JPH01162519A - Lead shaping device - Google Patents

Abstract

PURPOSE:To arrange all mounted sides on the points of a plurality of leads to prescribed positions by mounting a package of a semiconductor device having a plurality of irregular projected leads on a supporting base, forcing down a pressure member from an upper part until the point parts of a plurality of leads take a specified angle by the contact pieces of the pressure member, then, raising the pressure member. CONSTITUTION:A package 3 of a semiconductor device 2 provided with a plurality of leads such as normal leads 4a and irregularly deformed leads 4b, etc., is mounted on a supporting base 1. Then, the pressure member 5 is forced by the contact piece 5a of its point part down to a position where an angle theta2 formed by mounted sides 4c of the point parts of all the leads 4 and a reference surface P becomes larger than a prescribed angle and kept for a prescribed time, then the pressure member 5 is raised to release the compression of the point of the lead 4 by the contact piece 5a. The irregularly deformed leads 4b are deformed plastically at the root of the package 3 and the point parts are arranged with the regular leads 4a to the reference surface P to improve the flatness of the leads 4.

Description

[Detailed Description of the Invention] [Field of Industrial Application] This invention relates to lead shaping technology, and in particular to a technology that is effective when applied to correcting the flatness of a plurality of leads in a surface-mounted semiconductor device. It is.

[Conventional technology]

For example, in a surface mount type semiconductor device, the leads protruding along the mounting surface are formed into a gull-wing shape, and the lower surface of the lead tip is connected to the mounting board via solder or the like. It is important to align the tips of the plurality of leads within a predetermined reference plane from the viewpoint of reducing soldering variations during mounting work and improving reliability.

For this reason, when cutting and molding leads from a lead frame, for example, the bases of the leads are held from above and below by a mold, etc., and the leads are cut and bent in this state to reduce stress in the package. Efforts are being made to prevent this from occurring while maintaining the flatness of the molded lead to a predetermined precision.

Regarding the mounting technology of surface-mounted semiconductor devices, please refer to Nikkei McGraw-Hill, published June 11, 1984,
“Micro Devices, Nikkei Electronics Special Edition, n.
o, 2J, P148-Pi59.

[Problem that the invention seeks to solve]

However, in general, surface mount type flat packages often have warpage in the package itself, with the center becoming convex. Even if the flatness of the leads is forcibly aligned, the individual leads will tilt due to the deformation of the package that recovers immediately after the mold is opened.
The inventor has discovered that there is a problem that the flatness deteriorates.

An object of the present invention is to provide a lead shaping technique that can improve the flatness of the leads without applying excessive stress to the package.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, this is a lead shaping device for a semiconductor device in which a lead protrudes from a package in a direction along a reference plane, and includes a support base that supports the package or the root portion of the lead protruding from the package from a first direction; A pressing member disposed to be relatively movable in opposing directions and pressing the outer end of the lead in a second direction opposite to the first direction to deform the lead by a predetermined amount. be.

[Effect]

According to the above-mentioned means, for example, the amount of movement of the pressing member in the second direction is set so that a lead that deviates from the reference plane is plastically deformed, and a lead whose tip portion coincides with the reference plane is elastically deformed. Therefore, a plurality of leads can be aligned within the reference plane without causing excessive stress to the package, and the flatness of the leads can be improved.

[Embodiment 1] FIG. 1 is a sectional view showing the main parts of a lead shaping device that is an embodiment of the present invention.

A package 3 of a semiconductor device 2 is supported vertically upward (first direction) on a support stand 1 provided horizontally upward.

This semiconductor device 2 has a surface mount type sealing structure in which a plurality of leads 4 protruding horizontally from each side of a polygonal package 3 are formed into a so-called gull wing shape. The mounting side surface 4c of the distal end of 4 is fixed to a reference plane P1 indicated by a dashed line in FIG.

In this case, the normal leads 4a (second leads) among the plurality of leads 4 of the semiconductor device 2 form a predetermined angle θ1 with the reference plane P, and the four ends of the leads are all aligned with the reference plane P. At the same time, some of the leads 4b (first leads) are deformed to a state where they are lifted from the reference plane P. In this embodiment, the shape of the leads 4b is not normal. It is modified to be the same as the lead 4a.

Above the support base 1, a pressing member 5 having an inverted circular cross section and movable up and down is disposed facing each other, and by the downward movement of the pressing member 5, the abutment piece 5a at the tip causes Normal lead 4a of lead 4 and incorrectly deformed lead 4
b is configured to be pressed vertically downward (second direction), which is opposite to the direction in which the semiconductor device 2 is supported by the support base 1 .

