JPH10335387A - Producing device for semiconductor device - Google Patents
Producing device for semiconductor deviceInfo
- Publication number
- JPH10335387A JPH10335387A JP15801397A JP15801397A JPH10335387A JP H10335387 A JPH10335387 A JP H10335387A JP 15801397 A JP15801397 A JP 15801397A JP 15801397 A JP15801397 A JP 15801397A JP H10335387 A JPH10335387 A JP H10335387A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- solder ball
- film substrate
- semiconductor device
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＢＧＡ型半導体装置
の製造装置に関する。The present invention relates to an apparatus for manufacturing a BGA type semiconductor device.
【０００２】[0002]
【従来の技術】多ピンの半導体パッケージとしてＢＧＡ
（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）が注目されてい
る。また、ＢＧＡ半導体装置には半導体チップと、導体
パタ−ンを有する絶縁フィルム基板との熱膨張差を吸収
するエラストマ−を設け、該エラストマ−を介して片面
側に前記半導体チップ、他面側に前記絶縁フィルム基板
が設けられ、且つ絶縁フィルム基板の導体パタ−ンに通
じる半田ボ−ルが設けられている。2. Description of the Related Art BGA as a multi-pin semiconductor package
(Ball Grid Array) is attracting attention. Further, the BGA semiconductor device is provided with an elastomer for absorbing a difference in thermal expansion between a semiconductor chip and an insulating film substrate having a conductor pattern, and the semiconductor chip is provided on one side and the semiconductor chip is provided on the other side via the elastomer. The insulating film substrate is provided, and a solder ball communicating with a conductor pattern of the insulating film substrate is provided.
【０００３】かかるＢＧＡ型半導体装置では、絶縁フィ
ルム基板は機械的強度が低いので、例えば半田ボ−ルを
絶縁フィルム基板側に形成したヴィアホ−ルに載置する
工程で撓み、半田ボ−ル供給装置のマスクとのクリアラ
ンスが部分的に大きくなって、半田ボ−ルが前記ヴィア
ホ−ルへ載置されなかったり、あるいは部分的に過剰に
載置され、半田ボ−ルの載置作業に支障をきたして生産
性が低下している。In such a BGA type semiconductor device, since the insulating film substrate has low mechanical strength, for example, the solder ball is bent in a step of mounting on a via hole formed on the insulating film substrate side, and the solder ball is supplied. The clearance between the mask of the apparatus and the solder ball is partially increased, so that the solder ball is not placed on the via hole or is partially placed excessively, which hinders the work of placing the solder ball. And productivity has declined.
【０００４】エラストマ−を設ける半導体装置では、当
該エラストマ−はゲル状にしたものを塗布して設置する
ことから、その厚みは必ずしも精度がよくなく、塗布し
たエラストマ−により厚みに差異がでる。それ故に半導
体チップの高さが同一にならず半田ボ−ルの載置時に、
他より高く出た半導体チップは支承材に強く当接し損傷
することがある。In a semiconductor device provided with an elastomer, since the elastomer is applied after being applied in the form of a gel, its thickness is not always accurate, and the thickness differs depending on the applied elastomer. Therefore, the height of the semiconductor chip does not become the same and when placing the solder ball,
A semiconductor chip that is raised higher than others may come into strong contact with the support material and be damaged.
【０００５】[0005]
【この発明が解決しようとする課題】機械的強度の低い
フレキシブルな絶縁フィルムを基板とするＢＧＡ型半導
体装置の製造工程では、当該絶縁フィルム基板が撓むこ
とから前記のように半田ボ−ルを載置する際に整列不良
あるいは過ボ−ルと言った不首尾を生じる。また、所定
箇所に整列し直すのに時間を要し生産性が低下する。さ
らに、撓んで下方に位置する部品例えば半導体チップが
作業テ−ブル等に剛直的に当接し、傷つき商品価値を損
なう等の問題となる。In the process of manufacturing a BGA type semiconductor device using a flexible insulating film having low mechanical strength as a substrate, the solder ball is bent as described above because the insulating film substrate is bent. Failure to align or overball when placing. In addition, it takes time to re-align at a predetermined location, and the productivity is reduced. Furthermore, there is a problem in that a component, for example, a semiconductor chip, which is bent downward and rigidly contacts the work table or the like, is damaged, and the commercial value is impaired.
