JP2737783B2 - Wafer cutting equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cutting a wafer such as a semiconductor, and more particularly to an apparatus for cutting a wafer by cutting a material of a columnar body into flakes.

(Prior art)

Conventionally, as a device for cutting a wafer by cutting a columnar material (such as a silicon ingot) such as a semiconductor into a flake shape,
Slicing machines are used.

By the way, this slicing machine cannot maintain a constant cutting resistance applied to the inner peripheral blade due to wear, clogging, etc. of the inner peripheral blade for cutting the ingot. In such a case,
As shown in FIG. 6, the inner peripheral blade 150 moves irregularly in the cutting direction, and a warp, a saw mark (unevenness) 154 and the like are formed on the contact section of the wafer 152.

On the other hand, semiconductor materials tend to increase in diameter, and as the diameter increases, the wafer is warped when the wafer is manufactured by cutting the ingot, and this warpage is corrected by wrapping in a later process. Can not.

Therefore, Japanese Patent Application Laid-Open No. S61-106207 discloses a method for easily removing a warp or the like of a wafer. In this method, a cup-shaped grindstone is arranged close to an inner peripheral blade, and after cutting the wafer, the ingot cut surface is ground to finish the flatness of the cut surface of the wafer with high accuracy. This makes it possible to easily provide a wafer free from warpage or the like.

[Problems to be solved by the invention]

However, the wafer cutting method disclosed in the above publication does not disclose a specific configuration in which the inner peripheral blade and the grindstone are arranged in a limited space of slicing, and the wafer cutting method in which the inner peripheral blade and the grindstone are efficiently arranged. The development of the device was desired.

The present invention has been made in view of such circumstances, and has as its object to provide a wafer cutting device in which a grindstone and an inner peripheral blade are efficiently arranged.

[Means for solving the problem]

In order to achieve the above object, the present invention provides a first rotating body whose inner peripheral side is rotatably supported by a base and is rotationally driven by a first rotating drive source, and which is attached to the first rotating body. An inner peripheral blade that cuts the columnar material into flakes; a movable member that is disposed inside the first rotating body and whose outer peripheral side is slidably supported by the base and moved forward and backward with respect to the inner peripheral blade A second rotating body rotatably supported by a movable member and rotatably driven by a second rotating drive source fixed to the movable member, and a grindstone attached to a tip of the second rotating body;
And a feed device for moving the movable member in the axial direction to move the grindstone forward and backward with respect to the inner peripheral blade.

Further, in order to achieve the above object, the present invention provides a first rotating body whose inner peripheral side is rotatably supported by a base and is rotationally driven by a first rotating drive source; An inner peripheral blade attached to cut the columnar material into flakes;
A second rotating body that is rotatably supported by a base and whose outer peripheral side is rotatably driven by a second rotating drive source, and a grindstone is attached to a tip of the second rotating body. A grindstone shaft coupled to the rotating body and rotated integrally with the second rotating body and movable in the axial direction with respect to the second rotating body; And a feed device for moving forward and backward.

[Action]

According to the wafer cutting device of the present invention, the first rotating body is rotated to rotate the inner peripheral blade, and at the same time, the second rotating body is rotated to rotate the grindstone. Next, the feeder is operated to move the grindstone to the grinding position. Then
The end face of the ingot is ground with a grindstone, and the ingot is cut into flakes with an inner peripheral blade.

As described above, since the second rotating body is arranged inside the first rotating body and the grinding wheel is moved forward and backward to polish the cut surface of the ingot, it is possible to configure a compact wafer cutting apparatus. Further, the lapping step can be omitted, and the working efficiency can be improved.

〔Example〕

Hereinafter, preferred embodiments of a wafer cutting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an overall perspective view of a wafer cutting device according to the present invention. An inner peripheral blade 14 is disposed on an upper surface of a main body 12 of the wafer cutting device 10, and a first A cup-shaped grindstone 16 shown in FIG. 2 is rotatably mounted. A rotating mechanism 18 (shown in FIG. 2) for rotating the inner peripheral blade 14 and the cup-shaped grindstone 16 is attached below the grindstone 16.

Further, the main body 12 is provided with a wafer collecting device 22 extending from a side surface of the main body 12 to a substantially central portion of the inner peripheral blade 14. Further, the suction pad 22A at the tip of the wafer collecting device 22
A wafer transfer device 24 and a storage case 26 for storing the transferred wafer are mounted.

