WO2000037216A1

WO2000037216A1 - Wire saw having cutter for slicing base

Info

Publication number: WO2000037216A1
Application number: PCT/JP1998/005741
Authority: WO
Inventors: Kozo Sugai
Original assignee: Tokyo Seimitsu Co., Ltd.
Priority date: 1998-12-18
Filing date: 1998-12-18
Publication date: 2000-06-29

Abstract

A wire saw (10) having a cutter for a slicing base, capable of cutting off a plurality of wafers, which have been cut off from a work, from a slicing base without requiring labor, wherein a cutter (60) for the slicing base is provided in a machine body of the wire saw (10) so as to cut off a plurality of wafers (28, 28...), which have been cut off with rows of wires comprising a plurality of wires (24), from the slicing base (30) with the cutter (60), whereby the wafers (28, 28...) cut off with the rows of wires can be cut off inside the machine body of the wire saw (10) without taking the wafers out of the machine body.

Description

Wire saw with base cutting device '

Technical field

The present invention relates to a wire saw that cuts a thin plate-shaped wafer with a row of wires that move a work such as a columnar semiconductor ingot, ceramic, or glass.

Akita

Background art

A wire saw is one of the cutting devices for cutting a work such as a semiconductor ingot, a ceramic, and a glass into a thin plate. In this wire saw, a wire is wound around the grooves of a plurality of grooved ports to form a wire row, and at the same time, the grooved rollers are rotated to run the wire row, and the work is passed through a slice base. The workpiece is fed into the wire row by feeding the workpiece feed table attached by the above, so that the workpiece is pressed into contact with the wire row and cut into many pieces.

The thus cut wafer is taken out of the wire sawing machine and transferred to a slice base cutting device. Then, the wafers are cut from the slice base by the above-mentioned slice base cutting device, stored in the storage case one by one, and then transferred to the next cleaning step, where the cleaning processing is performed. You.

However, the conventional wire saw has a drawback that it takes time to detach and transport the wafer because the wafer cut by the wire saw must be transferred to a slice pace cutting device outside the wire saw. .

Further, the conventional wire saw has a drawback in that it requires a storage process for preventing damage to the wafer when the wafer is taken out of the wire saw, so that it takes time to manage the wafer.

The present invention has been made in view of such circumstances, and a slice base capable of cutting a large number of wafers cut from a work from a slice base without trouble. An object of the present invention is to provide a wire saw with a saw cutting device. Disclosure of the invention

In order to achieve the above object, the present invention provides a method of forming a row of wires by winding a wire around a plurality of grooved rollers and running the row of wires by rotating the grooved rollers. A workpiece is attached to the wire row by feeding the workpiece feed table toward the row of wires, thereby pressing the workpiece against the row of wires, and cutting the workpiece into a number of wafers. A cutting device is provided, and the plurality of wafers cut by the wire row are cut from a slice base by the slice base cutting device.

In the wire saw of the present invention, a slice base cutting device is provided in a wire saw machine, and a large number of wafers cut by a wire row of the wire saw are cut from a slice base by a slice pace cutting device. As a result, according to the present invention, it is possible to perform the cutting processing inside the wire sowing machine without taking out the 18 pieces cut by the wire row outside the wire sowing machine. Can be cut from the base. According to the present invention, the slice base cutting device is provided on the opposite side of the work feed table across the wire row. If a slice base cutting device is installed at this position, the wafer cut from the wire row will not be removed from the wire row, and the wafer will be removed from the slice base in the posture immediately after being cut by the wire row. Can be cut. Conversely, if a slice-based cutting device is provided on the work feed table side, the wire must be removed from the wire row, and the wire will be caught by the wire during this removal, resulting in damage to the wire. There are cases. Also, during maintenance of the wire row, it is an obstacle if the slicing space cutting device is on the work feed table side. According to the present invention, such a problem can be prevented.

According to the present invention, there is provided a storage case for storing the wafer cut by the slice base cutting apparatus. Thus, according to the present invention, it is possible to collect the above-mentioned # 18 in the storage case, so that the collecting operation is facilitated. According to the present invention, the storage case is provided with the eighteenth cleaning device. Accordingly, the present invention can clean the item (c) together with the storage of item (18), and thus can efficiently perform the cleaning process of item (1)).

