loading frame rotation moving mechanism 5 described later. The loading frame revolving movement mechanism 5 makes a revolving movement from the molded article supply side to the molded article supply side via the molding die 1 and the molded article discharge side with the plurality of loading frames 4 placed thereon.

Reference numeral 6 denotes a wire feeder, which aligns and feeds a plurality of wire diodes 2 to a loading frame 4 set on the side of the workpiece. Reference numeral 7 denotes a molded product take-out section as a molded product take-out means, which is used to separate the wire diode 2 and unnecessary resin from the molded product placed on the loading frame 4 set on the molded product discharge side by performing a gate break. Then, the wire diodes 2 are held and taken out in rack units.

Next, the configuration of each part of the resin molding apparatus provided with the above-mentioned wire feeder will be specifically described.

(Loading Frame Circumferential Movement Mechanism) As shown in FIG. 1, a first, second, and second belt conveying means are provided on a molded article supply side and a molded article discharge side of a mold.
Third, fourth, fifth belt conveying devices 8a, 8b, 8c, 8
d, 8e are provided. The first to fifth belt conveying devices 8a to 8e are arranged vertically and horizontally as shown in FIG. 1 so as to circulate the loading frame 4 from the molded article supply side to the molded article discharge side. 9 and transported. An endless belt is preferably used as the belt 9 and a belt drive motor 10
The loading frame 4 placed on the belt 9 is linearly moved in the vertical and horizontal directions by being rotationally driven by a, 10b, 10c, 10d, and 10e.

Reference numerals 11 and 12 denote elevator mechanisms as lifting means, which place the loading frame 4 on an elevation table and raise and lower it. The above elevator mechanism 1
As shown in FIG. 1, reference numerals 1 and 12 are provided on the left and right sides of the resin molding apparatus, respectively, corresponding to a molded article supply side and a molded article discharge side. The elevator mechanism 11 transfers the empty loading frame 4 from the fourth belt conveyor 8d to the elevating position H after the molded product is collected, raises it from the bottom of the apparatus to the upper part of the apparatus, and moves the standby position I by a moving cylinder described later.
Move to Then, at the standby position I, the loading frame 4 is transferred to the fifth belt transporting means 8e of the loading frame 4, and the loading frame 4 is transported toward the molded article supply position A. Further, the elevator mechanism 12 lowers the loading frame 4 after collecting the molded product from the top of the apparatus to the bottom of the apparatus, and transfers the loaded frame 4 from the elevating position G to the fourth belt conveying device 8d.

Reference numerals 13 and 14 denote moving cylinders as moving means, which are respectively provided on the left and right sides of the resin molding apparatus so as to correspond to a molded article supply side and a molded article discharge side. The moving cylinder 13 moves the loading frame 4 raised by the elevator mechanism 11 from the elevating position H to the standby position I, and transfers it to the fifth belt conveying device 8e. The moving cylinder 14 moves the loading frame 4 from the molded product storage position F to the elevating position G, and performs delivery to the elevator mechanism 12.

Reference numerals 15 and 16 denote an inloader and an unloader as transport means. After the loading frame 4 supplied with the wire diode 2 from the molded article supply unit 6 at the molded article supply position A is moved to the chucking position B by the first belt conveying device 8a, the loading frame 4 is chucked by the hand of the inloader 15 described above. It is carried into the molding position C on the mold 1. The hand of the unloader 16 is
The loading frame 4 on which the molded product after the resin molding is mounted is chucked and carried out from the molding position C to the molded product removal position D. A second belt transport device 8b is provided at the molded product take-out position D, and the loading frame 4 is placed on the second belt transport device 8b and transported to the unnecessary resin collecting position E. A cleaning device 16a is provided at the tip of the unloader 16 on the mold side.
When moving in and out of the mold 1, the mold surface is cleaned to remove dust, unnecessary resin, and the like.

The above-mentioned loading frame revolving moving mechanism 5
Is equipped with three to six loading frames 4, and a plurality of sheets are on standby on the molded article supply side and the molded article discharge side. The supply operation of the molded article, the molding operation, and the removal of the molded article The operation, the operation of collecting the unnecessary resin, the operation of storing the molded product, and the like can be performed with the standby time as short as possible.

(Wire Supply Apparatus) In FIG. 2, the wire supply apparatus 6 has a rack 17 for aligning and holding wires and a plurality of racks 17 as a wire storage section for aligning and storing a plurality of wires (wire diodes 2). And a rack holder 20 for receiving and transferring the rack 17 taken out of the magazine 18. As the rack 17, for example, a plurality of insertion holes are formed in a longitudinal direction on one side surface of the housing in accordance with the groove pitch of the mounting portion of the loading frame 4, and the lead of the wire diode 2 is inserted into the insertion hole. , A plurality of wire diodes 2. Further, the magazine 18 holds a plurality of racks 17 holding the wire diodes 2 stacked so that the longitudinal direction of the wire diodes 2 is horizontal. The racks 17 are stored in a magazine 18 and supplied, and when empty, are individually collected by a rack discharge mechanism 19a and a magazine discharge mechanism 19b (see FIG. 1). The rack 17 is loaded with the number (for example, about 48) of wire diodes 2 which are supplied to one side cavity and molded with resin, and about 500 to 600 wire diodes 2 are formed by one resin molding. Supplied in rack units.

