JPH09306948A - Method and apparatus for bonding inner leads - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid breaking leads due to warp of a TAB(tape automated bonding) tape. SOLUTION: An inner lead bonding apparatus 10 for bonding pellets 1 to inner leads 8 on a TAB tape 3 comprises retainers 17, 21 having shapes matched to natural warp of the tape 3. The pellets 1 are hot compression welded to the inner leads 8 by a bonding tool 15 with the TAB tape 3 warped by the retainers 17, 21, and hence the bonded inner leads 8 keeping being warped are bridged between the pellets 1 and TAB tape 3. After the tape is released from the retaining force of the retainers, the warp of the tape is kept to result in that no stress caused by the warp of the tape acts on the inner leads and hence no inner lead is broken.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner lead bonding technique, and more particularly to a semiconductor pellet (hereinafter referred to as a TAB tape) in which a plurality of inner leads and outer leads integrated with each inner lead are laid on a tape body. , Pellets) are bonded to an inner lead group to be electrically connected to the inner lead bonding technology. For example, the technology is effective when applied to a manufacturing method of a semiconductor integrated circuit device (hereinafter referred to as IC). Regarding

[0002]

2. Description of the Related Art As a package of IC, Tape Automated Bonding (Tape Automated)
ted Bonding. Hereinafter referred to as TAB. ) Technology-based tape carrier package (Tape)
Carrier Package. Hereinafter referred to as TCP. ). IC equipped with this TCP (hereinafter, TCP
・ It is called IC. ), The pellet is TA
It is mechanically and electrically connected to the tape of the B technology (TAB tape) by an inner lead bonding method using an inner lead bonding apparatus.

The conventional inner lead bonding apparatus is equipped with a retainer for retaining the TAB tape.
The inner lead bonding method is performed while the tape is kept flat by the pressing tool.

As an example in which TCP is described, Nikkei BP Co., Ltd., May 31, 1993 "Practical course VLSI packaging technology (below)" P72 to P10
There are three.

[0005]

[Problems to be Solved by the Invention]
In the bonding apparatus, since the warp of the TAB tape is not taken into consideration, there is a problem that as the miniaturization of the inner leads progresses, the inner leads bonded to the pellet are broken due to the warp of the TAB tape. It was made clear by the present inventor.

An object of the present invention is to provide an inner lead bonding technique capable of preventing disconnection due to warp of a TAB tape.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, the inner lead bonding apparatus for inner lead bonding the semiconductor pellet to the inner lead group of the TAB tape is provided with a pressing member having a shape that matches the warp shape naturally formed on the TAB tape.

According to the above-mentioned inner lead bonding apparatus, since the semiconductor pellets are bonded to the inner lead group while the TAB tape is warped, the inner lead group after bonding maintains the warp of the TAB tape. The semiconductor pellet and the TAB tape are bridged. In other words, TA with the retainer
Since the warp of the TAB tape is maintained after the pressing force of the B tape is released, the stress due to the warp of the TAB tape does not act on the inner lead group, so that no wire break occurs in any of the inner leads.

[0011]

1 is a partially omitted perspective view showing an inner lead bonding apparatus according to an embodiment of the present invention. 2A is a side sectional view thereof, and FIG. 2B is a front sectional view thereof. 3A is a side sectional view showing the inner lead bonding, FIG. 3B is a front sectional view taken along line bb of FIG. 3A, and FIG. 3C is a front view taken along line cc of FIG. FIG. FIG. 4 is a partially omitted perspective view showing the state after the inner lead bonding. 5A and 5B are front cross-sectional views showing an inner lead bonding method using a flat-shaped presser, where FIG. 5A shows before bonding and FIG. 5B shows during bonding. FIG. 6 is a partially omitted perspective view showing the state after the inner lead bonding.

In the present embodiment, the inner lead bonding apparatus according to the present invention is configured as an inner lead bonding apparatus used when manufacturing a TCP / IC, and pellets are formed on the inner lead group of the TAB tape. The pellets are mechanically and electrically connected to the TAB tape by bonding. The pellet 1, which is one of the works, is manufactured by forming an integrated circuit including a semiconductor element in a semiconductor wafer state in a so-called pre-process in a method of manufacturing an IC and then cutting it into a rectangular flat plate shape. One main surface of the pellet 1 (hereinafter,
The top surface. 2), a plurality of bump electrodes 2 are arranged in the peripheral portion on the pair of long sides and are provided so as to project upward.

The TAB tape 3 which is the other work has a tape body 4 which is manufactured by using an insulating material such as polyimide resin. The tape body 4 has a large number of feed holes 5 at both ends. Are arranged at a predetermined interval so as to follow. A large number of device holes 6 are arranged on the center line of the tape body 4 at predetermined intervals.
Each device hole 6 is formed in a rectangular shape slightly larger than the size of the pellet 1. A pair of outer lead holes 7, 7 are symmetrically formed on both sides of each device hole 6, and each outer lead hole 7 is formed in a long hole which is sufficiently longer than the long side of the device hole 6. .