【０００６】本発明は、絶縁フィルム基板を有するＢＧ
Ａ型半導体装置の製造において、半田ボ−ルを整列不良
や過ボ−ルを生じることなく、また半導体チップを損傷
することなく、絶縁フィルム基板の導体パタ−ンに通じ
るヴィアホ−ルに確実に生産性よく載置する装置を目的
とする。The present invention relates to a BG having an insulating film substrate.
In the manufacture of an A-type semiconductor device, a solder ball is surely formed on a via hole communicating with a conductor pattern of an insulating film substrate without causing misalignment or overball, and without damaging a semiconductor chip. The purpose of the device is to place it with high productivity.
【０００７】[0007]
【課題を解決するための手段】本発明の要旨は、導体パ
タ−ンを有する絶縁フィルム基板の片面側に半導体チッ
プを設け、他面側に前記導体パタ−ンに通じるヴィアホ
−ルに半田ボ−ルを設ける半導体装置を製造する装置に
おいて、前記半導体チップを入れ込む凹部を形成した半
導体装置載置テ−ブルと、前記凹部内に前記半導体チッ
プを垂下させることなく支える弾性能を有するバックア
ップ材を設けるとともに、上方に半田ボ−ル供給装置を
設けた半導体装置の製造装置にある。The gist of the present invention is to provide a semiconductor chip on one side of an insulating film substrate having a conductor pattern, and a solder ball on a via hole communicating with the conductor pattern on the other side. A semiconductor device mounting table in which a recess for receiving the semiconductor chip is formed, and a backup material having elasticity for supporting the semiconductor chip in the recess without suspending the semiconductor chip. And a semiconductor device manufacturing apparatus provided with a solder ball supply device above.
【０００８】[0008]
【発明の実施の形態】本発明について１実施例に基づき
図面を参照して説明する。まず本発明が適用する半導体
装置について図２に基づき述べる。図面において、１は
導体パタ−ンを有する絶縁フィルム基板で、フレキシブ
ルである。該絶縁フィルム基板１に絶縁性接着材例えば
エラストマ−２を介して半導体チップ３が設けられてい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described based on an embodiment with reference to the drawings. First, a semiconductor device to which the present invention is applied will be described with reference to FIG. In the drawings, reference numeral 1 denotes an insulating film substrate having a conductor pattern, which is flexible. The semiconductor chip 3 is provided on the insulating film substrate 1 via an insulating adhesive such as an elastomer-2.
【０００９】４は前記絶縁フィルム基板１の他面側に接
着した絶縁フィルムで、前記導体パタ−ンに通じるヴィ
アホ−ル５が形成されている。該ヴィアホ−ル５に半田
ボ−ル６を載置して、その後、当該半田ボ−ル６を溶着
し外部接続端子とする。Reference numeral 4 denotes an insulating film adhered to the other surface of the insulating film substrate 1, and a via hole 5 communicating with the conductor pattern is formed. A solder ball 6 is placed on the via hole 5, and then the solder ball 6 is welded to form an external connection terminal.
【００１０】ところで、半田ボ−ル６を絶縁フィルム基
板１のヴィアホ−ル５に載置するために、半導体チップ
３をエラストマ−２を介して設けた絶縁フィルム基板１
は、図１に示すように半田ボ−ル供給装置の半導体装置
載置テ−ブル７に置かれる。Incidentally, in order to place the solder ball 6 on the via hole 5 of the insulating film substrate 1, the insulating film substrate 1 provided with the semiconductor chip 3 via the elastomer-2 is provided.
Is placed on a semiconductor device mounting table 7 of the solder ball supply device as shown in FIG.