The operation of this embodiment will be explained below.

First, by a transport mechanism (not shown) or the like, the package 3 of the semiconductor device 2 is restrained from displacing the leads 4 with the mounting side surface 4C, which is fixed to the surface of the mounting board at the tip of the lead 4, facing downward. It is placed without any problem. .

Next, by lowering the pressing member 5, the abutting piece 5a at the tip of the pressing member 5 first hits the lead 4b which has been deformed to be lifted from the reference plane P, and further descends while deforming the lead 4b. As a result, the normal lead 4a is also deformed, and as shown in FIG. This state is maintained for a predetermined period of time, and then the pressing operation of the lead 4 by the contact piece 5a is released.

Here, in the case of this embodiment, the magnitude of the angle θ2, that is, the amount of descent of the abutting piece 5a of the pressing member 5, is such that the improperly deformed lead 4b has a predetermined amount at its base relative to the package 3. The lead 4a having a normal shape is set in a range such that plastic deformation occurs and the normally shaped lead 4a is elastically deformed.

Therefore, an excessive stress is not applied to the package 3, and when the pressing operation of the leads 4 by the abutting piece 5a of the pressing member 5 is released, both the deformed and normal leads 4b and the normal leads 4a are brought to the reference plane. The tips of the leads 4 are aligned, and the flatness of the leads 4 is improved.

Note that the angle θ1 between the tip of the lead 4 and the reference plane in the normal state is set small in advance when cutting or shaping the lead 4, so that improperly deformed leads 4b and normal leads 4a can be avoided. It goes without saying that the desired angle θ1 may be formed after the pressing operation by the contact piece 5a is released by plastically deforming both by a predetermined amount.

In this way, the following effects can be obtained in this embodiment.

[l] The lead 4 of the package 3 of the semiconductor device 2 is supported from below by the support 1, and the contact piece 5a of the pressing member 5 that descends with respect to the support 1 protects the normal lead 4a and the illegal lead 4a. Since the structure is such that the deformed lead 4b is elastically or plastically deformed by a predetermined amount at the same time, the lead 4b that has been improperly deformed is By setting the range such that a predetermined amount of plastic deformation occurs at the base of the package 3 and the normally shaped lead 4a is elastically deformed, the flatness of the lead 4 can be improved without generating excessive stress on the package 3. can be improved.

(2) As a result of (1) above, connection failures caused by variations in the flatness of the leads 4 can be avoided during the mounting work of the semiconductor device 2, and the system in which the semiconductor device 2 is incorporated can be improved. Improves sex.

[Embodiment 2] FIG. 3 is a sectional view showing the main parts of a lead shaping device according to another embodiment of the present invention.

In the case of this embodiment, a recess 6a for accommodating the package 3 of the semiconductor device 2 is formed on the upper surface of the support base 6, and the frame-shaped support piece 6b constituting the recess 6a supports the leads 4.
The base portion of the lead 4 is supported, and the flatness of the lead 4 can be improved by the same operation as in the first embodiment.

Furthermore, if the lead 4b of the semiconductor device 2 is deformed in such a way that it protrudes below the reference plane P, the semiconductor device 2 may be inverted as shown in FIG. A similar shaping operation can be performed by placing the lead 4 on the support stand 6 with the mounting side surface 4C of the leading end facing upward.

Incidentally, this also applies to the case of the first embodiment.

[Embodiment 3] FIG. 5 is a sectional view showing the main parts of a lead shaping device which is still another embodiment of the present invention.

In the case of this third embodiment, the lead shaping device is
In the operation test, the test board 7 is provided to electrically connect the semiconductor device 2 to a tester (not shown) that supplies test signals, power, and the like.

That is, the test board 7 is provided with a plurality of U-shaped contact pins 8 having a spring action, corresponding to the plurality of leads 4 of the semiconductor device 2 to be tested.

At the center of the plurality of contact pins 8, a support base 9 is provided that projects from the center and has a recess 9a for accommodating the package 3 of the semiconductor device 2. The structure is such that the tip of the glue 4 is positioned to match each of the plurality of contact pins 8.

At a position facing the test board 7, a pressing member 1O having a reverse circular cross section and a contact piece 10a protruding from its tip is provided so as to be movable up and down. The leads 4 of the semiconductor device 2 are sandwiched between them.

The operation of this embodiment will be explained below.

First, the semiconductor device 2 is placed on the support stand 9 by a transport mechanism (not shown), and the package 3 is fitted into the recess 9a, so that each of the plurality of leads 4 is directly connected to each of the plurality of contact pins 8. positioned at the top.