The same is true for a wire in which a wire is stretched in a rectangular frame in place of the grooved roller, and the wire is reciprocated and cut.

According to the present invention, since the storage case is provided on the opposite side of the work feed table across the wire row, the wafer cut by the wire row can be removed from the wire row. , Can be collected in the storage case. When the wafer is collected by such a method, the cutting wafer is not damaged by the wire row, and the cutting wafer can be collected in a short time.

According to the present invention, the work is cut into a large number of blades with a wire row, and the slicing space is cut by a predetermined amount with a wire row. By moving a fixed amount, the slice base is cut with a wire row, and the wafer is cut into single wafers. As a result, the wafer can be cut from the slice base one by one without installing a dedicated slice base cutting device on the wire saw. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a front view including a partially broken portion of the wire saw according to the embodiment of the present invention, and FIG. 2 is a side view showing a state immediately after a workpiece is cut by the wire saw shown in FIG. FIG. 3 is a perspective view of a slice-based cutting device built in the wire saw. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of a wire saw with a slice pace cutting device according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a front view including a partially broken fixed-abrasive-type vacuum cleaner to which a vacuum cleaner with a slice-based cutting device according to the present invention is applied.

The wire saw 10 shown in FIG. 1 has a pair of grooved openings 14, 16 installed in a cover 12, which constitutes the apparatus main body, with their rotating shafts 18, 20 being horizontal. I have. Slotted row The rotary shaft 18 of the roller 14 is connected to an output shaft (not shown) of the drive motor 22 as shown in FIG. 2, and the rotational force from the drive motor 22 rotates the grooved roller 14 at a constant rotational speed. It is set to rotate. Similarly, the rotation shaft 20 of the grooved roller 16 is also connected to the output shaft of a drive motor (not shown) so that the rotation force from the drive motor causes the grooved roller 16 to rotate at a constant rotation speed. Is set to

In the present embodiment, the drive motor is provided on both of the grooved rollers 14 and 16. However, the present invention is not limited to this, and a drive motor may be provided only on one of the grooved rollers. Further, when a drive motor is provided for both the grooved rollers 14 and 16 as in the present embodiment, a predetermined speed difference is generated between the rotation speeds of the grooved rollers 14 and 16, What is necessary is just to give the tension by the speed difference to the wire 24 mentioned later. For example, if the grooved roller 14 is set on the wire 24 feed side and the grooved roller 16 is set on the wire 24 take-up side, the grooved roller 16 rather than the grooved roller 14 It is only necessary to slightly increase the rotation speed of. In this case, a sliding clutch is provided between the rotating shaft 18 of the grooved roller 14 and the output shaft of the drive motor 22 to apply excessive tension to the wire 24, and the groove is formed by the action of the sliding clutch. If the attached roller 14 is caused to idle, it is possible to prevent the wire 24 from being damaged due to excessive tension.

A plurality of the wires 24 are aligned, and a large number of grooves 15, 15, formed at a constant pitch on the outer peripheral surface of the grooved roller 14, and a constant amount on the outer peripheral surface of the grooved roller 16. It is stretched in parallel with a number of grooves (not shown) formed at a pitch of. These wires 24, 24,... Are fixed abrasive wires having their surfaces electro-deposited with diamond abrasive grains. The wire 24 is formed endless so as to move between the grooved rollers 14 and 16. As a result, a row of wires composed of a large number of wires 24, 24,... Is formed between the grooved rollers 14 and 16, and the semiconductor ingot ( Work) 26 is cut into many wafers 28, 28 ...

The semiconductor ingot 26 is installed with the slice base 30 facing upward, and is fixed to the lower end of the work feed table 32 via the slice base 30. The upper end of the work feed table 32 rises via the output shaft 36 of the swinging motor 34. It is swingably supported by the descending base 38. The output shaft 36 of the rocking motor 34 is rotatably supported by a lifting base 38. Therefore, when the rocking motor 34 is driven, the semiconductor ingot 26 can be rocked in the direction indicated by the arrow in FIG. 1 via the work feed table 32. Thereby, the swing cutting of the semiconductor ingot 16 can be performed.

The elevating base 38 is supported by linear guides 42, 42 of a portal column 40 erected on the case 12. The linear guides 42, 42 are formed in the vertical direction on the inner surface of the column 40, and the linear guides 42, 42 have guides 44 formed on both side surfaces of the lifting base 38. , 4 4 are favored. As a result, the elevating base 38, that is, the semiconductor ingot 26, is supported so as to be vertically movable along the lower guides 42, 42.

