JPH10328999A - Wire saw with slicing base cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire saw having a slicing base cutting device that can easily cut a large number of wafers cut from a workpiece, from a slicing base. SOLUTION: A wire saw 10 is mounted with a slicing base cutting device 60 therein, and a large number of wafers 28, 28,... cut with the wire row of the wire saw 10 are cut from a slicing base 30 by the slicing base cutting device 60. The wafers 28, 28,... cut with the wire row can therefore be cut inside the wire saw 10 without taking out of the wire saw 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw for cutting a thin wafer into a row of wires running on a columnar semiconductor ingot, ceramic, glass or the like.

[0002]

2. Description of the Related Art A wire saw is one of the cutting devices for cutting a work such as a semiconductor ingot, ceramic, glass or the like into a thin wafer. This wire saw wraps the wire around the grooves of a plurality of grooved rollers to form a wire row and rotates the grooved roller to run the wire row,
Then, the workpiece is sent out toward the row of wires by sending the workpiece feed table attached to the row of wires via the slice base, whereby the workpiece is pressed against the row of wires and cut into a number of wafers.

[0003] The wafer thus cut is taken out of a wire saw machine and transferred to a slice-based cutting apparatus. Then, the wafers are cut from the slice base by the slice base cutting apparatus, stored one by one in a storage case, and then transferred to the next cleaning step, where the wafers are cleaned.

[0004]

However, in the conventional wire saw, since the wafer cut by the wire saw must be transferred to a slice-based cutting device outside the wire saw machine, it takes time to attach and detach the wafer and to carry the wafer. There are drawbacks. Further, the conventional wire saw requires a storage process for preventing the breakage of the wafer when the wafer is taken out of the wire saw machine, so that there is a disadvantage in that the management of the wafer is troublesome.

The present invention has been made in view of such circumstances, and provides a wire saw with a slice base cutting device that can cut a large number of wafers cut from a work from a slice base without trouble. With the goal.

[0006]

According to the present invention, in order to achieve the above object, a wire is wound around a plurality of grooved rollers to form a wire row, and the wire row is run by rotating the grooved roller. A workpiece is attached to a work feed table via a slice base, and the work feed table is sent out toward the wire row so that the work is pressed against the wire row to cut the work into a number of wafers. And a plurality of wafers cut by the wire rows are cut from a slice base by the slice base cutting device.

In the wire saw according to the first aspect, a slice base cutting device is provided in a wire saw machine, and a large number of wafers cut by a wire row of the wire saw are cut from the slice base by the slice base cutting device. Thus, according to the present invention, the wafer cut by the wire row can be cut in the wire saw machine without being taken out of the wire saw machine, so that the wafer can be cut from the slice base without any trouble.

According to a second aspect of the present invention, the slice-based cutting device is provided on the opposite side of the work feed table with the wire row interposed therebetween. When the slice base cutting device is provided at this position, the wafer can be cut from the slice base in a posture immediately after being cut by the wire row without removing the wafer cut by the wire row from the wire row. Conversely, if the slice-based cutting device is provided on the work feed table side, the wafer must be removed from the wire row, and the wire may be caught on the wafer during the removal, and the wire may be damaged. In addition, even during maintenance of the wire array, it is an obstacle if the slice base cutting device is on the work feed table side. According to the present invention, such a problem can be prevented.

According to a third aspect of the present invention, there is provided a storage case for storing a wafer cut by the slice-based cutting apparatus. Thus, according to the present invention, since the wafer can be collected in the storage case, the collection operation is facilitated. According to a fourth aspect of the present invention, a wafer cleaning device is provided in the storage case. According to the present invention, the wafer can be cleaned together with the storage of the wafer, so that the cleaning process of the wafer can be efficiently performed.

[0010] The same applies to a wire saw in which a wire is stretched in a rectangular frame in place of the grooved roller and reciprocated to cut.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wire saw with a slice-based cutting device according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view of a fixed-abrasive wire saw to which a wire saw with a slice-based cutting device of the present invention is applied, including a partial cutaway.

A wire saw 10 shown in FIG. 1 has a pair of grooved rollers 14 and 16 in a cover 12 which constitutes the apparatus main body.
Are installed with their respective rotating shafts 18, 20 horizontal. The rotating shaft 18 of the grooved roller 14 is connected to an output shaft (not shown) of the drive motor 22 as shown in FIG. 2 so that the grooved roller 14 is rotated at a constant rotation speed by the rotation force from the drive motor 22. Is set to Similarly, the rotating shaft 20 of the grooved roller 16 is also connected to the output shaft of a drive motor (not shown), and is set so that the grooved roller 16 is rotated at a constant rotation speed by the rotational force from the drive motor. I have.