On the upper surface of the main body 12, a cutting feed table 28 is provided.
It is slidably supported in the directions of arrows A and B shown in the figure, and is reciprocated by a driving source (not shown). This cutting feed table
At the left end of 28, a column 30 is erected. An indexing slider 32 is supported on the front of the column 30 so as to be movable in the longitudinal direction of the column 30, that is, in the vertical direction. The index slider 32 is
30 is screwed together with a feed screw (not shown) attached in the longitudinal direction, and the feed screw can be moved vertically by rotating the feed screw. Since the indexing slider 32 supports the ingot 34 to which the slice base 36 is fixed, the ingot 34 is moved in the directions of arrows A and B (cutting direction).
And in the vertical direction (ingot cutting thickness adjustment direction).

The rotation mechanism 18 of the inner peripheral blade 14 and the grindstone 16 will be described with reference to FIG. A flange 38A is formed at a lower end of the base 38 which is a part of the main body 12, and a lower end 40A of the cylindrical body 40 is fixed to the flange 38A. A first rotating body 42 is rotatably supported by the cylindrical body 40 via a bearing 41. First
A chuck body 44 is fixed to the rotating body 42, a donut-shaped blade 46 is fixed to the chuck body 44 in a state where a constant tension is applied, and an inner peripheral blade 14 is provided on an inner peripheral surface of the blade 46. Is formed. A driven pulley 48 is formed on the first rotating body 42, and the belt 50 is adjusted between the driven pulley 48 and the driving pulley 52.
The drive-side pulley 52 is attached to a rotation shaft 56 of the first motor 54.

Further, inside the base 38, slide bearings 56, 56 are provided.
The movable member 58 is supported so as to be movable in the axial direction. The movable member 58 is formed in a substantially cylindrical shape, and a second rotating body 60 is rotatably supported in the movable member 58 via bearings 62, 62.

The cup-shaped grindstone 16 is attached to the upper end 60A of the second rotating body 60. The grindstone 16 has a grinding portion 64 protruding from the periphery, and the grinding portion 64 is formed so as to be coplanar. The lower end 60A of the second rotating body 60 is connected to a connecting shaft 66.
Is fixed. The connection shaft 66 is connected to a drive shaft 70 of a second motor 68 via a coupling 72, and the second motor 68 is attached to the bent portion 58A of the movable member 58.
Thereby, the grindstone 16 can rotate.

A feed shaft 74 is screwed into a flange 58B formed on the movable member 58. A feed gear 78 is fixed to the lower end 74A of the feed shaft 74. The feed gear 78 is meshed with a drive gear 80, and the drive gear 80 is fixed to a drive shaft 84 of the third motor 82. The third motor 82 is attached to the base 38. As a result, the rotation of the third motor 82
80, transmitted to the feed shaft 74 via the feed gear 78,
Rotates. As a result, the movable member 58 can be moved in the axial direction.

The operation of the thus configured wafer cutting apparatus according to the present invention will be described.

When the first drive motor 54 is rotated, the first rotating body 42 rotates via the belt 50, and the blade 46 rotates. Next, when the second motor 68 is rotated, the second rotating body 60 is rotated, and the grindstone 16 is rotated. Next, the ingot 34 shown in FIG. 1 is lowered, and the third motor 82 is rotated to rotate the feed shaft 74 via the drive gear 80 and the feed gear 78. Accordingly, the movable member 58 moves upward in the axial direction together with the second rotating body 60. The movable member 58 moves the grindstone 16 to the grinding position and stops. Next, as shown in FIG. 3, when the ingot 34 is moved in the direction A, the ingot 34 is moved.
The end surface of the grinding wheel is first ground by the grinding portion 64 of the grinding wheel 16,
The inner peripheral blade 14 cuts the ingot 34 slightly later than the grinding of 16. In this case, if the cutting is performed before the grinding, an excessive stress is applied to the wafer being cut at the time of the grinding, so that not only the flatness is not obtained but also there is a risk of breakage or the like.

After the cutting, the table 28 shown in FIG. 1 is moved in the direction B to return to the original position. On the other hand, the movable member 58 moves downward by the reverse rotation of the third motor 80. Thereby, the second rotating body 60 moves downward together with the movable member 58, and the grindstone 16 reaches a predetermined position. The following operation is repeated to cut the ingot 34 sequentially.

By arranging the grindstone 16 inside the inner peripheral blade 14 in this manner, a compact wafer cutting device can be provided, and work efficiency can be improved. Also, the mechanism can be simplified.

In the above embodiment, the cutting feed table on the ingot 34 side
Although the ingot 34 is cut by moving the ingot 34, the present invention is not limited to this, and the ingot 34 may be cut by moving the inner peripheral blade 14 without moving the ingot 34.