【００１１】該半導体装置載置テ−ブル７には出っ張っ
ている前記半導体チップ３が当たらないように凹部８が
形成されている。A recess 8 is formed on the semiconductor device mounting table 7 so that the protruding semiconductor chip 3 does not hit the table.
【００１２】半導体装置載置テ−ブル７に置かれた半導
体装置を構成する絶縁フィルム基板１は、機械的強度が
低いので半導体チップ３等の重み及び自重により撓み、
上方に設けられた半田ボ−ル供給装置９のマスク１０と
のクリアランスが中央部及びその近傍で他より大きくな
る。これが起因して半田ボ−ル６がヴィアホ−ル５に載
置されずに落下し整列不良となったり、あるいは過剰に
半田ボ−ル６が載置されたりする。これを防ぐために半
導体装置載置テ−ブル７の凹部８内に弾性能を有するバ
ックアップ材１１、例えばシリコン樹脂、軟質合成樹
脂、ゴム材あるいはクッション材を設けた板等を設置し
ている。Since the insulating film substrate 1 constituting the semiconductor device placed on the semiconductor device mounting table 7 has low mechanical strength, it is bent by the weight of the semiconductor chip 3 and the like and its own weight.
The clearance between the solder ball supply device 9 provided above and the mask 10 is larger in the central portion and in the vicinity thereof than in the other portions. As a result, the solder ball 6 falls without being placed on the via hole 5, resulting in poor alignment, or the solder ball 6 is excessively placed. In order to prevent this, a backup material 11 having elasticity, for example, a plate provided with a silicone resin, a soft synthetic resin, a rubber material or a cushion material is provided in the concave portion 8 of the semiconductor device mounting table 7.
【００１３】該バックアップ材１１は、前記絶縁フィル
ム基板１が撓んで中央部が垂下するのを元に矯正する高
さに設置され、この高さ設定は前記絶縁フィルム基板１
の撓み、半導体チップ３及びエラストマ−２の厚みを予
め知ることによりなされる。該バックアップ材１１の設
置により半田ボ−ル供給装置９のマスク１０と絶縁フィ
ルム基板１とのクリアランスが常に一定に保たれる。な
お、１２は半導体装置を半導体装置載置テ−ブル７にセ
ットするためのマウントフレ−ムである。The backup material 11 is installed at a height that corrects based on the fact that the insulating film substrate 1 bends and the center part hangs down.
Of the semiconductor chip 3 and the thickness of the elastomer 2 in advance. By providing the backup material 11, the clearance between the mask 10 of the solder ball supply device 9 and the insulating film substrate 1 is always kept constant. Reference numeral 12 denotes a mount frame for setting the semiconductor device on the semiconductor device mounting table 7.
【００１４】本発明の１実施例の構成は前記のようであ
り、次に作用について述べる。半導体チップ３を片面側
に設けた絶縁フィルム基板１は、他面側のヴィアホ−ル
５に半田ボ−ル６を載置するために、半田ボ−ル供給装
置９の下方に設けられた半導体装置載置テ−ブル７に置
かれる。このとき、絶縁フィルム基板１は前記半導体チ
ップ３等の重さ及び自重により撓み下方に変形しようと
するが、これを前記半導体装置載置テ−ブル７の凹部８
に設けたバックアップ材１１が阻止して水平に位置せし
め、半田ボ−ル供給装置９のマスク１０とのクリアラン
スが一定に保たれる。これにより、半田ボ−ル供給装置
９から半田ボ−ル６がヴィアホ−ル５に確実に且つ生産
性よく載置される。The structure of one embodiment of the present invention is as described above, and the operation will now be described. The insulating film substrate 1 on which the semiconductor chip 3 is provided on one side is provided with a semiconductor provided below the solder ball supplying device 9 for mounting the solder ball 6 on the via hole 5 on the other side. It is placed on the device mounting table 7. At this time, the insulating film substrate 1 bends due to the weight of the semiconductor chip 3 and the like and its own weight, and tends to be deformed downward, but this is changed to the concave portion 8 of the semiconductor device mounting table 7.