In this embodiment, the grooved rollers 14, 1
6 is provided with the drive motor, but the present invention is not limited to this, and the drive motor may be provided only on one of the grooved rollers. When a drive motor is provided for both the grooved rollers 14 and 16 as in the present embodiment, a predetermined speed difference is generated between the rotation speeds of the grooved rollers 14 and 16 so that the wire What is necessary is just to give the tension by a speed difference. For example, when the grooved roller 14 is set on the feeding side of the wire 24 and the grooved roller 16 is set on the winding side of the wire 24, the rotation speed of the grooved roller 16 is slightly higher than that of the grooved roller 14. Just do it. In this case, a slip clutch is provided between the rotation shaft 18 of the grooved roller 14 and the output shaft of the drive motor 22, and when excessive tension is applied to the wire 24, the slip clutch causes the grooved roller 14 to idle. By doing so, damage to the wire 24 due to excessive tension can be prevented.

A plurality of the wires 24 are aligned and formed on the outer peripheral surface of the grooved roller 14 at a constant pitch. It is stretched in parallel with a number of grooves (not shown). These wires 24 are fixed abrasive wires having a surface to which diamond abrasive grains are electrodeposited. Further, the wire 24 is connected to the grooved rollers 14, 1
It is formed endless so as to move around between the six. Thus, a wire row composed of a large number of wires 24, 24... Is formed between the grooved rollers 14 and 16, and a columnar semiconductor ingot (work) 26 is formed by the traveling of the wire row into a large number of wafers 28, 28 ...

The semiconductor ingot 26 is installed with the slice base 30 facing upward, and is fixed to the lower end of the work feed table 32 via the slice base 30. The upper end of the work feed table 32 is swingably supported by an elevating base 38 via an output shaft 36 of a swing motor 34. The swing motor 3
The fourth output shaft 36 is rotatably supported by a lifting base 38. Accordingly, when the swing motor 34 is driven, the semiconductor ingot 26 can be swung in the direction indicated by the arrow in FIG. Thereby, the swing cutting of the semiconductor ingot 26 becomes possible.

The elevating base 38 is supported by linear guides 42 of a portal column 40 erected on the case 12. The linear guides 42, 42 are formed vertically on the inner surface of the column 40, and guides 44, 44 formed on both side surfaces of the elevating base 38 are supported by the linear guides 42, 42. As a result, the elevating base 38, that is, the semiconductor ingot 26 is supported movably up and down along the linear guides 42 and 42.

An elevating motor 4 is provided above the column 40.
The lifting motor 46 is installed with its output shaft facing downward. A screw rod 48 is connected to the output shaft, and the screw rod 48 is screwed to the elevating base 38. Therefore, the screw rod 4 is
When the rotary shaft 8 is rotated, the lifting base 38, that is, the semiconductor ingot 26 is vertically moved by the feeding action of the screw rod 48 and the linear guide action of the linear guides 42, 42.

In FIG. 1, tensioner guide rollers 50, 50 are provided at positions sandwiching the semiconductor ingot 26. The guide rollers 50, 50 abut against the wire row from below to apply tension to the wire row, and are connected to a drive unit 54 via an arm 52. The rotational position of the arm 52 is adjusted by the driving unit 54 and the guide roller 5 is adjusted.
By varying the positions of 0 and 50, the tension applied to the wire row can be adjusted.

Incidentally, the wire saw 10 has a built-in slice-based cutting device 60. The slice-base cutting device 60 is a single-wafer cutting device that cuts a large number of wafers 28, 28,... Cut by the wire row one by one from the slice base 30. (Opposite the table 32) and on the side of the semiconductor ingot 26 immediately after being cut by the wire row.