In FIG. 2, a magazine 18 is held by a hand 21a of a magazine transport mechanism 21 and transported to an upper portion of an elevator mechanism 22, and the magazine 18
2a. The elevation table 22
The rack 1a is moved upward by one pitch by the drive motor 22b (servo motor) and accommodated in the magazine 18
Push up 7. The uppermost rack 1 pushed up above
7 is chucked by the hand 23a of the rack transport mechanism 23 and delivered to the rack holding table 24. The rack transport mechanism 23 returns to the original elevation table 2
Returning to the upper side of 2a, the next rack 17 is prepared for conveyance.
The rack holding table 24 has an upper and lower cylinder 24b connected to a lower portion on a right end side thereof, and a fulcrum 24 provided on a lower portion on a left end side by operating the upper and lower cylinders 24b.
It is attached so as to be rotatable around a. The rack holding table 24 is supported by a horizontal support bar 24c and is configured to be able to maintain a horizontal state. The rack 17 placed on the rack holding table 24 so that the longitudinal direction of the wire diode 2 is horizontal is rotated counterclockwise around the fulcrum 24a by operating the upper and lower cylinders 24b. Almost 45
The wire diode 2 held by the rack 17 is aligned at one end.

Reference numeral 25 denotes a rack aligning mechanism, which is a rack 1 that is aligned and held by tilting the rack holding table 24.
7 is moved upward by chucking the hand 7a with the hand 25a, moved to the right side in the drawing, and the rotating cylinder 25b is operated to rotate the hand 25a counterclockwise around the fulcrum 25c so that the rack 17 stands upright. Hold. At this time, the free end of the lead end of the wire diode 2 is held on the upper side, and the aligned end is held on the lower side. The rack 17 held by the hand 25a is transferred to the rack holder 20. As shown in FIG. 2, the rack holder 20 supports the rack 17 by fitting the rack 17 into grooves on both sides in the longitudinal direction, and includes a fixed fixed side holder 20 a and a narrower than the fixed side holder 20 a. And a moving-side holding member 20b that performs a rectangular movement and is provided on the inner side at a width interval. The fixed side holder 20a has twelve rack holding grooves 20c formed in the longitudinal direction, and the movable side holder 20b has eleven rack holding grooves 20d at the same pitch as the rack holding grooves 20c. It is drilled in the direction. Moving side holder 2
Reference numeral 0b is provided side by side with the fixed-side holding tool 20a so that the left end side thereof is aligned. When the fixed-side holding tool 20a holds the rack 17 in the rack holding groove 20c, it stands by at a lower position where it does not interfere with each other.

As shown in FIG. 3A, a defective wire detection mechanism 30 is provided above the fixed holder 20a. The defective wire detection mechanism 30 is provided with upright walls 30a, 30a standing on both sides in the width direction of the fixed side holder 20a.
a, both ends of the rotating shaft 30b are rotatably supported. A groove is formed in the longitudinal direction on the lower peripheral surface of the rotating shaft 30b. In this groove, the same number of comb-shaped slits 30c are formed at the same pitch as the wire diodes 2 supported on the rack 17. A slit plate 30d is fitted. A detection piece 30e is integrally attached to one end side (the right side in FIG. 3A) of the rotation shaft 30b. The slit plate 30d and the detection piece 30e are supported by the rotating shaft 30b in a state of being suspended by their own weight. A photo sensor 30f is provided on the upright wall 30a close to the detection piece 30e, and the detection piece 30e rotates together with the rotation shaft 30b to open and close the optical axis of the photo sensor 30f.

The defective wire detecting mechanism 30 is provided at a predetermined position above the rack holder 20. A plurality of wire diodes 2 are held upright in the rack 17 held in the rack holding grooves 20c of the fixed-side holder 20a, and the rack 17 is moved forward by one pitch by the movable-side holder 20b. In this case, the non-defective wire diode 2 passes through the slit 30c of the slit plate 30d, and the defective (bent) wire diode 2 cannot pass through the slit 30c when moving and interferes with the slit plate 30d. In order to rotate this, the detecting piece 30e opens the optical axis of the photo sensor 30f, so that it is possible to detect that a defective product is mixed. When a defective product is detected, the supply operation of the rack 17 in the wire rod supply device 6 is stopped by a control unit (not shown), and the defective product is manually replaced. This makes it possible to prevent the occurrence of defective products before resin molding, and to maintain the quality of molded products. In addition, the defective new detection mechanism 30
May be provided at a plurality of positions above the rack holder 20.

