KR20050034877A - Apparatus for loading semiconductor wafer to chemical mechanical polishing apparatus - Google Patents
Apparatus for loading semiconductor wafer to chemical mechanical polishing apparatus Download PDFInfo
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- KR20050034877A KR20050034877A KR1020030070636A KR20030070636A KR20050034877A KR 20050034877 A KR20050034877 A KR 20050034877A KR 1020030070636 A KR1020030070636 A KR 1020030070636A KR 20030070636 A KR20030070636 A KR 20030070636A KR 20050034877 A KR20050034877 A KR 20050034877A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
본 발명의 반도체웨이퍼 로딩장치는, 화학적기계적평탄화장치의 헤드표면에 반도체웨이퍼를 부착시키기 위한 것이다. 이 반도체웨이퍼 로딩장치는 웨이퍼지지대, 및 업/다운 실리더를 포함하여 구성된다. 웨이퍼지지대는, 반도체웨이퍼를 지지하되, 반도체웨이퍼의 가장자리를 따라 접촉하고 반도체웨이퍼의 가장자리를 제외한 나머지 부분에서는 반도체웨이퍼와 접촉되지 않는다. 업/다운 실린더는, 웨이퍼지지대와 연결되며 상승운동 또는 하강운동을 하여 웨이퍼지지대가 수직운동을 할 수 있도록 한다.The semiconductor wafer loading apparatus of the present invention is for attaching a semiconductor wafer to the head surface of the chemical mechanical leveling apparatus. This semiconductor wafer loading apparatus includes a wafer support and an up / down cylinder. The wafer support supports the semiconductor wafer, but contacts along the edge of the semiconductor wafer and does not contact the semiconductor wafer at portions other than the edge of the semiconductor wafer. The up / down cylinder is connected to the wafer support and moves up or down to allow the wafer support to vertically move.
Description
본 발명은 화학적기계적평탄화장치에 관한 것으로서, 특히 화학적기계적평탄화장치의 헤드로 반도체웨이퍼를 로딩하는 반도체웨이퍼 로딩장치에 관한 것이다.The present invention relates to a chemical mechanical leveling device, and more particularly, to a semiconductor wafer loading device for loading a semiconductor wafer into the head of the chemical mechanical leveling device.
최근 반도체기술의 집적도 증가와 함께 구리배선기술의 발달과 더불어서, 기계적 제거가공과 화학적인 제거가공을 하나의 가공방법으로 혼합한 화학적기계적평탄화(CMP; Cjemical Mechanical Polishing)공정의 적용분야가 점점 넓어지고 있는 추세이다. CMP공정을 수행하는 CMP장치는, 반도체웨이퍼의 표면을 연마시키는 패드(pad)와, 반도체웨이퍼가 부착되는 헤드(head)를 포함하여 구성된다. 헤드는, 표면장력 또는 진공을 이용하여 반도체웨이퍼를 부착시키고, 부착된 반도체웨이퍼가 패드표면상에 적절하게 위치되도록 하는 한편 CMP공정동안에는 반도체웨이퍼에 회전운동 및 요동운동을 발생시킨다. 한편 상기 헤드에 반도체웨이퍼를 부착시키기 위해서는 적절한 이동수단을 사용하여야 하는데, 이때 사용하는 이동수단이 바로 반도체웨이퍼의 로딩장치이다.With the recent increase in the degree of integration of semiconductor technology and the development of copper wiring technology, the field of application of the CMP (Cjemical Mechanical Polishing) process, which combines mechanical removal and chemical removal into one processing method, has become wider. There is a trend. The CMP apparatus for performing the CMP process includes a pad for polishing the surface of the semiconductor wafer and a head to which the semiconductor wafer is attached. The head attaches the semiconductor wafer using surface tension or vacuum and allows the attached semiconductor wafer to be properly positioned on the pad surface while generating rotational and oscillatory motions in the semiconductor wafer during the CMP process. Meanwhile, in order to attach the semiconductor wafer to the head, an appropriate moving means must be used, and the moving means used here is the loading device of the semiconductor wafer.
도 1 및 도 2는 종래의 반도체웨이퍼 로딩장치를 이용하여 반도체웨이퍼를 화학적기계적평탄화장치의 헤드에 부착시키는 과정을 설명하기 위하여 나타내 보인 도면들이다.1 and 2 illustrate a process of attaching a semiconductor wafer to a head of a chemical mechanical planarization apparatus using a conventional semiconductor wafer loading apparatus.