An elevating motor 46 is installed above the column 40, and the elevating motor 46 is installed with its output shaft facing downward. A screw rod 48 is connected to the output shaft, and the screw rod 48 is hinged to the lifting base 38. Therefore, when the screw rod 48 is rotated by the lifting module 46, the lifting base 38 is moved by the feeding action of the screw rod 48 and the linear guide action of the linear guides 42, 42. That is, the semiconductor ingot 26 is moved up and down.

In FIG. 1, guide rollers 50, 50 for the tensioner are provided at positions sandwiching the semiconductor ingot 26. The guide rollers 50, 50 abut against the wire row from below to apply tension to the wire row, and are connected to the drive section 54 via the arm 52. The tension applied to the wire row can be adjusted by adjusting the rotational position of the arm 52 with the drive unit 54 and changing the position of the guide rollers 50, 50.

By the way, the wire saw 10 has a built-in slice base cutting device 60. The slice base cutting device 60 is a single-wafer cutting device that cuts a large number of sheets 28, 28,... Cut one by one from the slice base 30 one by one by the wire row. It is installed on the opposite side of the work feed table 32 across the wire row) and on the side of the semiconductor ingot I6 immediately after being cut by the wire row. FIG. 3 is a perspective view of the slice-based cutting device 60. The slice-base cutting device 60 shown in the figure includes a traveling head 64 with a fixed abrasive wire 62 for cutting attached, a feed screw mechanism 66 for traveling the traveling head 64, and a traveling head. It is composed of guide bars 68, 68 that guide the traveling of the road 64.

The wire 62 is wound around a pair of reels 70, 72 rotatably supported by the traveling head 64 and stretched over a predetermined length, and is rotatably mounted on the traveling head 64. It is wound around a pair of supported pulleys 74, 74 and stretched in a U-shape. The reel 72 is connected to an output shaft of a motor 76, and the reel 74 is connected to an output shaft of a motor 78. Therefore, when only the motor 76 is driven to rotate the reel 70, the wire 62 wound on the reel 72 can be wound up by the reel 70. It can be driven in the direction of the middle arrow. Conversely, when only the motor 78 is driven to rotate the reel 72, the wire 62 wound on the reel 70 can be wound by the reel 72, so that the wire 6 2 can be driven in the opposite direction. The switching between the motor 76 and the motor 78 may be controlled by time, and a detecting means for detecting the remaining length of the wire 62 wound on the reel is provided. The switching control may be performed when the detected remaining length of the wire 62 becomes equal to or less than a predetermined amount.

The traveling head 64 is slidably supported along the two guide bars 68, 68 described above. The guide bars 68, 68 have both ends fixed to the plates 80, 82 and are arranged in the horizontal direction. Therefore, when the traveling head 64 moves rightward in FIG. 3 along the guide bars 68, 68, the traveling wire 62 causes the traveling head 62,

2 8 ... can be cut from the slice base 30. That is, when the traveling head 64 moves, the slice base is moved by the wire 62 facing the slice base 30.

30 is cut along the path indicated by the broken line A in the figure. When the cutting is performed in this manner, the slice base cutting portion 30 A cut by the wires 24, 24,... Is cut from the slice base 30 fixed to the work feed tape 32. , One sheet of 28, 28 ... is cut. Reference numeral 84 denotes a cutting groove between the wafers 28 and reference numeral 86. Is a cut groove of slice base 3 OA. Reference numeral 88 denotes an escape groove formed in the traveling head 64, and the escape groove 88 causes interference between the slice base cutting portion 3 OA during cutting and the traveling head 64. Is prevented.

The feed screw mechanism 66 for driving the running head ¹ 64 includes a motor 90, a screw rod 92, and a nut 94. The motor 90 is fixed to a plate 80, and one end of the screw rod 92 is connected to an output shaft of the motor 90. The screw rod 92 is installed in parallel with the guide bars 68, 68, and the other end of the screw rod 92 is rotatably supported by the plate 82. The nut 94 is fixed to a traveling head 64 and screwed to a screw rod 92. Therefore, when the motor 90 is rotated in one direction, the traveling head 64 can be moved rightward (cutting direction) in the figure by the action of the screw rod 92 and the nut 94. When 90 is rotated in the other direction, the traveling head 64 can be moved to the left in the figure to return to the cutting standby position.