Next, the rectangular movement mechanism of the movable holder 20b of the rack holder 20 will be described with reference to FIGS. 3 (b) and 4 (b), the fixed side holder 20a and the movable side holder 20b
A base plate 32 is horizontally supported on a support leg 31 at a lower portion of the base plate 32, and an upper and lower cylinder 32a is attached to the base plate 32. The tip of a cylinder rod of the upper and lower cylinder 32a is connected to a movable plate 33, and a plurality of upper and lower guide rods 34 through which the base plate 32 is inserted are connected to the movable plate 33. A horizontal cylinder 35 is attached to the movable plate 33, and the tip of the cylinder rod is connected to the back side of the movable holder 20b. Further, the movable plate 33 supports a plurality of horizontal guide rods 36 through which a jig provided on the back side of the movable side holder 20b is inserted. Further, as shown in FIG. 4A, rack holding grooves 20c, 20c on both ends in the longitudinal direction of the fixed-side holding tool 20a.
Photo sensors 37a and 37b are provided at positions corresponding to c, respectively. The rack holding grooves 20c, 2
When the rack 17 is transported by the hand 25a or the moving-side holder 20b to the photo sensor 37c, the photo sensors 37a and 37b
The control unit causes the rack 17 to supply and discharge and to perform a chucking operation of the wire diode 2 from the rack 17 by opening and closing the optical axis of the rack 17.

Therefore, when the rack 17 is transferred to the rack holding groove 20c on the left end side of the fixed side holder 20a by the hand 25a of the rack aligning mechanism 25, the photo sensor 37a is moved to the rack holding groove 20c of the fixed side holder 20a. This is detected. Then, the upper and lower cylinders 32a are actuated to push up the movable plate 33 along the upper and lower guide rods 34, and the movable side holder 20b moves upward to move the rack holding groove 20d
The rack 17 is inserted into the rack and the delivery is performed. Then, at a position where the rack 17 is separated from the rack holding groove 20c of the fixed-side holding tool 20a, the horizontal cylinder 35 is operated to move the movable plate 33 along the horizontal guide rod 36 to the right in FIG. Move horizontally by the pitch. And
When the operation of the upper and lower cylinders 32a is stopped, the movable plate 33 moves down again, and the rack 17 held by the movable holder 20b fits into the second rack holding groove 20c from the left end of the fixed holder 20a. The horizontal cylinder 35 is operated at a position outside the rack holding groove 20d to move the moving-side holding tool 20b to the left side in FIG.
Move horizontally by the pitch and return to the original position.

The rack holding groove 2 of the fixed side holding tool 20a
When the rack 17 held by the hand 25a is inserted into the rack 0c and the delivery is completed, the hand 25a moves up again and rotates clockwise to move the rack 17 held obliquely on the rack holding table 24 next. Wait for transport. Then, when the next rack 17 is delivered to the rack holding groove 20c of the fixed-side holder 20a by the hand 25a, the movable-side holder 20b repeats the same rectangular movement, and is held by the fixed-side holder 20a. The rack 17 is held together with the rack 17 advanced by one pitch, and
It is advanced and held in the rightward direction in FIG. 4B by one pitch of 0c. Then, the same operation is repeated until the rack 17 is held in all (12) of the rack holding grooves 20c of the fixed-side holding tool 20a.

In FIG. 2, reference numeral 26 denotes a slide chuck as a wire rod transferring means,
0, the vicinity of the other end of the plurality of wire diodes 2 aligned and held on the fixed side holder 20a with one end as a reference is transferred to the loading frame 4 while being held in units of racks 17. Rack holding groove 20c of the fixed-side holding tool 20a
, The slide chuck 26 is rotated clockwise to move the wire diode from the rack 17 held on the most front side (right side in the drawing) held by the fixed side holder 20a. 2 is pulled out by chucking and rotated counterclockwise to hold the wire diode 2 so that the longitudinal direction is horizontal, and scan the loading frame 4 in the XY direction to open the chuck at a predetermined position. Then, it is dropped into the V-groove of the support and placed. As shown in FIG. 1, the empty rack 17 from which the wire diode 2 has been pulled out is chucked by a hand (not shown), conveyed onto a conveyor belt as a rack discharging mechanism 19a, and discharged out of the apparatus. Also,
When the magazine 18 becomes empty, it is moved to the discharge position by cylinder driving and taken out.

The slide chuck 26 includes a moving body 27
The moving body 27 has a ball screw 2
8a and 28b are connected in the XY directions. The X direction (vertical direction in FIG. 2) ball screw 28a is rotationally driven by an X direction drive motor (servo motor) 29a, and the Y direction (left and right direction in FIG. 2) ball screw 28b is rotated by a Y direction drive motor (servo motor) 29b. The movable body 27 that is driven and supports the slide chuck 26 can be scanned in the XY directions.