도 1을 참조하면, 종래의 반도체웨이퍼 로딩장치는, 반도체웨이퍼(200)를 지지하는 웨이퍼지지대(140)와, 이 웨이퍼지지대(140)를 상승 또는 하강시키기 위한 업/다운 실린더(up/down cylinder)(150)를 포함하여 구성된다. 웨이퍼지지대(140)와 업/다운 실린더(150)는 직접 연결될 수도 있으나 통상적으로 별도의 연결부(160)를 구비할 수도 있다. 업/다운 실린더(150)은 상승운동 또는 하강운동을 하며, 이에 연동되어 웨이퍼지지대(140) 또한 상승운도 또는 하강운동을 할 수 있다. 웨이퍼지지대(140)는, 원방형으로 형성되며, 웨이퍼지지대(140)의 모든 표면이 반도체웨이퍼(200)의 표면과 접촉된다.Referring to FIG. 1, a conventional semiconductor wafer loading apparatus includes a wafer support 140 for supporting a semiconductor wafer 200, and an up / down cylinder for raising or lowering the wafer support 140. And 150). The wafer support 140 and the up / down cylinder 150 may be directly connected, but may also be provided with a separate connection unit 160. The up / down cylinder 150 moves up or down, and in conjunction with the wafer support 140, the up / down cylinder 150 may also move up or down. The wafer support 140 is formed in a rectangular shape, and all surfaces of the wafer support 140 are in contact with the surface of the semiconductor wafer 200.
업/다운 실린더(150)가 상승운동을 하게 되면, 웨이퍼지지대(140)도 또한 상승운동을 하게 되고, 결과적으로 반도체웨이퍼(200)도 상승된다. 반도체웨이퍼(200)가 상승됨에 따라 헤드에 부착된다. 헤드몸체(110)에 부착되어 프레임(112)에 의해 지지되는 척킹플레이트(chuck plate)(120)는 아래 방향을 향해 돌출되는 돌출부를 가지고 있고 그 돌출부 표면에는 진공홀(vacuum hole)(130)이 위치한다. 상승된 반도체웨이퍼(200)는, 도 2에 도시된 바와 같이, 척킹플레이트(120)의 진공홀(130)에 부착되는데, 이때 도면에서 화살표로 표시한 바와 같이, 웨이퍼지지대(140)에 접한 반도체웨이퍼(200)의 중심부에는 이동방향으로의 압력을 받으며, 이 압력에 의해 반도체웨이퍼(200)와 척킹플레이트의 진공홀(130)이 접하는 부분(도면에서 A로 표시한 부분)에서 스트레스가 발생되어 반도체웨이퍼(200)가 파손될 수 있다.When the up / down cylinder 150 moves up, the wafer support 140 also moves up, and as a result, the semiconductor wafer 200 is raised. As the semiconductor wafer 200 is raised, it is attached to the head. The chuck plate 120 attached to the head body 110 and supported by the frame 112 has a protrusion projecting downward, and a vacuum hole 130 is formed on the surface of the protrusion. Located. As shown in FIG. 2, the raised semiconductor wafer 200 is attached to the vacuum hole 130 of the chucking plate 120, as indicated by arrows in the figure, and the semiconductor in contact with the wafer support 140. The center of the wafer 200 receives a pressure in the moving direction, and the pressure is generated in the portion where the semiconductor wafer 200 and the vacuum hole 130 of the chucking plate are in contact with each other (indicated by A in the drawing). The semiconductor wafer 200 may be damaged.
본 발명이 이루고자 하는 기술적 과제는, 화학적기계적평탄화장치의 헤드에 반도체웨이퍼를 부착시키는 과정에서 반도체웨이퍼에 대한 스트레스 발생을 억제시켜서 반도체웨이퍼의 파손이 발생되지 않도록 하는 반도체웨이퍼 로딩장치를 제공하는 것이다.SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a semiconductor wafer loading device which prevents breakage of a semiconductor wafer by suppressing stress on the semiconductor wafer in the process of attaching the semiconductor wafer to the head of the chemical mechanical leveling device.
상기 기술적 과제를 달성하기 위하여, 본 발명의 일 실시예에 따른 반도체웨이퍼 로딩장치는, 화학적기계적평탄화장치의 헤드표면에 반도체웨이퍼를 부착시키기 위한 반도체웨이퍼 로딩장치에 있어서, 상기 반도체웨이퍼를 지지하되, 상기 반도체웨이퍼의 가장자리를 따라 접촉하고 반도체웨이퍼의 가장자리를 제외한 나머지 부분에서는 상기 반도체웨이퍼와 접촉되지 않는 웨이퍼지지대; 및 상기 웨이퍼지지대와 연결되며 상승운동 또는 하강운동을 하여 상기 웨이퍼지지대가 수직운동을 할 수 있도록 하는 업/다운 실린더를 구비하는 것을 특징으로 한다.In order to achieve the above technical problem, the semiconductor wafer loading apparatus according to an embodiment of the present invention, in the semiconductor wafer loading apparatus for attaching the semiconductor wafer to the head surface of the chemical mechanical flattening apparatus, support the semiconductor wafer, A wafer support contacting along the edge of the semiconductor wafer and not in contact with the semiconductor wafer at portions other than the edge of the semiconductor wafer; And an up / down cylinder connected to the wafer support and configured to allow the wafer support to vertically move by moving up or down.
