JP3211930B2 - Wire saw - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw, and more particularly to a wire saw for cutting a large number of thin wafers with a wire running on a workpiece such as a cylindrical semiconductor ingot, ceramic, glass or the like.

[0002]

2. Description of the Related Art A wire saw is one of the cutting devices for cutting a workpiece such as a semiconductor ingot, ceramic, glass or the like into a thin wafer. This wire saw presses a workpiece while supplying a processing liquid containing abrasive grains to a wire running between a pair of wire reels,
The workpiece is cut into a large number of thin wafers by the lapping action of the abrasive grains. In recent years, since the diameter of wafers has increased to 8 inches and 12 inches, the wire of the wire saw must be long,
Wire reels with a heavy weight exceeding 100 kg are used.

Conventionally, the wire reel of this wire saw has been driven by transmitting a rotational force to the wire reel by belt transmission from a drive motor. In the case of slicing a workpiece with the wire saw, the slice direction includes a unidirectional feed in which the wire travels in only one direction and a bidirectional feed in which the wire reciprocates. Of these, in the case of bidirectional feeding, the wire reel must repeatedly accelerate and decelerate in a short time (1 second to 6 seconds), and thus requires a large acceleration torque due to the inertia of the wire reel.

[0004]

However, if a heavy weight wire reel is driven by the conventional belt drive system, a large inertia motor is required to drive the wire reel. There is a problem that a motor having a large size must be used, and the drive unit becomes large. Further, if the acceleration / deceleration torque is large, the belt may be damaged or the like, so that the acceleration / deceleration time cannot be shortened.

The present invention has been made in view of such circumstances, and can use a drive motor with low inertia.
An object of the present invention is to provide a wire saw drive structure capable of improving the throughput because the acceleration / deceleration time can be reduced.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a method in which a wire reciprocating between one wire reel and another wire reel is wound around a plurality of grooved rollers. A wire saw that cuts the workpiece into a plurality of thin wafers by forming a row and pressing the workpiece while supplying a working fluid containing abrasive grains to the wire row; And a disk-shaped turntable is directly connected to a rotation shaft of a forward / reversely rotatable drive motor for driving the wire reel, and a truncated conical projection formed at the center of the upper surface of the turntable. The wire reel is positioned and fixed to the turntable by fitting a truncated conical recess formed in the center of the lower surface of the flange of the wire reel into the portion. More, characterized by being directly connected to the wire reel to said forward and reverse rotatable drive motor rotary shaft coaxially.

In order to achieve the above object, a wire is fed from one wire reel, wound around a plurality of grooved rollers to form a wire row, and wound around the other wire reel. In a wire saw that supplies a processing liquid containing abrasive grains and presses the workpiece, and cuts the workpiece into a number of thin wafers, a rotating shaft of a drive motor that drives the grooved roller,
The grooved roller is connected coaxially with the rotating shaft.

[0008]

According to the present invention, the wire reel and the grooved roller are directly connected to the drive motor and are directly driven by the drive motor. Thereby, the acceleration / deceleration time is shortened, and the throughput is improved. Further, since a motor having low inertia, that is, a motor having a small size can be used as the drive motor, the drive unit can be made compact. Further, the space required for the belt transmission mechanism, which has been conventionally required, can be omitted, so that the drive unit can be made compact.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the wire saw according to the present invention will be described below in detail with reference to the accompanying drawings. First, the overall configuration of the wire saw 110 will be described with reference to FIG. Wire 114 wound around one wire reel 112
Is sequentially wound around three grooved rollers 122, 122, 122 via a wire guide device 116, a plurality of fixed guide rollers 118, 118, and a dancer roller 120 to form a wire row 124, and then a plurality of fixed It is wound around the other wire reel 126 via the guide rollers 118, 118, the dancer roller 120, and the wire guide device 116.

A weight 144 having a predetermined weight is suspended from the dancer roller 120, and a required tension is constantly applied to the traveling wire 114. A wire cleaning device 146 is provided in the middle of the wire running path, and the processing liquid 14 attached to the wire 114 by the wire cleaning device 146.
0 is removed.

The wire reels 112 and 126 are vertically
Drive motors 12 arranged in the directions
8 and 130, and one of the three grooved rollers 122 is connected to a drive motor 132 capable of rotating forward and backward. Thus, the wire 114 reciprocates between the one wire reel 112 and the other wire reel 126. In the wire row 124, abrasive grains (usually GC {600 to #}) stored in a polishing liquid storage tank 138 are provided.
A working fluid 140 containing about 1,000)
Is supplied from the abrasive liquid supply nozzle 142.