A plurality of inner leads 8 are laid for each device hole 6 on the upper surface of the tape body 4, and outer leads 9 are integrally connected to each inner lead 8. The inner leads 8 are arranged so as to be orthogonal to both long sides of the device hole 6, and the tips thereof are in a state of protruding inside the device hole 6. The outer lead 9 group is laid so that the tip portion on the side opposite to the inner lead 8 crosses the outer lead hole 7, and is arranged in the longitudinal direction of the outer lead hole 7. However, for convenience, only one unit of the TAB tape 3 is shown.

The TAB tape 3 has a device hole 6 portion (hereinafter referred to as a central portion) projecting downward due to distortion during molding of the tape body 4 and distortion due to attachment of the inner leads 8 and the outer leads 9. It often has a warped shape. The warp shape of the TAB tape 3 is measured in advance before the TAB tape 3 is loaded into the inner lead bonding apparatus 10, and is used for setting the warp shape of the pressing tool described later.

The inner lead bonding apparatus 10 is equipped with a feeding device (only part of which is shown) for feeding the TAB tape 3 which is the other work. The feeder has a plurality of sprockets (not shown),
The TAB tape 3 is stretched between the sprockets to form the feed hole 5
It is designed to be stepped forward through. A pair of guide rails 11, 11 are laid between the sprockets in parallel and horizontally with a width substantially equal to that of the TAB tape 3, and the TAB tape 3 has both guide rails 11, 11.
By means of 11, a stepwise feed is carried out while maintaining a horizontal state.

A bonding stage 12 for holding the pellet 1 is disposed directly below the device hole 6 of the TAB tape 3 between the guide rails 11 and 11 and is installed vertically upward. The pellet 1 is loaded and unloaded on the bonding stage 12 by a pickup arm (not shown). The bonding stage 12 is configured to move up and down to move the loaded and held pellet 1 back and forth with respect to the device hole 6.

An elevating and lowering drive device 13 for tools is installed on one side of one of the guide rails 11. A bonding arm 14 extends over the device hole 6 of the TAB tape 3 in the up and down drive device 13 for tools. Is installed as. A bonding tool 15 is attached vertically downward to the tip of the bonding arm 14, and the bonding arm 14 is moved up and down by an elevation drive device 13 for the tool. The bonding tool 15 is formed in a rectangular flat plate shape having substantially the same size as the pellet 1, and the tip of each inner lead 8 is thermocompression-bonded (gang bonding) to each bump electrode 2 of the pellet 1 at the same time by descending. Is configured to let.

A lifting drive device 16 for the upper pressing tool is provided near the lifting drive device 13 for the tool, and an upper pressing tool 17 is attached to the TA of the lifting drive device 16 for the upper pressing tool.
It is attached so as to project right above the B tape 3. The upper pressing member 17 is formed by using a thin plate having high mechanical strength such as a stainless steel plate, and the supported portion 18
And an upper holding portion 19. The supported portion 18 is formed in a flat plate shape, and is fixed to the upper presser lifting drive device 16 at one end side. The upper pressing portion 19 is integrally connected to the supported portion 18 at one end, and a portion along the center line parallel to the supported portion 18 (hereinafter, referred to as a central portion) is warped so as to protrude downward. It is bent and shaped. The warp shape of the upper pressing portion 19 is set so as to match the warp shape of the TAB tape 3 measured in advance as much as possible as described above. A bonding tool insertion hole 20 is formed in a rectangular shape slightly larger than the bonding tool 15 at a position facing the device hole 6 of the TAB tape 3 in the upper pressing portion 19.

Below the upper pressing member 17, a lower pressing member 21 is arranged vertically upward so as to face the upper pressing member 17 with the TAB tape 3 sandwiched therebetween. It is adapted to be lifted and lowered by a lifting / lowering drive device (not shown) for the pressing tool. Lower presser 21
Is provided with a supported portion 22 and a lower pressing portion 23, and the supported portion 22 is formed in a leg shape and is fixed to the lower pressing tool lifting drive device at the lower end side. The lower pressing portion 23 is integrally connected to the supported portion 22 at the four corners, and is bent and formed in the same warp shape as the upper pressing portion 19 of the upper pressing tool 17. At a position facing the device hole 6 of the TAB tape 3 in the lower holding part 23 of the lower holding tool 21, a pellet insertion hole 24 is formed in a rectangular shape slightly larger than the pellet 1.

Next, the operation of the inner lead bonding apparatus having the above structure will be described to explain the inner lead bonding method which is an embodiment of the present invention.