FIG. 3 is a perspective view of the slice-based cutting device 60. Slice-based cutting device 60 shown in FIG.
Is a traveling head 64 to which a fixed abrasive wire 62 for cutting is attached, and a feed screw mechanism 6 for traveling the traveling head 64.
6 and guide bars 68 for guiding the traveling of the traveling head 64. The wire 62 includes a pair of reels 70 and 7 rotatably supported by a traveling head 64.
2 is wound around a predetermined length and stretched.
4, and is wound around a pair of pulleys 74, 74 rotatably supported by and stretched in a U-shape. The reel 70
Is connected to an output shaft of a motor 76.
Is connected to an output shaft of a motor 78. Accordingly, when only the motor 76 is driven to rotate the reel 70, the wire 62 wound on the reel 72 can be wound up by the reel 70.
Can be run in the direction of the arrow in FIG. Conversely, if only the motor 78 is driven to rotate the reel 72, the wire 62 wound on the reel 70 can be wound by the reel 72, so that the wire 62 is You can run in the direction. In addition,
Switching between the motor 76 and the motor 78 may be controlled by time, and a detecting means for detecting the remaining length of the wire 62 wound on the reel is provided. Switching control may be performed when the remaining length becomes equal to or less than a predetermined amount.

The traveling head 64 is slidably supported along the two guide bars 68, 68 described above. The guide bars 68, 68 have plates 80, 8 at both ends.
2 and arranged horizontally. Therefore, when the traveling head 64 moves rightward in FIG. 3 along the guide bars 68, 68, the wafers 28, 28... Can be cut from the slice base 30 by the traveling wire 62. That is, when the traveling head 64 moves, the slice base 30 is cut along the path indicated by the broken line A in the figure by the wire 62 facing the slice base 30. When cut in this way, wire 2
Slice base cutting section 30 cut at 4, 24...
Since A is cut from the slice base 30 fixed to the work feed table 32, the wafers 28, 28
… Is cut. Reference numeral 84 denotes a cutting groove between the wafers 28, and reference numeral 86 denotes a cutting groove of the slice base 30A. Reference numeral 88 denotes a clearance groove formed in the traveling head 64, and the clearance groove 88 prevents interference between the slice base cutting portion 30A during cutting and the traveling head 64.

The feed screw mechanism 66 for moving the traveling head 64 comprises a motor 90, a screw rod 92, and a nut 94. The motor 90 is fixed to a plate 80, and one end of the screw rod 92 is connected to an output shaft of the motor 90. The screw rod 92 is connected to the guide bars 68,
8 and the other end of the screw rod 92 is
It is supported rotatably. The nut 94 is fixed to the traveling head 64 and is screwed to the screw rod 92. Therefore, when the motor 90 is rotated in one direction, the running head 64 can be moved in the right direction (cutting direction) in the drawing by the action of the screw rod 92 and the nut 94, and when the motor 90 is rotated in the other direction, The traveling head 64 can be moved to the left in the drawing to return to the cutting standby position.

1 and 2, the wire saw 10 includes:
A wafer storage case 100 is provided inside. The storage case 100 stores the wafers 28, 28... Cut by the slice base cutting device 60, and is installed at a position surrounding the wafers 28, 28. The storage case 100 is detachably mounted on the wire saw 10. That is, the wire saw 10 is provided with a door 102 for mounting the storage case 100 on the cover 12 so as to be openable and closable via the hinges 104, 104, and a table 106 for inserting the storage case 100 into a predetermined position. Have been. Thereby, the storage case 100 is opened and closed, and the door 102 is opened and taken out of the wire saw 10. The table 106 is provided with two guide plates 108, 108, and the storage case 100 is guided in and out of the guide plates 108, 108.

The storage case 100 stores a cleaning liquid (not shown). Further, an oscillator (not shown) for applying ultrasonic vibration to the cleaning liquid is provided in the storage case 100. Thus, the wafers 28, 28,... Stored in the storage case 100 are cleaned by the vibration of the cleaning liquid by the oscillator. Next, the operation of the wire saw 10 configured as described above will be described.

First, the slice base 30 of the semiconductor ingot 26 is fixed to the work feed table 32, and the semiconductor ingot 26 is fixed to the wire saw 10. This state is the state shown in FIG. Before fixing the semiconductor ingot 26 to the wire saw 10, its crystal axis orientation is detected in advance, and the semiconductor ingot 26 is positioned and fixed to the work feed table 32 so as to be cut in a direction perpendicular to the crystal axis.

Next, the grooved rollers 14 and 16 are rotated to move the wire array in a clockwise direction in FIG. 1 at a constant speed, and at the same time, the screw rod 48 is rotated by the elevating motor 46 so that the semiconductor ingot 26 is rotated. Is moved downward to press the semiconductor ingot 26 against the running wire row. And
While moving the semiconductor ingot 26 downward,
The swing motor 34 swings the semiconductor ingot 26 in the direction of the arrow in FIG. 1 to start swing cutting. Thereby, the semiconductor ingot 26 is gradually cut by the wire row. The cutting operation is continued, and the cutting operation is completed when the wire row completely cuts the semiconductor ingot 26 and cuts to the slice base cutting section 30A (see FIG. 3). This state is the state shown in FIG. Thus, a large number of wafers 28 are simultaneously cut from the semiconductor ingot 26.