Further, in the above embodiment, the ingot 34 was cut at the same time as the ingot 34 was ground.
As shown in FIG. 4 (a), the ingot 34 may be cut into thin pieces first, and then the cut surface may be ground as shown in FIG. 4 (b), and this may be repeated alternately.

Next, another embodiment will be described with reference to FIG.
The description of the same members as those in the above-described embodiment will be omitted.
A cylindrical rotating body 100 is mounted on a base 38 which is a part of the main body 12,
It is rotatably mounted via bearings 102,102. A pulley 104 is attached to the lower end member of the rotating body 100,
A belt 106 is stretched between the pulley 104 and the pulley 108. The pulley 108 is fixed to the output shaft of the motor 110.

The grinding wheel shaft 112 is inserted coaxially with the hole 100A of the rotating body 100,
They are connected via a spline connection 114 so as to be movable only in the axial direction. The cup-shaped grindstone 16 is located at the upper end of the grindstone shaft 112.
Is attached. Therefore, the grindstone 16 can rotate through the spline connection 114 and moves when it receives a pressing force in the axial direction. Further, a connection plate 116 that receives a pressing force in the axial direction is attached to a lower end portion of the grinding wheel shaft 112. The connection plate 116 is disposed in the joint casing 120 via a thrust bearing 118. On the other hand, the feed shaft 122 is coaxial with the grinding
It is attached to the lower end face. The feed shaft 122 is screwed with an inside of a feed gear 126 that rotates via a bearing 124 so as to be movable in the axial direction. The feed gear 126 is the motor 1
It is rotated by a drive gear 130 fixed to the output shaft 28.

The operation of another embodiment according to the present invention configured as described above will be described.

First, when the motor 110 shown in FIG. 5 is rotated, the grindstone shaft 112 rotates integrally with the rotating body 100 via the belt 106. Next, the motor 128 is rotated to move the feed shaft 122 upward in the axial direction via the drive gear 130 and the feed gear 126. Due to this movement, the casing 120 moves upward to move the grinding wheel shaft 112 upward in the axial direction. The feed shaft 122 moves downward by the reverse rotation of the motor 128.

In this way, in the embodiment shown in FIG. 5, similarly to the first embodiment, the grindstone 16 is arranged inside the inner peripheral blade 14, so that a compact wafer cutting device can be obtained.

〔The invention's effect〕

As described above, according to the wafer cutting device of the present invention, the grindstone is supported inside the first rotating body to which the inner peripheral blade is attached, and can move on the axis. It can move forward and backward with respect to the material. This makes it possible to provide a compact wafer cutting apparatus that can polish a cut surface and does not require a lapping operation after cutting.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall perspective view of a wafer cutting apparatus according to the present invention,
FIG. 2 is a sectional view of a wafer cutting apparatus according to the present invention, and FIG.
FIGS. 4A and 4B show a state of grinding and cutting an ingot by the wafer cutting apparatus according to the present invention. FIGS.
FIG. 5 is a view showing a grinding and cutting state of another embodiment of the ingot by the wafer cutting apparatus according to the present invention; FIG. 5 is a sectional view of another embodiment of the wafer cutting apparatus according to the present invention;
FIG. 1 is a front view showing a cutting state of an ingot by a conventional slicing machine. 10 Wafer cutting device, 14 Inner peripheral blade, 16 Cup-shaped grindstone, 34 Ingot, 42 First rotating body, 38
... Base, 54, 68, 82 ... Motor, 58 ... Movable member, 60 ...
... the second rotating body, 74 ... the feed shaft.

Claims (2)

(57) [Claims] An inner peripheral side is rotatably supported by a base and is rotatably driven by a first rotary drive source; and a columnar material attached to the first rotary body in a flake shape. An inner peripheral blade to be cut, a movable member disposed inside the first rotating body, the outer peripheral side of which is slidably supported by the base and moved forward and backward with respect to the inner peripheral blade; A second rotator supported by the second member and rotationally driven by a second rotator fixed to the movable member; a grindstone attached to the tip of the second rotator; and moving the movable member in the axial direction. And a feed device for moving the grindstone forward and backward with respect to the inner peripheral blade. 2. A first rotating body whose inner peripheral side is rotatably supported on a base and is rotationally driven by a first rotating drive source; and a columnar material attached to the first rotating body in a flake shape. An inner peripheral blade to be cut, a second rotator disposed inside the first rotator, the outer peripheral side of which is rotatably supported by the base and rotationally driven by a second rotator; A grindstone attached to the second rotating body, which is combined with the second rotating body, is integrally rotated with the second rotating body, and is movable in the axial direction with respect to the second rotating body; And a feed device for moving the grindstone to the inner peripheral blade by moving the grindstone to and from the inner peripheral blade.