The pellet 1 which is one of the workpieces is supplied onto the bonding stage 12 by a pickup arm with the bump electrode 2 group side facing upward, and after being positioned by a positioning device (not shown), the bonding stage 12 is held by means such as vacuum suction.

When the TAB tape 3, which is the other work, is stepwise fed by the feeding device of the inner lead bonding apparatus 10 and the device hole 6 to be inner lead bonded is stopped right above the bonding stage 12, the upper side. When the pressing tool 17 is lowered and the lower pressing tool 21 is raised, the periphery of the device hole 6 of the TAB tape 3 is sandwiched and held by the upper pressing part 19 and the lower pressing part 23. At this time, the upper holding portion 19 and the lower holding portion 23 are
Since the tapes 3 are each formed in a warp shape corresponding to the warp shape of the tape 3, as shown in FIGS. 3 (b) and 3 (c), the TAB tape 3 maintains the natural warp shape while maintaining the upper pressing portion. It will be in the state hold | maintained by 19 and the lower side press part 23.

Subsequently, as shown in FIG. 3, the bonding stage 12 is raised and the bonding tool 15 is lowered to bond the inner leads 8 to the bump electrodes 2 at once. It
At this time, the bonding stage 12 and / or the bonding tool 1 is manufactured by an alignment device (not shown).
The position of 5 is controlled so that the position to be bonded of each inner lead 8 and each bump electrode 2 are aligned. Bonded inner lead 8 and pellet 1
Since the connection terminals 25 are formed by thermocompression bonding with respect to the bump electrodes 2, the inner leads 8 and the pellets 1 are mechanically and electrically connected by the connection terminals 25. .

At this time, the TAB tape 3 is attached to the upper holding portion 1.
The inner leads 8 are brought into the state shown in FIG. 4 because the inner leads 8 are held and held by the lower pressing portion 23 while maintaining the natural warp shape. That is, the inner leads 8a located in the center are in a state of being bridged horizontally corresponding to the upper surface of the tape body 4, and the inner leads 8b located at both ends correspond to the rise of the warp of the TAB tape 3. And is bridged by inclining obliquely upward from the connection terminal 25 side toward the upper surface of the tape body 4. In this state, the natural shape of the TAB tape 3 is maintained. Therefore, after the pressing by the upper pressing portion 19 and the lower pressing portion 23 is released, the inner lead 8a in the central portion to the inner leads 8 at both ends are released. TAB tape 3 for all 8b
Unauthorized power will not act from. Therefore, TA
Even if the inner leads 8b at both ends located above the warp of the B tape 3 are not
The wire breakage due to the warp of the AB tape 3 does not occur.

By the way, as shown in FIG. 5 (a), in the case of the prior art in which the upper pressing member 17 'and the lower pressing member 21' are formed in a flat plate shape having no warp, the inner pressing member Fig. 5 for lead bonding
As shown in (b), the TAB tape 3 is held in a flat shape in which the natural warp shape is corrected.
The tape 3 and the inner lead 8 group are in the state shown in FIG. That is, the inner leads 8a located at the center and the inner leads 8b located at both ends are all bridged horizontally. In this state, when the holding of the TAB tape 3 by the upper pressing member 17 'and the lower pressing member 21' is released, the TAB tape 3 returns to the warped state which is a natural state, and thus corresponds to the upper position of the warp. TAs for returning to the warped state are provided on the inner leads 8b at both ends.
The elastic force of the B tape 3 acts. Then, as miniaturization progresses, the inner leads 8b at both ends may be broken due to this elastic force.

When the inner lead bonding described above is completed, the bonding tool 15 is raised and the bonding stage 12 is lowered, and subsequently, the upper holding member 1
7 is raised and the lower presser 21 is lowered. afterwards,
The TAB tape 3 is stepwise fed by the feeding device, and the device hole 6 for inner lead bonding next time is stopped at a position right above the bonding stage 12. After that, by repeating the above-mentioned operation, T
The inner lead bonding method is carried out for each device hole 6 of the AB tape 3.

In the TAB tape 3 to which the pellets 1 are mechanically and electrically connected by the inner lead bonding method as described above, a resin sealing body (not shown) is pelletized in the resin sealing step. 1 and the inner leads 8 are molded by a potting method so as to be resin-sealed. By molding this resin encapsulant, TCP.
An IC (not shown) has been substantially manufactured. Then, the TCP / IC molded with the resin sealing body is appropriately shipped in the TAB tape 3 as it is, or in a state of being separated from the TAB tape 3 at the tips of the outer leads 9.