In FIGS. 1 and 2, the wire saw 10 has a storage case 100 therein. The storage case 100 stores the 18 2. 28... Cut by the slice base cutting device 60 and is cut by a wire row as shown in FIG. It is installed in a position surrounding 8, 28 ... The storage case 100 is detachably mounted on the wire saw 10. That is, a door 102 for mounting the storage case 100 is attached to the wire saw 10 such that the door 102 can be freely opened and closed via the hinges 104 and 104 to the cover 12. A table 106 for inserting 00 into a predetermined position is provided. As a result, the storage case 100 is opened and closed by opening the door 102. The table 106 is provided with two guide plates 108, 108, and the storage case 100 is guided in and out of the storage case 100 by being guided by the guide plates 108, 108. Further, an unloading device for automatically unloading the storage case 100 out of the wire saw 10 may be provided.

A cleaning liquid (not shown) is stored in the storage case 100. An oscillator (not shown) for applying ultrasonic vibration to the cleaning liquid is provided in the storage case 100. As a result, the channels 28, 28,... Stored in the storage case 100 are controlled by the oscillator. The cleaning process is performed by the vibration of the cleaning solution.

Next, the operation of the wire saw 10 configured as described above will be described.

First, the slice base 30 of the semiconductor ingot 26 is fixed to the work feed table 3, and the semiconductor ingot 26 is fixed to the wire saw 10. This state is the state shown in FIG. Before fixing the semiconductor ingot 6 to the wire saw 10, its crystal axis direction is detected in advance, and the semiconductor ingot 6 is positioned on the work feed table 32 so as to be cut in a direction perpendicular to the crystal axis. Fixed.

Next, the grooved rollers 14 and 16 are rotated to move the wire row around the wire at a constant speed in the clockwise direction in FIG. 1, and the lifting rod 46 is used to rotate the screw rod 48 to rotate the semiconductor ingot. The semiconductor ingot 16 is pressed down against the running wire row by moving the head 16 downward. Then, while moving the semiconductor ingot 26 downward, the semiconductor ingot 26 is swung in the direction indicated by the arrow in FIG. As a result, the semiconductor ingot 26 is gradually cut in the wire row. This cutting operation is continued, and the wire row completely cuts the semiconductor ingot 26, and the cutting operation is completed when the cutting is performed to the slice base cutting section 3OA (see FIG. 3). This state is the state shown in FIG. As a result, a large number of sheets 30, 30... Are simultaneously cut from the semiconductor ingot 26.

Next, the operation of the slice base cutting device 60 will be described. When the semiconductor ingot 26 is cut into pieces 28, 28,..., The traveling head 64 waiting at the position shown in FIG. 3 is driven by the driving force of the screw feed mechanism 66 in FIG. At the same time, the wire 62 is moved in the direction of the arrow, and the wire 6 is pressed against the slice base 30 to start cutting the slice base 30. As a result, the wafers 28, 28,... Are cut one by one with the movement of the traveling head 64, and the cut wafers 28, 28,. It falls to 0 and is stored. Then, the stored wafers 28, 28,... Are washed with the washing liquid of the storage case.

When all the slices 28, 28,... Are cut by the slice base cutting device 60, the cleaning process is performed for a predetermined time, and then the oscillator is stopped to stop the cleaning process. And The door 102 is opened, the storage case 100 is taken out of the wire saw, and the wafers 28, 28, ... are stored in the storage case 100 and transferred to a predetermined post-process. . Thus, the cutting process, the single-wafer cutting process, the recovery process, and the cleaning process of one semiconductor ingot 26 by the wire saw 10 are completed.

As described above, in the wire saw 10 of the present embodiment, since the slice-based cutting device 60 is provided inside the wire saw, the wafers 28, 28... The cutting process can be performed in the wire sowing machine without taking out. Therefore, in the wire saw 10, the blades 28, 28,... Can be cut from the slice space 30 without any trouble.