Below the wire array 124, a semiconductor ingot 154, which is a workpiece, is placed on a work block 15a.
6 and the work table 148 via the slice base 158. The work feed table 148 is provided movably up and down by a screw rod 152 rotated by a motor 150. The semiconductor ingot 154
The workpiece feed table 148 is moved upward to be pressed against the high-speed running wire row 124, and is wrapped by the processing liquid 140 supplied to the high-speed running wire row 124 to form a large number of thin wafers. Be cut off.

Next, the structure of the drive unit of the wire reel 112 will be described with reference to FIG. The wire reel 1
The drive motor 128 for driving the motor 12 is a casing 160 containing a rotating shaft 162 and the like.
10 are fixed to the body frame by bolts. Rotating the center in the casing 160 shaft 1 62 is bearing 1
64, 164, 164, and are rotatably supported. Permanent magnets 166, 16
6 is fixed. On the other hand, armature coils 168 and 168 are fixed to the inner peripheral wall of the casing 160 so as to face the permanent magnets 166 and 166. By passing a current through the armature coils 168 and 168,
The rotation shaft 162 rotates.

A disk-shaped turntable 170 is connected to the upper end of the rotating shaft 162. The turntable 170 is coaxially connected to the rotation shaft 162, and the connection portion is fixed by being bolted with two connection bolts 172,172. The wire reel 112 is connected to the upper surface of the turntable 170. At the center of the lower surface of the flange 113 of the wire reel 112, a truncated cone-shaped recess 113A is formed. The wire reel 112 and the turntable 1
70 is coaxially connected. In addition, the flange 113 and the turntable 170 that are connected to each other are fixed by bolting the peripheral ends thereof with bolts 174 and 174, and transmit the rotation of the turntable 170 to the wire reel 112 without rotating together.

As described above, by making the rotary drive of the turntable 170 a built-in type, the wire reel 112 is directly connected to the drive motor 128 and is driven directly. Thereby, the acceleration / deceleration time is shortened, and the throughput is improved. In addition, since a motor having low inertia, that is, a motor having a small size can be used as the drive motor, the drive unit can be made compact.

Further, the space required for the belt transmission mechanism, which has been conventionally required, can be omitted, so that the drive unit can be made compact. This also eliminates the risk of damage to the belt during operation. In addition, wire row 1
As for the driving method of the grooved roller 122 forming the groove 24, the same effect as that of the wire saw 110 can be obtained by adopting the method of driving the drive motor by directly connecting the driving motor to the grooved roller 122 in the same manner as the wire reel 112. Can be obtained.

[0017]

As described above, according to the wire saw of the present invention, when the wire reel is disposed vertically.
In both cases, the rotation of the drive motor that drives the wire reel
The shaft is coaxial with the rotating shaft via a disc-shaped turntable.
Since the above-mentioned wire reel is directly connected, it is directly driven by the drive motor. Thereby, the acceleration / deceleration time is shortened, and the throughput is improved. Further, since a motor having low inertia, that is, a motor having a small size can be used as the drive motor, the drive unit can be made compact. Further, the space required for the belt transmission mechanism, which has been conventionally required, can be omitted, so that the drive unit can be made compact.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of a wire saw.

FIG. 2 is a sectional view of a drive unit of the wire reel.

[Explanation of symbols]

 110: wire saw 112: wire reel 114: wire 122: grooved roller 124: wire row 128, 130, 132: drive motor

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-177958 (JP, A) JP-A-3-49863 (JP, A) JP-A-1-234153 (JP, A) 78656 (JP, U) Japanese Utility Model 4-4-756 (JP, U) Japanese Utility Model 44-21157 (JP, Y1) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24B 27/06 B28D 5 / 04 B65H 54/44

Claims (2)

(57) [Claims] 1. One wire reel and the other wire
The wire reciprocating between the reel and the
Around a wire row to form a wire row.
Pressing the workpiece while supplying the machining fluid containing abrasive grains
The Rukoto, in wire saw for cutting the workpiece into a number of thin plate-like wafer, while disposing the wire reel in the vertical direction, the rotation axis of the forward and reverse rotatable drive motor for driving the wire reel Directly connect a disk-shaped turntable to the
The truncated cone formed at the center of the upper surface of the cable
Formed in the center of the lower surface of the flange of the wire reel
Insert the truncated cone into the wire reel
By positioning and fixing to the turntable,
A wire saw, wherein the wire reel is directly connected coaxially with a rotation shaft of a drive motor that can rotate in a reverse direction . Wherein said grooved rollers is directly coupled to the rotation shaft of the forward and reverse rotatable drive motor for driving the grooved rollers, the
The wire saw according to claim 1, wherein the wire saw is disposed coaxially with a rotation axis of the drive motor .