According to the above embodiment, the following effects can be obtained. (1) By carrying out the inner lead bonding method while holding the TAB tape 3 by the upper side presser 17 and the lower side presser 21 while maintaining the natural warp shape, the TAB tape 3 after the inner lead bonding is performed. Since the natural shape of the TAB tape 3 can be maintained, it is possible to prevent the TAB tape 3 from exerting a force on all of the inner leads 8a at the central portion to the inner leads 8b at both ends. Even with the inner leads 8b located at both ends, it is possible to prevent disconnection.

(2) In order to prevent the disconnection of the inner lead 8 caused by the warp of the TAB tape 3 after the inner lead bonding, the upper pressing member 17 and the lower pressing member 21 for pressing the TAB tape 3 are provided. Since it is only necessary to form the warp shape corresponding to the warp shape of the TAB tape 3 in advance, it is possible to suppress an increase in manufacturing cost in the TCP / IC manufacturing method.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in carrying out the inner lead bonding method, the shape of forcibly pressing the TAB tape is not limited to the warped shape formed naturally on the TAB tape,
It may have a predetermined shape set in advance. The inner lead bonding method is forcibly pressed to a predetermined shape to arrange the inner lead groups after inner lead bonding and the TAB tape in a desired relationship that is assumed in advance. Therefore, an ideal inner lead bonding shape can be created.

The arrangement of the inner lead group and the outer lead group is not limited to the arrangement on both long sides of the device hole.
According to the specifications of TCP / IC, they can be arranged radially on four sides.

In the above description, TCP is a field of application which is the background of the invention mainly made by the present inventor.
The case where the invention is applied to the inner lead bonding technique in the IC manufacturing method has been described, but the present invention is not limited to this, and the inner lead bonding technique in the manufacturing method of a transistor array including TCP and other electronic components. It can be applied to all.

[0035]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The inner lead bonding is carried out while the TAB tape is forcibly pressed so as to maintain a predetermined shape, so that the inner lead disconnection defect due to the warp of the TAB tape after the inner lead bonding occurs. It is possible to prevent this, and an ideal inner lead bonding shape can be obtained.

In order to prevent disconnection of the inner leads due to the warp of the TAB tape after the inner lead bonding or to obtain an ideal inner lead bonding shape, the upper holding member and the lower holding member for holding the TAB tape are used. Since it is only necessary to previously form the pressing tool into a desired shape, it is possible to suppress an increase in manufacturing cost in the TCP manufacturing method.

[Brief description of drawings]

FIG. 1 is a partially omitted perspective view showing an inner lead bonding apparatus according to an embodiment of the present invention.

2A is a side sectional view thereof, and FIG. 2B is a front sectional view thereof.

3A is a side sectional view showing the inner lead bonding, FIG. 3B is a front sectional view taken along line bb of FIG. 3A, and FIG. 3C is a line cc of FIG. It is a front sectional view which follows.

FIG. 4 is a partially omitted perspective view showing the state after inner lead bonding.

5A and 5B are front cross-sectional views showing an inner lead bonding method using a flat-shaped holder, wherein FIG. 5A shows a state before bonding and FIG. 5B shows a state during bonding.

FIG. 6 is a partially omitted perspective view showing the state after inner lead bonding.

[Description of sign]

1 ... Pellet, 2 ... Bump electrode, 3 ... TAB tape, 4
… Tape body, 5… Feed hole, 6… Device hole, 7…
Outer lead holes, 8 ... Inner leads, 9 ... Outer leads, 10 ... Inner lead bonding equipment, 11 ...
Guide rail, 12 ... Bonding stage, 13 ... Tool lifting drive device, 14 ... Bonding arm, 15
... bonding tool, 16 ... elevating drive device for upper pressing tool, 17 ... upper pressing tool, 18 ... supported part, 19 ... upper pressing part, 20 ... bonding tool insertion hole, 21 ...
Lower presser, 22 ... Supported part, 23 ... Lower presser,
24 ... Pellet insertion hole, 25 ... Connection terminal.

Claims (3)

[Claims] 1. A semiconductor pellet is bonded to an inner lead group and mechanically and electrically connected to a TAB tape in which a plurality of inner leads and outer leads integrated with the inner leads are laid on a tape body. In the inner lead bonding method, the semiconductor pellets are bonded to the inner lead group while the TAB tape is forcibly pressed to a desired non-flat shape set in advance. Method. 2. A semiconductor pellet is bonded to an inner lead group and electrically and mechanically connected to a TAB tape in which a plurality of inner leads and outer leads integrated with each inner lead are laid on the tape body. In the inner lead bonding apparatus, the semiconductor pellet is bonded to the inner lead group while the TAB tape is forcibly pressed by a holding tool formed in a predetermined non-flat shape. -Bonding equipment. 3. The inner lead bonding apparatus according to claim 2, wherein the tape retainer is formed in a shape that matches the warped shape formed on the TAB tape in a natural state.