Next, a more detailed configuration of the slide chuck 26 will be described with reference to FIGS. In FIG. 5A, reference numeral 38 denotes a slide member which is provided with a movable slide plate 38c between fixed slide plates 38a and 38b having a plurality of comb-shaped protrusions formed at the same pitch (for example, 4.0 mm). I have. The movable slide plate 38c
Is configured to slide in the left and right direction in FIG. 5A by the movable plate drive cylinder 39. Reference numeral 40 denotes a rotation arm, which rotatably supports the slide member 38 about a rotation shaft 41 of a rotation cylinder (air cylinder) 44. The rotary cylinder 44 is integrally mounted on a mounting plate 42, and the rotary shaft 41 is rotatably supported by a cylindrical boss 43 mounted on the mounting plate 42. By operating the rotation cylinder 44, the rotation arm 40 rotates 90 degrees between the horizontal position and the hanging position as shown in FIG. 5B. FIG. 5 (b)
As shown in (1), a vertical cylinder 45 is provided on the moving body 27, and the tip of a cylinder rod of the vertical cylinder 45 is connected to the upper side of the mounting plate. When the vertical cylinder 45 is operated, the slide member 38 moves up and down together with the mounting plate 42.

In FIG. 6, the movable slide plate 38c is a thin metal plate (such as carbon steel) having a thickness of about 1.0 mm.
Is used. As shown in the enlarged view of FIG. 6, the movable slide plate 38c is formed such that the width of the wire holding portion 38e of the comb-shaped protrusion 38d is as thin as about 0.3 mm. Since both sides in the longitudinal direction are rounded, the protrusion 38d has sufficient elasticity and strength, and the diameter of the wire diode 2 (about 0.5 mm)
Even if the tolerances of
The variation can be absorbed and the wire diode 2 can be held. The comb-shaped projection 38d of the movable slide plate 38c is formed by wire cutting. As a result, the wire holding portion 38e of the projection 38d is formed in a satin shape, so that the frictional resistance between the wire holding portion 38e and the lead portion pressed against the wire holding portion 38e is increased, so that the wire diode 2 is hardly dropped. The tip of the projection 38d is formed in a tapered shape so as to become thinner toward the tip, following the shape of the fixed slide plates 38a and 38b. As shown in FIG. 7, the fixed slide plates 38a, 38
8b projections 38f, 38f, wire holding portions 38g, 3
The width of 8 g is about 1.0 mm, and is formed wider than the protrusion 38 d of the movable slide plate 38 c.

Next, the operation of chucking the wire diode 2 of the slide member 38 will be described with reference to FIG. In FIG. 7A, in a standby state, the slide member 38 stands by at a position where the projection 38d of the movable slide plate 38c overlaps with the projection 38f of the fixed slide plates 38a, 38b. Therefore, the fixed slide plate 38a,
The rack 1 is located between the projections 38f (approximately 3.0 mm wide) of the rack 38b.
The lead (free end side) of the wire diode 2 held at 7 is made to enter. That is, in FIG. 2, the slide member 38 operates the rotation cylinder 44 to rotate the rotation arm 40.
Is rotated by 90 degrees, and is held in the horizontal direction, the Y-direction drive motor 29b is driven to move the moving body 27 to the left side in FIG. 2, and the leading side (the right end in FIG. side)
The protrusions 38f, 38d, and 38f are respectively inserted between the leads of the wire diode 2 held by the rack 17 of FIG. At this time, as shown in FIG. 7A, the projections 38f, 38d, and 38f are made to enter the center position between the leads.

Next, in FIG. 7B, positioning is performed by abutting the fixed slide plates 38a and 38b against the leads. That is, the X-direction drive motor 29a shown in FIG. 2 is driven to move the moving body 27, and as shown in FIG.
The wire is moved to the left side in FIG. 7B until the wire holding portions 38g of the projections 38f, 38f of the fixed slide plates 38a, 38b hit the leads of the wire diode 2.

Next, in FIG. 7 (c), the movable slide plate 38c is brought into contact with the lead and fixed slide plates 38a,
38b. That is, the movable plate driving cylinder 39 shown in FIG.
Slide to the right side of FIG.
The wire 38 is moved from the side opposite to the lead abutted against the wire holding portions 38g, 38g until the wire holding portion 38e of the projection 38d abuts. Thereby, the leads of the wire diode 2 are fixed to the fixed slide plates 38a and 38b.
The movable slide plate 38c is chucked so as to be sandwiched at three places from both sides, and the delivery from the rack 17 is performed.

As described above, even if there is a variation in the tolerance of the lead diameter of the wire diode 2, it is absorbed by the elasticity of the projection 38d of the movable fly plate 38c, and the wire holding portion 38d is formed in a satin shape. Thus, the wire diode 2 can be reliably chucked without dropping. In the chucking operation of the slide plate 38, as shown in FIG.
The reason why the operation of abutting the lead on the projections 38f, 38f of FIGS.
FIG. 7 shows a state in which 38d and 38f have entered between the leads.
This is because the lead may be bent when the movable slide plate 38c is slid as shown in FIG.

Next, the operation of transferring the wire diode 2 from the rack holder 20 to the loading frame 4 by the slide chuck 26 will be described with reference to FIG. In FIG. 8, the rack 1 in which the wire diodes 2 are aligned and held in the rack holding grooves 20c of the fixed holder 20a.
When condition 7 is satisfied, the rotation cylinder 44 of the slide chuck 26 at the home position shown in FIG. 8 is operated to rotate the rotation arm 40 clockwise by 90 degrees from the hanging position to the horizontal position. At this time, the height of the slide member 38 is raised because the slide member 38 is held in the horizontal direction, but the height of the chuck position is adjusted by operating the vertical cylinder 45.