Also, in the wire saw 10, since the slice base cutting device 60 is provided on the opposite side of the work feed table 32 across the wire row, the wafers 28, 2 cut by the wire row are provided. Without removing 8 ... from the wire row, it is possible to cut 18 28, 28 ... from the slice base 30 in the posture immediately after being cut by the wire row. Conversely, if the slice base cutting device 60 is provided on the work feed table 32 side, the blades 28, 28 ... must be removed from the wire row, and during this removal, the wires 24 However, the wire 24 may be damaged by being caught on the wafer 28. The slice base cutting device 60 also hinders the maintenance of the wire array. In the wire saw 10 of the present embodiment, such a problem can be prevented.

In addition, since the wire saw 10 is provided with the wafer storage case 100, the work of collecting the wafers 28, 28,... Becomes easy.

Also, in the wire saw 100, a cleaning device is provided in the storage case 100 to clean the wafers 28, 28,... Together with the storage of the wafer 28. The cleaning process of 28 can be performed efficiently.

In this embodiment, a wire source using a fixed abrasive wire has been described. However, the present invention is not limited to this. It can also be applied to a wire saw.

In the present embodiment, the slice base cutting device 60 is connected to the work Although provided on the opposite side of the feed table 32, the present invention is not limited to this, and a slice base cutting device 60 may be provided on the work feed table 32. In this case, after raising the work feeding table 32 to a position where the slice base can be cut, the slice base 30 is cut by the slice base cutting device 60.

Further, in the present embodiment, the slice base 30 is cut by the slice base cutting device 60. However, the work feed table 32 immediately after the end of the cutting is moved in the axial direction of the semiconductor ingot 26 (ゥ 2-1). (The direction perpendicular to the plane of c), the slice base 30 is cut in the direction perpendicular to the plane of the wafer 28 by the wires 24, 24 ... in the wire row. can do. As a result, it is possible to cut single wafers 28, 28, ... from the slice base 30. In this case, the slice-based cutting device 60 becomes unnecessary.

In such a wire saw, a work feed table 32 is attached to a horizontal feed mechanism such as a feed screw device, and the horizontal feed mechanism is supported by linear guides 42, 42 of a portal column 40. I have. Therefore, when the wafers 28, 28,... Are to be cut one by one from the slice base 30, the horizontal feed mechanism is driven to move the work feed tape 32 in the axial direction of the semiconductor ingot 26. Move to This makes it possible to cut wafers 28 to 18 wafers. Further, even if the row of wires is moved in the axial direction of the semiconductor ingot 26 by moving the grooved rollers 14 and 16 without moving the work feed table 32 in the above-mentioned direction, Eight pieces can be cut.

Industrial applicability

As described above, according to the wire saw with a slice base cutting device according to the present invention, a slice pace cutting device is provided in the wire saw, and a large number of blades cut by the wire row of the wire saw are sliced. Since the cutting is performed from the slice base by the slice cutting device, a large number of blades cut from the work can be cut from the slice base one by one without any trouble.

Claims

The scope of the claims

1. Wrap the wire around a plurality of grooved rollers to form a wire row and

-Run the wire row by rotating the roller, attach a work piece to the work feed table through the slice base, and push the work to the wire row by sending out the work feed table toward the wire row. Contact and cut the workpiece into many

A slice base cutting device is provided on the wire saw, and the multiple blades cut by the wire row are cut from a slice base by the slice base cutting device. With wire saw.

2. The wire saw with a slice base cutting device according to claim 1, wherein the slice base cutting device is provided on the opposite side of the work feed table across the wire row.

3. The wire saw with a slice base cutting device according to claim 1, wherein the wire saw is provided with a storage case for storing the paper cut by the slice base cutting device.

4. The wire saw with a slice pace cutting device according to claim 3, wherein the storage case is provided with 18 cleaning devices.

5. The wire source with a slice base cutting device according to claim 3, wherein the storage case is provided on the opposite side of the work feed table with the wire row interposed therebetween.

6. The wire is wound around a plurality of grooved rollers to form a wire row, and at the same time, the wire row is run by rotation of the grooved roller, and a work is attached to the work feed table via a slice base, By feeding the work feed table toward the wire row, the work is pressed against the wire row to cut the work into a number of wafers.

The work is cut into many pieces by the wire row, and After cutting the base by a predetermined amount with the wire row, the work feed table is moved by a predetermined amount in a direction orthogonal to the plane of the sheet, thereby cutting the slice base with the wire row, Wire saw characterized in that wafers are cut from a slice base one by one.