상기 웨이퍼지지대는 원형이며, 상기 원형의 가장자리부만 상부로 돌출되는 형상을 갖는 것이 바람직하다.The wafer support is circular, and preferably has a shape in which only the edge of the circular portion protrudes upward.
본 발명에 있어서, 상기 웨이퍼지지대와 상기 업/다운 실리더를 연결하여 상기 웨이퍼지지대와 상기 업/다운 실린더가 상호 연동되도록 하는 연결부를 더 구비할 수도 있다.In the present invention, the wafer support and the up / down cylinder may be further connected to each other so that the wafer support and the up / down cylinders interlock with each other.
이하 첨부도면을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 그러나 본 발명의 실시예들은 여러가지 다른 형태들로 변형될 수 있으며, 따라서 본 발명의 범위가 아래에서 상술되는 실시예들로 한정되는 것으로 해석되어져서는 안된다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms and, therefore, the scope of the present invention should not be construed as limited to the embodiments described below.
도 3은 본 발명에 따른 반도체웨이퍼 로딩장치와 이를 이용하여 반도체웨이퍼를 화학적기계적평탄화장치의 헤드에 부착시키는 과정을 설명하기 위하여 나타내 보인 도면이다.3 is a view showing a semiconductor wafer loading apparatus according to the present invention and a process of attaching the semiconductor wafer to the head of the chemical mechanical planarization apparatus using the same.
도 3을 참조하면, 본 발명에 따른 반도체웨이퍼 로딩장치는, 반도체웨이퍼(200)를 지지하는 웨이퍼지지대(340)와, 이 웨이퍼지지대(340)를 상승 또는 하강시키기 위한 업/다운 실린더(up/down cylinder)(350)를 포함하여 구성된다. 웨이퍼지지대(340)와 업/다운 실린더(350)는 직접 연결될 수도 있으나 통상적으로 별도의 연결부(360)를 구비할 수도 있다. 이 연결부(360)에 의해 상호 연결되는 웨이퍼지지대(340)와 업/다운 실린더(350)는 상호 연동된다. 즉 업/다운 실린더(350)은 상승운동 또는 하강운동을 하며, 이에 연동되어 웨이퍼지지대(340) 또한 상승운도 또는 하강운동을 할 수 있다.Referring to FIG. 3, the semiconductor wafer loading apparatus according to the present invention includes a wafer support 340 for supporting a semiconductor wafer 200, and an up / down cylinder for raising or lowering the wafer support 340. down cylinder 350). The wafer support 340 and the up / down cylinder 350 may be directly connected, but may also be provided with a separate connection portion 360. The wafer support 340 and the up / down cylinder 350 which are interconnected by the connection part 360 interlock with each other. That is, the up / down cylinder 350 moves up or down, and in conjunction with this, the wafer support 340 may also move up or down.
웨이퍼지지대(340)는, 원방형으로 형성되는데, 반도체웨이퍼(200)가 부착되는 표면은 동일평면상에 놓여있지 않고 가장자리와 그 안쪽 부분이 다른 평면상에 위치한다. 즉 웨이퍼지지대(340)의 가장자리에는 상부로 돌출되는 돌출부(342)가 형성되며, 그 밖의 나머지 부분(340)은 평평한 형상을 갖는다. 상기 돌출부(342)는 반도체웨이퍼(200)의 가장자리에 접하고, 따라서 나머지 부분(340)은 반도체웨이퍼(200)와 직접 접촉되지 않고 일정간격 이격된다. 결론적으로 반도체웨이퍼(200)는 웨이퍼지지대(340)의 돌출부(342)에만 접촉된다.The wafer support 340 is formed in a rectangular shape. The surface to which the semiconductor wafer 200 is attached is not placed on the same plane, but the edge and the inner portion thereof are located on different planes. That is, a protrusion 342 protruding upward is formed at the edge of the wafer support 340, and the remaining portions 340 have a flat shape. The protrusion 342 is in contact with the edge of the semiconductor wafer 200, so that the remaining portions 340 are spaced apart from each other without being in direct contact with the semiconductor wafer 200. In conclusion, the semiconductor wafer 200 contacts only the protrusion 342 of the wafer support 340.