Next, the Y-direction drive motor 29b is driven to move the moving body 27 from the home position to the rack 17 side (the left side in FIG. 8).
f, 38d and 38f enter between the leads of the wire diode 2 (chuck position P). Then, as described above, the X-direction drive motor 29a is driven to bring the fixed slide plates 38a and 38b into contact with the leads, and then the movable plate drive cylinder 39 is operated to move the fixed slide plate 38
The lead is chucked between a, 38b and the movable slide plate 38c.

When the slide member 38 chucks the lead, the upper and lower cylinders 45 are operated to move the slide member 3.
The wire diode 2 is pulled out from the rack 17 while being chucked (upward movement position Q).

The Y-direction drive motor 29b is again driven in the reverse direction to move the moving body 27 backward (to the right in FIG. 8), and to move the slide member 38, which has chucked the lead, to a rotatable position (rotation). Position R). At this time, the wire diode 2 is chucked so that the longitudinal direction is the vertical direction. Next, the rotating cylinder 44 is operated to rotate the rotating arm 40 in the counterclockwise direction by 90 degrees to make it fall down (hanging position S). At this time, the wire diode 2 is chucked so that the longitudinal direction is horizontal. And the X-direction and Y-direction drive motors 2
9a and 29b are respectively driven to scan the moving body 27 above the loading frame 4 in the X and Y directions, the upper and lower cylinders 45 are operated at a predetermined mounting position to lower the slide member 38, and The movable plate drive cylinder 39 is operated near the loading plate 4c to slide the movable slide plate 38c to open the chuck (chuck release position T). When the chuck is opened, the chucked wire diode is moved to the supporting member 4 provided on each loading plate 4c.
It is dropped into the V-grooves a and 4b.

In FIG. 1, reference numeral 46 denotes a dummy wire supply device as dummy supply means, which supplies a dummy wire to a defective portion of the wire diode 2 arranged and mounted on the loading frame 4. The dummy wire supply device 46 is configured to be able to scan on the loading frame 4 in the X-Y direction, and when a sensor detects a defective portion of the wire diode 2, the dummy wires supplied to the hopper are removed one by one. Supply. By supplying a dummy wire by the dummy wire supply device 46, resin leakage from a defective portion of the wire diode 2 is prevented.

(Molded Product Take-Out Portion) In FIG. 1, the loading frame 4 taken out by the unloader 16 to the molded product take-out position D relatively rotates the wire diode 2 and the unnecessary resin by the gate break mechanism. As a result, a gate break is performed, and the unnecessary resin in which the cull, the runner, and the gate are integrated is separated from the wire diode 2. Then, the loading frame 4 is delivered to the second belt conveying device 8b and is conveyed to an unnecessary resin collecting section 47 as an unnecessary resin collecting means provided at the unnecessary resin collecting position E. The unnecessary resin collecting section 47 uses a third belt conveying device 8c to load the unnecessary frame after the gate break by the unnecessary resin collecting mechanism and hold the unnecessary diode after the gate break by the third belt conveying device 8c. 4 is transported to the molded article storage position F. Unnecessary resin chucked by the hand is released from the chuck and falls downward through the hopper, and the scrap box 4 is conveyed by the conveyor.
8 to be collected.

Reference numeral 49 denotes a molded product storage section as a molded product storage means. The loading diode 4 conveyed to the molded product storage position F chucks the wire diode 2 for each chase by the storage hand 50 and discharges and discharges. Tool 51
In order. As shown in FIG. 2, the discharge jig 51 accommodates the wire diodes 2 for each chase and discharges them outside the apparatus, the next discharge jig 51 is moved to the accommodation position, and the empty discharge jigs 51 are sequentially arranged. Supplied. In this way, the plurality of discharge jigs 51 sequentially move around and collect the wire diode 2. The resin is removed from the wire diode 2 collected by the discharge jig 51 by barrel polishing or the like.

(Loading Frame) As shown in FIG. 8, a loading frame 4 as a loading member
Is provided with a total of twelve sheets, six on each side, so as to be adjacent to each other, with a plurality of loading plates 4c formed with support portions 4a and 4b formed with a plurality of concavo-convex portions formed continuously on both sides in the longitudinal direction (see FIG. 1). Each loading plate 4c is placed and fixed on a base plate 4d. On each loading plate 4c, a wire diode 2 in which a wire lead is joined to a semiconductor element such as a diode is mounted with both ends of the wire supported by the support portions 4a and 4b and aligned in rack units in the longitudinal direction. . As shown in FIG. 8, on both sides of the support portions 4a and 4b, wire guides 4e and 4f serving as stoppers for preventing rattling in the longitudinal direction of the wire diode 2 are provided on the support portions 4a and 4b, respectively. They are provided in parallel in the longitudinal direction.