Next, when the pressing member 10 is lowered, the contact piece 1 at the tip end
0a is in contact with the upper surface of the lead 4, and the lead 4 is held between the contact pin -8 which is elastically deformed downward, and each of the plurality of leads 4 is attached to a predetermined contact pin 8. The semiconductor device 2 is electrically connected, and an operation test of the semiconductor device 2 is performed using power, operation test signals, etc. applied from a tester (not shown) or the like.

At this time, since the lower surface of the package 3 is supported by the support stand 9, the lead 4 is deformed so that the tip end is pushed down by a predetermined amount, and the lead 4b is deformed to deviate from the reference plane, for example. The formatting is done at the same time.

As a result, when the operation test of the semiconductor device 2 is completed and the clamping state between the pressing member 10 and the contact pin 8 is released, the tips of the plurality of leads 4 are aligned within a predetermined plane. Therefore, the operation test of the semiconductor device 2 is carried out.
The flatness of the board 4 can be corrected at the same time.

As a result, productivity in, for example, a pre-shipment process of the semiconductor device 2 is improved.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, a lead shaping device for a semiconductor device in which leads are made to protrude from a package in a direction along a reference plane, comprising: a support base that supports the root portion of the lead protruding from the package or the pancage from a first direction; a pressing member disposed to be relatively movable in a direction facing the support base, and pressing the outer end of the lead in a second direction opposite to the first direction to deform the lead by a predetermined amount; For example, the amount of movement of the pressing member in the second direction is set so that a lead that deviates from the reference plane is plastically deformed, and a lead whose tip coincides with the reference plane is elastically deformed. By doing so, without creating excessive stress on the package,
A plurality of leads can be aligned within the reference plane, and the flatness of the leads can be improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the shape of leads for semiconductor devices is gal.
It is not limited to the wing shape, but may be of any other shape.

In the above explanation, the invention made by the present inventor was mainly applied to lead shaping technology in a surface-mounted semiconductor device, which is the background field of application, but the invention is not limited to this. It can be widely applied to general semiconductor devices.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a cross-sectional view showing the main parts of a lead shaping device according to a first embodiment of the present invention, Fig. 2 is an explanatory diagram illustrating the operation of an embodiment of the present invention, and Fig. 3 The figure is a cross-sectional view showing the main parts of a lead shaping device according to the second embodiment of the present invention, FIG. 4 is an explanatory diagram when the posture of the semiconductor device is changed in the second embodiment, and FIG. 5 is an implementation of the present invention. FIG. 7 is a sectional view showing the main parts of the lead shaping device of Example 3. DESCRIPTION OF SYMBOLS 1... Support stand, 2... Semiconductor device, 3... Package, 4... Lead, 4a... Normal lead (second
lead), 4b...Unauthorized lead (first
), 4C... Mounting side of lead tip, 5
... Pressing member, 5a... Contact piece, 6... Support stand,
6a... Concavity, 6b... Support piece, 7... Test
board, 8... contact bin, 9... support stand,
9a... Concave portion, 10... Pressing member, 10a... Contact piece, P... Reference plane, θ1... Angle formed by the tip of a normal lead with the reference plane, θ2... Shaping The angle that the lead tip makes with the reference plane. Agent Patent Attorney Daiwa Tsutsui

Claims (1)

[Scope of Claims] 1. A lead shaping device for a semiconductor device in which a lead protrudes from a package in a direction along a reference plane, wherein the package or the base portion of the lead protruding from the package is shaped from a first direction. a support stand to support the support stand; and the first
A lead shaping device comprising: a pressing member that presses the outer end of the lead in a second direction opposite to the direction shown in FIG. 2. Among the leads, the first lead whose tip part deviates from the reference plane is plastically deformed, and the second lead whose tip part coincides with the reference plane is elastically deformed within the range of the pressing member. 2. The lead shaping device according to claim 1, wherein the amount of movement in two directions is set. 3. The lead shaping device according to claim 1, wherein the angle that the lead of the semiconductor device makes with the reference plane is set in advance to be small in a direction that cancels out the deformation caused by the pressing member. . 4. The support stand is disposed at the center of a plurality of contact pins on a test board for testing the operation of the semiconductor device, and the support base prevents electrical contact between the leads and the contact pins by the pressing member. Claim 1 characterized in that securing and shaping are performed at the same time.
Lead shaping device as described in section. 5. Claim 1, wherein the lead of the semiconductor device is formed in a gull wing shape.
Lead shaping device as described in section.