업/다운 실린더(350)가 상승운동을 하게 되면, 웨이퍼지지대(340)도 또한 상승운동을 하게 되고, 결과적으로 반도체웨이퍼(200)도 상승된다. 반도체웨이퍼(200)가 상승됨에 따라 헤드에 부착된다. 헤드몸체(110)에 부착되어 프레임(112)에 의해 지지되는 척킹플레이트(120)는 아래 방향을 향해 돌출되는 돌출부를 가지고 있고 그 돌출부 표면에는 복수개의 진공홀(130)들이 위치한다. 상승된 반도체웨이퍼(200)는, 도 2에 도시된 바와 같이, 척킹플레이트(120)의 진공홀(130)에 부착되는데, 이때 도면에서 화살표로 표시한 바와 같이, 웨이퍼지지대(340)의 돌출부(342)에만 접촉하는 반도체웨이퍼(200)의 중심부에는 이동방향으로의 압력을 받지 않으며, 따라서 반도체웨이퍼(200)와 척킹플레이트의 진공홀(130)이 접하는 부분에서도 스트레스가 거의 발생되지 않는다. 이는 업/다운 실린더(350)의 상승운동에 의해 발생되는 수직방향으로의 압력이 웨이퍼지지대(340)를 통해 반도체웨이퍼(200)로 전달되는 과정에서, 웨이퍼지지대(340)의 가장자리에 위치한 돌출부(342)에서만 반도체웨이퍼(200)로 전달될 수 있기 때문에, 기존에 반도체웨이퍼(200)의 중심부에 압력이 집중되는 현상이 발생하지 않기 때문이다.When the up / down cylinder 350 moves up, the wafer support 340 also moves up, and as a result, the semiconductor wafer 200 is raised. As the semiconductor wafer 200 is raised, it is attached to the head. The chucking plate 120 attached to the head body 110 and supported by the frame 112 has a protrusion projecting downward, and a plurality of vacuum holes 130 are positioned on the surface of the protrusion. As shown in FIG. 2, the raised semiconductor wafer 200 is attached to the vacuum hole 130 of the chucking plate 120, where the protrusions of the wafer support 340 are indicated by arrows in the drawing. The center portion of the semiconductor wafer 200 which contacts only 342 is not subjected to pressure in the moving direction, and thus stress is hardly generated even in a portion where the semiconductor wafer 200 and the vacuum hole 130 of the chucking plate are in contact with each other. This is because the projection in the vertical direction generated by the upward movement of the up / down cylinder 350 is transferred to the semiconductor wafer 200 through the wafer support 340, a protrusion located at the edge of the wafer support 340 ( Since only 342 may be transferred to the semiconductor wafer 200, the phenomenon in which pressure is concentrated in the center of the semiconductor wafer 200 does not occur.
이상의 설명에서와 같이, 본 발명에 따른 반도체웨이퍼 로딩장치에 의하면, 이 로딩장치의 웨이퍼지지대 가장자리만이 반도체웨이퍼와 접촉됨으로써, 로딩장치와 함께 수직운동을 하는 반도체웨이퍼가 헤드표면에 부착될 때, 반도체웨이퍼와 헤드표면의 스트레스 발생이 현저하게 감소하며, 이에 따라 기존의 높은 압력에 의한 반도체웨이퍼의 파손현상이 억제된다.As described above, according to the semiconductor wafer loading apparatus according to the present invention, when only the edge of the wafer support of the loading apparatus is in contact with the semiconductor wafer, when the semiconductor wafer, which moves vertically together with the loading apparatus, is attached to the head surface, The occurrence of stress on the semiconductor wafer and the head surface is significantly reduced, thereby preventing the damage of the semiconductor wafer due to the existing high pressure.
도 1 및 도 2는 종래의 반도체웨이퍼 로딩장치를 이용하여 반도체웨이퍼를 화학적기계적평탄화장치의 헤드에 부착시키는 과정을 설명하기 위하여 나타내 보인 도면들이다.1 and 2 illustrate a process of attaching a semiconductor wafer to a head of a chemical mechanical planarization apparatus using a conventional semiconductor wafer loading apparatus.
도 3은 본 발명에 따른 반도체웨이퍼 로딩장치와 이를 이용하여 반도체웨이퍼를 화학적기계적평탄화장치의 헤드에 부착시키는 과정을 설명하기 위하여 나타내 보인 도면이다.3 is a view showing a semiconductor wafer loading apparatus according to the present invention and a process of attaching the semiconductor wafer to the head of the chemical mechanical planarization apparatus using the same.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030070636A KR20050034877A (en) | 2003-10-10 | 2003-10-10 | Apparatus for loading semiconductor wafer to chemical mechanical polishing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020030070636A KR20050034877A (en) | 2003-10-10 | 2003-10-10 | Apparatus for loading semiconductor wafer to chemical mechanical polishing apparatus |
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| KR20050034877A true KR20050034877A (en) | 2005-04-15 |
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2003
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