When the loading frame 4 has been mounted on the mold 1, the wire diode 2 is clamped by the mold 1 in order to proceed to the resin molding step. At this time, the leads on both sides of the wire diode 2 are fixed in the recesses of the mold 1.
Since the support portions 4a and 4b and the wire guides 4d and 4e of the loading frame 4 are located at positions escaping outward from the mold, they do not interfere with the mold. Also,
The loading frame 4 is positioned by fitting upwardly projecting wire guides 4e and 4f into the upper mold.

(Circumferential Moving Operation of Loading Frame) Next, the circular moving operation of the loading frame in the loading frame circular moving mechanism 5 will be described with reference to FIG. A plurality of loading frames 4 are set in the loading frame revolving mechanism 5, and the revolving operation of any one of the loading frames 4 will be described.

The loading frame 4 waiting at the standby position I operates the fifth belt drive motor 10e to
The article is conveyed to the molded article supply position A by the belt conveying device 8e. At the above-mentioned molded article supply position A, the wire diodes 2 held by the racks 17 transferred to the rack holder 20 from the magazine 18 of the wire feeder 6 are chucked by the slide chuck 26 for each rack 17 and the stacking plate is loaded. It is placed on the supporting portions 4a and 4b on the upper side 4c. In the present embodiment, since the die is a 12-piece mold, the supply operation for 12 racks is performed, and the supply operation of the wire diode 2 to the loading frame 4 is completed.

When the supply of the wire diode 2 is completed, the fifth belt drive motor 10e is operated, and the loading frame 4 is transported from the workpiece supply position A to the chuck position B by the first belt transport device 8a. At the chuck position B, the loading frame 4 is chucked by the hand of the inloader 15 and is carried into the molding position C on the mold 1 in the mold open state. After loading the loading frame 4 into the mold 1, a resin tablet is loaded from the tablet holder 3 into the pot of the mold 1. The wire diode 2 is carried into the mold 1 (mold chase) 1 while being aligned and mounted on the loading frame 4, and after closing the mold, molten resin is injected into the cavity by a plunger to perform resin molding. When the resin molding step is performed, the fifth belt transporting device 8e is operated to move the next loading frame 4 to the molded article supply position A.
, And the wire diode 2 is supplied from the wire rod supply device 6.

When the resin molding is completed, the lower mold is lowered to open the mold, the unloader 16 waiting at the molded product take-out position D is moved onto the mold 1 and the loading frame 4 is chucked by hand. I do. Then, while holding the loading frame 4, the loading frame 4 is conveyed again to the molded product removal position D,
The chuck is released and the delivery is performed to the second belt transport device 8b. The cleaning device 16a provided in the unloader 16 enters the mold, and
To collect and remove unnecessary resin, dust and the like when retreating.

The loading frame 4 conveyed to the molded product take-out position D performs a gate break by relatively rotating the wire diode 2 and the unnecessary resin by a gate break mechanism, and the cull, runner, and gate are integrated. The separated unnecessary resin and the wire diode 2 are separated. Then, after the gate break, the loading frame 4 operates the second belt drive motor 10b to transport the unnecessary resin to the unnecessary resin collecting position E while remaining on the belt 9 of the second belt transport device 8b. Unnecessary resin collection position E
In the state described above, the third belt drive motor 10c is operated to move the loading frame 4 to the belt of the third belt conveying device 8c in a state where the unnecessary resin after the gate break is chucked by the hand by the unnecessary resin collecting mechanism and kept on standby on the upper side. 9 and is conveyed to the molded article storage position F. Further, the unnecessary resin chucked by the hand is released from the chuck after the loading frame 4 is moved, falls downward, is conveyed by the conveyor, and is collected in the scrap box 48. When the loading frame 4 is transported to the molded product storage position F, the next loading frame 4 on which the molded product is placed is taken out to the molded product take-out position D by the unloader 16 and gate break is performed. Is transported to the unnecessary resin collecting position E, and the unnecessary resin collecting operation is performed.

The loading frame 4 conveyed to the molded article storage position F has a storage hand 50 provided on the upper side thereof.
As a result, the molded wire diodes 2 are chucked for each chase and sequentially discharged to the discharge jig 51. When the collection of all the wire diodes 2 placed on the loading frame 4 is completed, the emptying loading frame 4 is moved to the elevating position G by the moving cylinder 14, and the delivery to the elevator mechanism 12 is performed. Further, the next loading frame 4 on which the wire diode 2 after the gate break is placed is transported to the molded product storage position F.

Elevator mechanism 1 waiting at the top of the device
The loading frame 4 placed on the second elevation table is moved down the elevation table and transferred to a fourth belt transport device 8d provided at the bottom of the device. Then, by operating the fourth belt drive motor 10d, the loading frame 4 placed on the belt 9 of the fourth belt transport device 8d is transported to the elevating position H, and is delivered to the elevator mechanism 11.