The back-up material 11 provided in the above is prevented from being positioned horizontally, and the clearance between the solder ball supply device 9 and the mask 10 is kept constant. As a result, the solder balls 6 from the solder ball supply device 9 are securely and efficiently mounted on the via holes 5.
【００１５】[0015]
【発明の効果】本発明は前述のようであるから、半田ボ
−ルが例え微小球であっても絶縁フィルム基板側に設け
たヴィアホ−ルに整列不良や過ボ−ルを生じることな
く、且つ作業性、生産性ともよく載置される。また、半
導体チップがバックアップ材に当接しても損傷するよう
なことはない。According to the present invention as described above, even if the solder balls are microspheres, the via holes provided on the insulating film substrate side do not cause misalignment or overball. In addition, the workability and productivity are well placed. Further, even if the semiconductor chip comes into contact with the backup material, no damage is caused.
【図１】本発明の１実施例を示す図。FIG. 1 is a diagram showing one embodiment of the present invention.
【図２】本発明の１実施例で適用する半導体装置を示す
図。FIG. 2 is a diagram showing a semiconductor device applied in one embodiment of the present invention.
１ 絶縁フィルム基板 ２ エラストマ− ３ 半導体チップ ４ 絶縁フィルム ５ ヴィアホ−ル ６ 半田ボ−ル ７ 半導体装置載置テ−ブル ８ 凹部 ９ 半田ボ−ル供給装置 １０ マスク １１ バックアップ材 １２ マウントフレ−ム REFERENCE SIGNS LIST 1 insulating film substrate 2 elastomer 3 semiconductor chip 4 insulating film 5 via hole 6 solder ball 7 semiconductor device mounting table 8 recess 9 solder ball supply device 10 mask 11 backup material 12 mount frame
Claims (1)
の片面側に半導体チップを設け、他面側に前記導体パタ
−ンに通じるヴィアホ−ルに半田ボ−ルを設ける半導体
装置の製造装置において、前記半導体チップを入れ込む
凹部を形成した半導体装置載置テ−ブルと、前記凹部内
に前記半導体チップを垂下させることなく支える弾性能
を有するバックアップ材を設けるとともに、上方に半田
ボ−ル供給装置を設けたことを特徴とする半導体装置の
製造装置。1. A semiconductor device manufacturing apparatus comprising: a semiconductor chip provided on one side of an insulating film substrate having a conductor pattern; and a solder ball provided on a via hole communicating with the conductor pattern on the other side. A semiconductor device mounting table formed with a concave portion for receiving the semiconductor chip, a backup material having elasticity for supporting the semiconductor chip without hanging down in the concave portion, and supplying a solder ball upward; An apparatus for manufacturing a semiconductor device, comprising: an apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15801397A JP3378771B2 (en) | 1997-05-30 | 1997-05-30 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15801397A JP3378771B2 (en) | 1997-05-30 | 1997-05-30 | Semiconductor device manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10335387A true JPH10335387A (en) | 1998-12-18 |
| JP3378771B2 JP3378771B2 (en) | 2003-02-17 |
Family
ID=15662371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15801397A Expired - Fee Related JP3378771B2 (en) | 1997-05-30 | 1997-05-30 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3378771B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7514768B2 (en) * | 1998-08-18 | 2009-04-07 | Oki Electric Industry Co., Ltd. | Package structure for a semiconductor device incorporating enhanced solder bump structure |
| CN102610535A (en) * | 2011-01-21 | 2012-07-25 | 三星半导体(中国)研究开发有限公司 | Ball attachment device, solder ball picking method and solder ball mounting method |
-
1997
- 1997-05-30 JP JP15801397A patent/JP3378771B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7514768B2 (en) * | 1998-08-18 | 2009-04-07 | Oki Electric Industry Co., Ltd. | Package structure for a semiconductor device incorporating enhanced solder bump structure |
| CN102610535A (en) * | 2011-01-21 | 2012-07-25 | 三星半导体(中国)研究开发有限公司 | Ball attachment device, solder ball picking method and solder ball mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3378771B2 (en) | 2003-02-17 |
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