Next, the operation of the slice-based cutting device 60 will be described. When the semiconductor ingot 26 is cut into wafers 28,..., The traveling head 64 waiting at the position shown in FIG. 3 is moved rightward in FIG. Is moved in the direction of the arrow, and the wire 62 is pressed against the slice base 30 to start cutting the slice base 30. .. Are cut into single wafers with the movement of the traveling head 64, and the cut wafers 28, 28,. The stored wafers 28 are cleaned with a cleaning liquid for the storage case.

When all the wafers 28 are cut by the slice-based cutting apparatus 60, the cleaning process is performed for a predetermined time, and then the oscillator is stopped to stop the cleaning process. Then, the door 102 is opened, the storage case 100 is taken out of the wire saw machine, and the wafers 28 are transferred to a predetermined post-process while being stored in the storage case 100. As described above, the cutting process of one semiconductor ingot 26 by the wire saw 10, the single-wafer cutting process, the collection process,
Then, the cleaning process ends.

As described above, the wire saw 1 according to the present embodiment
0, the slice-based cutting device 60 is installed in the wire saw machine.
Provided, the wafers 28, 2
8 can be cut in the wire saw machine without being taken out of the wire saw machine. Therefore, in the wire saw 10, the wafers 28 can be cut from the slice base 30 without any trouble.

Further, in the wire saw 10, since the slice base cutting device 60 is provided on the opposite side of the work feed table 32 across the wire row, the wafers 28 cut by the wire row are removed from the wire row. Wafer 2 in the posture immediately after being cut by the wire row without removal
8, 28... Can be cut from the slice base 30. Conversely, when the slice-based cutting device 60 is provided on the work feed table 32 side, the wafers 28, 2
.. Must be removed from the row of wires, and during this removal, the wires 24 may get caught on the wafer 28 and damage the wires 24. Also, the slice base cutting device 60 becomes an obstacle during maintenance of the wire array. In the wire saw 10 of the present embodiment, such a problem can be prevented.

Further, since the wire saw 10 is provided with the wafer storage case 100, the work of collecting the wafers 28, 28,. In addition, the wire saw 10
Since the wafer cleaning apparatus is provided in the storage case 100 to clean the wafers 28, 28,... While storing the wafers 28, the cleaning processing of the wafers 28 can be performed efficiently.

In this embodiment, the wire saw using the fixed abrasive wire has been described. However, the present invention is not limited to this, and the wafer is cut while supplying the working liquid containing the abrasive to the cutting position. It can also be applied to wire saws.

[0033]

As described above, according to the wire saw with the slice base cutting device according to the present invention, the slice base cutting device is provided in the wire saw machine, and a large number of wafers cut by the wire row of the wire saw are cut by the slice base cutting. Since the cutting is performed from the slice base by the apparatus, a large number of wafers cut from the work can be cut from the slice base without trouble.

[Brief description of the drawings]

FIG. 1 is a front view including a partially broken portion of a wire saw according to an embodiment of the present invention.

FIG. 2 is a side view showing a state immediately after the work is cut by the wire saw shown in FIG. 1;

FIG. 3 is a perspective view of a slice-based cutting device built in a wire saw.

[Explanation of symbols]

 Reference Signs List 10 wire saw 14, 16 grooved roller 24 wire 26 semiconductor ingot 28 wafer 30 slice base 60 slice base cutting device 100 wafer storage case

Claims (4)

[Claims] A wire is wound around a plurality of grooved rollers to form a wire row, the wire row is run by rotation of the grooved roller, and a work is attached to a work feed table via a slice base. In a wire saw for cutting a work into a number of wafers by pressing a work against the wire row by feeding a work feed table toward the wire row, a slice base cutting device is provided on the wire saw, and the workpiece is cut by the wire row. A wire saw with a slice-based cutting device, wherein the plurality of wafers are cut from a slice base by the slice-based cutting device. 2. The wire saw with a slice base cutting device according to claim 1, wherein the slice base cutting device is provided on the opposite side of the work feed table with the wire row interposed therebetween. 3. The wire saw with a slice base cutting device according to claim 1, wherein the wire saw is provided with a storage case for storing a wafer cut by the slice base cutting device. 4. The wire saw according to claim 3, wherein a wafer cleaning device is provided in the storage case.