Elevator mechanism 1 waiting at the bottom of the device
The loading frame 4 placed on the first elevation table is raised by the elevation table, moved to the standby position I by the moving cylinder 13, and received by the fifth belt transport device 8e provided at the upper part of the device. Passed. Then, after waiting for the supply order by the wire supply device 6, the fifth belt drive motor 10e is operated to be transported again to the molded article supply position A by the fifth belt transport device 8e, and the same orbital movement operation is repeated.

The orbiting path of the loading frame 4 may be orbited on the same plane. However, as in this embodiment, the mold bottom is used by using the bottom of the apparatus as a moving space via the elevator mechanisms 11 and 12. The work space for loading and unloading the mold 1 can be effectively utilized.

According to the above configuration, the slide chuck 26 holds the vicinity of the other end of the wire diode 2 which is aligned and held on the rack 17 with reference to one end at a pitch corresponding to the groove of the wire rod mounting portion of the loading frame 4. Then, since the wire diode 2 is configured to be transferred to the loading frame 4, the wire diode 2 can be positioned with high precision in the longitudinal direction and transferred to the loading frame 4. In addition, since the fixed slide plates 38a and 38b and the movable slide plate 38c are combined to chuck the wire diode 2, the pitch of the wire is narrow, and even when a large amount of wire is chucked and supplied, the chuck space is small. As a result, the yield of the wire rod accommodating part is improved, the work efficiency is good, and the wire rod can be chucked at at least three points, so that the wire rod can be reliably chucked without dropping. Especially the movable slide plate 3
8c, by forming a comb-shaped protrusion 38d continuously by wire-cutting a thin metal plate, the protrusion 38d is made elastic, and even if the tolerance of the wire diameter varies, the protrusion 38d is elastically deformed. This can be absorbed and reliably held. Further, the rack holder 20 is equipped with a wire detection mechanism 30 for detecting the bending of the wire diode 2, thereby preventing the occurrence of defective products before resin molding and maintaining the quality of the molded products. be able to. In addition, since the configuration is such that the one end in the longitudinal direction of the wire material such as the wire diode 2 is held as a reference and the other end is chucked, delicate electronic components or the like in which a semiconductor element or the like is easily damaged can be handled. It is possible to provide a resin molding device provided with a highly versatile wire supply device. Also, a loading frame orbital moving mechanism 5 for mounting a plurality of loading frames 4 and moving the loading frame 4 from the supply side of the molded article to the supply side of the molded article at a predetermined cycle through the mold die and the unloading side of the molded article.
By combining with, a series of operations such as wire placement, resin molding, gate break, collection of unnecessary resin, storage of molded products, etc. are performed automatically, so that the resin molding process is labor-saving and the machine cycle is shortened. It can contribute to improvement of work efficiency.

In the above-described embodiment, the wire diode 2 is supplied as a wire while being aligned and held on the rack 17 in a state where the wire diode 2 stands at 90 degrees with respect to the horizontal plane. It is good if you lean more. In the above embodiment, the rack holder 2
Reference numeral 0 denotes a configuration in which the rack 17 is held by the molding die 1 for 12 racks corresponding to the amount of resin molding for one time. However, the present invention is not limited to this, and may be larger or smaller than the above.

Although the rack 17 is configured to be forward-forwarded while being delivered to the rack holder 20 and carried to the chuck position by the slide chuck 26, the rack holder 20 may be omitted. For example, FIG.
As shown in (a), the magazine 18 accommodating a plurality of racks 17 may be transported to the chuck position.

The rack 17 is not limited to the one that holds the wire diode 2 therethrough, but may be one that is placed in a V-groove or the like as shown in FIG. 9B. In this case, it is necessary to position and chuck the wire diode 2 placed on the rack 17 by the slide chuck 26. Therefore, as shown in FIG. 9B, the movable wire alignment plates 5 provided on both sides of the rack 17 are provided.
2, the lead end face of the wire diode 2 is abutted and positioned, and then chucked by the slide chuck 26, or the set table 53 on which the rack 17 is placed is tilted at 45 degrees with respect to the horizontal direction to set the lead end. It is desirable that the slide chuck 26 be used to chuck the slide wall 26 after positioning it against the support wall 53a.

The present invention is not limited to the above embodiment. For example, a wire diode is used as a wire, but the present invention can be applied to other wire-like electronic parts. The present invention is not limited to the case in which it is equipped in the molding device, and can be used as a device for arranging and supplying a wire to a loading member alone. Of course, many more modifications can be made without departing from the spirit of the invention. That is.

[0062]

As described above, according to the present invention, the vicinity of the other end of the wire, which is aligned and held on the rack with one end as a reference at a pitch corresponding to the groove of the loading portion of the loading member, is moved by the wire transfer means. Since it is configured to be chucked and transferred to the loading member, the wire can be positioned with high precision in the longitudinal direction and transferred to the loading member, and delicate electronic components and the like in which semiconductor elements and the like are easily damaged can be used. Can also be handled, and a highly versatile wire supply device can be provided. Further, when the wire rod transfer means is configured to chuck a wire by combining a plurality of fixed and movable slide plates, the chuck space is small even when the wire pitch is narrow and a large amount of wire is chucked and supplied. As a result, the yield of the wire rod accommodating part is improved, the work efficiency is good, and the wire rod can be chucked at least at three points, so that the wire rod can be reliably chucked without dropping. In particular, the movable slide plate is made by cutting a thin metal plate with a wire, and by continuously forming comb-shaped projections, the projections have elasticity. The deformation can absorb this and securely hold it. Further, in the case where the wire accommodating portion is provided with a defective product detecting means for detecting bending of the wire, for example, in a resin molding apparatus, occurrence of a defective product is prevented before resin molding, and the quality of the molded product is reduced. Can be maintained.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of a resin molding device provided with a wire supply device.

FIG. 2 is a side view of the wire supply device.

FIG. 3 is an explanatory diagram of a defective wire detection mechanism in the rack alignment mechanism.

FIG. 4 is an explanatory view showing a rectangular movement mechanism of a rack holder.

FIG. 5 is a front view and a side view showing a configuration of a sliding hand.

FIG. 6 is an enlarged explanatory view of a movable slide plate.

FIG. 7 is an explanatory diagram of a chuck operation of the slide member.

FIG. 8 is an explanatory diagram showing a transfer operation of the slide chuck.

FIG. 9 is an explanatory diagram showing another configuration of the wire rod accommodating portion.

FIG. 10 is an explanatory view of a conventional rack and a supply mechanism of a wire held by the rack.

[Explanation of symbols]

A Molded article supply position B Chuck position C Molding position D Molded article take-out position E Unnecessary resin collecting position F Molded article storage position G, H Elevating position I Stand-by position 1 Mold die 2 Wire diode 3 Tablet holder 4 Loading frame 4a, 4b Supporting part 4c Loading plate 4d Base plate 4e, 4f Wire guide 5 Loading frame circulating movement mechanism 6 Wire feeder 7 Molded product take-out part 8a, 8b, 8c, 8d, 8e Belt transporter 9 Belt 10a, 10b, 10c, 10d , 10e Belt drive motor 11, 12 Elevator mechanism 13, 14 Moving cylinder 15 In loader 16 Unloader 16a Cleaning device 17 Rack 18 Magazine 19a Rack discharge mechanism 19b Magazine discharge mechanism 20 Lead holder 20a Fixed side holding 20b Moving-side holder 20c, 20d Rack holding groove 21 Magazine transfer mechanism 21a, 23a, 25a Hand 22 Elevator mechanism 22a Elevation table 23 Rack transfer mechanism 24 Rack holding table 24a, 25c Support point 24b, 32a, 45 Vertical cylinder 24c Horizontal support Rod 25 Rack alignment mechanism 25b Rotating cylinder 26 Slide chuck 27 Moving body 28a, 28b Ball screw 29a X-direction drive motor 29b Y-direction drive motor 30 Wire detection mechanism 30a Upright wall 30b Rotation axis 30c Slit 30d Slit plate 30e Detecting piece 30f, 37a, 37b Photosensor 31 Support leg 32 Base plate 33 Movable plate 34 Vertical guide rod 35 Horizontal cylinder 36 Horizontal guide rod 38 Slide member 38a, 3 b Fixed slide plate 38c Movable slide plate 38d Projection 38e Wire holding portion 39 Movable plate drive cylinder 40 Rotating arm 41 Rotation shaft 42 Mounting plate 43 Boss portion 44 Rotating cylinder 46 Dummy wire supply device 47 Unnecessary resin collecting portion 48 Scrap box 49 Molded product storage section 50 Storage hand 51 Discharge jig 52 Wire alignment plate 53 Set table 53a Support wall

Claims (4)

[Claims] 1. A wire feeder which supplies a plurality of wires to a loading member in an aligned manner, wherein a plurality of racks for holding the plurality of wires on the basis of one longitudinal end in accordance with a pitch of a mounting portion of the loading member. A wire accommodating portion for accommodating, and wire material transfer means for holding the vicinity of the other end of the plurality of wires held in the rack accommodated in the wire material accommodating portion and transferring the wires to the loading member; The mounting means includes a plurality of slide members having comb-shaped protrusions formed at substantially the same pitch as each other, and the protrusions of the respective slide members are caused to enter between the wires held in the rack of the wire receiving portion. A part of the wire rod is slid from one side to the other, and the vicinity of the other end of each wire rod is sandwiched from both sides to be held and transferred to the loading member. 2. The wire feeder according to claim 1, wherein the wire housing is provided with a defective product detecting means for detecting a bent wire. 3. The slide member is provided with fixed slide plates on both sides of a movable slide plate, and a projection of the slide member is caused to enter between wires held by a rack.
After moving the slide member so that one side of the wire abuts against the fixed slide plate, the movable slide member is slid to abut on the other side of the wire, thereby pressing the wire end near the both sides from both sides. 3. The wire feeder according to claim 1, wherein the wire is supplied. 4. The wire feeder according to claim 1, wherein said slide member has flexible comb-shaped protrusions formed at substantially the same pitch. apparatus.